CN221192312U - Cooling device for vacuum pipeline of LPCVD equipment - Google Patents
Cooling device for vacuum pipeline of LPCVD equipment Download PDFInfo
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- CN221192312U CN221192312U CN202322866679.XU CN202322866679U CN221192312U CN 221192312 U CN221192312 U CN 221192312U CN 202322866679 U CN202322866679 U CN 202322866679U CN 221192312 U CN221192312 U CN 221192312U
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- cooling
- vacuum
- air cooling
- semiconductor
- lpcvd equipment
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- 238000001816 cooling Methods 0.000 title claims abstract description 110
- 238000004518 low pressure chemical vapour deposition Methods 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 238000009423 ventilation Methods 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 35
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a cooling device for a vacuum pipeline of LPCVD equipment, which comprises a vacuum pipeline body, wherein a semiconductor cooling assembly is arranged at the periphery of the vacuum pipeline body, an air cooling assembly is arranged at one side of the semiconductor cooling assembly, and a natural ventilation assembly is arranged at the periphery of the air cooling assembly; the utility model improves the prior art, and solves the problem that the high temperature heat of the tail gas can affect the subsequent work by accumulating a large amount of heat of the tail gas in the vacuum pipeline of the traditional LPCVD equipment through the semiconductor cooling assembly in the actual use. But also solves the problem that most of the vacuum pipelines of the LPCVD equipment can only reduce the temperature of the reaction chamber by a normal-temperature cooling method and can not fully reduce the temperature of the vacuum pipelines of the LPCVD equipment.
Description
Technical Field
The utility model relates to the field of cooling of vacuum pipeline systems of LPCVD equipment, in particular to a cooling device for vacuum pipelines of LPCVD equipment.
Background
LPCVD (low pressure chemical vapor deposition) is a process equipment for forming a thin film on the surface of a silicon wafer by forming a solid reactant through chemical reaction of a gas. The prepared film has the characteristics of excellent quality, good uniformity and high yield, and is widely applied to the preparation of films such as silicon oxide, silicon nitride and polysilicon in microelectronics industry and the like. Under the working condition, a large amount of tail gas heat is accumulated in the vacuum pipeline of the LPCVD equipment, and the high temperature heat can influence the subsequent work. At present, most vacuum pipelines of LPCVD equipment only reduce the temperature of a reaction chamber by a normal-temperature cooling method, and obviously, the temperature of the vacuum pipelines of the LPCVD equipment cannot be sufficiently reduced.
Disclosure of utility model
Technical scheme (one)
In order to solve the problems in the background art, the utility model adopts the following specific technical scheme:
A cooling device for a vacuum pipeline of LPCVD equipment comprises a vacuum pipeline body, wherein a semiconductor cooling assembly is arranged on the periphery of the vacuum pipeline body, an air cooling assembly is arranged on one side of the semiconductor cooling assembly, and a natural ventilation assembly is arranged on the periphery of the air cooling assembly;
In order to achieve the purpose of semiconductor cooling, the semiconductor cooling assembly comprises a cooling installation shell, the cooling installation shell is sleeved on the periphery of a vacuum pipeline body, a liquid inlet pipe is connected above the cooling installation shell, one end of the liquid inlet pipe is connected with a liquid inlet pump, the input end of the liquid inlet pump is connected with a liquid extracting pipe, one end of the liquid extracting pipe is connected with a semiconductor refrigerating sheet embedded in a semiconductor heat exchange box, the top of the semiconductor heat exchange box is connected with a liquid discharge pipe, and one end of the liquid discharge pipe is connected with the bottom of the cooling installation shell.
Further, a multi-control switch is arranged on one side of the semiconductor heat exchange box.
Further, the semiconductor heat exchange box is electrically connected with an external power supply through a multi-control switch.
Further, in order to reach the purpose of forced air cooling, forced air cooling subassembly includes forced air cooling mounting bracket, and forced air cooling mounting bracket is connected with the vacuum duct body, and forced air cooling mounting bracket internally mounted has the fan mounting bracket, and the inside forced air cooling electric fan that is equipped with of fan mounting bracket, forced air cooling mounting bracket bottom are equipped with the forced air cooling support frame.
Further, the air-cooled fan is electrically connected with an external power supply through a multi-control switch.
Further, in order to achieve the purpose of natural ventilation cooling, the natural ventilation assembly comprises a ventilation installation shell, the vacuum pipeline body penetrates through the ventilation installation shell, a ventilation groove is formed in the periphery of the ventilation installation shell, and an installation door is installed on one side of the ventilation installation shell.
Further, a supporting base is fixed at the bottom of the ventilation installation shell.
(II) advantageous effects
Compared with the prior art, the utility model provides a cooling device for a vacuum pipeline of an LPCVD device, which has the following beneficial effects:
(1) The utility model improves the prior art, and solves the problem that a great deal of tail gas heat is accumulated in the vacuum pipeline of the traditional LPCVD equipment and can influence the subsequent work through the semiconductor cooling assembly in the actual use. But also solves the problem that most of the vacuum pipelines of the LPCVD equipment can only reduce the temperature of the reaction chamber by a normal-temperature cooling method and can not fully reduce the temperature of the vacuum pipelines of the LPCVD equipment.
(2) In actual use, through setting up the forced air cooling mounting bracket to reach the purpose of being convenient for install the fan mounting bracket, the forced air cooling electric fan in the fan mounting bracket can carry out the forced air cooling to the vacuum duct body, thereby reaches the purpose that improves the cooling effect, makes the forced air cooling support frame reach the purpose of being convenient for support forced air cooling mounting bracket.
Drawings
FIG. 1 is a schematic view showing a main structure of a cooling apparatus for a vacuum pipe of an LPCVD apparatus according to an embodiment of the present utility model;
FIG. 2 is a perspective view of a cooling apparatus for a vacuum pipe of an LPCVD apparatus according to an embodiment of the present utility model;
FIG. 3 is a schematic view showing the structure of a semiconductor cooling module used in a cooling apparatus in a vacuum line of an LPCVD apparatus according to an embodiment of the present utility model;
Fig. 4 is a schematic view showing a structure of a stroke cooling module in a cooling device for a vacuum line of an LPCVD apparatus according to an embodiment of the utility model.
In the figure:
1. A vacuum pipe body; 2. a semiconductor cooling assembly; 201. cooling the mounting shell; 202. a liquid inlet pipe; 203. a liquid inlet pump; 204. a liquid suction pipe; 205. a semiconductor heat exchange box; 206. a semiconductor refrigeration sheet; 207. a liquid discharge pipe; 3. an air cooling assembly; 301. an air-cooled mounting frame; 302. a fan mounting rack; 303. an air-cooled electric fan; 304. an air-cooled support frame; 4. a natural ventilation assembly; 401. a ventilation mounting housing; 402. a ventilation groove; 403. installing a door; 5. a multi-control switch; 6. and a supporting base.
Detailed Description
For the purpose of further illustrating the concepts of the utility model, there is provided in the drawings, which are a part of the disclosure of the utility model and are primarily intended to illustrate examples and, together with the description, serve to explain the principles of the examples, with reference to the description, wherein elements of the drawings are not drawn to scale and like reference numerals are generally used to designate like elements.
The utility model will be further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1-4, a cooling device for a vacuum pipe of an LPCVD apparatus according to an embodiment of the utility model includes a vacuum pipe body 1, a semiconductor cooling component 2 is disposed at the periphery of the vacuum pipe body 1, an air cooling component 3 is disposed at one side of the semiconductor cooling component 2, and a natural ventilation component 4 is disposed at the periphery of the air cooling component 3.
As shown in fig. 1-4, the semiconductor cooling assembly 2 comprises a cooling installation shell 201, the cooling installation shell 201 is sleeved on the periphery of the vacuum pipeline body 1, a liquid inlet pipe 202 is connected above the cooling installation shell 201, one end of the liquid inlet pipe 202 is connected with a liquid inlet pump 203, the input end of the liquid inlet pump 203 is connected with a liquid extraction pipe 204, one end of the liquid extraction pipe 204 is connected with a semiconductor heat exchange box 205, a semiconductor refrigerating sheet 206 is embedded inside the semiconductor heat exchange box 205, the top of the semiconductor heat exchange box 205 is connected with a liquid discharge pipe 207, one end of the liquid discharge pipe 207 is connected with the bottom of the cooling installation shell 201, a multi-control switch 5 is installed on one side of the semiconductor heat exchange box 205, and the semiconductor heat exchange box 205 is electrically connected with an external power supply through the multi-control switch 5.
Through the above technical scheme, through setting up the feed liquor pump 203 to make the feed liquor pump 203 can be through the coolant liquid input in the drawing liquid pipe 204 with the semiconductor heat exchange box 205 in cooling installation casing 201, at this moment the coolant liquid in the cooling installation casing 201 can carry out heat transfer with vacuum pipeline body 1, later hot water is in flowing back into the semiconductor heat exchange box 205 through the fluid-discharge tube 207, cools off through the semiconductor refrigeration piece 206, so circulated, thereby reaches the purpose of cooling off vacuum pipeline body 1.
As shown in fig. 1-4, the air cooling assembly 3 includes an air cooling installation frame 301, the air cooling installation frame 301 is connected with the vacuum pipeline body 1, a fan installation frame 302 is installed inside the air cooling installation frame 301, an air cooling electric fan 303 is installed inside the fan installation frame 302, an air cooling support frame 304 is installed at the bottom of the air cooling installation frame 301, and the air cooling electric fan 303 is electrically connected with an external power supply through the multi-control switch 5.
Through above-mentioned technical scheme, through setting up forced air cooling mounting bracket 301 to reach the purpose of being convenient for install fan mounting bracket 302, the forced air cooling electric fan 303 in the fan mounting bracket 302 can carry out the forced air cooling to vacuum duct body 1, thereby reaches the purpose that improves the cooling effect, makes forced air cooling support frame 304 reach the purpose of being convenient for support forced air cooling mounting bracket 301.
As shown in fig. 1-4, the natural ventilation assembly 4 comprises a ventilation installation housing 401, the vacuum pipeline body 1 penetrates through the ventilation installation housing 401, a ventilation groove 402 is formed in the periphery of the ventilation installation housing 401, an installation door 403 is installed on one side of the ventilation installation housing 401, and a support base 6 is fixed at the bottom of the ventilation installation housing 401.
Through above-mentioned technical scheme, through setting up ventilation installation casing 401 to reach the purpose of being convenient for install vacuum pipe body 1, reach the purpose that carries out natural cooling to vacuum pipe body 1 through ventilation groove 402, make mounting door 403 reach the purpose of being convenient for switch ventilation installation casing 401, make support base 6 reach the purpose of being convenient for support ventilation installation casing 401.
In order to facilitate understanding of the above technical solutions of the present utility model, the following describes in detail the working principle or operation manner of the present utility model in the actual process.
Working principle: by arranging the liquid inlet pump 203, the liquid inlet pump 203 can input the cooling liquid in the semiconductor heat exchange box 205 into the cooling installation shell 201 through the liquid suction pipe 204, at the moment, the cooling liquid in the cooling installation shell 201 exchanges heat with the vacuum pipeline body 1, then hot water returns to the semiconductor heat exchange box 205 through the liquid discharge pipe 207 and is cooled through the semiconductor refrigerating sheet 206, and the circulation is performed, so that the purpose of cooling the vacuum pipeline body 1 is achieved;
By arranging the air cooling installation frame 301, the purpose of conveniently installing the fan installation frame 302 is achieved, the air cooling electric fan 303 in the fan installation frame 302 can cool the vacuum pipeline body 1, the purpose of improving the cooling effect is achieved, and the air cooling support frame 304 is convenient for supporting the air cooling installation frame 301;
Through setting up ventilation installation casing 401 to reach the purpose of being convenient for install vacuum pipe body 1, reach the purpose that carries out natural cooling to vacuum pipe body 1 through ventilation groove 402, make mounting door 403 reach the purpose of being convenient for switch ventilation installation casing 401, make support base 6 reach the purpose of being convenient for support ventilation installation casing 401.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (7)
1. The cooling device for the vacuum pipeline of the LPCVD equipment is characterized by comprising a vacuum pipeline body (1), wherein a semiconductor cooling component (2) is arranged on the periphery of the vacuum pipeline body (1), an air cooling component (3) is arranged on one side of the semiconductor cooling component (2), and a natural ventilation component (4) is arranged on the periphery of the air cooling component (3);
The semiconductor cooling assembly (2) comprises a cooling installation shell (201), the cooling installation shell (201) is sleeved on the periphery of a vacuum pipeline body (1), a liquid inlet pipe (202) is connected above the cooling installation shell (201), one end of the liquid inlet pipe (202) is connected with a liquid inlet pump (203), the input end of the liquid inlet pump (203) is connected with a liquid suction pipe (204), one end of the liquid suction pipe (204) is connected with a semiconductor heat exchange box (205) and internally inlaid with a semiconductor refrigerating sheet (206), the top of the semiconductor heat exchange box (205) is connected with a liquid discharge pipe (207), and one end of the liquid discharge pipe (207) is connected with the bottom of the cooling installation shell (201).
2. A cooling device for vacuum pipes of an LPCVD equipment according to claim 1, characterized in that a multi-control switch (5) is installed at one side of the semiconductor heat exchanging box (205).
3. A cooling device for vacuum pipes of an LPCVD equipment according to claim 2, characterized in that the semiconductor heat exchange box (205) is electrically connected to an external power source through the multi-control switch (5).
4. A cooling device for a vacuum pipe of an LPCVD equipment according to claim 3, wherein the air cooling assembly (3) comprises an air cooling mounting frame (301), the air cooling mounting frame (301) is connected with the vacuum pipe body (1), a fan mounting frame (302) is mounted inside the air cooling mounting frame (301), an air cooling electric fan (303) is mounted inside the fan mounting frame (302), and an air cooling supporting frame (304) is mounted at the bottom of the air cooling mounting frame (301).
5. The cooling device for vacuum pipes of an LPCVD equipment according to claim 4, wherein the air-cooled electric fan (303) is electrically connected to an external power source through the multi-control switch (5).
6. A cooling device for a vacuum pipe of an LPCVD equipment according to claim 5, characterized in that the natural draft assembly (4) includes a draft mounting housing (401), the vacuum pipe body (1) penetrates through the draft mounting housing (401), a draft groove (402) is provided at the periphery of the draft mounting housing (401), and a mounting door (403) is mounted at one side of the draft mounting housing (401).
7. A cooling device for vacuum pipes of an LPCVD equipment according to claim 6, characterized in that the bottom of the ventilation mounting housing (401) is fixed with a supporting base (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322866679.XU CN221192312U (en) | 2023-10-25 | 2023-10-25 | Cooling device for vacuum pipeline of LPCVD equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322866679.XU CN221192312U (en) | 2023-10-25 | 2023-10-25 | Cooling device for vacuum pipeline of LPCVD equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221192312U true CN221192312U (en) | 2024-06-21 |
Family
ID=91522722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322866679.XU Active CN221192312U (en) | 2023-10-25 | 2023-10-25 | Cooling device for vacuum pipeline of LPCVD equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221192312U (en) |
-
2023
- 2023-10-25 CN CN202322866679.XU patent/CN221192312U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |