CN221127592U - PCB batch production carrier suitable for multiple sizes - Google Patents
PCB batch production carrier suitable for multiple sizes Download PDFInfo
- Publication number
- CN221127592U CN221127592U CN202322597230.8U CN202322597230U CN221127592U CN 221127592 U CN221127592 U CN 221127592U CN 202322597230 U CN202322597230 U CN 202322597230U CN 221127592 U CN221127592 U CN 221127592U
- Authority
- CN
- China
- Prior art keywords
- carrier
- pcb
- adhesive tape
- grooves
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010923 batch production Methods 0.000 title claims abstract description 10
- 239000002390 adhesive tape Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention belongs to the field of printed board mounting, and particularly relates to a PCB batch production carrier suitable for multiple sizes, which comprises: MARK points are arranged on the carrier, so that the identification and positioning of the printing patch equipment are ensured; the fixture is provided with a plurality of positioning grooves, adhesive tape grooves and double-sided high-temperature adhesive tapes; the positioning grooves are distributed in an array in the carrier, and the positioning grooves are arrayed in parallel in a balanced direction; the adhesive tape grooves are vertically and uniformly arranged on the carrier, and the adhesive tape grooves are mutually perpendicular to the positioning grooves; the positioning groove is used for determining the position of the PCB, and the double-sided high-temperature adhesive tape is arranged in the adhesive tape groove and used for fixing the PCB; the invention ensures the machine mounting of small-size non-jointed printed boards through the array type positioning grooves, increases the single mounting quantity of the printed boards, can be suitable for batch production of the multi-size printed boards within a certain range, has no jointed design requirement on the printed boards, and improves the production efficiency of products.
Description
Technical Field
The invention belongs to the field of printed board mounting, and particularly relates to a PCB batch production carrier suitable for multiple sizes.
Background
With the evolution of the continuous development of electronic products, the printing demands of small-batch and small-size circuit boards are continuously increasing no matter for the development of new products or the production of old products. In SMT production, good positioning and supporting of the printed board is a key for guaranteeing the printing and mounting quality. For a printed board with lower rigidity, the printed board is easy to warp and deform due to clamping of equipment rails, pressure of a scraper and pressure of a suction nozzle, so that the problems of bad printed patterns of solder paste, low component mounting precision, damage to components and the like are caused. Therefore, the small and thin printed board is difficult to meet the clamping requirement of an automatic equipment rail, the printing and mounting precision cannot be ensured, and the mounting quality and the production efficiency of the product are adversely affected. The existing carrier has the characteristic of strong specificity, so that the existing carrier cannot meet the use requirements of various printed boards, and the problem of extremely increased production and manufacturing cost is caused due to low utilization rate of the carrier.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a PCB batch carrier suitable for multiple sizes, the apparatus comprising: a plurality of positioning grooves, adhesive tape grooves and double-sided high-temperature adhesive tapes are respectively arranged on the carrier; the positioning grooves are distributed in an array in the carrier, and the positioning grooves are arrayed in parallel in a balanced direction; the adhesive tape grooves are vertically and uniformly arranged on the carrier, and the adhesive tape grooves are mutually perpendicular to the positioning grooves; the positioning groove is used for determining the position of the PCB, and the double-sided high-temperature adhesive tape is arranged in the adhesive tape groove and used for fixing the PCB.
Preferably, the carrier is further provided with a plurality of hollow holes, and the hollow holes are uniformly formed in the positioning groove.
Preferably, a plurality of limiting blocks are arranged in the positioning groove, and each limiting block is uniformly arranged in the positioning groove and used for limiting the position of the PCB.
Preferably, MARK points are arranged on four vertex angles of the carrier, and the MARK points are used for identifying and correcting the printed board array.
The invention has the beneficial effects that:
the invention provides a PCB batch production carrier suitable for multiple sizes, which increases the single mounting quantity of printed boards through an array type positioning groove and provides support and positioning for producing the printed boards; the carrier is suitable for mass production of multi-size printed boards in a certain range, improves the production efficiency of products, and saves the manufacturing cost of the carrier.
Drawings
FIG. 1 is a diagram of a carrier according to the present utility model;
Fig. 2 is a partial view of a carrier according to the present utility model.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In one embodiment, as shown in fig. 1 and 2, the apparatus comprises: a plurality of positioning grooves, adhesive tape grooves and double-sided high-temperature adhesive tapes are respectively arranged on the carrier; the positioning grooves are distributed in an array in the carrier, and the positioning grooves are arrayed in parallel in a balanced direction; the adhesive tape grooves are vertically and uniformly arranged on the carrier, and the adhesive tape grooves are mutually perpendicular to the positioning grooves; the positioning groove is used for determining the position of the PCB, and the double-sided high-temperature adhesive tape is arranged in the adhesive tape groove and used for fixing the PCB.
Optionally, the carrier is made of high-temperature-resistant, wear-resistant and non-deformable materials, and the size of the carrier meets the clamping requirement of the equipment transportation rail.
In this embodiment, a carrier suitable for multi-size PCB batch production is provided with a positioning groove, a glue groove, a hollowed-out hole and MARK points. Wherein: the positioning grooves are arranged in an array at the center of the carrier, and the size is not required. Generally, the plane of the positioning groove is slightly larger than the size of a common printed board, and the depth is slightly lower than the thickness of the printed board. The adhesive tape grooves are arranged in longitudinal rows on the surface of the carrier, and the groove depth is about 0.1 mm. The hollowed holes are uniformly distributed on the carrier, and the diameter is about 3 mm. And the MARK is used for positioning correction of the carrier in the mounting process by adopting laser to burn or coat gold dots with diameters of 2mm at four corners of the carrier.
In the embodiment, the carrier is further provided with a plurality of hollowed holes, and the hollowed holes are uniformly formed in the positioning groove; the arrangement of the hollowed-out holes ensures the light weight of the fixture, and the printed board is heated more efficiently in the reflow soldering process.
In this embodiment, a plurality of limiting blocks are disposed in the positioning groove, and each limiting block is uniformly disposed in the positioning groove and used for limiting the position of the PCB board.
The carrier designed by the scheme is suitable for small-size printed boards, the printed boards are placed in the positioning grooves, the edges of the printed boards are tightly abutted against the X/Y axis positioning edges of the positioning grooves, and the array ordered arrangement of the printed boards on the carrier is ensured. The high-temperature double-sided adhesive tape is stuck in the adhesive tape groove, so that the printed board and the carrier are adhered and fixed, the printed board and the carrier are prevented from being displaced, and the positioning accuracy of the printed board in the printing and mounting process is ensured. The MARK on the carrier can enable the equipment to identify and correct the printed board array, and the consistency of mass production of products is ensured.
In the description of the present invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "another end," "upper," "one side," "top," "inner," "outer," "front," "center," "two ends," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the invention.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "rotated," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A PCB batch carrier adapted for multiple sizes, comprising: the PCB batch production carrier is integrally formed, and a plurality of positioning grooves, adhesive tape grooves and double-sided high-temperature adhesive tapes are arranged on the carrier; the positioning grooves are distributed in an array in the carrier, and each positioning groove is parallel to each other and is arranged in a balanced direction; the adhesive tape grooves are vertically and uniformly arranged on the carrier, and the adhesive tape grooves are mutually perpendicular to the positioning grooves; the positioning groove is used for determining the position of the PCB, and the double-sided high-temperature adhesive tape is arranged in the adhesive tape groove and used for fixing the PCB.
2. The PCB batch production carrier suitable for multiple sizes according to claim 1, wherein the carrier is further provided with a plurality of hollowed holes, and the hollowed holes are uniformly formed in the positioning groove.
3. The PCB batch production carrier suitable for multiple sizes according to claim 1, wherein a plurality of limiting blocks are arranged in the positioning groove, and each limiting block is uniformly arranged in the positioning groove and used for limiting the position of the PCB.
4. The PCB batch carrier of claim 1, wherein MARK points are disposed on four corners of the carrier, and the MARK points are used for identifying and correcting the printed board array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322597230.8U CN221127592U (en) | 2023-09-22 | 2023-09-22 | PCB batch production carrier suitable for multiple sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322597230.8U CN221127592U (en) | 2023-09-22 | 2023-09-22 | PCB batch production carrier suitable for multiple sizes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221127592U true CN221127592U (en) | 2024-06-11 |
Family
ID=91363200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322597230.8U Active CN221127592U (en) | 2023-09-22 | 2023-09-22 | PCB batch production carrier suitable for multiple sizes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221127592U (en) |
-
2023
- 2023-09-22 CN CN202322597230.8U patent/CN221127592U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |