CN115811563A - Mobile terminal - Google Patents

Mobile terminal Download PDF

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Publication number
CN115811563A
CN115811563A CN202111083988.9A CN202111083988A CN115811563A CN 115811563 A CN115811563 A CN 115811563A CN 202111083988 A CN202111083988 A CN 202111083988A CN 115811563 A CN115811563 A CN 115811563A
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CN
China
Prior art keywords
board
interface
mobile terminal
sub
spare
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Pending
Application number
CN202111083988.9A
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Chinese (zh)
Inventor
黄波
查鹏
徐治效
李旺益
徐一
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202111083988.9A priority Critical patent/CN115811563A/en
Publication of CN115811563A publication Critical patent/CN115811563A/en
Pending legal-status Critical Current

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Abstract

The application provides a mobile terminal, including: the PCB comprises a shell, wherein a main board, a flexible circuit board and a small board which are sequentially connected are arranged in the shell, the main board comprises a first sub-board and a frame board, a first interface is arranged on one side surface of the frame board and comprises a plurality of pins, and the first sub-board is welded with the frame board through the first interface; the signal multiplexer is arranged on the mainboard and used for multiplexing a plurality of paths of digital signals to be transmitted by the mainboard and sending the multiplexed digital signals to the small board through the flexible circuit board; and the signal demultiplexer is arranged on the small plate and used for demultiplexing and outputting the multiplexed digital signals. This application sends through flexible circuit board after adopting signal multiplexer to multiplex multichannel digital signal, can reduce the flexible circuit board size for mobile terminal's inner structure is effectively optimized.

Description

Mobile terminal
Technical Field
The application relates to the technical field of electronic products, in particular to a mobile terminal.
Background
With the development of science and technology, intelligent mobile terminals such as mobile phones and tablet computers are rapidly popularized, social development is greatly promoted, and people's life is facilitated. Due to the portability requirement of the mobile terminal, the internal space is very limited, and people are constantly striving to realize more functions in the limited space so as to bring better use experience to users. Thus, more and more functional elements are integrated inside the mobile terminal.
In the current design scheme, for making cell-phone complete machine thickness thin, adopt the design framework of syllogic more, set up the mainboard promptly on the battery, set up the platelet at the battery lower extreme, adopt Flexible Printed Circuit (FPC) to connect mainboard and platelet. And a plurality of functional elements on the small board realize the communication of digital signals with a processor on the main board through the flexible circuit board. As the mobile terminal includes more and more functional elements, the flexible circuit board to be used becomes thicker and thicker, thereby occupying more internal space of the mobile terminal, limiting the structural design and layout of the inside of the mobile terminal, and being disadvantageous to product miniaturization and light and thin design.
Disclosure of Invention
The application provides a mobile terminal sends through flexible circuit board after adopting signal multiplexer to multiplex multichannel digital signal, can reduce the flexible circuit board size for mobile terminal's inner structure is effectively optimized.
In a first aspect, a mobile terminal is provided, which includes a housing, and a main board, a flexible circuit board and a small board sequentially connected to each other are disposed inside the housing, the main board includes a first sub-board and a frame board, a first interface is disposed on one side surface of the frame board, the first interface includes a plurality of pins, and the first sub-board is welded to the frame board through the first interface; the signal multiplexer is arranged on the mainboard and used for multiplexing a plurality of paths of digital signals to be transmitted by the mainboard and sending the multiplexed digital signals to the small board through the flexible circuit board; and the signal demultiplexer is arranged on the small plate and used for demultiplexing and outputting the multiplexed digital signals.
According to the mobile terminal provided by the embodiment of the application, the signal multiplexer is arranged on the main board, the signal demultiplexer is arranged on the small board, the two signal processors are mutually matched for use, the signal multiplexer on the main board (namely, the signal input end) multiplexes the multiple paths of digital signals to be transmitted and then sends the multiplexed signals to the small board through the flexible circuit board, and the signal demultiplexer on the small board (namely, the signal output end) demultiplexes the multiplexed signals and then transmits the demultiplexed signals to the corresponding signal receiving party, so that the normal transmission of the multiple paths of digital signals is not influenced.
On this basis, the mobile terminal provided in the embodiment of the present application combines multiple digital signals on one physical channel by using a multiplexing (multiplexing) technology to perform transmission, so that a communication line can be effectively utilized, and the number of physical channels required for signal transmission is reduced. The physical channels are disposed on the flexible circuit board, and the number of the physical channels is positively correlated to the size of the flexible circuit board, so that the size (e.g., width and/or thickness) of the flexible circuit board is reduced due to the reduction of the physical channels. Therefore, the arrangement space of other components in the mobile terminal is expanded, the internal structure of the mobile terminal is effectively optimized, the difficulty of the internal structural design and layout of the mobile terminal is reduced, the miniaturization and light and thin design of the mobile terminal are facilitated, and the use experience of a user can be improved. In addition, as the size of the flexible circuit board becomes smaller, the capacity of the storage battery is increased, which is beneficial to increasing the cruising ability of the mobile terminal.
Alternatively, the signal multiplexer and the signal demultiplexer may be a signal processing circuit or a signal processing chip, and may be a Field Programmable Gate Array (FPGA) circuit, for example.
Optionally, functional elements such as a microphone, a speaker, a charging interface, a USB interface, a SIM card interface, a radio frequency interface, or an antenna contact are disposed on the small board.
Alternatively, the flexible circuit board may be electrically connected to the main board and/or the small board through a soldering process.
Optionally, the flexible circuit board is electrically connected to the main board and/or the small implementation through a connector.
For example, the connector may be a Zero Insertion Force (ZIF) connector or a Board To Board (BTB) connector.
Alternatively, a storage battery is disposed in a battery compartment between the main board and the small board, and the storage battery is an energy storage tool for providing power for the mobile terminal, and generally consists of a battery core, a protection circuit and a casing. The storage battery can be a lithium battery, a nickel-metal hydride battery, a sodium ion battery or the like.
In one possible design, the signal aggregator is disposed on the first sub-board, and the flexible circuit board is connected to the frame board.
This application embodiment is through locating signal multiplexer on first daughter board, can multiplex the back earlier and transmit to the frame plate through first interface, can reduce the quantity of the required pin that sets up of first interface from this, the quantity of pin is reduced the face area of the frame plate that required the occupation also and is reduced, and then is favorable to reducing the frame plate size, mobile terminal's inner structure is further optimized, the capacity of battery also can increase.
Optionally, the signal multiplexer may be disposed on the motherboard as a separate component, or may be integrated with other components (e.g., a chip or a processor) to serve as a module of the integrated device, which is not limited in this application. For example, the signal multiplexer may be integrated with the SOC chip, and in this case, the signal multiplexer may also serve as a processing module of the new chip.
Similarly, the signal demultiplexer may be disposed on the small board as a separate component, or may be integrated with other components (e.g., a chip or a processor) to serve as a module of the integrated device, which is not limited in this application.
In one possible design, a first spare interface is further disposed on the frame plate, the first spare interface includes a plurality of pins, and the first spare interface is used for welding a first spare sub-plate replacing the first sub-plate.
This application is through setting up the first reserve interface with first reserve daughter board looks adaptation on the frame plate, can make the frame plate can arrange first daughter board or first reserve daughter board and use from this, the suitability of frame plate has been improved, mobile terminal's manufacture factory can freely select to use first daughter board or first reserve daughter board according to the condition of prepareeing materials, and need not to prepare materials at first daughter board and redevelop the frame plate of the first reserve daughter board of adaptation when not enough, can guarantee the continuation of manufacture to this money product production and going to the market from this.
In one possible design, the first interface is shared with a portion of the pins of the first spare interface.
The number of pins required to be arranged can be reduced through the arrangement, the size of the frame plate is favorably reduced, the adverse effect on the internal structure of the mobile terminal caused by the arrangement of the first standby interface can be reduced as much as possible, and the influence on the capacity of the storage battery is reduced as much as possible.
In a possible design, the signal splitter is further configured to multiplex multiple digital signals to be transmitted by the small board, and send the multiplexed digital signals to the main board through the flexible circuit board; the signal aggregator is also used for demultiplexing the multiplexed digital signals and outputting the demultiplexed digital signals.
That is to say, the signal multiplexer has the ability of signal multiplexing and signal demultiplexing simultaneously, the signal demultiplexer also has the ability of signal multiplexing and signal demultiplexing simultaneously, the flexible circuit board can carry out the bidirectional transmission of digital signals, and in any transmission direction, all adopt multiplexing technique to combine multichannel digital signals and carry out transmission on a physical channel, can further reduce the quantity of the physical channel that signal transmission needs from this, can further reduce the size of flexible circuit board, further optimize the inner structure of mobile terminal.
Optionally, all signals to be transmitted between the main board and the small board may be implemented by the flexible circuit board without providing other circuit boards, for example, a flexible board originally disposed between the battery and the middle frame may be eliminated, and only the flexible circuit board is retained, and the flexible circuit board may be disposed between the battery and the rear cover.
In one possible design, the housing includes a rear cover, a battery is further provided between the main board and the small board, and the flexible circuit board is located between the battery and the rear cover.
In a possible design, the main board further comprises a second sub-board, a second interface is arranged on the other side face of the frame board, the second interface comprises a plurality of pins, and the second sub-board is welded to the frame board through the second interface.
In a possible design, a second spare interface is further disposed on the frame plate, the second spare interface includes a plurality of pins, the second spare interface is used for welding a second spare daughter board replacing the second daughter board, and the second interface is shared with a part of the pins of the second spare interface.
In one possible design, the first sub-board is an SOC board, and the second sub-board is a radio frequency board.
In one possible design, one or more electronic components are provided on the frame plate.
