CN221157405U - Semiconductor glue gluing mechanism - Google Patents
Semiconductor glue gluing mechanism Download PDFInfo
- Publication number
- CN221157405U CN221157405U CN202322378333.5U CN202322378333U CN221157405U CN 221157405 U CN221157405 U CN 221157405U CN 202322378333 U CN202322378333 U CN 202322378333U CN 221157405 U CN221157405 U CN 221157405U
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- China
- Prior art keywords
- fixedly connected
- driving motor
- stirring
- threaded rod
- spraying mechanism
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- 239000003292 glue Substances 0.000 title claims abstract description 49
- 230000007246 mechanism Effects 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004026 adhesive bonding Methods 0.000 title description 3
- 238000003756 stirring Methods 0.000 claims abstract description 57
- 238000005507 spraying Methods 0.000 claims abstract description 20
- 230000007480 spreading Effects 0.000 claims abstract description 12
- 238000003892 spreading Methods 0.000 claims abstract description 12
- 230000000670 limiting effect Effects 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 8
- 238000010073 coating (rubber) Methods 0.000 abstract description 7
- 239000007921 spray Substances 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Coating Apparatus (AREA)
Abstract
The utility model discloses a semiconductor glue spreading mechanism, which comprises a spraying mechanism and a first driving motor arranged on one side of the spraying mechanism, wherein the first driving motor is arranged on one side of the spraying mechanism; the top of the spraying mechanism is provided with a stirring mechanism, and one side of the stirring mechanism is provided with a second driving motor; further comprises: the spraying mechanism comprises a workbench, the both sides of workstation are provided with the support frame, the first electric telescopic handle is installed to the both ends symmetry at support frame top, two the output fixedly connected with connecting block of first electric telescopic handle can be convenient for the rubber coating of semiconductor through setting up the spraying mechanism, drive first threaded rod through first driving motor and rotate, utilize the screw thread effect between first threaded rod and the first thread bush to drive the gluey shower nozzle of point and control and remove, can carry out the rubber coating to the semiconductor of different positions, utilize the pin to glue the cooperation between the shower nozzle with the point, can avoid the tip of point to glue the shower nozzle to take place to block up.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor glue spreading mechanism.
Background
A semiconductor refers to a material having conductivity between that of a conductor and an insulator at normal temperature. Semiconductors are widely used in radio, television and temperature measurement, for example, diodes are devices fabricated using semiconductors, which are materials of great importance from a technological or economic standpoint, in which the electrical conductivity is controlled from an insulator to a conductor.
The glue spreading mechanism for the current semiconductor packaging equipment is provided with a glue storage barrel, a stirring device is usually arranged in the glue storage barrel, glue is prevented from being solidified in the glue storage barrel, but in the stirring process, glue in the glue storage barrel moves towards the side wall of the glue storage barrel under the action of centrifugal force, stirring cannot be fully carried out, agglomeration is easy to occur, the agglomeration glue is easy to sink, and further the glue spreading device is blocked after the glue is sucked into the glue receiving group, so that the normal use of the glue spreading device is influenced, and the glue spreading mechanism for the semiconductor glue is provided, so that the problem set forth in the above is solved.
Disclosure of utility model
The technical problems to be solved by the utility model are as follows: along with stirring in-process, deposit the rubber coating in the gluey bucket under the effect of centrifugal force, remove to depositing the lateral wall of gluey bucket, can not fully stir, and then take place the caking easily, and the rubber coating of caking takes place the bottom very easily, and then leads to the rubber coating device to take place to block up after the rubber coating of inhaling the grafting, and then influences the normal use of rubber coating device.
The aim of the utility model can be achieved by the following technical scheme:
a semiconductor glue spreading mechanism comprises a spraying mechanism and a first driving motor arranged on one side of the spraying mechanism;
the top of the spraying mechanism is provided with a stirring mechanism, and one side of the stirring mechanism is provided with a second driving motor;
Further comprises:
The spraying mechanism comprises a workbench, the both sides of workstation are provided with the support frame, the both ends symmetry at support frame top is installed first electric telescopic handle, two the output fixedly connected with connecting block of first electric telescopic handle, one side and the first driving motor fixed connection of connecting block, the output of first driving motor runs through connecting block and the first threaded rod of fixedly connected with, the one end and the connecting block rotation connection of first driving motor are kept away from to first threaded rod, the outside threaded connection of first threaded rod has first thread bush, the inside sliding connection at first thread bush top has the guide arm, the both ends and the connecting block fixed connection of guide arm, the bottom fixedly connected with link of first thread bush, the one end fixedly connected with point gum spray head of first thread bush is kept away from to the link, the central point of link bottom puts the second electric telescopic handle, the output fixedly connected with pin of second electric telescopic handle, the outside and the point gum spray head sliding connection of pin.
As a further scheme of the utility model: the stirring mechanism comprises a stirring chamber, the bottom of the stirring chamber is fixedly connected with a support frame, a hose is fixedly connected to the bottom of the stirring chamber, one end of the hose, away from the stirring chamber, penetrates through the support frame and is fixedly connected with a dispensing nozzle, and a support is fixedly connected to the top of the stirring chamber.
As a further scheme of the utility model: one side of support and second driving motor fixed connection, the output of second driving motor runs through the support and fixedly connected with roller, the outside sliding connection of roller has the limiting plate, the top and the support fixed connection of limiting plate, the one end sliding connection that second driving motor was kept away from to the roller has first helical gear, one side meshing of first helical gear is connected with the second helical gear.
As a further scheme of the utility model: the inside central point of second helical gear puts fixedly connected with (mixing) shaft, the one end that the second helical gear was kept away from to the (mixing) shaft runs through the teeter chamber and fixedly connected with a plurality of stirring leaf, the number of stirring leaf is three group, and stirring leaf evenly distributed is in the outside of (mixing) shaft bottom, the outside laminating that the roller is close to second driving motor one end is connected with the belt, the one end laminating that the roller was kept away from to the belt is connected with the second threaded rod, the both ends and the support rotation of second threaded rod are connected, the outside and the limiting plate rotation of second threaded rod are connected, the outside threaded connection of second threaded rod has the second thread bush, the bottom fixedly connected with L template of second thread bush, one side and the first helical gear rotation of L template are connected, the opposite side and the second helical gear rotation of L template are connected.
The utility model has the beneficial effects that:
1. The spraying mechanism is arranged, so that the glue of the semiconductor can be conveniently coated, the first threaded rod is driven to rotate by the first driving motor, the glue dispensing spray nozzle is driven to move left and right by utilizing the threaded action between the first threaded rod and the first threaded sleeve, the glue can be coated on the semiconductor at different positions, and the end part of the glue dispensing spray nozzle can be prevented from being blocked by utilizing the cooperation between the stop lever and the glue dispensing spray nozzle;
2. Can avoid glue caking through setting up rabbling mechanism, drive the roller through the second driving motor and rotate, utilize the meshing effect between first helical gear and the second helical gear, thereby drive the (mixing) shaft and rotate, can stir glue, utilize the synchronizing action of belt, thereby drive the second threaded rod and rotate, utilize the screw thread fit between second threaded rod and the second thread bush, thereby drive the left and right sides removal of (mixing) shaft, can avoid glue to receive under the effect of centrifugal force, rotate to the lateral wall of teeter chamber, lead to the caking that the stirring unevenly caused.
Drawings
The utility model is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the internal structure of the dispensing nozzle of the present utility model;
FIG. 3 is an enlarged schematic view of the stirring mechanism of FIG. 1 according to the present utility model;
FIG. 4 is a schematic diagram of the whole structure of the stirring mechanism in the utility model.
In the figure: 1. a spraying mechanism; 101. a work table; 102. a support frame; 103. a first electric telescopic rod; 104. a connecting block; 105. a first driving motor; 106. a first threaded rod; 107. a first threaded sleeve; 108. a guide rod; 109. a connecting frame; 110. dispensing spray heads; 111. a second electric telescopic rod; 112. a stop lever; 2. a stirring mechanism; 201. a stirring chamber; 202. a hose; 203. a bracket; 204. a second driving motor; 205. a roll shaft; 206. a limiting plate; 207. a first helical gear; 208. a second helical gear; 209. a stirring shaft; 210. stirring the leaves; 211. a belt; 212. a second threaded rod; 213. a second threaded sleeve; 214. an L-shaped plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-4, a semiconductor glue spreading mechanism comprises a spraying mechanism 1 and a first driving motor 105 arranged on one side of the spraying mechanism 1; the top of the spraying mechanism 1 is provided with a stirring mechanism 2, and one side of the fan blade adjusting mechanism 2 is provided with a second driving motor 204; the spraying mechanism 1 comprises a workbench 101, wherein supporting frames 102 are arranged on two sides of the workbench 101, first electric telescopic rods 103 are symmetrically arranged at two ends of the top of the supporting frames 102, connecting blocks 104 are fixedly connected to the output ends of the two first electric telescopic rods 103, and the height of the dispensing nozzle 110 can be changed by arranging the first electric telescopic rods 103; one side of the connecting block 104 is fixedly connected with the first driving motor 105, the output end of the first driving motor 105 penetrates through the connecting block 104 and is fixedly connected with a first threaded rod 106, one end, far away from the first driving motor 105, of the first threaded rod 106 is rotationally connected with the connecting block 104, and the first threaded rod 106 can be driven to rotate by arranging the first driving motor 105; the outer side of the first threaded rod 106 is in threaded connection with a first threaded sleeve 107, a guide rod 108 is slidably connected to the inside of the top of the first threaded sleeve 107, two ends of the guide rod 108 are fixedly connected with the connecting block 104, and the limiting effect of the guide rod 108 on the first threaded sleeve 107 is utilized, and meanwhile, the first threaded rod 106 and the first threaded sleeve 107 are in threaded action, so that the dispensing nozzle 110 is driven to move left and right; the bottom of the first thread bush 107 is fixedly connected with a connecting frame 109, one end of the connecting frame 109 far away from the first thread bush 107 is fixedly connected with a dispensing spray head 110, the center position of the bottom of the connecting frame 109 is fixedly connected with a second electric telescopic rod 111, the output end of the second electric telescopic rod 111 is fixedly connected with a stop lever 112, the outer side of the stop lever 112 is in sliding connection with the dispensing spray head 110, the stop lever 112 can be driven to move up and down by arranging the second electric telescopic rod 111, and the amount of glue discharged at one time can be controlled by the time of upward movement of the stop lever 112;
The stirring mechanism 2 comprises a stirring chamber 201, the bottom of the stirring chamber 201 is fixedly connected with a support frame 102, a hose 202 is fixedly connected to the bottom of the stirring chamber 201, one end of the hose 202, which is far away from the stirring chamber 201, penetrates through the support frame 102 and is fixedly connected with the dispensing nozzle 110, a bracket 203 is fixedly connected to the top of the stirring chamber 201, and the stirring chamber 201 and the dispensing nozzle 110 can be connected through the hose 202;
One side of the bracket 203 is fixedly connected with the second driving motor 204, the output end of the second driving motor 204 penetrates through the bracket 203 and is fixedly connected with a roll shaft 205, the outer side of the roll shaft 205 is slidably connected with a limiting plate 206, the top of the limiting plate 206 is fixedly connected with the bracket 203, one end of the roll shaft 205, which is far away from the second driving motor 204, is slidably connected with a first bevel gear 207, one side of the first bevel gear 207 is in meshed connection with a second bevel gear 208, and the meshing effect between the first bevel gear 207 and the second bevel gear 208 is utilized to drive a stirring shaft 209 to rotate so as to stir glue;
The inside central point of second helical gear 208 puts fixedly connected with (mixing) shaft 209, the one end that second helical gear 208 was kept away from to (mixing) shaft 209 runs through teeter chamber 201 and fixedly connected with a plurality of stirring leaf 210, the number of stirring leaf 210 is three, and stirring leaf 210 evenly distributed is in the outside of (mixing) shaft 209 bottom, the outside laminating of roller 205 near second driving motor 204 one end is connected with belt 211, utilize the synchro effect of belt 211, thereby drive second threaded rod 212 and roller 205 and rotate simultaneously, the one end laminating of roller 205 is kept away from to belt 211 is connected with second threaded rod 212, the both ends of second threaded rod 212 are connected with support 203 rotation, the outside of second threaded rod 212 is connected with limiting plate 206 rotation, the outside threaded connection of second threaded rod 212 has second thread bush 213, utilize the screw fit between second threaded rod 212 and the second thread bush 213, thereby drive the left and right sides of (mixing) shaft 209) remove, the bottom fixedly connected with L template 214 of second thread bush 213, one side and the first helical gear 207 rotate with second template 214, the opposite side and second template 208 rotate and are connected, through setting up L template 214, can stabilize the rotation of first helical gear 207 and remove.
The working principle of the utility model is as follows:
Before the semiconductor glue gluing mechanism is used, the whole condition of the device needs to be checked firstly to ensure that normal work can be carried out, glue is poured into a stirring chamber 201 from a feed inlet, and then a second driving motor 204 is started to drive a roll shaft 205 to rotate, the stirring shaft 209 is driven to rotate by utilizing the meshing effect between a first bevel gear 207 and a second bevel gear 208, the glue can be stirred, a second threaded rod 212 and the roll shaft 205 are driven to rotate simultaneously by utilizing the synchronous effect of a belt 211, and the left and right movement of the stirring shaft 209 is driven by utilizing the threaded fit between the second threaded rod 212 and a second threaded sleeve 213, so that caking caused by uneven stirring can be avoided due to the fact that the glue rotates towards the side wall of the stirring chamber under the action of centrifugal force;
Secondly, when the semiconductor is required to be glued, the first driving motor 105 is started to drive the first threaded rod 106 to rotate, the glue dispensing nozzle 110 is driven to move left and right by utilizing the threaded action between the first threaded rod 106 and the first threaded sleeve 107, the glue dispensing nozzle 110 is moved to a designated position, then the first electric telescopic rod 103 is started to drive the glue dispensing nozzle 110 to move up and down, then the second electric telescopic rod 111 is started to drive the stop lever 112 to move up and down, glue can be discharged when the stop lever 112 ascends, glue discharge is stopped when the stop lever 112 descends, and meanwhile, the stop lever 112 and the glue dispensing nozzle 110 are matched, so that the end part of the glue dispensing nozzle 110 can be prevented from being blocked.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (4)
1. The semiconductor glue spreading mechanism comprises a spraying mechanism (1) and a first driving motor (105) arranged on one side of the spraying mechanism (1);
The top of the spraying mechanism (1) is provided with a stirring mechanism (2), and one side of the stirring mechanism (2) is provided with a second driving motor (204);
Characterized by further comprising:
The spraying mechanism (1) comprises a workbench (101), two sides of the workbench (101) are provided with a supporting frame (102), two ends of the top of the supporting frame (102) are symmetrically provided with a first electric telescopic rod (103), two output ends of the first electric telescopic rod (103) are fixedly connected with a connecting block (104), one side of the connecting block (104) is fixedly connected with a first driving motor (105), the output end of the first driving motor (105) penetrates through the connecting block (104) and is fixedly connected with a first threaded rod (106), one end of the first threaded rod (106) far away from the first driving motor (105) is rotationally connected with the connecting block (104), the outer side of the first threaded rod (106) is in threaded connection with a first thread bush (107), the inner part of the top of the first thread bush (107) is in sliding connection with a guide rod (108), two ends of the guide rod (108) are fixedly connected with the connecting block (104), the bottom of the first thread bush (107) is fixedly connected with a connecting frame (109), one end of the connecting frame (109) far away from the first thread bush (105) is fixedly connected with a second threaded rod (111), one end of the second threaded rod (107) is fixedly connected with a second threaded rod (111), the outer side of the stop lever (112) is in sliding connection with the dispensing nozzle (110).
2. The semiconductor glue spreading mechanism according to claim 1, wherein the stirring mechanism (2) comprises a stirring chamber (201), the bottom of the stirring chamber (201) is fixedly connected with a support frame (102), a hose (202) is fixedly connected to the bottom of the stirring chamber (201), one end, far away from the stirring chamber (201), of the hose (202) penetrates through the support frame (102) and is fixedly connected with a glue dispensing nozzle (110), and a support (203) is fixedly connected to the top of the stirring chamber (201).
3. The semiconductor glue spreading mechanism according to claim 2, wherein one side of the bracket (203) is fixedly connected with the second driving motor (204), an output end of the second driving motor (204) penetrates through the bracket (203) and is fixedly connected with a roll shaft (205), a limiting plate (206) is slidably connected to the outer side of the roll shaft (205), the top of the limiting plate (206) is fixedly connected with the bracket (203), one end, far away from the second driving motor (204), of the roll shaft (205) is slidably connected with a first bevel gear (207), and one side of the first bevel gear (207) is connected with a second bevel gear (208) in a meshed manner.
4. A semiconductor glue spreading mechanism according to claim 3, wherein the inside central point of second helical gear (208) puts fixedly connected with (209) stirring shaft, stirring shaft (209) is kept away from the one end of second helical gear (208) and is run through teeter chamber (201) and fixedly connected with a plurality of stirring leaf (210), the number of stirring leaf (210) is three, and stirring leaf (210) evenly distributed is in the outside of (209) bottom of (209), the outside laminating of roller (205) near second driving motor (204) one end is connected with belt (211), the one end laminating that roller (205) was kept away from to belt (211) is connected with second threaded rod (212), the both ends and the support (203) of second threaded rod (212) rotate and are connected with limiting plate (206), the outside threaded connection of second threaded rod (212) has second thread bush (213), the bottom fixedly connected with L (214) of second thread bush (213), L (214) is kept away from the one end laminating of roller (205) is connected with second helical gear (208) and rotates with second helical gear (214).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322378333.5U CN221157405U (en) | 2023-09-01 | 2023-09-01 | Semiconductor glue gluing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322378333.5U CN221157405U (en) | 2023-09-01 | 2023-09-01 | Semiconductor glue gluing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221157405U true CN221157405U (en) | 2024-06-18 |
Family
ID=91436309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322378333.5U Active CN221157405U (en) | 2023-09-01 | 2023-09-01 | Semiconductor glue gluing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221157405U (en) |
-
2023
- 2023-09-01 CN CN202322378333.5U patent/CN221157405U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |