CN216450679U - Heat dissipation light emitting diode - Google Patents
Heat dissipation light emitting diode Download PDFInfo
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- CN216450679U CN216450679U CN202123175209.6U CN202123175209U CN216450679U CN 216450679 U CN216450679 U CN 216450679U CN 202123175209 U CN202123175209 U CN 202123175209U CN 216450679 U CN216450679 U CN 216450679U
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- heat dissipation
- fixedly connected
- emitting diode
- heat
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Abstract
The utility model discloses a heat radiation LED, comprising: the heat dissipation device comprises a heat dissipation base, wherein a protective cover is arranged at the bottom of the heat dissipation base, a fixing plate is arranged in the middle of the heat dissipation base, a wafer is arranged at the top of the fixing plate, a positive wiring column is fixedly connected to one side of the bottom of the wafer, and a negative wiring column is fixedly connected to the other side of the bottom of the wafer; according to the utility model, the heat dissipation mechanism is arranged, the heat dissipation mechanism has the function of improving the air flow speed in the protective cover, a traditional light-emitting diode can generate certain heat after working for a long time, and the light attenuation of the light-emitting diode and the monochromaticity of light can be influenced due to the lack of the heat dissipation mechanism, so that the service life of the light-emitting diode is finally reduced, the heat dissipation light-emitting diode improves the air flow speed near the wafer, the heat dissipation effect is further achieved, the light attenuation of the light-emitting diode and the monochromaticity of light are prevented from being influenced, and the service life of the light-emitting diode is prolonged.
Description
Technical Field
The utility model relates to the technical field of light-emitting diode equipment, in particular to a heat-dissipation light-emitting diode.
Background
Light emitting diodes, referred to as LEDs for short, are made of compounds containing gallium, arsenic, phosphorus, nitrogen, etc., and can radiate visible light when electrons and holes recombine, and thus can be used to make light emitting diodes, as indicator lights in circuits and instruments, or to make text or numerical displays;
the conventional light emitting diode generates certain heat after working for a long time, and because the conventional light emitting diode lacks a heat dissipation mechanism, the light attenuation of the light emitting diode and the monochromaticity of light are influenced, and the service life of the light emitting diode is finally shortened.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a heat-dissipating light-emitting diode, in which a heat-dissipating mechanism is provided to increase the air flow speed inside a protective cover, so as to increase the air flow speed near a chip, thereby achieving a heat-dissipating effect, preventing light attenuation and monochromaticity of light from affecting the light-emitting diode, and increasing the service life of the light-emitting diode.
In order to realize the purpose of the utility model, the utility model is realized by the following technical scheme: a heat dissipating light emitting diode comprising: the heat dissipation base, heat dissipation base bottom is provided with the safety cover, the middle part of heat dissipation base is provided with the fixed plate, the top of fixed plate is provided with the wafer, the positive terminal that connects of bottom one side fixedly connected with of wafer, the bottom opposite side fixedly connected with negative terminal of wafer, positive terminal and negative terminal are kept away from the one end of wafer is run through the fixed plate just extends to the outside of fixed plate, the surface of fixed plate evenly is provided with first dead lever, the one end of first dead lever with fixed plate fixed connection, the other end of first dead lever with heat dissipation base fixed connection, the inside of safety cover is provided with heat dissipation mechanism, the four corners of safety cover evenly is provided with ventilation mechanism, the bottom surface of safety cover is provided with heat conduction mechanism.
The further improvement lies in that: a first dustproof net is arranged among the heat dissipation base, the fixing plate and the first fixing rod, and the first dustproof net is fixedly connected with the heat dissipation base, the fixing plate and the first fixing rod.
The further improvement lies in that: the heat dissipation mechanism comprises a support rod, a micro motor, a rotating shaft and heat dissipation blades, the support rod is fixedly connected to the top of the inner wall of the protection cover, the micro motor is fixedly connected to the middle of the support rod, the rotating shaft is fixedly connected to the output end of the micro motor, and the heat dissipation blades are fixedly connected to one end of the micro motor.
