CN221127333U

CN221127333U - Electronic equipment

Info

Publication number: CN221127333U
Application number: CN202322764196.9U
Authority: CN
Inventors: 徐治效; 郗娇娇; 杨江涛
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-10-13
Filing date: 2023-10-13
Publication date: 2024-06-11
Anticipated expiration: 2033-10-13

Abstract

The application provides an electronic device. The electronic equipment comprises a first shell, a second shell, a first folding mechanism, a first circuit board, a second circuit board, a first trans-axial circuit board, a first chip and a second chip, wherein the first folding mechanism is connected with the first shell and the second shell. The first circuit board is fixed on the first shell, and the second circuit board is fixed on the second shell. The first plate part of the first trans-axle circuit board is positioned at the first shell, and the third plate part of the first trans-axle circuit board is positioned at the second shell and is electrically connected with the second circuit board. The first chip is fixed on the first circuit board and is electrically connected with the first circuit board, the second chip is fixed on the first board and is electrically connected with the first board, and the second chip is connected with the first chip in a wireless communication mode so that the first board is electrically connected with the first circuit board. In the folding or flattening process of the electronic equipment, the first plate part of the first trans-axis circuit board can move, so that the fracture risk of the first trans-axis circuit board is reduced, and the reliability of the electronic equipment is improved.

Description

Electronic equipment

Technical Field

The present disclosure relates to foldable electronic devices, and particularly to an electronic device.

Background

With the development of technology and the market demand of electronic devices, foldable electronic devices are increasingly used. Foldable electronic devices generally include a first housing, a second housing, and a folding mechanism, where the first housing and the second housing are connected by the folding mechanism, and the electronic device is folded or flattened by the first housing and the second housing approaching or moving away from the folding mechanism. Devices are uniformly distributed on two sides of the foldable electronic equipment, and in order to realize functions of lighting the inner screen and the outer screen, antenna signal layout and the like, signal communication between the first shell and the second shell must be realized through a circuit.

The signal transmission of the first shell and the second shell is realized by connecting a main board and an auxiliary board of the electronic equipment through a flexible circuit board, and two ends of the flexible circuit board are respectively fixedly connected with the main board and the auxiliary board through BTB and other electric connectors. The flexible circuit board may also buckle during the unfolding or closing of the foldable electronic device. Because both ends of the flexible circuit board are fixedly connected to the circuit board, the space for the flexible circuit board to dislocate is smaller, when the folding times of the flexible circuit board are increased, the risk of the flexible circuit board breaking is increased, so that the normal operation of the foldable electronic equipment is influenced, and the reliability of the foldable electronic equipment is reduced.

Disclosure of utility model

The application aims to provide electronic equipment, and a trans-axis circuit board of the electronic equipment is not easy to break and has better reliability.

The application provides an electronic device. The electronic equipment comprises a first shell, a second shell, a first folding mechanism, a first circuit board, a second circuit board and a first trans-axial circuit board, wherein the first folding mechanism is connected with the first shell and the second shell, and the first folding mechanism can drive the first shell and the second shell to be unfolded and closed relatively. The first circuit board is fixed on the first shell, and the second circuit board is fixed on the second shell.

The first trans-axle circuit board comprises a first board part, a second board part and a third board part which are connected in sequence. It will be appreciated that the first plate portion, the second plate portion and the third plate portion may be mechanically connected in sequence in construction. The first plate portion, the second plate portion, and the third plate portion may be electrically connected in order on signal transmission.

The first plate part is positioned on the first shell, and the third plate part is positioned on the second shell and is electrically connected with the second circuit board. The electronic equipment further comprises a first chip and a second chip, wherein the first chip is fixed on the first circuit board and is electrically connected with the first circuit board, the second chip is fixed on the first board and is electrically connected with the first board, and the second chip is in wireless communication connection with the first chip so that the first board is electrically connected with the first circuit board.

It can be appreciated that, since the first circuit board is connected to the first trans-axis circuit board through the wireless communication between the first chip and the second chip, there is no fixed connection between the first circuit board and the first trans-axis circuit board. In this way, in the folding or flattening process of the electronic equipment, the first plate part of the first trans-axle circuit board can move to solve the problem of deformation of the first trans-axle circuit board caused by pulling, so that the risk of breakage of the first trans-axle circuit board after the folding times are increased is reduced, and the reliability of the electronic equipment is improved.

In a possible implementation, the first chip and the second chip are disposed opposite to each other, and a distance between the first chip and the second chip is in a range of 5mm to 15 mm in a thickness of the electronic device. It can be understood that the distance between the first chip and the second chip is smaller, so that signal transmission between the first chip and the second chip is enhanced, and the reliability of wireless communication between the chips is improved.

In a possible implementation manner, the electronic device further includes a third chip and a fourth chip, where the third chip is fixed on the second circuit board and electrically connected to the second circuit board, the fourth chip is fixed on the third board portion and electrically connected to the third board portion, and the fourth chip is connected to the third chip in a wireless communication manner.

It is understood that the second circuit board can be connected to the first trans-axis circuit board through wireless communication between the third chip and the fourth chip. The first trans-axis circuit board can be connected to the first circuit board through wireless communication between the third chip and the fourth chip. In this way, the first circuit board can be connected to the second circuit board through the third chip, the fourth chip, the first trans-axis circuit board, and the third chip and the fourth chip in a wireless communication manner, so that the third board part is electrically connected with the second circuit board.

It can be understood that, since the second circuit board is connected to the first trans-axis circuit board through the third chip and the fourth chip in a wireless communication manner, there is no fixed connection between the second circuit board and the first trans-axis circuit board, that is, a portion of the first trans-axis circuit board close to the second circuit board is a free portion. Therefore, in the folding or flattening process of the electronic equipment, the third plate part of the first trans-axle circuit board can move to solve the problem of deformation of the first trans-axle circuit board caused by pulling, so that the risk of breakage of the first trans-axle circuit board after the folding times are increased is reduced, and the stability and reliability of the electronic equipment are improved.

In a possible implementation manner, the electronic device further includes an electrical connector fixed between the third board portion and the second circuit board, and the third board portion is electrically connected to the second circuit board through the electrical connector. It can be understood that the first trans-axis circuit board can be connected with the second circuit board through wireless communication through the electric connector, and the electric connector enables signal transmission between the first trans-axis circuit board and the second circuit board to be more stable, and stability of the electronic equipment is improved.

In a possible implementation manner, the electronic device further includes a bracket, wherein the middle part of the bracket is located at one side of the third board part far away from the second circuit board, and two ends of the bracket are fixed on the second circuit board; the bracket is used for applying pressure to the third plate part so as to press the electric connector on the second circuit board through the third plate part. It can be understood that the support is used for exerting pressure to first striding the axle circuit board to press electric connector on the second circuit board through first striding the axle circuit board, thereby guarantee on the one hand that the public seat of electric connector is connected with electric connector's female seat is stable, guarantee normal wireless communication connection between first striding the axle circuit board and the second circuit board, and then guarantee signal transmission between first circuit board and the second circuit board, improved electronic equipment's stability and reliability, on the other hand guarantee that electric connector is difficult to drop from second circuit board and first striding the axle circuit board.

In a possible implementation manner, the first shell comprises a first frame, a first middle plate and a first rear cover, the first middle plate and the first rear cover are connected to the inner side of the first frame along the thickness direction of the electronic equipment, and at least part of the first middle plate is opposite to the first rear cover and is arranged at intervals; a part of the first frame, a part of the first middle plate and a part of the first rear cover enclose a first accommodating space, the first circuit board and the first chip are located in the first accommodating space, and the first plate part and the second chip are located on one side, back to the first accommodating space, of the first middle plate. It will be appreciated that the first midplane separates the first chip and the second chip from the external environment, ensuring that normal signal transmissions of the first chip and the second chip are not disturbed by external signals.

In one possible implementation, the first middle plate has a first insulating portion, and the first insulating portion is located between the first chip and the second chip. It can be understood that the material of the first insulating part is plastic or other materials which can not shield or interfere wireless signals, namely, the first insulating part between the first chip and the second chip can not generate shielding effect or interference on communication transmission between the first chip and the second chip, normal communication connection between the first circuit board and the first trans-axis circuit board is not influenced, normal signal transmission between the first circuit board and the second circuit board is ensured, and normal operation of each device in the first accommodating space of the first shell and the second accommodating space of the second shell is ensured, and stability and reliability of the electronic equipment are further ensured.

In a possible implementation manner, the first insulating portion is provided with a first concave region, an opening of the first concave region faces the first accommodating space, and at least part of the first chip is located in the first concave region. In this embodiment, the first chip may be further located in the first recess region of the first insulating portion. It can be understood that the first chip can utilize the space of the first middle plate in the thickness direction (i.e. the Z-axis direction) of the electronic device, and at this time, the thickness of the electronic device in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device.

In a possible implementation manner, the first insulating portion is provided with a second concave region, an opening of the second concave region faces away from one side of the first accommodating space, and at least part of the second chip is located in the second concave region. It can be understood that the second chip can utilize the space of the first middle plate in the thickness direction (i.e. the Z-axis direction) of the electronic device, and at this time, the thickness of the electronic device in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device.

In one possible implementation manner, the first middle plate is provided with a first groove, an opening of the first groove faces away from one side of the first accommodating space, and at least part of the first plate portion of the first trans-axis circuit board is located in the first groove. It can be understood that the first board portion of the first trans-axis circuit board can utilize the space of the first groove in the thickness direction (i.e., the Z-axis direction) of the electronic device, and at this time, the thickness of the electronic device in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device.

In a possible implementation manner, the electronic device further includes a flexible screen, where the flexible screen includes a first display area, a second display area, and a third display area that are sequentially connected. The first display area of the flexible screen is fixed on the first shell, and the third display area is fixed on the second shell; the first plate part of the first trans-axle circuit board is positioned between the first shell and the first display area, the second plate part of the first trans-axle circuit board is positioned between the first folding mechanism and the second display area, and the third plate part of the first trans-axle circuit board is positioned between the second shell and the third display area. It can be appreciated that in this embodiment, by arranging the second board portion of the first trans-axis circuit board between the first folding mechanism and the second display area, the first trans-axis circuit board does not need to pass through the first folding mechanism any more, and the first folding mechanism can be narrowed and thinned, so as to realize the light and thin arrangement of the electronic device. Therefore, the first span shaft circuit board and the first folding mechanism are two independent structural members, the first span shaft circuit board does not need to be folded in order to penetrate through the first folding mechanism, the reliability of the first span shaft circuit board is guaranteed, and the service life of the first span shaft circuit board is prolonged. On the one hand, the assembly difficulty of the first trans-axis circuit board and the first folding mechanism can be reduced, and the cost investment is reduced. On the other hand, when needing to maintain and change first axle circuit board that strides, need not carry out relevant dismantlement operation to first folding mechanism, can avoid damaging first folding mechanism's risk, simplify maintenance operation, reduce the maintenance degree of difficulty, practice thrift cost of maintenance. The maintenance or replacement of the first trans-axle circuit board and the maintenance or replacement of the first folding mechanism can not interfere with each other, and the recycling rate of the components is improved.

In a possible implementation manner, the electronic device further includes a glue layer, where the glue layer connects the third board portion of the first trans-axis circuit board and the third display area. It can be understood that at least part of the third board portion of the first shaft-spanning circuit board is fixed on the flexible screen, and in the processes of folding, flattening and the like of the electronic equipment, the third board portion of the first shaft-spanning circuit board can be stably connected with the flexible screen, and the third board portion is not easy to fall off from the flexible screen, so that normal communication connection between the first shaft-spanning circuit board and the first circuit board and normal communication connection between the first shaft-spanning circuit board and the second circuit board are ensured, signal transmission between the first circuit board and the second circuit board are further ensured, and stability and reliability of the electronic equipment are improved.

In a possible implementation manner, the electronic device further includes a third housing, a second folding mechanism, a second trans-axis circuit board and a third circuit board, the second folding mechanism is connected with the first housing and the third housing, and the second folding mechanism can drive the first housing and the third housing to be relatively unfolded and closed; the third circuit board is fixed on the third shell; the second shaft-crossing circuit board comprises a fourth board part, a fifth board part and a sixth board part which are sequentially connected, wherein the fourth board part is positioned on the first shell, and the sixth board part is positioned on the third shell and is electrically connected with the third circuit board; the electronic equipment further comprises a fifth chip and a sixth chip, wherein the fifth chip is fixed on the first circuit board and is electrically connected with the first circuit board, the sixth chip is fixed on the fourth board and is electrically connected with the fourth board, and the sixth chip is in wireless communication connection with the fifth chip so that the fourth board is electrically connected with the first circuit board. It is understood that the first circuit board can be communicatively coupled to the second trans-axis circuit board via the fifth chip and the sixth chip. Thus, the first circuit board can be connected to the third circuit board through wireless communication of the fifth chip, the sixth chip, the second trans-axis circuit board, and the second electrical connector. In other words, the present embodiment may communicatively connect circuit boards located in different housings through the fifth chip, the sixth chip, and the second trans-axis circuit board.

It can be understood that, since the first circuit board is connected to the second trans-axis circuit board through the wireless communication between the fifth chip and the sixth chip, there is no direct fixed connection between the first circuit board and the second trans-axis circuit board, that is, the portion of the second trans-axis circuit board close to the first circuit board is a free portion. Therefore, in the folding or flattening process of the electronic equipment, the part, close to the first circuit board, of the second trans-axis circuit board can be moved to solve the problem of deformation of the second trans-axis circuit board caused by pulling, so that the risk of breakage of the second trans-axis circuit board after the folding times are increased is reduced, and the stability and reliability of the electronic equipment are improved.

In a possible implementation manner, the fifth chip is disposed opposite to the sixth chip, and a distance between the fifth chip and the sixth chip is in a range of 5mm to 15 mm in a thickness of the electronic device. It can be understood that the distance between the fifth chip and the sixth chip is smaller, so that signal transmission between the fifth chip and the sixth chip is enhanced, and the reliability of wireless communication between the chips is improved.

In a possible implementation manner, the third shell comprises a third frame, a third middle plate and a third back cover, the third middle plate and the third back cover are connected to the inner side of the third frame along the thickness direction of the electronic equipment, and at least part of the third middle plate is opposite to and spaced from at least part of the third back cover; a part of the third frame, a part of the third middle plate and a part of the third rear cover enclose a third accommodating space; the third circuit board is located in the third accommodating space. It will be appreciated that the first midplane separates the third circuit board from the external environment, ensuring that the third circuit board is not disturbed by external signals.

In a possible implementation manner, the fifth board portion of the second trans-axis circuit board is located between the second folding mechanism and the flexible screen.

It can be understood that the second trans-axis circuit board does not need to pass through the second folding mechanism any more, and the second folding mechanism can be further narrowed and thinned, so that the light and thin arrangement of the electronic equipment is realized. Therefore, the second span shaft circuit board and the second folding mechanism are two independent structural members, the second span shaft circuit board does not need to be bent, the reliability of the second span shaft circuit board is guaranteed, and the service life of the second span shaft circuit board is prolonged. On the one hand, the assembly difficulty of the second trans-axis circuit board and the second folding mechanism can be reduced, and the cost investment is reduced. On the other hand, when needing to maintain and change the second and stride the axle circuit board, need not carry out relevant dismantlement operation to second folding mechanism, can avoid damaging the risk of second folding mechanism, simplify maintenance operation, reduce the maintenance degree of difficulty, practice thrift cost of maintenance. The maintenance or replacement of the second trans-axis circuit board and the maintenance or replacement of the second folding mechanism can not interfere with each other, and the recycling rate of the components is improved.

Drawings

In order to describe the embodiments of the present application or the technical solutions in the background art, the following description will describe the drawings used in the embodiments of the present application or the background art.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application in a flattened state;

FIG. 2 is a partially exploded view of the electronic device of FIG. 1 in one embodiment;

Fig. 3 is a schematic structural diagram of an implementation manner of an electronic device in a folded state according to an embodiment of the present application;

FIG. 4 is a partial cross-sectional view of one embodiment of the electronic device of FIG. 3 in a folded state, taken along line A-A;

FIG. 5 is a partially exploded view of the electronic device of FIG. 1 in one embodiment;

FIG. 6 is a partially exploded view of the first housing of FIG. 5 in one embodiment;

FIG. 7 is a partial cross-sectional view of one embodiment of the first housing shown in FIG. 5 at line B-B;

FIG. 8 is a partial cross-sectional view of one embodiment of the second housing shown in FIG. 5 at line C-C;

FIG. 9 is a partial cross-sectional view of one embodiment of the electronic device of FIG. 1 at line D-D;

FIG. 10 is a partial cross-sectional view of one embodiment of the electronic device shown in FIG. 9;

FIG. 11 is a partial cross-sectional view II of one embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 12 is a partial cross-sectional view III of one embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 13A is a partial cross-sectional view fourth of one embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 13B is a partially exploded view of the electronic device 100 of FIG. 1 in one embodiment;

FIG. 14 is a partial cross-sectional view of one embodiment of the electronic device shown in FIG. 3 at line E-E;

FIG. 15 is a partial cross-sectional view fifth of one embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 16 is a partial cross-sectional view six of one embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 17 is a partial cross-sectional view seventh of another embodiment of the electronic device shown in FIG. 1 at line D-D;

FIG. 18 is a schematic view of an electronic device according to another embodiment of the present application in an unfolded state;

FIG. 19 is a schematic view of an embodiment of the electronic device of FIG. 18 in a first folded state;

FIG. 20 is a schematic diagram illustrating the structure of one embodiment of the electronic device of FIG. 18 in a second folded state;

FIG. 21 is a partially exploded view of one embodiment of the electronic device shown in FIG. 18;

FIG. 22 is a partial cross-sectional view of one embodiment of the electronic device shown in FIG. 20 at line F-F;

FIG. 23 is a partial cross-sectional view of one embodiment of the electronic device shown in FIG. 18 at the G-G line.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

In the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; can be directly connected or indirectly connected through an intermediate medium; either electrically or mechanically. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled. In addition, the two parts are integrally formed to form an integrated structure, that is, one of the two parts is connected with the other part during the process of forming the two parts, and the two parts do not need to be connected together by means of re-processing (such as bonding, welding, buckling connection and screw connection).

In addition, "electrically connected" may be understood as providing signal transmission between components. The electrical connection includes a wired communication connection and a wireless communication connection. "wired communication connection" is understood to mean that multiple components are in physical contact and electrically conductive; it is also understood that the connection between the components in the circuit configuration is made through physical circuits such as copper foil or wires of a printed circuit board (printed circuit board, PCB) that can transmit signals. A "wireless communication connection" is understood to mean that a plurality of components are in signal transmission by means of a space/contactless manner. For example, the plurality of components may employ Near Field Communication technology (e.g., bluetooth (r), wireless local area network (WiFi, wireless Fidelity), or Near Field Communication (NFC), etc.).

References to orientation terms, such as "top," "bottom," "inner," "outer," etc., in the embodiments of the present application are merely with reference to the orientation of the drawings, and thus, the use of orientation terms is intended to better and more clearly describe and understand the embodiments of the present application, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the embodiments of the present application. The specific meaning of the terms described above will be understood by those of ordinary skill in the art as the case may be.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application in a flattened state. Fig. 2 is a partially exploded view of the electronic device 100 shown in fig. 1 in one embodiment. Fig. 3 is a schematic structural diagram of an implementation of the electronic device 100 in a folded state according to an embodiment of the present application. Fig. 4 is a partial cross-sectional view of one embodiment of the electronic device 100 in the folded state shown in fig. 3, taken along line A-A.

As shown in fig. 1 to 4, the present application provides a foldable electronic device 100. The foldable electronic device 100 may be a foldable device such as a mobile phone, a tablet computer, a personal computer, a notebook computer, a vehicle-mounted device, or a wearable device (e.g., a smart band). The embodiment of the present application will be described in detail by taking the electronic device 100 as an example of a mobile phone.

For convenience of description, exemplarily, a thickness direction of the electronic apparatus 100 is defined as a Z-axis direction, an extension direction of a rotation axis of the electronic apparatus 100 is a Y-axis direction, that is, a width direction of the electronic apparatus 100 is a Y-axis direction. The direction perpendicular to the Y-axis direction and the Z-axis direction is the X-axis direction, that is, the length direction of the electronic device 100 is the X-axis. It is understood that the coordinate system of the electronic device 100 may also be flexibly set according to specific requirements. Illustratively, the X-axis direction is defined as a first direction, the Y-axis direction is defined as a second direction, and the Z-axis direction is defined as a third direction. In other embodiments, the first direction, the second direction and the third direction may be flexibly set according to the requirement, so as to ensure that the first direction, the second direction and the third direction are different. It is understood that, in the present embodiment, when the direction of the rotation axis of the electronic device 100 is the Y-axis direction, the electronic device 100 may be relatively flattened or folded along the Y-axis direction. In this way, when the electronic apparatus 100 is in the folded state, the size of the electronic apparatus 100 in the X-axis direction becomes small.

It is to be understood that, in this embodiment, the electronic device 100 can be rotated left and right, and the folding and flattening of the electronic device 100 affects the width dimension of the electronic device 100, by taking the example that the rotation center of the electronic device 100 is parallel to the width direction of the electronic device 100 as an example. In other embodiments, the rotation center of the electronic device 100 may be parallel to the length direction of the electronic device 100, and the electronic device 100 can rotate up and down, so that the folding and flattening of the electronic device 100 affects the length dimension of the electronic device 100.

Fig. 5 is a partially exploded view of the electronic device 100 shown in fig. 1 in one embodiment.

As shown in fig. 5, the electronic apparatus 100 includes a flexible screen 1, a first housing 2, a second housing 3, a first folding mechanism 4, a first circuit board 5a, a second circuit board 5b, a first trans-axis circuit board 6, a first chip 7a, a second chip 7b, and an electrical connector 36. The first casing 2, the second casing 3, and the first folding mechanism 4 may constitute a casing device of the electronic apparatus 100.

In addition, the first folding mechanism 4 connects the first casing 2 and the second casing 3. The first folding mechanism 4 is used to unfold or fold the first casing 2 and the second casing 3 relative to each other. It will be appreciated that in the present application, the first folding mechanism 4 may be an inner first folding mechanism 4 or an outer first folding mechanism 4. The inner folding mechanism refers to a first folding mechanism 4 which can fold at least part of the flexible screen 1 between two housings. The outer folding mechanism refers to a first folding mechanism 4 which can fold at least part of the flexible screen 1 to the outside of the housing. The present application is not limited to the specific structure of the first folding mechanism 4. In the present embodiment, the first folding mechanism 4 is exemplified as the inner first folding mechanism 4.

Fig. 6 is a partially exploded view of the first housing 2 shown in fig. 5 in one embodiment. Fig. 7 is a partial cross-sectional view of one embodiment of the first housing 2 shown in fig. 5 at line B-B.

As shown in fig. 6 and7, the first housing 2 includes a first rim 21, a first middle plate 22, and a first rear cover 23. The first middle plate 22 and the first rear cover 23 are connected to the inner side of the first frame 21 along the Z-axis direction. At least a portion of the first middle plate 22 is disposed opposite to and spaced apart from at least a portion of the first rear cover 23.

As shown in fig. 6 and 7, the first housing 2 has a first accommodation space 24. Illustratively, a portion of the first bezel 21, a portion of the first middle plate 22, and a portion of the first rear cover 23 enclose a first accommodating space 24.

As shown in fig. 6 and 7, the first housing 2 has a first fixing groove 222. The first fixing groove 222 is disposed opposite to the first accommodating space 24. Illustratively, a portion of the first bezel 21 encloses a first fixing groove 222 with a portion of the first middle plate 22. It is understood that the first fixing groove 222 is separated from the first receiving space 24 by the first middle plate 22.

Illustratively, the first midplane 22 may be provided with a first groove 223. The opening of the first groove 223 is located on the surface of the first middle plate 22 facing the first fixing groove 222. In other words, the bottom wall of the first fixing groove 222 is provided with the first groove 223.

As shown in fig. 6 and 7, the first housing 2 has a first insulating portion 25. Illustratively, the first insulating portion 25 may be made of plastic.

In some embodiments, the first insulating portion 25 is part of the first midplane 22. The first insulating portion 25 is provided with a first recessed region 25a and a second recessed region 25b. The opening of the first concave area 25a faces the first accommodating space 24, that is, the lower surface of the first insulating portion 25 is concave toward the first fixing groove 222 to form the first concave area 25a. In addition, the opening of the second concave region 25b faces the first fixing groove 222, that is, the upper surface of the first insulating portion 25 is concave toward the first accommodating space 24 to form the second concave region 25b.

As shown in fig. 6 and 7, one end portion of the first middle plate 22 is provided with a first mounting groove 221. The opening of the first mounting groove 221 is located at a surface of the first middle plate 22 facing the first fixing groove 222. In other words, the bottom wall of the first fixing groove 222 is provided with the first mounting groove 221.

Fig. 8 is a partial cross-sectional view of one embodiment of the second housing 3 shown in fig. 5 at C-C.

As shown in fig. 8, the second housing 3 includes a second rim 31, a second middle plate 32, and a second rear cover 33. The second middle plate 32 and the second rear cover 33 are connected to the inner side of the second frame 31 along the Z-axis direction. At least a portion of the second middle plate 32 is disposed opposite to and spaced apart from at least a portion of the second rear cover 33.

As shown in fig. 8, the second housing 3 has a second accommodation space 34. Illustratively, a portion of the second bezel 31, a portion of the second middle plate 32, and a portion of the second rear cover 33 enclose a second receiving space 34.

As shown in fig. 8, the second housing 3 has a second fixing groove 322. The second fixing groove 322 is disposed opposite to the second accommodating space 34. Illustratively, a portion of the second bezel 31 encloses a second fixing groove 322 with a portion of the second middle plate 32. It is understood that the second fixing groove 322 is separated from the second receiving space 34 by the second middle plate 32.

Illustratively, the second midplane 32 may be provided with a first through hole 324. The first through hole 324 may penetrate through two surfaces of the second middle plate 32 disposed opposite thereto. The first through hole 324 communicates the second receiving space 34 with the second fixing groove 322.

Illustratively, the second midplane 32 may be provided with a second groove 323. The opening of the second recess 323 is located on the surface of the second middle plate 32 facing the second fixing groove 322. In other words, the bottom wall of the second fixing groove 322 is provided with the second groove 323.

As shown in fig. 8, one end of the second middle plate 32 is provided with a second mounting groove 321. The opening of the second mounting groove 321 is located on the surface of the second middle plate 32 facing the second fixing groove 322. In other words, the bottom wall of the second fixing groove 322 is provided with the second mounting groove 321.

Referring to fig. 2, and referring to fig. 5 to 8, a part of the first folding mechanism 4 is located in the first mounting groove 221 of the first housing 2, and a part is located in the second mounting groove 321 of the second housing 3. Like this, in the Z axle direction, first folding mechanism 4 has the overlap region with first casing 2, second casing 3, and first folding mechanism 4 is arranged compacter with first casing 2, second casing 3, is favorable to improving space utilization. It will be appreciated that the first mounting groove 221 of the first housing 2 is located at the end of the first middle plate 22 facing the second housing 3. The second mounting groove 321 of the second housing 3 is located at an end of the second middle plate 32 facing the first housing 2.

As shown in fig. 2, when the first casing 2, the second casing 3, and the first folding mechanism 4 are relatively unfolded to the flattened state, the electronic apparatus 100 is in the flattened state. For example, when the first housing 2 and the second housing 3 are in the open state, the first housing 2 and the second housing 3 may be substantially 180 °. In other embodiments, the angle between the first housing 2 and the second housing 3 may be slightly different from 180 ° when the two housings are in the open state, for example 165 °, 177 °, 185 °, or the like.

As shown in fig. 3 and 4, when the electronic device 100 is in a folded state, the first case 2 and the second case 3 may be close to each other, and the first case 2 and the second case 3 are stacked in the thickness direction (i.e., the Z-axis direction) of the electronic device 100. A part of the first folding mechanism 4 encloses an accommodation space 44. It will be appreciated that the differently configured first folding mechanisms 4 have differently shaped receiving spaces 44.

In some other embodiments, the first housing 2 and the second housing 3 may be relatively flattened or relatively folded to an intermediate state, that is, the electronic device 100 is in the intermediate state, where the intermediate state may be any state between the open state and the closed state.

As shown in fig. 1 and 2, the flexible screen 1 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini-light-emitting diode (mini organic light-emitting diode) display screen, a micro-organic light-emitting diode (micro organic light-emitting diode) display screen, a quantum dot LIGHT EMITTING diodes (QLED) display screen, or the like.

As shown in fig. 1 and 2, in some embodiments, the flexible screen 1 includes a first display area 11, a second display area 12, and a third display area 13 connected in sequence. The second display area 12 is connected between the first display area 11 and the third display area 13. Exemplarily, fig. 1 and 2 each illustrate an example in which the first display area 11, the second display area 12, and the third display area 13 are arranged in the X-axis direction, and the first display area 11, the second display area 12, and the third display area 13 are exemplarily distinguished by a dot-dash line.

As shown in fig. 1 and 2, in some embodiments, the first display area 11 of the flexible screen 1 is fixed to the first housing 2. The third display area 13 of the flexible screen 1 is fixed to the second housing 3. Illustratively, as shown in connection with fig. 7 and 8, the first display area 11 of the flexible screen 1 is fixed on the first middle plate 22 and is located in the first fixing groove 222. In addition, the third display area 13 of the flexible screen 1 is fixed on the second middle plate 32 and is located in the second fixing groove 322. It will be appreciated that the peripheral portion of the first display area 11 may overlap the first bezel 21 to reduce the gap width between the flexible screen 1 and the first bezel 21. The peripheral portion of the third display area 13 may overlap the second bezel 31 to reduce the gap width between the flexible screen 1 and the second bezel 31.

It can be appreciated that when the first folding mechanism 4 makes the first housing 2 and the second housing 3 relatively flat or fold, the first housing 2 may drive the first display area 11 of the flexible screen 1 to be flat or fold relative to the third display area 13, and the second housing 3 may drive the third display area 13 of the flexible screen 1 to be flat or fold relative to the first display area 11. At this time, the second display area 12 of the flexible screen 1 may be bent.

As shown in fig. 1 and 2, when the electronic apparatus 100 is in the flattened state, the flexible screen 1 is unfolded with the first folding mechanism 4, and the flexible screen 1 is flattened. Illustratively, the first display area 11, the second display area 12 and the third display area 13 of the flexible screen 1 may be substantially 180 ° (allowing for slight deviations, such as 165 °, 177 ° or 185 °). At this time, the flexible screen 1 has a continuous large-area display area, that is, the flexible screen 1 can realize a large-screen display, and the user experience is better.

Illustratively, at least a portion of the first folding mechanism 4 may be used to support the second display area 12 when the electronic device 100 is in the flattened state. In this way, when the second display area 12 of the flexible screen 1 is subjected to a pressing force, an impact force, or the like, the first folding mechanism 4 can be used to improve the compression resistance and the impact resistance of the second display area 12, that is, to ensure that the second display area 12 is not prone to problems such as sagging.

As shown in fig. 3 and 4, the flexible screen 1 may be in a folded state when the electronic device 100 is in the folded state. Illustratively, the first display area 11 and the third display area 13 of the flexible screen 1 are disposed close to each other. The first display area 11 and the third display area 13 of the flexible screen 1 may be arranged along the Z-axis direction. In addition, the second display area 12 of the flexible screen 1 is bent and is located in the accommodating space 44 of the first folding mechanism 4. At this time, the electronic apparatus 100 is in a folded state, and the electronic apparatus 100 has a small planar size (has a small width size), so that it is convenient for a user to carry and store. In other embodiments, a slight gap may exist between the first display area 11 and the third display area 13 of the flexible screen 1 when the electronic device 100 is in the closed state.

In some other embodiments, the electronic device 100 may be in a relatively flattened or relatively folded to an intermediate state, which may be any state between an open state and a closed state. The flexible screen 1 is in an intermediate state of a relatively flattened state or a relatively folded state depending on the state of the electronic device 100.

Fig. 9 is a partial cross-sectional view of one embodiment of the electronic device 100 shown in fig. 1 at line D-D. Fig. 10 is a partial cross-sectional view of one embodiment of the electronic device 100 shown in fig. 9. Illustratively, fig. 10 is a partial cross-sectional view of the electronic device 100 shown in fig. 9 with the first midplane 22 and the second midplane 32 hidden.

As shown in fig. 9 and 10, in some embodiments, the first circuit board 5a is fixed to the first housing 2. Illustratively, the first circuit board 5a is fixed to the first rear cover 23 and is located in the first accommodating space 24 of the first housing 2. It will be appreciated that the first circuit board 5a may be used to connect individual devices, making electrical connections between the devices. The material, shape, position, size, etc. of the first circuit board 5a are not particularly limited.

It can be appreciated that the first circuit board 5a is disposed in the first accommodating space 24, so that the first middle board 22 is used to separate the flexible screen 1 from the first circuit board 5a, so as to avoid signal interference of devices on the first circuit board 5a on the flexible screen 1.

As shown in fig. 9 and 10, in some embodiments, the second circuit board 5b is fixed to the second housing 3. The second circuit board 5b is illustratively fixed to the second rear cover 33 and is located in the second accommodating space 34 of the second housing 3. It will be appreciated that the second circuit board 5b may be used to connect individual devices to make electrical connection between the devices. The material, shape, position, size, etc. of the second circuit board 5b are not particularly limited.

It can be appreciated that the second circuit board 5b is disposed in the second accommodating space 34, so that the second middle board 32 is used to separate the flexible screen 1 from the first circuit board 5a, so as to avoid signal interference of devices on the first circuit board 5a on the flexible screen 1.

Fig. 11 is a partial cross-sectional view second of one embodiment of the electronic device 100 shown in fig. 1 at line D-D.

As shown in fig. 11, in some embodiments, the first chip 7a is fixedly connected to the first circuit board 5a, and is electrically connected to the first circuit board 5a.

The first chip 7a may be fixed to a side of the first circuit board 5a facing the first middle plate 22, for example. The first chip 7a is located in the first accommodating space 24 of the first middle plate 22. In some other embodiments, the first chip 7a may also be located in the first recess region 25a of the first insulating portion 25. In this way, the first chip 7a can utilize the space of the first middle plate 22 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device 100.

Fig. 12 is a partial cross-sectional view III of one embodiment of the electronic device 100 shown in fig. 1 at line D-D.

As shown in fig. 12, in some embodiments, the first trans-axle circuit board 6 includes a first plate portion 61, a second plate portion 62, and a third plate portion 63 that are sequentially connected. The second plate portion 62 is connected between the first plate portion 61 and the third plate portion 63. Illustratively, fig. 12 illustrates an example in which the first plate portion 61, the second plate portion 62, and the third plate portion 63 are arranged in the X-axis direction, and the first plate portion 61, the second plate portion 62, and the third plate portion 63 are exemplarily distinguished by dash-dot lines.

Wherein the first plate portion 61 is located in the first housing 2. The third plate portion 63 is located in the second housing 3 and is electrically connected to the second circuit board 5b.

Fig. 13A is a partial cross-sectional view fourth of one embodiment of the electronic device 100 shown in fig. 1 at line D-D. Fig. 13B is a partially exploded view of the electronic device 100 shown in fig. 1 in one embodiment.

As shown in fig. 13A and 13B, in some embodiments, the first board portion 61 of the first trans-axle circuit board 6 is located between the first housing 2 and the first display area 11 of the flexible screen 1. The second plate portion 62 of the first trans-axle circuit board 6 is located between the first folding mechanism 4 and the second display area 12 of the flexible screen 1. The third plate portion 63 of the first trans-axis circuit board 6 is located between the second housing 3 and the third display area 13 of the flexible screen 1. In other embodiments, the second plate portion 62 of the first trans-axle circuit board 6 may be disposed internally through the first folding mechanism 4. The application is not particularly limited.

As shown in fig. 13A and 13B, the first plate portion 61 of the first trans-axis circuit board 6 is exemplarily provided separately from both the first housing 2 and the first display area 11 of the flexible screen 1. In other words, the first plate portion 61 of the first trans-axis circuit board 6 is not fixedly connected to the first housing 2 and the first display area 11 of the flexible screen 1.

As shown in fig. 13A and 13B, the second plate portion 62 of the first trans-axis circuit board 6 is exemplarily provided separately from both the first folding mechanism 4 and the second display area 12 of the flexible screen 1. In other words, the second plate portion 62 of the first trans-axis circuit board 6 is not fixedly connected to the first folding mechanism 4 and the second display area 12 of the flexible screen 1.

As shown in fig. 13A, the electronic device 100 also illustratively includes a glue layer 64. The glue layer 64 connects the third plate portion 63 of the first trans-axial circuit board 6 with the third display area 13 of the flexible screen 1. It will be appreciated that the glue layer 64 may connect a portion of the third plate portion 63 of the first trans-axle circuit board 6 or may connect all of the third plate portion 63 of the first trans-axle circuit board 6.

In other embodiments, the glue layer 64 may also connect a portion of the second plate portion 62 of the first trans-axis circuit board 6 with a portion of the second display area 12 of the flexible screen 1. Or the glue layer 64 connects a portion of the second plate portion 62 and the third plate portion 63 of the first trans-axial circuit board 6 at the same time.

As shown in fig. 12, 13A, and 13B, in some embodiments, the second chip 7B is fixed to a side of the first board portion 61 of the first trans-axis circuit board 6 facing the first middle board 22, and is electrically connected to the first board portion 61. In some other embodiments, the second chip 7b may be located in the second recess region 25b of the first insulating portion 25. In this way, the second chip 7b can utilize the space of the first middle plate 22 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device 100.

As shown in fig. 12, 13A and 13B, in some embodiments, the second chip 7B and the first chip 7a can implement a wireless communication connection. In this way, the first circuit board 5a can be connected to the first trans-axis circuit board 6 by wireless communication between the first chip 7a and the second chip 7 b.

In one embodiment, the second chip 7b is disposed opposite the first chip 7 a. In the first direction Z, the distance between the first chip 7a and the second chip 7b is in the range of 5 to 15 mm. The distance between the first chip 7a and the second chip 7b may be 5mm, 8 mm, 10mm, 12 mm, 13 mm or 15 mm, for example. In this embodiment, the distance between the first chip 7a and the second chip 7b is smaller, so that signal transmission between the first chip 7a and the second chip 7b is enhanced, and the reliability of wireless communication between the chips is also improved. It should be appreciated that in the present application, the relative arrangement of the component a and the component B may be such that the component a projects a projection C in the target direction and the component B projects a projection D in the target direction, and the projections C and D may overlap at least in large part. In some embodiments, the majority of the overlap may be any of the following: projection C is located entirely within projection D. Or projection D is located entirely within projection C. Or projection C and projection D intersect each other, and the intersection area of projection C and projection D is higher than 50% of projection C or projection D.

As shown in fig. 12, 13A, and 13B, in some embodiments, the electrical connector 36 includes a female receptacle 36a and a male receptacle 36B. The female socket 36a is fixed on the second circuit board 5b and electrically connected to the second circuit board 5b.

Illustratively, the female socket 36a may be fixed to a side of the second circuit board 5b facing the second middle plate 32. In one embodiment, the female socket 36a is located in the second accommodating space 34 of the second middle plate 32 and is opposite to the first through hole 324.

As shown in fig. 12 and 13A, in some embodiments, the male socket 36b of the electrical connector 36 may be fixedly connected to the third plate portion 63 and electrically connected to the first trans-axle circuit board 6. The male receptacle 36b of the electrical connector 36 can be plugged into the female receptacle 36a of the electrical connector 36. In this way, the first trans-axle circuit board 6 can be communicatively connected with the second circuit board 5b through the electrical connector 36. In other embodiments, the positions of the female and male seats 36a, 36b may be reversed.

It will be appreciated that in the present embodiment, the first circuit board 5a can be connected to the first trans-axis circuit board 6 by wireless communication between the first chip 7a and the second chip 7 b. The first trans-axle circuit board 6 can be communicatively connected to the second circuit board 5b by an electrical connector 36. In this way, the first circuit board 5a can be communicatively connected to the second circuit board 5b through the first chip 7a, the second chip 7b, the first trans-axis circuit board 6, and the electrical connector 36. In other words, the present embodiment can communicatively connect circuit boards located in different housings through the first chip 7a, the second chip 7b, the first trans-axis circuit board 6, and the electrical connector 36.

As shown in fig. 12 and 13B, in some embodiments, the first trans-axis circuit board 6 may be flat when the electronic device 100 is in a flattened state. Illustratively, the first, second and third plate portions 61, 62, 63 of the first trans-axial circuit board 6 may be substantially 180 ° (allowing for slight deviations, such as 165 °, 177 ° or 185 °).

Fig. 14 is a partial cross-sectional view of one embodiment of the electronic device 100 shown in fig. 3 at line E-E.

As shown in fig. 14, in some embodiments, the first plate portion 61 and the third plate portion 63 of the first trans-axis circuit board 6 may be disposed close to each other when the electronic device 100 is in the folded state. The first plate portion 61 and the third plate portion 63 of the first trans-axis circuit board 6 may be arranged along the Z-axis direction. Wherein the first plate portion 61 and the third plate portion 63 of the first trans-axis circuit board 6 may be located between the first display area 11 and the third display area 13 of the flexible screen 1. In addition, the second plate portion 62 of the first trans-axis circuit board 6 is bent and positioned in the accommodating space 44 of the first folding mechanism 4. The second plate portion 62 of the first trans-axle circuit board 6 may be located at a side of the second display area 12 of the flexible screen 1 facing the first folding mechanism 4. At this time, the first trans-axis circuit board 6 is substantially U-shaped.

As shown in fig. 12, 13B, and 14, when the electronic device 100 is switched between the flattened state and the folded state, the first trans-axis circuit board 6 may be flattened as the electronic device 100 is unfolded or folded as the electronic device 100 is folded. At this time, the first plate portion 61, the second plate portion 62, and the third plate portion 63 of the first trans-axle circuit board 6 can be switched between the flat state and the "U-shape".

In some other embodiments, the electronic device 100 may be in a relatively flattened or relatively folded to an intermediate state, which may be any state between an open state and a closed state. The first trans-axis circuit board 6 is in an intermediate state of a relatively flattened state or a relatively folded state with the state of the electronic device 100.

As shown in fig. 12 to 14, since the third plate portion 63 of the first trans-axis circuit board 6 is fixed on the second circuit board 5b through the electrical connector 36, and the third plate portion 63 of the first trans-axis circuit board 6 is connected with the third display area 13 of the flexible screen 1 through the adhesive layer 64, the third plate portion 63 of the first trans-axis circuit board 6 is a fixed end. In addition, since the first board portion 61 of the first trans-axle circuit board 6 is connected to the first circuit board 5a through the first chip 7a and the second chip 7b in a wireless communication manner, the first board portion 61 of the first trans-axle circuit board 6 and the first circuit board 5a may be separately disposed (i.e., not fixedly connected). Furthermore, the first plate portion 61 of the first trans-axis circuit board 6 is separately disposed (i.e. not fixedly connected) from the first housing 2 and the first display area 11 of the flexible screen 1, so that the first plate portion 61 of the first trans-axis circuit board 6 is a movable end. In addition, the second plate portion 62 of the first trans-axis circuit board 6 is disposed (i.e. not fixedly connected) with the first folding mechanism 4 and the second display area 12 of the flexible screen 1, so that the second plate portion 62 of the first trans-axis circuit board 6 is also a movable portion. In this way, when the electronic apparatus 100 is folded in the flattened state to the folded state, the first plate portion 61 and the second plate portion 62 of the first trans-axis circuit board 6 can be moved in a direction approaching the third plate portion 63 of the first trans-axis circuit board 6 by the third plate portion 63 of the first trans-axis circuit board 6. When the electronic device 100 is unfolded from the folded state to the flattened state, the first plate portion 61 and the second plate portion 62 of the first trans-axle circuit board 6 may move in a direction away from the third plate portion 63 of the first trans-axle circuit board 6 by the third plate portion 63 of the first trans-axle circuit board 6.

It can be appreciated that, compared to the scheme that the first circuit board 5a is communicatively connected to the first trans-axle circuit board 6 through the electrical connector, in the present embodiment, since the first circuit board 5a is connected to the first trans-axle circuit board 6 through the first chip 7a and the second chip 7b in a wireless communication manner, there is no fixed connection between the first circuit board 5a and the first trans-axle circuit board 6. In this way, in the folding or flattening process of the electronic device 100, the portion of the first trans-axis circuit board 6 close to the first circuit board 5a may be moved to solve the problem of deformation of the first trans-axis circuit board 6 caused by pulling, so as to reduce the risk of breakage of the first trans-axis circuit board 6 after the folding times are increased, and further improve the stability and reliability of the electronic device 100.

It can be appreciated that, compared to the scheme of passing the first trans-axle circuit board 6 through the first folding mechanism 4, in this embodiment, by disposing the first board portion 61 of the first trans-axle circuit board 6 between the first housing 2 and the first display area 11 of the flexible screen 1, the second board portion 62 of the first trans-axle circuit board 6 is disposed between the first folding mechanism 4 and the second display area 12 of the flexible screen 1, and the third board portion 63 of the first trans-axle circuit board 6 is disposed between the second housing 3 and the third display area 13 of the flexible screen 1, the first trans-axle circuit board 6 does not pass through the first folding mechanism 4 any more, and the first folding mechanism 4 can be narrowed and thinned, so as to realize the light and thin arrangement of the electronic device. Thus, the first span shaft circuit board 6 and the first folding mechanism 4 are two independent structural members, the first span shaft circuit board 6 does not need to be folded for penetrating through the first folding mechanism, the reliability of the first span shaft circuit board 6 is ensured, and the service life of the first span shaft circuit board 6 is prolonged. On the one hand, the assembly difficulty of the first trans-axis circuit board 6 and the first folding mechanism 4 can be reduced, and the cost investment is reduced. On the other hand, when the first span shaft circuit board 6 needs to be maintained and replaced, the first folding mechanism 4 does not need to be subjected to related disassembly operation, so that the risk of damaging the first folding mechanism 4 can be avoided, the maintenance operation is simplified, the maintenance difficulty is reduced, and the maintenance cost is saved. The maintenance or replacement of the first trans-axle circuit board 6 and the maintenance or replacement of the first folding mechanism 4 do not interfere with each other, and the recycling rate of the components is improved.

It can be understood that the material of the first insulating portion 25 is plastic or other materials that will not shield or interfere with wireless signals, that is, the first insulating portion 25 located between the first chip 7a and the second chip 7b will not generate shielding effect or interfere with communication transmission between the first chip 7a and the second chip 7b, so that normal communication connection between the first circuit board 5a and the first trans-axis circuit board 6 is not affected, normal signal transmission between the first circuit board 5a and the second circuit board 5b is ensured, and normal operation of each device located in the first accommodating space 24 of the first housing 2 and the second accommodating space 34 of the second housing 3 is ensured, and stability and reliability of the electronic device 100 are further ensured.

Fig. 15 is a partial cross-sectional view five of one embodiment of the electronic device 100 shown in fig. 1 at line D-D.

As shown in fig. 15, the electronic device 100 further includes a camera module 41, and the camera module 41 is fixedly connected to a side of the first rear cover 23 away from the first accommodating space 24.

The camera module 41 includes a lens 411. The lens 411 is electrically connected to the first circuit board 5a. It is to be understood that the number of lenses 411 is not limited to two as shown in fig. 15, and may be one or three or more. The types of the lenses 411 may include, but are not limited to, infrared lenses, wide-angle lenses, fixed focus lenses, zoom lenses, etc., and the present application is not particularly limited to the number, types, functions, etc. of the lenses 411.

As shown in fig. 15, the second circuit board 5b further includes a controller 51. The controller 51 may transmit control signals to the lens 411 through the second circuit board 5b, the electrical connector 36, the first trans-axis circuit board 6, the first chip 7a, the second chip 7b, and the first circuit board 5 a. The lens 411 may start to operate under a control signal.

It is to be understood that, although the lens 411 of the present embodiment is located on the first housing 2, the controller 51 located on the second housing 3 may send control signals to the lens 411 through the second circuit board 5b, the electrical connector 36, the first trans-axis circuit board 6, the first circuit board 5a, the first chip 7a and the second chip 7b, so that the lens 411 may start to operate under the control signals. Therefore, the present embodiment can realize control of the lens 411 on different housings to meet the requirements of the user for operation and control of the lens 411 at different positions.

Fig. 16 is a partial cross-sectional view six of one embodiment of the electronic device 100 shown in fig. 1 at line D-D.

As shown in fig. 16, the electronic device 100 further includes a stand 37. The middle part of the bracket 37 is located at one side of the first trans-axis circuit board 6 away from the second circuit board 5b, and both ends of the bracket 37 are fixed to the second circuit board 5 b. The bracket 37 is used for applying pressure to the first trans-axle circuit board 6 to press the electric connector 36 onto the second circuit board 5b through the first trans-axle circuit board 6, so that on one hand, the male seat 36b of the electric connector 36 is ensured to be stably connected with the female seat 36a of the electric connector 36, normal communication connection between the first trans-axle circuit board 6 and the second circuit board 5b is ensured, and further signal transmission between the first circuit board 5a and the second circuit board 5b is ensured, stability and reliability of the electronic device 100 are improved, and on the other hand, the electric connector 36 is ensured to be not easy to fall off from the second circuit board 5b and the first trans-axle circuit board 6.

Fig. 17 is a partial cross-sectional view seven of another embodiment of the electronic device 100 shown in fig. 1 at line D-D.

As shown in fig. 17, the second housing 3 may have a second insulating portion 35. For example, the second insulating portion 35 may be made of plastic.

In some embodiments, the second insulating portion 35 may be a portion of the second midplane 32. The second insulating portion 35 is provided with a third recessed region 35a and a fourth recessed region 35b. Wherein, the opening of the third recess region 35a faces the second accommodating space 34, that is, the lower surface of the second insulating portion 35 is recessed toward the second fixing groove 322 to form the third recess region 35a. In addition, the opening of the fourth concave region 35b faces the second fixing groove 322, that is, the upper surface of the second insulating portion 35 is concave toward the second accommodating space 34 to form the fourth concave region 35b.

As shown in fig. 17, in some embodiments, the electronic device 100 further includes a third chip 7c, where the third chip 7c is fixedly connected to the second circuit board 5b and electrically connected to the second circuit board 5b.

The third chip 7c may be exemplarily fixed at a side of the second circuit board 5b facing the second middle plate 32. The third chip 7c is located in the second accommodating space 34 of the second middle plate 32. In some other embodiments, the third chip 7c may also be located in the third recess region 35a of the second insulating portion 35. In this way, the third chip 7c can utilize the space of the second middle plate 32 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device 100.

As shown in fig. 17, in some embodiments, the electronic device 100 further includes a fourth chip 7d. Illustratively, the fourth chip 7d is fixed to a side of the third plate portion 63 of the first trans-axle circuit board 6 facing the second middle plate 32, and is electrically connected to the third plate portion 63. In some other embodiments, the fourth chip 7d may be located in the fourth recess region 35b of the second insulating portion 35. In this way, the fourth chip 7d can utilize the space of the second middle plate 32 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device 100.

As shown in fig. 17, in some embodiments, the fourth chip 7d and the third chip 7c can implement a wireless communication connection. In this way, the second circuit board 5b can be connected to the first trans-axis circuit board 6 by wireless communication between the third chip 7c and the fourth chip 7 d. In one embodiment, the fourth chip 7d is disposed opposite the third chip 7 c. In the Z-axis direction, the distance between the third chip 7c and the fourth chip 7d is in the range of 5 to 15 mm. The distance between the third chip 7c and the fourth chip 7d may be 5 mm, 8 mm, 10 mm, 12 mm, 13 mm or 15 mm, for example. In the present embodiment, the distance between the third chip 7c and the second chip 7b is smaller, so that signal transmission between the third chip 7c and the fourth chip 7d is enhanced, and the reliability of wireless communication between the chips is also improved.

It is understood that in the present embodiment, the second circuit board 5b can be connected to the first trans-axis circuit board 6 through wireless communication between the third chip 7c and the fourth chip 7 d. The first trans-axis circuit board 6 can be connected to the first circuit board 5a through wireless communication between the third chip 7c and the fourth chip 7 d. In this way, the first circuit board 5a can be communicatively connected to the second circuit board 5b through the third chip 7c, the fourth chip 7d, the first trans-axis circuit board 6, and the third chip 7c, the fourth chip 7 d. In other words, the present embodiment can connect the circuit boards located in different housings in communication through the first chip 7a, the second chip 7b, the first trans-axis circuit board 6, and the third chip 7c and the fourth chip 7 d.

It can be understood that, compared to the scheme that the second circuit board 5b is communicatively connected to the first trans-axle circuit board 6 through the electrical connector, in the present embodiment, since the second circuit board 5b is connected to the first trans-axle circuit board 6 through the third chip 7c and the fourth chip 7d in a wireless communication manner, there is no fixed connection between the second circuit board 5b and the first trans-axle circuit board 6, that is, a portion of the first trans-axle circuit board 6 close to the second circuit board 5b is a free portion. In this way, in the folding or flattening process of the electronic device 100, the portion of the first trans-axis circuit board 6 close to the second circuit board 5b may be moved to solve the problem of deformation of the first trans-axis circuit board 6 caused by pulling, so as to reduce the risk of breakage of the first trans-axis circuit board 6 after the folding times are increased, and further improve the stability and reliability of the electronic device 100.

It can be understood that the second insulating portion 35 is made of plastic or other materials that will not shield or interfere with wireless signals, that is, the second insulating portion 35 located between the third chip 7c and the fourth chip 7d will not generate shielding effect or interfere with communication transmission between the third chip 7c and the fourth chip 7d, so that normal communication connection between the second circuit board 5b and the first trans-axis circuit board 6 is not affected, normal signal transmission between the first circuit board 5a and the second circuit board 5b is ensured, and normal operation of each device located in the first accommodating space 24 of the first housing 2 and the second accommodating space 34 of the second housing 3 is ensured, and stability and reliability of the electronic device 100 are further ensured.

It will be appreciated that the electronic device 100 above is described with respect to a single fold occurring. In other embodiments, the electronic device 100 may be folded twice or more. The technical content that is the same as most of the above is not repeated.

Fig. 18 is a schematic structural diagram of an electronic device 100 in an unfolded state according to another embodiment of the present application. Fig. 19 is a schematic view of an embodiment of the electronic device 100 shown in fig. 18 in a first folded state. Fig. 20 is a schematic structural view of an embodiment of the electronic device 100 shown in fig. 18 in a second folded state.

As shown in fig. 18 to 20, the present application provides an electronic device 100 having a folding number of more than 1. The electronic device 100 of the embodiment shown in fig. 18 to 20 is also illustrated by taking a mobile phone as an example. For convenience of description, exemplarily, a thickness direction of the electronic apparatus 100 is defined as a Z-axis direction, an extension direction of a rotation axis of the electronic apparatus 100 is a Y-axis direction, that is, a width direction of the electronic apparatus 100 is a Y-axis direction. The direction perpendicular to the Y-axis direction and the Z-axis direction is the X-axis direction, that is, the length direction of the electronic device 100 is the X-axis. Illustratively, the X-axis direction is defined as a first direction and the Y-axis direction is defined as a second direction. In other embodiments, the first direction and the second direction may be flexibly set according to the requirement, so as to ensure that the first direction and the second direction are different.

It is understood that the coordinate system of the electronic device 100 may also be flexibly set according to specific requirements. In the present embodiment, when the direction of the rotation axis of the electronic apparatus 100 is the Y-axis direction, the electronic apparatus 100 can be relatively unfolded or folded along the Y-axis direction. In this way, when the electronic apparatus 100 is in the second folded state, the size of the electronic apparatus 100 in the X-axis direction becomes smaller.

Fig. 21 is a partially exploded view of one embodiment of the electronic device 100 shown in fig. 18. FIG. 22 is a partial cross-sectional view of one embodiment of the electronic device shown in FIG. 20 at line F-F.

Referring to fig. 21 and 22, and referring to fig. 18 to 20, an electronic device 100 includes a flexible screen 1, a first housing 2, a second housing 3, a third housing 8, a first folding mechanism 4, and a second folding mechanism 10. The first casing 2, the second casing 3, the third casing 8, the first folding mechanism 4, and the second folding mechanism 10 may constitute a casing device of the electronic apparatus 100.

In addition, the first folding mechanism 4 connects the first casing 2 and the second casing 3. The first folding mechanism 4 is used to unfold or fold the first casing 2 and the second casing 3 relative to each other. The second folding mechanism 10 connects the third casing 8 with the first casing 2. The second folding mechanism 10 is used to unfold or fold the third casing 8 and the first casing 2 relative to each other. It can be appreciated that in the present application, the first folding mechanism 4 and the second folding mechanism 10 are provided in the electronic apparatus 100, so that the electronic apparatus 100 can be folded a plurality of times. Wherein the first folding mechanism 4 may be an outer folding mechanism. The second folding mechanism 10 may be an inner folding mechanism. The inner folding mechanism refers to a folding mechanism that can fold at least part of the flexible screen 1 between two housings. The outer folding mechanism refers to a folding mechanism that can fold at least part of the flexible screen 1 to the outside of the housing. In other embodiments, the first folding mechanism 4 may be an inner folding mechanism. The second folding mechanism 10 may also be an outer folding mechanism. The application is not particularly limited.

In the present embodiment, the second folding mechanism 10 is an inner folding mechanism, and the first folding mechanism 4 is an outer folding mechanism.

Referring to fig. 21, in conjunction with fig. 18, when the first housing 2, the second housing 3, the third housing 8, the first folding mechanism 4, and the second folding mechanism 10 are relatively unfolded to an unfolded state, the electronic device 100 is in an unfolded state. Illustratively, when the electronic apparatus 100 is in the unfolded state, the third casing 8, the first casing 2, the second casing 3, the second folding mechanism 10, and the first folding mechanism 4 may be arranged along the X-axis direction and may be substantially 180 ° (allowing for some deviation, such as 165 °, 177 °, 127 °, or the like).

Referring to fig. 19, in conjunction with fig. 21, when the third housing 8, the first housing 2, the second housing 3, the second folding mechanism 10, and the first folding mechanism 4 are relatively folded to the first folded state, the electronic device 100 is in the first folded state. Illustratively, when the electronic device 100 is in the first folded state, the third housing 8, the first housing 2, and the second folding mechanism 10 may be arranged along the X-axis direction and may be substantially 180 ° (allowing for a slight deviation, such as 165 °, 177 °, 127 °, or the like), the first housing 2 and the second housing 3 may be close to each other, and the first housing 2 and the second housing 3 may be stacked in the thickness direction of the electronic device 100.

Referring to fig. 22, in conjunction with fig. 20, when the third housing 8, the first housing 2, the second housing 3, the second folding mechanism 10, and the first folding mechanism 4 are relatively folded to the second folded state, the electronic device 100 is in the second folded state. For example, when the electronic device 100 is in the second folded state, the third casing 8 and the first casing 2 may be close to each other, and the third casing 8 and the first casing 2 are stacked in the thickness direction of the electronic device 100; the first casing 2 and the second casing 3 may be close to each other, the first casing 2 and the second casing 3 are stacked in the thickness direction of the electronic device 100, and the first casing 2 is stacked between the third casing 8 and the second casing 3. At this time, the third casing 8, the first casing 2, and the second casing 3 may be arranged in the Z-axis direction. When the third casing 8 and the first casing 2 are converted from the first folded state to the second folded state, the second folding mechanism 10 can enclose the accommodating space 104. It will be appreciated that the second folding mechanism 10 of different structure has differently shaped receiving spaces 104. The specific structures of the second folding mechanism 10 and the first folding mechanism 4 are not limited in the present application.

Referring to fig. 21 and 22, and referring to fig. 18 to 20, the flexible screen 1 includes a fifth display area 15, a fourth display area 14, a first display area 11, a second display area 12, and a third display area 13, which are sequentially connected. The fourth display area 14 is connected between the fifth display area 15 and the first display area 11. The first display area 11 is connected between the fourth display area 14 and the second display area 12. The second display area 12 is connected between the first display area 11 and the third display area 13. Fig. 18 and 21 are each illustrated by way of example in which the fifth display area 15, the fourth display area 14, the first display area 11, the second display area 12, and the third display area 13 are arranged in the X-axis direction.

Wherein the fifth display area 15 of the flexible screen 1 may be fixed to the third housing 8. The first display area 11 may be fixed to the first housing 2. The third display area 13 may be fixed to the second housing 3. It can be appreciated that when the second folding mechanism 10 enables the third housing 8 to be unfolded or folded relative to the first housing 2, the third housing 8 can drive the fifth display area 15 of the flexible screen 1 to be unfolded or folded relative to the first display area 11, and the first housing 2 can drive the first display area 11 of the flexible screen 1 to be unfolded or folded relative to the fifth display area 15. At this time, the fourth display area 14 of the flexible screen 1 may be bent. When the first folding mechanism 4 enables the first housing 2 and the second housing 3 to be unfolded or folded relatively, the first housing 2 can drive the first display area 11 of the flexible screen 1 to be unfolded or folded relatively to the third display area 13, and the second housing 3 can drive the third display area 13 of the flexible screen 1 to be unfolded or folded relatively to the first display area 11. At this time, the second display area 12 of the flexible screen 1 may be bent.

As shown in fig. 18 and 21, the flexible screen 1 may be in an expanded state when the electronic device 100 is in the expanded state. Illustratively, the fifth display area 15, the fourth display area 14, the first display area 11, the second display area 12 and the third display area 13 of the flexible screen 1 may be substantially 180 ° (allowing for slight deviations, such as 165 °, 177 ° or 185 °). At this time, the flexible screen 1 has a continuous large-area display area, that is, the flexible screen 1 can realize a large-screen display, and the user experience is better.

Illustratively, at least a portion of the second folding mechanism 10 may be used to support the fourth display area 14 and at least a portion of the first folding mechanism 4 may be used to support the second display area 12 when the electronic device 100 is in the unfolded state. In this way, when the fourth display area 14 and the second display area 12 of the flexible screen 1 are subjected to a pressing force, an impact force, or the like, the second folding mechanism 10 and the first folding mechanism 4 can be used to improve the compression resistance and the impact resistance of the fourth display area 14 and the second display area 12, that is, to ensure that the fourth display area 14 and the second display area 12 are not easily recessed.

Referring to fig. 19 in combination with fig. 18, when the electronic device 100 is in the first folded state, the flexible screen 1 may be in the first folded state. The fifth display area 15, the fourth display area 14, the first display area 11, the second display area 12 and the third display area 13 of the flexible screen 1 are all located outside the electronic device 100. At this time, the fifth display area 15, the fourth display area 14, the first display area 11, the second display area 12, and the third display area 13 of the flexible screen 1 are folded as the external screen of the electronic apparatus 100. Illustratively, the fifth display area 15, the fourth display area 14 and the first display area 11 of the flexible screen 1 may be substantially 180 ° (allowing for slight deviations, such as 165 °, 177 ° or 185 °). The first display area 11 and the third display area 13 of the flexible screen 1 are arranged close to each other. At this time, the first display area 11 and the third display area 13 of the flexible screen 1 may be arranged along the Z-axis direction. In addition, the second display area 12 of the flexible screen 1 is bent.

As shown in fig. 20 and 22, when the electronic device 100 is in the second folded state, the flexible screen 1 may be in the second folded state. Illustratively, the fifth display area 15 and the first display area 11 of the flexible screen 1 are disposed close to each other, and the first display area 11 and the third display area 13 of the flexible screen 1 are disposed close to each other. At this time, the fifth display area 15, the first display area 11, and the third display area 13 of the flexible screen 1 may be arranged along the Z-axis direction. In addition, the fourth display area 14 and the second display area 12 of the flexible screen 1 are bent.

Illustratively, when the electronic device 100 is in the second folded state, the fifth display area 15, the fourth display area 14, and the first display area 11 of the flexible screen 1 are all located between the third housing 8 and the first housing 2, and the fourth display area 14 is located in the accommodating space 104 of the second folding mechanism 10, the second display area 12 and the third display area 13 of the flexible screen 1 are all located outside the first folding mechanism 4 and the second housing 3 (i.e. outside the electronic device 100), and the third display area 13 of the flexible screen 1 is located on the side of the second housing 3 away from the first housing 2. When the electronic device 100 is in the second folded state, since the fifth display area 15, the fourth display area 14, and the first display area 11 of the flexible screen 1 are all located between the third housing 8 and the first housing 2, the display surface of the fifth display area 15 faces the display surface of the first display area 11, the fourth display area 14 is folded and disposed between the fifth display area 15 and the first display area 11, and the fourth display area 14 is located in the accommodating space 104 of the second folding mechanism 10, the fifth display area 15, the fourth display area 14, and the first display area 11 of the flexible screen 1 may be referred to as an inner screen of the flexible screen 1. When the third casing 8 is folded with the first casing 2, the fifth display area 15, the fourth display area 14, and the first display area 11 are folded to the space formed by the third casing 8, the first casing 2, and the second folding mechanism 10, and the fifth display area 15, the fourth display area 14, and the first display area 11 may thus also be referred to as an inner screen of the flexible screen 1. When the fourth display area 14 and the first display area 11 are folded, at least part of the display surface of the second display area 12 and the display surface of the third display area 13 of the flexible screen 1 are located outside the first folding mechanism 4 and the second housing 3, i.e. outside the electronic device 100, and the second display area 12 and the third display area 13 of the flexible screen 1 may thus be referred to as the outer screen of the flexible screen 1. At this time, the first folding mechanism 4 is used to fold the second display area 12 and the third display area 13 of the flexible screen 1 into the external screen of the electronic device 100.

Fig. 23 is a partial cross-sectional view of one embodiment of the electronic device 100 shown in fig. 18 at line G-G.

As shown in fig. 23, the third housing 8 includes a third rim 81, a third middle plate 82, and a third rear cover 83. Wherein, third medium plate 82 and third back lid 83 are connected along the inboard of third frame 81 along the Z axle direction. At least a portion of the third middle plate 82 is opposite to and spaced apart from at least a portion of the third rear cover 83.

As shown in fig. 23, the third housing 8 has a third accommodation space 84. Illustratively, a portion of the third bezel 81, a portion of the third middle plate 82, and a portion of the third rear cover 83 enclose a third receiving space 84.

As shown in fig. 21 and 23, the third housing 8 has a third fixing groove 822. The third fixing groove 822 and the third accommodating space 84 are disposed opposite to each other. Illustratively, a portion of the third rim 81 and a portion of the third middle plate 82 define a third retaining groove 822. It is understood that the third fixing groove 822 is separated from the third receiving space 84 by the third middle plate 82.

Illustratively, the third midplane 82 may be provided with a third via 824. The third through holes 824 may extend through both surfaces of the third middle plate 82 that are disposed opposite. The third through hole 824 communicates with the third receiving space 84 and the third fixing groove 822.

As shown in fig. 23, the first housing 2 has a third insulating portion 27. For example, the third insulating portion 27 may be made of plastic.

In some embodiments, the third insulating portion 27 is part of the first midplane 22. The third insulating portion 27 is provided with a fifth recessed region 27a and a sixth recessed region 27b. Wherein, the opening of the fifth concave area 27a faces the first accommodating space 24, that is, the lower surface of the third insulating portion 27 is concave toward the first fixing groove 222 to form the fifth concave area 27a. In addition, the opening of the sixth recessed area 27b is recessed toward the first fixing groove 222, that is, the upper surface of the third insulating portion 27 is recessed toward the first accommodating space 24 to form the sixth recessed area 27b.

As shown in fig. 23, in some embodiments, the electronic device 100 further includes a fifth chip 7e, where the fifth chip 7e is fixedly connected to the first circuit board 5a and electrically connected to the first circuit board 5a.

Illustratively, the fifth chip 7e may be fixed to a side of the first circuit board 5a facing the first middle board 22. The fifth chip 7e is located in the first accommodating space 24 of the first middle plate 22. In some other embodiments, the fifth chip 7e may also be located in the fifth recess region 27a of the third insulating portion 27. In this way, the fifth chip 7e can utilize the space of the first middle plate 22 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is beneficial to realizing the miniaturized arrangement of the electronic device 100.

As shown in fig. 21 and 23, in some embodiments, the electronic device 100 further includes a second trans-axis circuit board 9. The second trans-axis circuit board 9 includes a fourth plate portion 91, a fifth plate portion 92, and a sixth plate portion 93, which are connected in this order. The fifth plate portion 92 is connected between the fourth plate portion 91 and the sixth plate portion 93. Fig. 21 and 23 exemplarily illustrate that the fourth plate portion 91, the fifth plate portion 92, and the sixth plate portion 93 are arranged in the X-axis direction.

In some embodiments, the fourth plate portion 91 is located between the first housing 2 and the first display area 11 of the flexible screen 1. The fifth plate portion 92 is located between the folding mechanism 10 and the fourth display area 14 of the flexible screen 1. The sixth plate portion 93 is located between the third housing 8 and the fifth display area 15 of the flexible screen 1. In other embodiments, at least a portion of the second trans-axle circuit board 9 may be disposed internally through the second folding mechanism 10.

As shown in fig. 21 and 23, the fourth plate portion 91 of the second trans-axis circuit board 9 is exemplarily provided separately from both the first housing 2 and the first display area 11 of the flexible screen 1. In other words, the fourth plate portion 91 of the second trans-axis circuit board 9 is not fixedly connected to the first housing 2 and the first display area 11 of the flexible screen 1.

As shown in fig. 21 and 23, the fifth plate portion 92 of the second trans-axis circuit board 9 is exemplarily provided separately from both the first folding mechanism 4 and the fourth display area 14 of the flexible screen 1. In other words, the fifth plate portion 92 of the second trans-axis circuit board 9 is not fixedly connected to the first folding mechanism 4 and the fourth display area 14 of the flexible screen 1.

As shown in fig. 21 and 23, the sixth plate portion 93 of the second trans-axle circuit board 9 may be fixedly connected with the fifth display area 15 by adhesive, for example.

As shown in fig. 23, in some embodiments, the electronic device 100 further includes a sixth chip 7f. Illustratively, the sixth chip 7f is fixed to a side of the fourth plate portion 91 of the second trans-axle circuit board 9 facing the first middle plate 22, and is electrically connected to the fourth plate portion 91. In some other embodiments, the fourth chip 7d may be located in the sixth recess region 27b of the third insulating portion 27. In this way, the sixth chip 7f can utilize the space of the first middle plate 22 in the thickness direction (i.e., the Z-axis direction) of the electronic device 100, and at this time, the thickness of the electronic device 100 in the Z-axis direction can be reduced, which is advantageous for realizing the miniaturized arrangement of the electronic device 100.

As shown in fig. 23, in some embodiments, the sixth chip 7f is disposed opposite to the fifth chip 7 e. The sixth chip 7f and the fifth chip 7e can realize wireless communication connection. In this way, the first circuit board 5a can be connected to the second trans-axis circuit board 9 by wireless communication between the fifth chip 7e and the sixth chip 7 f.

In one embodiment, the distance between the fifth chip 7e and the sixth chip 7f is in the range of 5 to 15 mm in the Z-axis direction. Illustratively, the distance between the fifth chip 7e and the sixth chip 7f may be 5 mm, 8 mm, 10 mm, 12 mm, 13 mm or 15 mm. In the present embodiment, the distance between the fifth chip 7e and the sixth chip 7f is smaller, so that signal transmission between the fifth chip 7e and the sixth chip 7f is enhanced, and the reliability of wireless communication between the chips is also improved.

As shown in fig. 23, in some embodiments, the electronic device 100 further includes a third circuit board 5c. The third circuit board 5c is fixed to the third housing 8. Illustratively, the third circuit board 5c is fixed to the third rear cover 83 and is located in the third accommodating space 84 of the third housing 8. It will be appreciated that the third circuit board 5c may be used to connect the various devices, making electrical connection between the devices. The material, shape, position, size, etc. of the third circuit board 5c are not particularly limited.

As shown in fig. 23, in some embodiments, the electronic device 100 further includes a second electrical connector 86. The second electrical connector 86 includes a second female receptacle 86a and a second male receptacle 86b. The second female socket 86a is fixed on the third circuit board 5c and electrically connected to the third circuit board 5c.

Illustratively, the second female socket 86a may be fixed to a side of the third circuit board 5c facing the third middle plate 82. In one embodiment, the second female seat 86a is located within the third through-hole 824 of the third midplane 82.

As shown in fig. 23, in some embodiments, the second male socket 86b of the second electrical connector 86 may be fixedly connected to the sixth plate portion 93 and electrically connected to the second trans-axle circuit board 9. The second male socket 86b of the second electrical connector 86 can be plugged into the second female socket 86a of the second electrical connector 86. In this way, the second trans-axle circuit board 9 can be connected in wireless communication with the third circuit board 5c through the second electrical connector 86.

It is understood that in the present embodiment, the first circuit board 5a can be connected to the second trans-axis circuit board 9 through wireless communication between the fifth chip 7e and the sixth chip 7 f. The second trans-axle circuit board 9 can be connected to the third circuit board 5c by wireless communication through the second electrical connector 86. In this way, the first circuit board 5a can be connected to the third circuit board 5c by wireless communication through the fifth chip 7e, the sixth chip 7f, the second trans-axis circuit board 9, and the second electrical connector 86. In other words, the present embodiment can connect circuit boards located in different housings in wireless communication through the first chip 7a, the second chip 7c, the trans-axis circuit board 6, and the electrical connector 36. The circuit boards located in different housings can also be connected in wireless communication through the first chip 7a, the second chip 7c, the trans-axis circuit board 6, and the third chip 7c and the fourth chip 7 d. The circuit boards located in different housings may also be connected in wireless communication via the fifth chip 7e, the sixth chip 7f, the second trans-axle circuit board 9 and the second electrical connector 86.

In the present embodiment, since the first circuit board 5a is connected to the second trans-axis circuit board 9 through the fifth chip 7e and the sixth chip 7f in a wireless communication manner, there is no direct fixed connection between the first circuit board 5a and the second trans-axis circuit board 9, that is, a portion of the second trans-axis circuit board 9 close to the first circuit board 5a is a free portion. In this way, in the folding or flattening process of the electronic device 100, the portion of the second trans-axis circuit board 9 close to the first circuit board 5a may be moved to solve the problem of deformation of the second trans-axis circuit board 9 caused by pulling, so as to reduce the risk of breakage of the second trans-axis circuit board 9 after the folding times are increased, and further improve the stability and reliability of the electronic device 100.

It can be understood that, in the present embodiment, by disposing the fourth plate portion 91 of the second trans-axle circuit board 9 between the first housing 2 and the first display area 11 of the flexible screen 1, the fifth plate portion 92 of the second trans-axle circuit board 9 is disposed between the folding mechanism 10 and the fourth display area 14 of the flexible screen 1, and the sixth plate portion 93 of the second trans-axle circuit board 9 is disposed between the third housing 8 and the fifth display area 15 of the flexible screen 1, the second trans-axle circuit board 9 does not pass through the second folding mechanism 10 any more, and the second folding mechanism 10 can be further narrowed and thinned, so as to realize the light and thin arrangement of the electronic device. Thus, the second trans-axle circuit board 9 and the second folding mechanism 10 are two independent structural members, the second trans-axle circuit board 9 does not need to be folded, the reliability of the second trans-axle circuit board 9 is ensured, and the service life of the second trans-axle circuit board 9 is prolonged. On the one hand, the assembly difficulty of the second trans-axle circuit board 9 and the second folding mechanism 10 can be reduced, and the cost investment is reduced. On the other hand, when the second span shaft circuit board 9 needs to be maintained and replaced, the risk of damaging the second folding mechanism 10 can be avoided without carrying out relevant disassembly operation on the second folding mechanism 10, the maintenance operation is simplified, the maintenance difficulty is reduced, and the maintenance cost is saved. The maintenance or replacement of the second trans-axle circuit board 9 and the maintenance or replacement of the second folding mechanism 10 do not interfere with each other, and the recycling rate of the components is improved.

It can be understood that the third insulating portion 27 is made of plastic or other materials that will not shield or interfere with the wireless signal, that is, the third insulating portion 27 located between the fifth chip 7e and the sixth chip 7f will not generate shielding effect or interfere with the communication transmission between the fifth chip 7e and the sixth chip 7f, so that the normal wireless communication connection between the first circuit board 5a and the second trans-axis circuit board 9 is not affected, the normal signal transmission between the first circuit board 5a and the third circuit board 5c is ensured, and thus the normal operation of each device located in the first accommodating space 24 of the first housing 2 and the third accommodating space 84 of the third housing 8 is ensured, and further the stability and reliability of the electronic device 100 are ensured.

It should be noted that, under the condition of no conflict, the embodiments of the present application and features in the embodiments may be combined with each other, and any combination of features in different embodiments is also within the scope of the present application, that is, the above-described embodiments may also be combined arbitrarily according to actual needs.

It should be noted that all the above figures are exemplary illustrations of the present application and do not represent actual sizes of products. And the dimensional relationships among the components in the drawings are not intended to limit the actual products of the application. The above is only a part of examples and embodiments of the present application, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are covered in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. An electronic device (100) is characterized by comprising a first shell (2), a second shell (3), a first folding mechanism (4), a first circuit board (5 a), a second circuit board (5 b) and a first trans-axis circuit board (6), wherein the first folding mechanism (4) is connected with the first shell (2) and the second shell (3), and the first folding mechanism (4) can drive the first shell (2) and the second shell (3) to be unfolded and closed relatively;

The first circuit board (5 a) is fixed on the first shell (2), and the second circuit board (5 b) is fixed on the second shell (3);

The first trans-axle circuit board (6) comprises a first board part (61), a second board part (62) and a third board part (63) which are connected in sequence, wherein the first board part (61) is positioned in the first shell (2), and the third board part (63) is positioned in the second shell (3) and is electrically connected with the second circuit board (5 b);

The electronic device (100) further comprises a first chip (7 a) and a second chip (7 b), wherein the first chip (7 a) is fixed on the first circuit board (5 a) and is electrically connected with the first circuit board (5 a), the second chip (7 b) is fixed on the first board part (61) and is electrically connected with the first board part (61), and the second chip (7 b) is in wireless communication connection with the first chip (7 a) so that the first board part (61) is electrically connected with the first circuit board (5 a).

2. The electronic device (100) according to claim 1, wherein the first chip (7 a) is arranged opposite the second chip (7 b) over a thickness of the electronic device (100), a distance between the first chip (7 a) and the second chip (7 b) being in a range of 5 to 15 millimeters.

3. The electronic device (100) according to claim 1, wherein the electronic device (100) further comprises a third chip (7 c) and a fourth chip (7 d), the third chip (7 c) being fixed on the second circuit board (5 b) and electrically connected to the second circuit board (5 b), the fourth chip (7 d) being fixed on the third board portion (63) and electrically connected to the third board portion (63);

The fourth chip (7 d) is connected to the third chip (7 c) in a wireless communication manner so that the third board portion (63) is electrically connected to the second circuit board (5 b).

4. The electronic device (100) according to claim 1, wherein the electronic device (100) further comprises an electrical connector (36), the electrical connector (36) being fixed between the third board portion (63) and the second circuit board (5 b), the third board portion (63) being electrically connected to the second circuit board (5 b) through the electrical connector (36).

5. The electronic device (100) according to claim 4, wherein the electronic device (100) further comprises a bracket (37), a middle portion of the bracket (37) is located at a side of the third board portion (63) away from the second circuit board (5 b), and both ends of the bracket (37) are fixed to the bracket on the second circuit board (5 b).

6. The electronic device (100) according to any one of claims 1 to 5, wherein the first housing (2) includes a first frame (21), a first middle plate (22), and a first rear cover (23), the first middle plate (22) and the first rear cover (23) are connected inside the first frame (21) in a thickness direction of the electronic device (100), and at least a portion of the first middle plate (22) is disposed opposite to and spaced apart from the first rear cover (23);

A first accommodating space (24) is surrounded by a part of the first frame (21), a part of the first middle plate (22) and a part of the first rear cover (23), the first circuit board (5 a) and the first chip (7 a) are positioned in the first accommodating space (24), and the first plate part (61) and the second chip (7 b) are positioned on one side, facing away from the first accommodating space (24), of the first middle plate (22).

7. The electronic device (100) according to claim 6, wherein the first midplane (22) has a first insulating portion (25), the first insulating portion (25) being located between the first chip (7 a) and the second chip (7 b).

8. The electronic device (100) according to claim 7, wherein the first insulating portion (25) is provided with a first recessed area (25 a), an opening of the first recessed area (25 a) being directed towards the first accommodation space (24);

At least part of the first chip (7 a) is located in the first recess region (25 a).

9. The electronic device (100) according to claim 7, wherein the first insulating portion (25) is provided with a second recessed area (25 b), an opening of the second recessed area (25 b) facing away from a side of the first accommodation space (24);

At least part of the second chip (7 b) is located in the second recess region (25 b).

10. The electronic device (100) according to claim 6, wherein the first middle plate (22) is provided with a first groove (223), and an opening of the first groove (223) faces away from a side of the first accommodating space (24);

At least part of the first plate portion (61) of the first trans-axial circuit board (6) is located in the first groove (223).

11. The electronic device (100) according to claim 6, wherein the electronic device (100) further comprises a flexible screen (1), the flexible screen (1) comprising a first display area (11), a second display area (12) and a third display area (13) connected in sequence, the first display area (11) being fixed to the first housing (2), the third display area (13) being fixed to the second housing (3);

The first plate part (61) of the first trans-axle circuit board (6) is located between the first shell (2) and the first display area (11), the second plate part (62) of the first trans-axle circuit board (6) is located between the first folding mechanism (4) and the second display area (12), and the third plate part (63) of the first trans-axle circuit board (6) is located between the second shell (3) and the third display area (13).

12. The electronic device (100) according to claim 11, wherein the electronic device (100) further comprises a glue layer (64), the glue layer (64) connecting a third board portion (63) of the first trans-axis circuit board (6) with the third display area (13).

13. The electronic device (100) according to any one of claims 1 to 5, 7 to 12, wherein the electronic device (100) further comprises a third housing (8), a second folding mechanism (10), a second trans-axial circuit board (9) and a third circuit board (5 c), the second folding mechanism (10) connecting the first housing (2) and the third housing (8), the second folding mechanism (10) being capable of bringing the first housing (2) and the third housing (8) to open and close relatively; the third circuit board (5 c) is fixed to the third housing (8);

The second trans-axle circuit board (9) comprises a fourth board part (91), a fifth board part (92) and a sixth board part (93) which are connected in sequence, wherein the fourth board part (91) is positioned in the first shell (2), and the sixth board part (93) is positioned in the third shell (8) and is electrically connected with the third circuit board (5 c);

The electronic device (100) further comprises a fifth chip (7 e) and a sixth chip (7 f), wherein the fifth chip (7 e) is fixed on the first circuit board (5 a) and is electrically connected with the first circuit board (5 a), the sixth chip (7 f) is fixed on the fourth board portion (91) and is electrically connected with the fourth board portion (91), and the sixth chip (7 f) is in wireless communication connection with the fifth chip (7 e) so that the fourth board portion (91) is electrically connected with the first circuit board (5 a).

14. The electronic device (100) according to claim 13, wherein the fifth chip (7 e) is arranged opposite to the sixth chip (7 f), the distance between the fifth chip (7 e) and the sixth chip (7 f) being in the range of 5 to 15 mm in the thickness of the electronic device (100).

15. The electronic device (100) according to claim 13, wherein the third housing (8) includes a third frame (81), a third middle plate (82), and a third rear cover (83), the third middle plate (82) and the third rear cover (83) are connected inside the third frame (81) in a thickness direction of the electronic device (100), and at least a part of the third middle plate (82) is opposite to and spaced apart from at least a part of the third rear cover (83);

A third accommodating space (84) is defined by a part of the third frame (81), a part of the third middle plate (82), and a part of the third rear cover (83);

The third circuit board (5 c) is located in the third accommodating space (84).