Drawings
Fig. 1 is a schematic overall structure diagram of a mobile terminal according to an embodiment of the present application.
Fig. 2 is a cross-sectional view from the AA perspective of the mobile terminal shown in fig. 1.
Fig. 3 is a back view of a mobile terminal according to an embodiment of the present disclosure after uncapping.
Fig. 4 is a schematic overall structure diagram of a main board of a mobile terminal according to an embodiment of the present application.
Fig. 5 is an exploded view of the main board shown in fig. 4.
Fig. 6 is a cross-sectional view of the main board shown in fig. 4 from the BB view.
Fig. 7 is a top view of the frame plate in fig. 4.
Fig. 8 is a cross-sectional view of another example of a main board of a mobile terminal according to an embodiment of the present application.
Fig. 9 is a schematic diagram of the signal flow direction between the motherboard and the platelet.
Reference numerals:
100. a housing; 110. a frame; 120. a rear cover;
200. a display screen;
300. a middle frame;
400. a main board; 410. a first sub-board; 411. an SOC chip; 412. a first electronic component; 413. a signal multiplexer; 420. a frame plate; 421. a third interface; 422. a third electronic component; 423. a first interface; 424. a first backup interface; 425. a second interface; 426. a second backup interface; 427. a pin; 430. a second sub-board; 431. a radio frequency chip; 432. a second electronic component; 433. a fourth interface; 440. a solder ball; 410', a first spare daughter board; 411', a standby SOC chip; 412', a first spare electronic component; 413', a standby signal aggregator; 430', a second spare daughter board; 431', a spare radio frequency chip; 432', a second spare electronic component;
500. a storage battery;
600. a platelet; 610. a signal demultiplexer; 620. a fifth interface; 630. a first functional element; 640. a second functional element;
700. a flexible circuit board.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it is to be understood that the terms "upper", "lower", "side", "front", "rear", and the like indicate orientations or positional relationships based on installation, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it should be noted that the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.
It should be noted that the same reference numerals are used to denote the same components or parts in the embodiments of the present application, and for the same parts in the embodiments of the present application, only one of the parts or parts may be given the reference numeral, and it should be understood that the reference numerals are also applicable to the other same parts or parts.
The embodiment of the application provides a mobile terminal, a signal multiplexer is arranged on a main board, firstly, multiplexing (aggregation compression) is carried out on a plurality of paths of digital signals to be transmitted according to a specific format, then, the signals are sent to a small board through a flexible circuit board, and then the signal demultiplexer arranged on the small board carries out demultiplexing (expansion dispersion) according to a corresponding rule. The mobile terminal provided by the application can reduce the size of the flexible circuit board on the premise of not influencing normal signal transmission, so that the internal structure of the mobile terminal is effectively optimized, the difficulty of the internal structural design and layout of the mobile terminal is reduced, the miniaturization and light and thin design of the mobile terminal are facilitated, and the use experience of a user can be improved.
The mobile terminal provided by the embodiment of the present application is an electronic device that is portable and has at least one of a voice and phone call function, an information input and/or output function, a data storage function, and the like. For example, the electronic device may be any electronic device such as a mobile phone, a tablet computer, an electronic reader, a notebook computer, a vehicle-mounted device, a wearable device, and the like, and may also be a foldable device such as a foldable mobile phone, but is not limited thereto. The following describes a specific structure of a mobile terminal according to an embodiment of the present application, by taking a mobile phone as an example.
Fig. 1 is a schematic overall structure diagram of a mobile terminal according to an embodiment of the present application. Fig. 2 is a cross-sectional view from the AA perspective of the mobile terminal shown in fig. 1. Fig. 3 is a back view of a mobile terminal according to an embodiment of the present disclosure after uncapping. As shown in fig. 1 to 3, the mobile terminal provided by the embodiment of the present application includes a housing 100 and a display 200, and the display 200 is mounted on the housing 100.
The housing 100 forms an external shape of the mobile terminal, and the housing 100 may be a metal housing, such as a magnesium alloy, an aluminum alloy, and stainless steel. In addition, the housing may be a plastic housing, a glass housing, a ceramic housing, or the like, but is not limited thereto. The casing 100 has a mounting cavity inside, and various electronic components (not shown in fig. 3) are mounted in the mounting cavity, such as a circuit board, a processor disposed on the circuit board, a storage battery, a camera, a flash lamp, a microphone, a speaker, and various peripherals, but not limited thereto.
The mobile terminal may further include a display screen 200 disposed on the housing 100, wherein the display screen 200 serves as a front panel of the mobile terminal and forms the aforementioned installation cavity with the housing 100. The display screen 200 constitutes a display surface of the mobile terminal, and is used for displaying information such as images and texts and providing information interaction. The display panel 200 may be a Light Emitting Diode (LED) display panel, a Liquid Crystal Display (LCD) display panel, or an Organic Light Emitting Diode (OLED) display panel, but is not limited thereto.
The display 200 may also be a flexible screen (folding screen) having a bending property, in which case the mobile terminal may be a foldable terminal device. The flexible screen may be, for example, an OLED display, an active-matrix organic light-emitting diode (AMOLED) display, a mini-led (mini-organic light-emitting diode) display, a micro-led (micro-organic light-emitting diode) display, a micro-OLED (micro-organic light-emitting diode) display, a quantum dot led (QLED) display, etc., but is not limited thereto.
As shown in fig. 1 to 3, the casing 100 includes a frame 110 and a rear cover 120, the rear cover 120 is fixedly connected to a rear end surface of the frame 110, and the display screen 200 is fixedly connected to a front end surface of the frame 110. The casing 100 is further provided with a middle frame 300, the middle frame 300 is connected with the frame 110, the display screen 200 is fixedly attached to the front side of the middle frame 300, and elements such as the main board 400, the storage battery 500 and the small board 600 are accommodated between the rear side of the middle frame 300 and the rear cover 120.
Specifically, the inside of the casing 100 further includes a main board 400, a storage battery 500, and a small board 600 sequentially arranged from top to bottom to form a traditional three-stage design architecture, the main board 400 and the small board 600 are electrically connected through a Flexible Printed Circuit (FPC) 700, and the FPC 700 is stacked on the storage battery 500.
The main board 400 is an important part of the mobile terminal on which various devices constituting a circuit system of the mobile terminal are mounted. For example, the main circuit, processor, chip, capacitor, resistor, inductor, interface, and plug-in of the mobile terminal are disposed on the main board 400.
For example, the main board 400 may be provided with an integrated circuit (SOC) chip, a Power Management Unit (PMU) chip, a radio frequency chip, or the like, and the main board 400 is generally provided with various processors such as a Central Processing Unit (CPU), an Application Processor (AP), a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), or the like, but is not limited thereto.
The battery 500 is disposed in a battery compartment between the main board 400 and the small board 600, and the battery 500 is an energy storage tool for providing power to the mobile terminal, and generally comprises three parts, namely a battery core, a protection circuit and a housing. The battery 500 may be a lithium battery, a nickel metal hydride battery, a sodium ion battery, or the like.
The small plate 600 is disposed at the bottom end of the mobile terminal, and functional elements such as a microphone, a speaker, a charging interface, a USB interface, a SIM card interface, a radio frequency interface, or an antenna contact are generally disposed on the small plate 600.
The main board 400 and the small board 600 are connected through the flexible circuit board 700. In one embodiment, the flexible circuit board 700 may be attached to an outer surface of the secondary battery 500 and clamped between the secondary battery 500 and the middle frame 300 of the mobile terminal. In another embodiment, the flexible circuit board 700 is clamped between the secondary battery 500 and the rear cover 120 of the mobile terminal.
Alternatively, the flexible circuit board 700 may be electrically connected to the main board 400 and/or the small board 600 through a soldering process.
Optionally, the flexible circuit board 700 is electrically connected to the main board 400 and/or the small board 600 through a connector.
For example, the connector may be a Zero Insertion Force (ZIF) connector or a Board To Board (BTB) connector.
As shown in fig. 3, the mobile terminal provided in the present application further includes a signal multiplexer (multiplexer) 413 and a signal demultiplexer (demultiplexer) 610, which are used in cooperation with each other, and the signal multiplexer 413 and the signal demultiplexer 610 can process multiple digital signals transmitted by the flexible circuit board 700.
Specifically, the signal multiplexer 413 is provided on the main board 400, the signal demultiplexer 610 is provided on the small board 600, the signal multiplexer 413 is located at a signal input end (upstream end) of the flexible circuit board 700, and the signal demultiplexer 610 is located at a signal output end (downstream end) of the flexible circuit board 700. The signal multiplexer 413 is configured to multiplex (aggregate-compress) the multiple digital signals, and the signal demultiplexer 610 is configured to demultiplex (decompose-restore) the multiplexed digital signals. The signal multiplexer 413 and the signal demultiplexer 610 may be a signal processing circuit or a signal processing chip, and may be a Field Programmable Gate Array (FPGA) circuit, for example.
The signal multiplexer 413 is configured to multiplex (also commonly referred to as aggregate, or combine) multiple digital signals to be transmitted by the motherboard 400, and transmit the multiplexed digital signals to the small board 600 through the flexible circuit board 700. The signal demultiplexer 610 and the signal multiplexer 413 are used together, and the processing logics of the two are completely opposite, and the signal demultiplexer 610 is used for demultiplexing (also commonly referred to as recovering, restoring, decomposing or splitting) and outputting the multiplexed digital signal.
Here, the signal multiplexer 413 can perform multiplexing processing on the multiple digital signals according to preset logic, for example, the multiple digital signals are multiplexed into one path and then transmitted to the signal demultiplexer 610 on the small board 600 through the flexible circuit board 700, and the signal demultiplexer 610 restores the multiple digital signals according to corresponding logic and distributes the multiple digital signals to a signal receiving party, which may be, for example, a plurality of functional elements arranged on the small board 600. Thus, the sender of the multipath signal may come from a processor on the motherboard 400 that controls the action of the functional elements on the platelet 600.
According to the mobile terminal provided by the embodiment of the application, the signal multiplexer 413 is arranged on the main board 400, the signal demultiplexer 610 is arranged on the small board 600, the two signal processors are used in a matched manner, the signal multiplexer 413 on the main board 400 (i.e. a signal input end) multiplexes the to-be-transmitted multi-channel digital signals and then transmits the multiplexed signals to the small board 600 through the flexible circuit board 700, and the signal demultiplexer 610 on the small board 600 (i.e. a signal output end) demultiplexes the multiplexed signals and then transmits the demultiplexed signals to the corresponding signal receiver, so that the normal transmission of the multi-channel digital signals is not affected.
On this basis, the mobile terminal provided in the embodiment of the present application combines multiple digital signals on one physical channel by using a multiplexing (multiplexing) technique to transmit, so that a communication line can be effectively utilized, and the number of physical channels required for signal transmission is reduced. The number of physical channels is positively correlated to the size of the flexible circuit board 700, and thus the reduction of the physical channels also enables the size (e.g., width and/or thickness) of the flexible circuit board 700 to be reduced. Therefore, the arrangement space of other components in the mobile terminal is expanded, the internal structure of the mobile terminal is effectively optimized, the difficulty of the internal structural design and layout of the mobile terminal is reduced, the miniaturization and light and thin design of the mobile terminal are facilitated, and the use experience of a user can be improved. In addition, as the size of the flexible circuit board 700 becomes smaller, the capacity of the storage battery is increased, which is beneficial to increasing the cruising ability of the mobile terminal.
Further, in this embodiment, the signal demultiplexer 610 is further configured to multiplex multiple digital signals to be transmitted by the small board 600, and send the multiplexed digital signals to the main board 400 through the flexible circuit board 700, and the signal multiplexer 413 is further configured to demultiplex the multiplexed digital signals and output the demultiplexed digital signals. At this time, the multi-channel digital signals transmitted from the small board 600 to the main board 400 may be aggregated and compressed, transmitted through the flexible circuit board 700, and then decomposed and restored.
That is to say, the signal multiplexer 413 has the capability of signal multiplexing and signal demultiplexing, the signal demultiplexer 610 also has the capability of signal multiplexing and signal demultiplexing, the flexible circuit board 700 can perform bidirectional transmission of digital signals, and in any transmission direction, multiplexing technology is adopted to combine multiple digital signals to transmit on one physical channel, so that the number of physical channels required by signal transmission can be further reduced, that is, the size of the flexible circuit board 700 can be further reduced, and the internal structure of the mobile terminal can be further optimized.
At this time, all signals that need to be transmitted between the main board 400 and the small board 600 may be realized by the flexible circuit board 700 without arranging other circuit boards, for example, a flexible board originally arranged between the storage battery 500 and the middle frame 300 may be eliminated, and only the flexible circuit board 700 is remained, and the flexible circuit board 700 may be arranged between the storage battery 500 and the rear cover 120.
The following describes a specific structure of a mobile terminal according to an embodiment of the present application with reference to the accompanying drawings. Fig. 4 is a schematic overall structure diagram of a main board 400 of a mobile terminal according to an embodiment of the present application. Fig. 5 is an exploded view of the main board 400 shown in fig. 4. Fig. 6 is a cross-sectional view of the main board 400 shown in fig. 4 from the BB view. Fig. 7 is a plan view of the frame plate 420 in fig. 4.
As shown in fig. 4 to 6, the main board 400 includes a first sub-board 410, a frame board 420, and a second sub-board 430, which are sequentially stacked and form a "sandwich" structure. The first sub-board 410, the frame board 420, and the second sub-board 430 correspond to an upper board, a middle connection board, and a lower board in a "sandwich" structure, respectively. The frame plate 420 is provided as a ring structure, the inside of which is hollowed out, the frame plate 420 may provide support for the first sub-plate 410 and the second sub-plate 430, and the first sub-plate 410, the frame plate 420, and the second sub-plate 430 together enclose a closed decoration space, which may be used to arrange (accommodate) various electronic components.
Considering the size, shape, and board routing of each electronic device comprehensively, a plurality of electronic components may be arranged on the first sub-board 410, the frame board 420, or the second sub-board 430 in combination, as shown in fig. 3-6, the first sub-board 410 may be provided with an SOC chip 411, the second sub-board 430 is provided with a radio frequency chip 431, and at this time, the first sub-board 410 may be referred to as an SOC board, and the second sub-board 430 is referred to as a radio frequency board.
Alternatively, the SOC chip 411 and/or the rf chip 431 may be disposed in the space of the decoration.
Alternatively, the SOC chip 411 may be disposed on an outer surface (a surface facing away from the swing space) of the first sub-board 410, and/or the rf chip 431 may be disposed on an outer surface of the second sub-board 430.
Alternatively, as shown in fig. 3 to 7, other electronic components may be further disposed on the first sub-board 410 and the second sub-board 430, for example, the first electronic component 412 may be further disposed on any one surface of the first sub-board 410, and the second electronic component 432 may be further disposed on any one surface of the second sub-board 430.
Optionally, the frame plate 420 may also be provided with at least one electronic component, for example, a third electronic component 422 may be provided on either side of the plate surface.
Alternatively, the first electronic component 412, the second electronic component 432, and the third electronic component 422 may be any one of the following electronic components: various circuits, functional elements (e.g., cameras, sensors, etc.), processors, chips, memories, capacitors, resistors, inductors, and interfaces and plug-ins, etc., but are not limited thereto.
As shown in fig. 5 to 7, a first interface 423 is disposed on one side surface (i.e., an upper surface in the figures) of the frame plate 420, and the first sub-plate 410 is welded to the frame plate 420 through the first interface 423, so as to achieve electrical conduction therebetween.
Specifically, the first interface 423 is formed by a plurality of pins 427, which are also commonly referred to as solder feet, so that the first interface 423 may also be referred to as a solder pad, and a corresponding interface (solder pad) is also disposed at a corresponding position of the first sub-board 410, so that the first sub-board 410 can be soldered to the frame board 420 through the solder balls 440 and the first interface 423 to achieve signal conduction.
As shown in fig. 5 to 7, the pins 427 are used for transmitting digital signals, and the number of the pins 427 is larger (for example, more than 100) due to the larger number of the digital signals to be transmitted, so that the plurality of pins 427 may be arranged around and spaced apart from each other along the circumferential direction of the frame plate 420, and may be arranged in a plurality of turns. The first sub-board 410 is soldered to the pins 427 by solder balls 440, which may also be referred to as solder bumps, the adjacent two solder balls 440 are isolated from each other, and the solder balls 440 may be, for example, tin plating, nickel plating, gold plating, organic solder resist (OSP), nickel gold (ENIG), electroless nickel palladium immersion gold (ENEPIG), etc., but are not limited thereto.
As shown in fig. 3-6, the signal multiplexer 413 is disposed on the first sub-board 410, the frame board 420 is disposed with a third interface 421, the third interface 421 may be a pad, or a male end or a female end of a connector, and the flexible circuit board 700 is connected to the frame board 420 through the third interface 421.
The embodiment of the present application, by disposing the signal multiplexer 413 on the first sub-board 410, can multiplex a plurality of signals and transmit the multiplexed signals to the frame board 420 through the first interface 423, thereby reducing the number of pins 427 required to be disposed on the first interface 423, reducing the number of pins 427 required to occupy the frame board 420, and further reducing the size of the frame board 420, further optimizing the internal structure of the mobile terminal, and increasing the capacity of the battery 500.
Alternatively, the signal multiplexer 413 may be disposed on the main board 400 as a separate component, or may be integrated with other components (e.g., a chip or a processor) to serve as a module of the integrated component, which is not limited in this application. For example, the signal multiplexer 413 may be integrated with the SOC chip 411, and the signal multiplexer 413 may be a processing module of the new SOC chip.
Similarly, the signal demultiplexer 610 may be disposed on the small board 600 as a separate component, or may be integrated with other components (e.g., a chip or a processor) to be a module of the integrated device, which is not limited in this application.
Fig. 9 is a schematic diagram of the signal flow direction between the main board 400 and the small board 600. As shown in fig. 9, the multiple paths of digital signals generated by the components such as the SOC chip 411 on the first board 410 are first multiplexed by the signal multiplexer 413, then transmitted to the frame board 420 through the first interface 423, and transmitted to the flexible circuit board 700 through the third interface 421 on the frame board 420, and then transmitted to the signal demultiplexer 610 through the fifth interface 620 provided on the small board 600, and the signal demultiplexer 610 demultiplexes the multiplexed digital signals and outputs the multiplexed digital signals to the plurality of functional elements provided on the small board 600, such as the first functional element 630 and the second functional element 640.
Similarly, the multiplexed digital signals generated by the first functional element 630, the second functional element 640, and the like are first multiplexed by the signal demultiplexer 610, then transmitted to the flexible circuit board 700 through the fifth interface 620, and then transmitted to the signal multiplexer 413 through the third interface 421 and the first interface 423 on the frame plate 420, and the signal multiplexer 413 demultiplexes the multiplexed digital signals and outputs the demultiplexed digital signals to the SOC chip 411, and the like.
As shown in fig. 5 and 6, in the embodiment of the present invention, a second interface 425 is disposed on the other side surface (i.e., the lower surface in the drawing) of the frame plate 420, and the second sub-plate 430 is welded to the frame plate 420 through the second interface 425, so as to achieve electrical conduction therebetween.
