CN221192387U - Local plating compensating device for long-axis electroplated workpiece - Google Patents
Local plating compensating device for long-axis electroplated workpiece Download PDFInfo
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- CN221192387U CN221192387U CN202322868666.6U CN202322868666U CN221192387U CN 221192387 U CN221192387 U CN 221192387U CN 202322868666 U CN202322868666 U CN 202322868666U CN 221192387 U CN221192387 U CN 221192387U
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- replenishment
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- 238000007747 plating Methods 0.000 title claims abstract description 210
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 43
- 230000001502 supplementing effect Effects 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 11
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 6
- 239000002699 waste material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a local plating compensating device for a long-axis electroplated workpiece, and belongs to the technical field of electroplating production and processing devices. The technical proposal is as follows: a local plating compensating device for a long-axis electroplated workpiece comprises a plating compensating tank with an open top end, an anode component and two groups of sealing rings which are respectively and detachably arranged between two corresponding side walls of the plating compensating tank and the plating compensating workpiece, wherein the plating compensating workpiece penetrates through two opposite side walls of the plating compensating tank, and when plating is performed, plating solution submerges the part of the plating compensating workpiece in the plating compensating tank; the anode assembly comprises a conductive rod which is spanned above the plating compensating tank and is electrically connected with the positive stage of the power supply, and a plating compensating anode of which the top end is electrically connected with the conductive rod; during the plating compensation, the bottom end of the anode of the plating compensation extends into the plating solution in the plating compensation tank. The beneficial effects of the utility model are as follows: the local plating compensating device for the long-axis electroplated workpiece has the advantages of simple structure, low cost, simple and efficient plating compensating operation, small occupied space, convenient movement and wide application range.
Description
Technical Field
The utility model relates to the technical field of electroplating production and processing devices, in particular to a local plating compensating device for a long-axis electroplated workpiece.
Background
In the electroplating production and processing process of long-axis type electroplated workpieces, due to the characteristics of an electroplating process, some small local defects are inevitably generated, at present, the common practice is that the workpieces are subjected to integral deplating and then polished electroplating again, so that great resource waste is caused, a great amount of dangerous waste is generated, moreover, the larger and longer the workpieces are, the larger the probability of occurrence of one to a plurality of pinholes and explosion point type local small defects is, and the more serious the resource waste is caused. Plating a large long shaft workpiece that is expensive is simply a small local defect that is neither economical nor environmentally friendly. At present, the brush plating machine equipment used in small quantity internationally can solve the defect of local electroplating, but has the problems of high price, complex structure, huge equipment and low plating efficiency, so the application range is narrow.
How to solve the technical problems is the subject of the present utility model.
Disclosure of utility model
In order to solve the problems in the prior art, the utility model provides the local plating compensating device for the long-axis electroplating workpiece, which has the advantages of simple structure, low cost, simple and efficient plating compensating operation, small occupied space, convenient movement and wide application range.
In order to achieve the above object, the present utility model provides a local plating replenishment device for plating a work piece with a long axis, comprising:
The top end of the plating supplementing groove is open, the plating supplementing workpiece penetrates through two opposite side walls of the plating supplementing groove, and when in plating supplementing, the plating solution submerges the part of the plating supplementing workpiece in the plating supplementing groove;
The anode assembly comprises a conductive rod which is spanned above the plating compensating tank and is electrically connected with the positive stage of the power supply, and a plating compensating anode of which the top end is electrically connected with the conductive rod; during the plating compensation, the bottom end of the plating compensation anode extends into the plating solution in the plating compensation tank;
And two groups of sealing rings are detachably arranged between the plating supplementing workpiece and two corresponding side walls of the plating supplementing groove respectively, and plating solution is prevented from flowing out during plating supplementing.
The anode assembly is characterized by further comprising insulating pads arranged on two opposite sides of the top surface of the plating bath, and the conductive rod is arranged on the insulating pads, so that the anode assembly is simple in structure, can integrate the conductive rod and the plating bath, reduces the occupied space of the device, is not limited by the field space, and is convenient to move.
The utility model is characterized in that the sealing ring is in sealing sleeve connection with the circumferential side surface of the plating-repairing workpiece, the sealing ring is fixedly connected with the side wall of the plating-repairing groove through a flange, the disassembly and the assembly are convenient, the corresponding cutting and replacement can be carried out according to the section size and the shape of the plating-repairing workpiece, and the application range is wide.
The utility model is characterized in that the sealing ring is made of rubber, the materials are convenient to obtain, and the price is low.
The plating device for the long-axis electroplating workpiece is characterized by further comprising a plating solution management groove, wherein a liquid inlet pipe and a liquid outlet pipe are respectively communicated between the plating solution management groove and the plating replenishment groove, a water pump is arranged on the liquid inlet pipe, a valve is arranged on the liquid outlet pipe, the liquid outlet end of the liquid inlet pipe is positioned at the upper end part of the plating replenishment groove and above the plating replenishment workpiece, the input end of the liquid outlet pipe is positioned at the lower end part of the plating replenishment groove and below the plating replenishment workpiece, and during the process of disassembling and assembling the plating replenishment workpiece and when the device is idle, the plating solution flows into the plating solution management groove through the liquid outlet pipe, and when the plating replenishment operation is needed, the plating solution is transmitted into the plating replenishment groove from the plating solution management groove through the water pump.
The plating solution management tank is characterized in that an overflow pipe is further communicated between the plating solution management tank and the plating replenishment tank, and the input end of the overflow pipe is positioned between the top end of the plating replenishment workpiece and the bottom end of the liquid outlet end of the liquid inlet pipe, so that redundant plating solution can conveniently flow back into the plating solution management tank.
The plating solution management tank is fixed on the bottom surface of the plating replenishment tank, so that on one hand, the plating replenishment tank and the plating solution management tank are integrated, the floor space of the device is reduced, the device is not limited by the floor space and is convenient to move, on the other hand, the plating solution can automatically flow back through the potential energy of the device, no additional plating solution backflow component is needed, and the device is simplified.
The plating solution management tank has the specific characteristics that the area of the top surface of the plating solution management tank is larger than that of the bottom surface of the plating replenishment tank, the plating replenishment tank is positioned in the middle of the plating solution management tank, and the liquid inlet pipe and the liquid outlet pipe respectively penetrate through the top surface of the plating solution management tank, so that the plating solution management tank is stable in structure and reasonable in layout.
The plating bath is characterized in that one side of the plating bath supplementing groove is provided with the liquid inlet pipe, the water pump and the liquid discharge pipe, one side of the plating bath managing groove, which is close to the liquid discharge pipe, is provided with the groove cover, so that plating bath can be conveniently supplemented or replaced, preferably, the groove cover is provided with the handle, the operation of the groove cover is convenient, and the layout is reasonable.
The utility model is characterized in that the bottom end of the plating-compensating anode is annular, and the annular is sleeved outside the plating-compensating workpiece during operation, so that the structure is simple, and the plating-compensating effect is improved.
The beneficial effects of the utility model are as follows: the utility model has simple structure, low cost, simple and efficient plating operation and extremely high plating speed, avoids the resource waste caused by the local defect plating stripping and re-plating of large-scale workpieces, avoids a great amount of dangerous waste caused by the stripping and is beneficial to environmental protection; the utility model has small occupied space, is not limited by the space of the field, and is convenient for movement; the sealing ring can be correspondingly cut and replaced according to the section size and the shape of the plating-repairing workpiece, and the application range is wide.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a front view of the present utility model;
FIG. 3 is a left side view of the present utility model;
Fig. 4 is a top view of the present utility model.
Wherein, the reference numerals are as follows: 1. a plating bath; 11. a liquid inlet pipe; 12. a liquid discharge tube; 13. an overflow pipe; 2. an anode assembly; 21. a conductive rod; 22. plating an anode; 23. an insulating pad; 3. a plating solution management tank; 31. a slot cover; 32. a handle; 4. a seal ring; 5. and (5) plating the workpiece.
Description of the embodiments
In order to clearly illustrate the technical characteristics of the scheme, the scheme is explained below through a specific embodiment.
Examples
The embodiment provides a local plating compensating device for long-axis electroplated workpieces, which comprises:
The top end of the plating compensating tank 1 is open, the plating compensating workpiece 5 penetrates through the two opposite side walls of the plating compensating tank 1, and during plating compensating, the plating solution submerges the part of the plating compensating workpiece 5 in the plating compensating tank 1;
The anode assembly 2 comprises a conductive rod 21 which is spanned above the plating bath 1 and is electrically connected with the positive stage of the power supply, and a plating anode 22 of which the top end is electrically connected with the conductive rod 21; during the plating compensation, the bottom end of the plating compensation anode 22 extends into the plating solution in the plating compensation tank 1;
And two groups of sealing rings 4 are detachably arranged between two corresponding side walls of the plating compensating workpiece 5 and the plating compensating tank 1 respectively, plating solution is prevented from flowing out during plating compensating, the sealing rings 4 are hermetically sleeved on the circumferential side surface of the plating compensating workpiece 5, the sealing rings 4 are fixedly connected with the side wall of the plating compensating tank 1 through flanges, the sealing rings 4 are made of rubber, the materials are convenient to obtain, the price is low, the disassembly and the assembly are convenient, and the corresponding cutting and replacement can be performed according to the cross section size and the shape of the plating compensating workpiece 5, so that the application range is wide.
The defect plating position of the plating compensating workpiece 5 is ground to a workpiece substrate and penetrates through two opposite side walls of the plating compensating tank 1, the ground part to be plated is opposite to the bottom end of the plating compensating anode 22, the side wall of the plating compensating tank 1 and the plating compensating workpiece 5 are respectively sealed by a sealing ring 4, plating solution is added into the plating compensating tank 1, and the positive electrode of the electric conduction rod 21 connected with an electroplating power supply and the negative electrode of the electroplating power supply are respectively connected with the plating compensating workpiece 5.
Examples
Referring to fig. 1, 2 and 3, on the basis of embodiment 1, the anode assembly 2 further includes insulation pads 23 disposed on two opposite sides of the top surface of the plating tank 1, and the conductive rod 21 is mounted on the insulation pads 23, so that the structure is simple, the conductive rod 21 and the plating tank 1 can be integrated, the occupied space of the device is reduced, and the device is not limited by the space of the field, and is convenient to move.
Examples
On the basis of embodiment 2, the local plating replenishment device for long-axis electroplating workpieces further comprises a plating solution management tank 3, a liquid inlet pipe 11 and a liquid outlet pipe 12 are respectively communicated with the plating solution management tank 3 and the plating replenishment tank 1, a water pump 10 is arranged on the liquid inlet pipe 11, a valve is arranged on the liquid outlet pipe 12, the liquid outlet end of the liquid inlet pipe 11 is positioned at the upper end part of the plating replenishment tank 1 and above the plating replenishment workpiece 5, the input end of the liquid outlet pipe 12 is positioned at the lower end part of the plating replenishment tank 1 and below the plating replenishment workpiece 5, during the process of dismounting the plating replenishment workpiece 5 and when the device is idle, the plating solution flows into the plating solution management tank 3 through the liquid outlet pipe 12, and when the plating replenishment operation is needed, the plating solution is transmitted into the plating replenishment tank 1 from the plating solution management tank 3 through the water pump 10.
The overflow pipe 13 is further communicated between the plating solution management tank 3 and the plating replenishment tank 1, and the input end of the overflow pipe 13 is positioned between the top end of the plating replenishment workpiece 5 and the bottom end of the liquid outlet end of the liquid inlet pipe 11, so that redundant plating solution can flow back into the plating solution management tank 3 conveniently.
The plating solution management tank 3 is fixed on the bottom surface of the plating replenishment tank 1, on one hand, the plating replenishment tank 1 and the plating solution management tank 3 are integrated into a whole, the occupied space of the device is reduced, the device is not limited by the space of the field, the movement is convenient, on the other hand, the plating solution can automatically flow back through the potential energy of the device, no additional plating solution backflow component is needed, and the device is simplified.
The top surface area of the plating solution management tank 3 is larger than the bottom surface area of the plating replenishment tank 1, the plating replenishment tank 1 is positioned in the middle of the plating solution management tank 3, and the liquid inlet pipe 11 and the liquid outlet pipe 12 respectively penetrate through the top surface of the plating solution management tank 3, so that the plating solution management tank has stable structure and reasonable layout.
One side of the plating bath supplementing 1 is provided with a liquid inlet pipe 11, a water pump 10, the other side is provided with a liquid storage pipe 12 and an overflow pipe 13, one side, close to the liquid storage pipe 12, of the top surface of the plating bath management tank 3 is provided with a tank cover 31, plating bath is conveniently supplemented or replaced, preferably, the tank cover 31 is provided with a handle, operation on the tank cover 31 is convenient, and the layout is reasonable.
Examples
On the basis of embodiment 1, 2 or 3, the bottom end of the plating compensating anode 22 is annular, and the annular is sleeved outside the plating compensating workpiece 5 during operation, so that the structure is simple, and the plating compensating effect is improved.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. A localized plating replenishment device for long axis plating a workpiece, comprising:
The top end of the plating supplementing groove (1) is open, the plating supplementing workpiece (5) penetrates through two opposite side walls of the plating supplementing groove (1), and when in plating supplementing, the plating solution submerges the part of the plating supplementing workpiece (5) in the plating supplementing groove (1);
The anode assembly (2) comprises a conductive rod (21) which is spanned above the plating compensating tank (1) and is electrically connected with the positive stage of the power supply, and a plating compensating anode (22) of which the top end is electrically connected with the conductive rod (21); during the plating compensation, the bottom end of the plating compensation anode (22) extends into the plating solution in the plating compensation tank (1);
And two groups of sealing rings (4) are detachably arranged between two side walls corresponding to the plating supplementing workpiece (5) and the plating supplementing groove (1).
2. The partial plating replenishment device for long-axis plating work as claimed in claim 1, wherein the anode assembly (2) further comprises insulating pads (23) provided on opposite sides of the top surface of the replenishment tank (1), and the conductive rod (21) is bridged on the insulating pads (23).
3. The local plating compensating device for long-axis electroplated workpieces according to claim 1, wherein the sealing ring (4) is in sealing sleeve connection with the circumferential side surface of the plating compensating workpiece (5), and the sealing ring (4) is fixedly connected with the side wall of the plating compensating tank (1) through a flange.
4. The partial plating replenishment device for a long-axis plated workpiece according to claim 1, wherein the material of the seal ring (4) is rubber.
5. The local plating replenishment device for long-axis electroplated workpieces according to claim 1, further comprising a plating solution management tank (3), wherein a liquid inlet pipe (11) and a liquid outlet pipe (12) are respectively communicated between the plating solution management tank (3) and the plating replenishment tank (1), a water pump (10) is arranged on the liquid inlet pipe (11), and a valve is arranged on the liquid outlet pipe (12).
6. The local plating replenishment device for long-axis plated workpieces according to claim 5, wherein an overflow pipe (13) is further communicated between the plating solution management tank (3) and the plating replenishment tank (1), and an input end of the overflow pipe (13) is positioned between the top end of the plating replenishment workpiece (5) and the bottom end of the liquid outlet end of the liquid inlet pipe (11).
7. The partial plating replenishment device for a long-axis plated workpiece as recited in claim 5, wherein the plating solution management tank (3) is fixed on a bottom surface of the plating replenishment tank (1).
8. The local plating replenishment device for long-axis plated workpieces according to claim 5, wherein the top surface area of the plating solution management tank (3) is larger than the bottom surface area of the plating replenishment tank (1), the plating replenishment tank (1) is located in the middle of the plating solution management tank (3), and the liquid inlet pipe (11) and the liquid outlet pipe (12) respectively penetrate through the top surface of the plating solution management tank (3).
9. The local plating replenishment device for long-axis electroplated workpieces according to claim 8, wherein one side of the plating replenishment tank (1) is provided with the liquid inlet pipe (11) and the water pump (10), the other side is provided with the liquid discharge pipe (12), and one side, close to the liquid discharge pipe (12), of the top surface of the plating solution management tank (3) is provided with a tank cover (31).
10. The partial plating apparatus for long axis plating work pieces according to any one of claims 1 to 9, wherein the bottom end of the plating anode (22) is annular, and the annular is sleeved outside the plating work piece (5) in operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322868666.6U CN221192387U (en) | 2023-10-25 | 2023-10-25 | Local plating compensating device for long-axis electroplated workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322868666.6U CN221192387U (en) | 2023-10-25 | 2023-10-25 | Local plating compensating device for long-axis electroplated workpiece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221192387U true CN221192387U (en) | 2024-06-21 |
Family
ID=91522645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322868666.6U Active CN221192387U (en) | 2023-10-25 | 2023-10-25 | Local plating compensating device for long-axis electroplated workpiece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221192387U (en) |
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2023
- 2023-10-25 CN CN202322868666.6U patent/CN221192387U/en active Active
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