The further improvement lies in that: ventilation mechanism includes ventilation hole, connecting block and second dust screen, the ventilation hole has all been seted up in the four corners of safety cover, the safety cover is close to ventilation hole department fixedly connected with connecting block, the connecting block is close to ventilation hole department is provided with the second dust screen, the second dust screen with connecting block fixed connection.
The further improvement lies in that: the top fixedly connected with annular connecting block of safety cover, the top center department of annular connecting block is provided with the roof, the outer fixed surface of roof is connected with the second dead lever that quantity is six, the second dead lever is kept away from the one end of roof with annular connecting block fixed connection, be provided with the third dirt net between roof, second dead lever and the annular connecting block, the third dirt net with roof, second dead lever and annular connecting block fixed connection.
The further improvement lies in that: and a cooling patch is arranged between the wafer and the fixing plate and fixedly connected with the fixing plate.
The further improvement lies in that: the heat conduction mechanism comprises an annular copper sheet and a copper sheet, the outer surface of the bottom of the protective cover is fixedly connected with the annular copper sheet, and the outer surface of the annular copper sheet is fixedly connected with a plurality of copper sheets.
The utility model has the beneficial effects that: according to the utility model, the heat dissipation mechanism is arranged, the heat dissipation mechanism has the function of improving the air flow speed in the protective cover, a traditional light-emitting diode can generate certain heat after working for a long time, and the light attenuation of the light-emitting diode and the monochromaticity of light can be influenced due to the lack of the heat dissipation mechanism, so that the service life of the light-emitting diode is finally reduced, the heat dissipation light-emitting diode improves the air flow speed near a wafer, the heat dissipation effect is further achieved, the light attenuation of the light-emitting diode and the monochromaticity of light are prevented from being influenced, and the service life of the light-emitting diode is prolonged; through setting up heat conduction mechanism, heat conduction mechanism has the function that increases heat radiating area, and this heat dissipation emitting diode has increased the heat radiating area of safety cover bottom, has further improved emitting diode's radiating effect.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a connection diagram of the heat dissipation base and the first fixing rod of the present invention;
FIG. 3 is a view of the connection of the annular connecting block with a second fixing rod according to the present invention;
fig. 4 is a schematic diagram of the circuit of the present invention.
Wherein: 1. a heat dissipation base; 2. a protective cover; 3. a fixing plate; 4. a wafer; 5. a positive terminal post; 6. a negative terminal; 7. a first fixing lever; 8. a first dust screen; 9. a support bar; 10. a micro motor; 11. a rotating shaft; 12. a heat dissipating fin; 13. a vent hole; 14. connecting blocks; 15. a second dust screen; 16. an annular connecting block; 17. a top plate; 18. a second fixing bar; 19. cooling the patch; 20. an annular copper sheet; 21. a copper sheet; 22. and a third dust prevention net.
Detailed Description
In order to further understand the present invention, the following detailed description will be made with reference to the following examples, which are only used for explaining the present invention and are not to be construed as limiting the scope of the present invention.
According to fig. 1 to 4, the present embodiment provides a heat-dissipating light emitting diode, including: the method comprises the following steps: heat dissipation base 1, heat dissipation base 1 bottom is provided with safety cover 2, heat dissipation base 1's middle part is provided with fixed plate 3, the top of fixed plate 3 is provided with wafer 4, wafer 4's bottom one side fixedly connected with positive terminal 5, wafer 4's bottom opposite side fixedly connected with negative terminal 6, the one end that wafer 4 was kept away from to positive terminal 5 and negative terminal 6 runs through fixed plate 3 and extends to the outside of fixed plate 3, fixed plate 3's surface evenly is provided with first dead lever 7, the one end and the fixed plate 3 fixed connection of first dead lever 7, the other end and heat dissipation base 1 fixed connection of first dead lever 7, safety cover 2's inside is provided with heat dissipation mechanism, safety cover 2's four corners evenly is provided with ventilation mechanism, safety cover 2's bottom surface is provided with heat conduction mechanism.
Be provided with first dust screen 8 between heat dissipation base 1, fixed plate 3 and the first dead lever 7, first dust screen 8 and heat dissipation base 1, fixed plate 3 and first dead lever 7 fixed connection can prevent that the dust from getting into from the bottom.
The heat dissipation mechanism comprises a support rod 9, a micro motor 10, a rotating shaft 11 and heat dissipation blades 12, an inner wall top fixedly connected with support rod 9 of the protective cover 2, a middle fixedly connected with micro motor 10 of the support rod 9, an output end fixedly connected with rotating shaft 11 of the micro motor 10, one end fixedly connected with heat dissipation blades 12 of the micro motor 10 are far away from the rotating shaft 11, the air flow speed near the wafer 4 is improved, further, the heat dissipation effect is achieved, the light attenuation of the light emitting diode and the monochromaticity of the light are prevented from being influenced, and the service life of the light emitting diode is prolonged.
Ventilation mechanism includes ventilation hole 13, connecting block 14 and second dust screen 15, ventilation hole 13 has all been seted up in the four corners of safety cover 2, safety cover 2 is close to ventilation hole 13 fixedly connected with connecting block 14, connecting block 14 is close to ventilation hole 13 and locates to be provided with second dust screen 15, second dust screen 15 and connecting block 14 fixed connection, ventilation effect has been improved, and prevent that the dust from getting into inside safety cover 2 from ventilation hole 13.
Top fixedly connected with annular connecting block 16 of safety cover 2, the top center department of annular connecting block 16 is provided with roof 17, the outer fixed surface of roof 17 is connected with quantity and is six second dead lever 18, the one end and the annular connecting block 16 fixed connection of roof 17 are kept away from to second dead lever 18, roof 17, be provided with third dust screen 22 between second dead lever 18 and the annular connecting block 16, third dust screen 22 and roof 17, second dead lever 18 and annular connecting block 16 fixed connection, can make outside air admission safety cover 2 inside with the heat dissipation mechanism cooperation dispel the heat to the wafer.
A cooling patch 19 is arranged between the wafer 4 and the fixing plate 3, and the cooling patch 19 is fixedly connected with the fixing plate 3 to prevent the wafer 4 from being damaged due to overhigh temperature.
The heat conducting mechanism comprises an annular copper sheet 20 and a copper sheet 21, the annular copper sheet 20 is fixedly connected to the outer surface of the bottom of the protective cover 2, and the plurality of copper sheets 21 are fixedly connected to the outer surface of the annular copper sheet 20, so that the heat dissipation area of the bottom of the protective cover 2 is increased, and the heat dissipation effect of the light-emitting diode is further improved.
When the protective cover is used, a user connects the positive wiring column 5 with the positive electrode of a power supply, connects the negative wiring column 6 with the negative electrode of the power supply, because the micro motor 10 is connected in parallel with the two electrodes of the wafer 4, the micro motor 10 rotates, the micro motor 10 drives the rotating shaft 11, the rotating shaft 11 drives the radiating blades 12 to rotate, the air pressure at the bottom of the radiating blades 12 is increased by the rotation of the radiating blades 12, further, the air at the bottom of the radiating blades 12 is discharged to the outer side of the protective cover 2 through the first dustproof net 8, the air at the top of the radiating blades 12 is blown to the bottom of the protective cover 2 by the radiating blades 12, so that the air pressure at the top of the protective cover 2 is reduced, the external air enters the protective cover 2 through the third dustproof net 22 due to the principle of negative pressure to be matched with the radiating blades 12 to radiate the wafer 4, the air flow speed near the wafer 4 is improved, further, the radiating effect is achieved, and the light attenuation of the light-emitting diode and the monochromaticity are prevented from being influenced, the service life of the light-emitting diode is prolonged, meanwhile, heat generated by the wafer 4 is conducted to the annular copper sheet 20 through the protective cover 2 and then conducted to the copper sheet 21 through the annular copper sheet 20, the wafer 4 is cooled, the function of increasing the cooling area is achieved, the cooling area of the bottom of the protective cover 2 is increased, and the cooling effect of the light-emitting diode is further improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. A heat dissipating light emitting diode comprising: heat dissipation base (1), its characterized in that: the heat dissipation base is characterized in that a protective cover (2) is arranged at the bottom of the heat dissipation base (1), a fixed plate (3) is arranged at the middle part of the heat dissipation base (1), a wafer (4) is arranged at the top of the fixed plate (3), a positive wiring column (5) is fixedly connected to one side of the bottom of the wafer (4), a negative wiring column (6) is fixedly connected to the other side of the bottom of the wafer (4), one ends, far away from the wafer (4), of the positive wiring column (5) and the negative wiring column (6) penetrate through the fixed plate (3) and extend to the outer side of the fixed plate (3), first fixing rods (7) are uniformly arranged on the outer surface of the fixed plate (3), one ends of the first fixing rods (7) are fixedly connected with the fixed plate (3), the other ends of the first fixing rods (7) are fixedly connected with the heat dissipation base (1), and a heat dissipation mechanism is arranged inside the protective cover (2), the four corners of safety cover (2) evenly are provided with ventilation mechanism, the bottom surface of safety cover (2) is provided with heat conduction mechanism.
2. The heat-dissipating light-emitting diode of claim 1, wherein: be provided with first dust screen (8) between heat dissipation base (1), fixed plate (3) and first dead lever (7), first dust screen (8) with heat dissipation base (1), fixed plate (3) and first dead lever (7) fixed connection.
3. The heat-dissipating light-emitting diode of claim 1, wherein: the heat dissipation mechanism comprises a support rod (9), a micro motor (10), a rotating shaft (11) and heat dissipation blades (12), the inner wall top of the protection cover (2) is fixedly connected with the support rod (9), the middle of the support rod (9) is fixedly connected with the micro motor (10), the output end of the micro motor (10) is fixedly connected with the rotating shaft (11), and the rotating shaft (11) is kept away from the one end of the micro motor (10) is fixedly connected with the heat dissipation blades (12).
4. The heat-dissipating light-emitting diode of claim 1, wherein: ventilation mechanism includes ventilation hole (13), connecting block (14) and second dust screen (15), ventilation hole (13) have all been seted up in the four corners of safety cover (2), safety cover (2) are close to ventilation hole (13) fixedly connected with connecting block (14), connecting block (14) are close to ventilation hole (13) department is provided with second dust screen (15), second dust screen (15) with connecting block (14) fixed connection.
5. The heat-dissipating light-emitting diode of claim 1, wherein: the top fixedly connected with annular connecting block (16) of safety cover (2), the top center department of annular connecting block (16) is provided with roof (17), the outer fixed surface of roof (17) is connected with second dead lever (18) that quantity is six, keep away from second dead lever (18) the one end of roof (17) with annular connecting block (16) fixed connection, be provided with third dust screen (22) between roof (17), second dead lever (18) and annular connecting block (16), third dust screen (22) with roof (17), second dead lever (18) and annular connecting block (16) fixed connection.
6. The heat-dissipating light-emitting diode of claim 1, wherein: and a cooling patch (19) is arranged between the wafer (4) and the fixing plate (3), and the cooling patch (19) is fixedly connected with the fixing plate (3).
7. The heat-dissipating light-emitting diode of claim 1, wherein: the heat conduction mechanism comprises an annular copper sheet (20) and a copper sheet (21), the outer surface of the bottom of the protection cover (2) is fixedly connected with the annular copper sheet (20), and the outer surface of the annular copper sheet (20) is fixedly connected with a plurality of copper sheets (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123175209.6U CN216450679U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123175209.6U CN216450679U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216450679U true CN216450679U (en) | 2022-05-06 |
Family
ID=81376267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123175209.6U Active CN216450679U (en) | 2021-12-16 | 2021-12-16 | Heat dissipation light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216450679U (en) |
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2021
- 2021-12-16 CN CN202123175209.6U patent/CN216450679U/en active Active
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