Specifically, the second interface 425 also includes a plurality of pins 427, a fourth interface 433 is disposed at a position corresponding to the second sub-board 430, and the fourth interface 433 also includes a plurality of pins that are disposed in one-to-one correspondence with the plurality of pins 427 of the second interface 425, so that the second sub-board 430 can be soldered to the frame plate 420 through the fourth interface 433, the solder balls 440, and the second interface 425, so as to achieve signal conduction.
Fig. 8 is a cross-sectional view of another example of the main board 400 of the mobile terminal according to the embodiment of the present application. As shown in fig. 5 to 8, in the embodiment of the present application, the frame plate 420 is further provided with a first spare joint 424, and the first spare joint 424 is located on the same side as and adjacent to the first joint 423. The first spare interface 424 includes a plurality of pins 427, and the first spare interface 424 is used to solder a first spare daughter board 410' that replaces the first daughter board 410.
As shown in fig. 8, the first spare sub-board 410' has the same function as the first sub-board 410, and can be used to replace (substitute for) the first sub-board 410. The first spare sub-board 410' is provided with a spare SOC chip 411', and the first spare sub-board 410' may also be referred to as a spare SOC board.
The spare SOC chip 411 'is functionally identical to the SOC chip 411, but may be manufactured by a different manufacturer, or have a different model, so that the type and/or number of signals transmitted by the two may be different, thereby making it impossible for the first spare sub-board 410' to be electrically connected to the frame board 420 through the first interface 423.
According to the embodiment of the application, the first standby interface 424 matched with the first standby sub-board 410 'is arranged on the frame board 420, so that the frame board 420 can be matched with the first sub-board 410 or the first standby sub-board 410' to be used, the adaptability of the frame board 420 is improved, a manufacturer of the mobile terminal can freely select to use the first sub-board 410 or the first standby sub-board 410 'according to the stock preparation condition, the frame board matched with the first standby sub-board 410' does not need to be re-developed when the stock preparation of the first sub-board 410 is insufficient, and therefore the continuity of the manufacturer for the production and marketing of the product can be guaranteed.
It should be understood that a plurality of electronic components are correspondingly disposed on the first sub-board 410 and the first spare sub-board 410', for example, the first spare electronic component 412', the spare signal multiplexer 413', and the like are further disposed on the first spare sub-board 410', most of the electronic components on the first sub-board 410 and the first spare sub-board 410' may be correspondingly the same, and only a few of the electronic components may be of different models, for example, the first spare electronic component 412' may be identical to the first electronic component 412, and the spare signal multiplexer 413' may be identical to the signal multiplexer 413, except that the spare SOC chip 411' is of different model from the SOC chip 411 (for example, produced by different suppliers), and in consideration of the possible shortage of materials in the SOC chip 411, the first spare sub-board 410' for the SOC chip 411' is additionally developed, and the first spare interface 424 adapted to the first spare sub-board 410' (i.e., the SOC chip 411 ') continues to be developed on the frame board 420, thereby enabling the frame board 420 to be freely used with the first spare sub-board 410 or the first spare sub-board 410'.
It should be noted that the electronic components with different models on the first sub-board 410 and the first spare sub-board 410 'may also be various processors or chips, that is, other components such as the processors or chips may have a material shortage, the first spare sub-board 410' may also be developed for processors or chips of different types, and the first spare interface 424 that is adapted to each other is disposed on the frame board 420, which is not limited in this application.
As shown in fig. 5-8, the first interface 423 is shared with a portion of the pins 427 of the first spare interface 424, i.e., the portion of the pins 427 belongs to both the first interface 423 and the first spare interface 424. For example, in fig. 5-8, the frame plate 420 has 3 turns of pins 427 on the top surface, the outer two turns of pins 427 form a first interface 423, and the inner two turns of pins 427 form a first spare interface 424, where the first interface 423 and the first spare interface 424 share a middle one turn of pins 427. The number of pins 427 required to be arranged can be reduced through the above arrangement, which is beneficial to reducing the size of the frame plate 420, and adverse effects on the internal structure of the mobile terminal caused by the arrangement of the first standby interface 424 can be reduced as much as possible, and the influence on the capacity of the storage battery 500 can be reduced as much as possible.
Further, as shown in fig. 5-8, in the embodiment of the present application, a second spare interface 426 is further disposed on the frame plate 420, the second spare interface 426 is disposed adjacent to and on the same side as the second interface 425, the second spare interface 426 includes a plurality of pins 427, and the second spare interface 426 is used for soldering a second spare sub-board 430' in place of the second sub-board 430.
Similarly, the second spare sub-board 430' has the same function as the second sub-board 430, and can be used in place of (or in place of) the second sub-board 430. The second spare daughter board 430 'is provided with a spare rf chip 431' and a second spare electronic component 432', the spare rf chip 431' has a different model from the rf chip 431, the second spare electronic component 432 'has the same model as the second electronic component 432, and the second spare daughter board 430' may also be referred to as a spare rf board.
The spare rf chip 431' has the same function as the rf chip 431, but the type and/or number of signals transmitted by the spare rf chip 431' may be different, thereby making it impossible for the second spare daughter board 430' to electrically connect to the frame board 420 through the second interface 425.
In the embodiment of the present application, the second spare interface 426 adapted to the second spare sub-board 430 'is disposed on the frame plate 420, so that the frame plate 420 can be arbitrarily matched with the second sub-board 430 or the second spare sub-board 430', thereby improving the adaptability of the frame plate 420.
Similarly, the second interface 425 shares a portion of the pins 427 with the second spare interface 426, i.e., a portion of the pins 427 belongs to both the second interface 425 and the second spare interface 426. For example, in fig. 6 and 8, the lower surface of the frame plate 420 is provided with 3 turns of the pins 427, the outer two turns of the pins 427 form the second interface 425, and the inner two turns of the pins 427 form the second spare interface 426, in which case the second interface 425 and the second spare interface 426 share the middle one turn of the pins 427. The number of pins 427 required to be arranged can be reduced through the above arrangement, which is beneficial to reducing the size of the frame plate 420, and adverse effects on the internal structure of the mobile terminal caused by the arrangement of the second standby interface 426 can be reduced as much as possible, and the influence on the capacity of the storage battery 500 can be reduced as much as possible.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A mobile terminal, comprising:
the flexible printed circuit board comprises a shell (100), wherein a main board (400), a flexible printed circuit board (700) and a small board (600) which are sequentially connected are arranged inside the shell, the main board (400) comprises a first sub-board (410) and a frame board (420), a first interface (423) is arranged on one side surface of the frame board (420), the first interface (423) comprises a plurality of pins, and the first sub-board (410) is welded with the frame board (420) through the first interface (423);
the signal multiplexer (413) is arranged on the main board (400) and used for multiplexing a plurality of paths of digital signals to be transmitted by the main board (400) and sending the multiplexed digital signals to the small board (600) through the flexible circuit board (700);
and the signal demultiplexer (610) is arranged on the small plate (600) and is used for demultiplexing the multiplexed digital signals and outputting the demultiplexed digital signals.
2. The mobile terminal of claim 1, wherein the signal aggregator (413) is disposed on the first sub-board (410), and the flexible circuit board (700) is connected to the frame plate (420).
3. The mobile terminal of claim 1 or 2, wherein the frame board (420) further has a first spare interface (424) disposed thereon, the first spare interface (424) comprising a plurality of pins, the first spare interface (424) being configured to solder a first spare daughter board (410') that replaces the first daughter board (410).
4. A mobile terminal according to claim 3, characterized in that the first interface (423) is shared with part of the pins of the first spare interface (424).
5. The mobile terminal according to any of claims 1-4, wherein the signal splitter (610) is further configured to multiplex multiple digital signals to be transmitted by the small board (600), and send the multiplexed digital signals to the main board (400) through the flexible circuit board (700); the signal aggregator (413) is also used for demultiplexing the multiplexed digital signals and outputting the demultiplexed digital signals.
6. Mobile terminal according to any of claims 1 to 5, characterized in that said housing (100) comprises a back cover (120), a battery (500) being further provided between said main board (400) and said small board (600), said flexible circuit board (700) being located between said battery (500) and said back cover (120).
7. The mobile terminal of any of claims 1-6, wherein the main board (400) further comprises a second sub-board (430), wherein a second interface (425) is disposed on the other side of the frame board (420), wherein the second interface (425) comprises a plurality of pins, and wherein the second sub-board (430) is soldered to the frame board (420) through the second interface (425).
8. The mobile terminal of claim 7, wherein a second spare interface (426) is further disposed on the frame board (420), the second spare interface (426) comprises a plurality of pins, the second spare interface (426) is used for soldering a second spare daughter board (430') replacing the second daughter board (430), and the second interface (425) is shared with a portion of the pins of the second spare interface (426).
9. The mobile terminal of claim 7 or 8, wherein the first sub-board (410) is an SOC-board and the second sub-board (430) is a radio frequency board.
10. A mobile terminal according to any of claims 1-9, characterized in that one or more electronic components are provided on the frame plate (420).
CN202111083988.9A 2021-09-15 2021-09-15 Mobile terminal Pending CN115811563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111083988.9A CN115811563A (en) 2021-09-15 2021-09-15 Mobile terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111083988.9A CN115811563A (en) 2021-09-15 2021-09-15 Mobile terminal

Publications (1)

Publication Number Publication Date
CN115811563A true CN115811563A (en) 2023-03-17

Family

ID=85481991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111083988.9A Pending CN115811563A (en) 2021-09-15 2021-09-15 Mobile terminal

Country Status (1)

Country Link
CN (1) CN115811563A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116709642A (en) * 2023-08-07 2023-09-05 荣耀终端有限公司 Circuit board assembly, electronic equipment, frame plate and component integration method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116709642A (en) * 2023-08-07 2023-09-05 荣耀终端有限公司 Circuit board assembly, electronic equipment, frame plate and component integration method

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