CN221125899U

CN221125899U - Wafer cleaning device

Info

Publication number: CN221125899U
Application number: CN202322637068.8U
Authority: CN
Inventors: 郭忠
Original assignee: Guangdong Full Core Semiconductor Co ltd
Current assignee: Guangdong Full Core Semiconductor Co ltd
Priority date: 2023-09-27
Filing date: 2023-09-27
Publication date: 2024-06-11
Anticipated expiration: 2033-09-27

Abstract

The utility model discloses a wafer cleaning device which comprises a cleaning solution collecting box, wherein a cleaning assembly is fixedly arranged on the inner wall of the cleaning solution collecting box, output pipes are fixedly arranged on the outer walls of the left side and the right side of the cleaning solution collecting box, a base is fixedly arranged on the outer surface of the lower end of the cleaning solution collecting box, and the cleaning assembly comprises a driving motor, a rotating shaft, a transmission connecting rod, a first bearing, a bottom plate, a through hole, a second bearing and a conical screen. According to the wafer cleaning device, the wafer is placed on the wafer tray through the cleaning assembly, the wafer is padded through the arc-shaped gaskets, so that residual cleaning liquid is prevented from being adsorbed on the wafer in the cleaning process, the cleaning liquid can be effectively prevented from splashing back to the surface of the wafer when the surface of the wafer is cleaned by the cleaning liquid, secondary pollution to the wafer is avoided, the yield of wafer production is further improved, and a better application prospect can be brought.

Description

Wafer cleaning device

Technical Field

The utility model relates to the technical field of wafer production, in particular to a wafer cleaning device.

Background

In the semiconductor wet cleaning process, the operation mode is divided into a groove type cleaning process and a single-chip cleaning process, but with the continuous reduction of the feature size, the requirements of the cleaning process are also higher and higher. The single-chip cleaning method has better cleaning effect than the groove type cleaning. In the single wafer cleaning process, the wafer is driven to rotate by utilizing the rotating structure of the cleaning equipment, chemical cleaning liquid is sprayed on the surface of the wafer from the upper part of the cavity through the nozzle, and used cleaning liquid is thrown out through rotation and is respectively recovered or directly discharged.

In the use process of the existing single wafer cleaning device, a small part of cleaning liquid can splash back onto the wafer, if the cleaning liquid is not timely processed, secondary pollution to the wafer can be caused, defects can be caused at the edge or the back of the wafer, and certain adverse effects are brought to the production and processing process of the wafer.

Disclosure of utility model

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a wafer cleaning device which is provided with a cleaning component, a wafer is placed on a wafer tray, and is padded by an arc-shaped gasket, so that residual cleaning liquid is prevented from being adsorbed on the wafer in the cleaning process, the cleaning liquid can be effectively prevented from splashing back to the surface of the wafer when the surface of the wafer is cleaned by the cleaning liquid, secondary pollution to the wafer is avoided, the yield of wafer production is further improved, and the problems in the background art can be effectively solved.

Technical proposal

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the wafer cleaning device comprises a cleaning liquid collecting box, wherein a cleaning assembly is fixedly arranged on the inner wall of the cleaning liquid collecting box, output pipes are fixedly arranged on the outer walls of the left side and the right side of the cleaning liquid collecting box, and a base is fixedly arranged on the outer surface of the lower end of the cleaning liquid collecting box.

Preferably, the cleaning component comprises a driving motor, a rotating shaft, a transmission connecting rod, a first bearing, a bottom plate, a through hole, a second bearing, a conical screen, a wafer tray, an arc-shaped stop block and an arc-shaped gasket, wherein the driving motor is fixedly arranged on the outer surface of the upper end of the base, the rotating shaft is fixedly arranged on the outer surface of the upper end of the driving motor, the transmission connecting rod is connected with the transmission outer surface of the upper end of the rotating shaft, the first bearing is fixedly arranged on the outer wall of the upper end of the transmission connecting rod, the bottom plate is fixedly arranged on the outer wall of the first bearing, and the bottom plate is positioned on the inner wall of the cleaning liquid collecting box.

Preferably, through holes are formed in the outer surface of the bottom plate, the number of the through holes is two, and the through holes are communicated with the output pipe.

Preferably, a second bearing is fixedly arranged on the outer surface of the upper end of the transmission connecting rod, and the second bearing is positioned at the upper end of the bottom plate.

Preferably, the outer wall of the second bearing is fixedly provided with a conical screen, the conical screen is positioned on the inner wall of the cleaning liquid collecting box, and the outer surface of one end of the upper end of the transmission connecting rod is fixedly provided with a wafer tray.

Preferably, the outer surface around the upper end of the wafer tray is fixedly provided with an arc-shaped stop block and an arc-shaped gasket, and the number of the arc-shaped stop blocks and the arc-shaped gaskets is four.

Advantageous effects

Compared with the prior art, the utility model provides a wafer cleaning device, which has the following beneficial effects:

This wafer cleaning device, place the wafer on the wafer tray through the cleaning element who sets up earlier, pad the wafer through the arc gasket, prevent to have remaining washing liquid to adsorb on the wafer in the cleaning process, under the rotation of start driving motor, drive the wafer tray and carry out high-speed rotation, rotatory simultaneously, spray the washing liquid on the wafer through the nozzle and wash, after wasing, through the vacuum pump of connecting on the output tube, make the washing liquid collecting box in with the outside form the atmospheric pressure difference, make the quick whereabouts of liquid that splashes go to the lower extreme of toper screen cloth, thereby can be when wasing the surface of wafer with the washing liquid, can effectually prevent that the washing liquid from back splashing on the surface of wafer, avoid causing secondary pollution to the wafer, further improved the yield of wafer production.

Drawings

Fig. 1 is a schematic overall structure of a wafer cleaning apparatus according to the present utility model.

Fig. 2 is a schematic view of a portion of a cleaning assembly of the wafer cleaning apparatus according to the present utility model.

FIG. 3 is a schematic view of a conical screen in a cleaning assembly of a wafer cleaning apparatus according to the present utility model.

Fig. 4 is a schematic view of a structure of a wafer tray in the wafer cleaning apparatus according to the present utility model.

In the figure: 1. a cleaning liquid collection box; 2. cleaning the assembly; 3. an output pipe; 4. a base; 5. a driving motor; 6. a rotating shaft; 7. a transmission connecting rod; 8. a first bearing; 9. a bottom plate; 10. a through hole; 11. a second bearing; 12. a conical screen; 13. a wafer tray; 14. an arc-shaped stop block; 15. an arc-shaped gasket.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

As shown in fig. 1-4, the wafer cleaning device comprises a cleaning solution collecting box 1, wherein a cleaning assembly 2 is fixedly arranged on the inner wall of the cleaning solution collecting box 1, output pipes 3 are fixedly arranged on the outer walls of the left side and the right side of the cleaning solution collecting box 1, and a base 4 is fixedly arranged on the outer surface of the lower end of the cleaning solution collecting box 1.

Further, the cleaning assembly 2 comprises a driving motor 5, a rotating shaft 6, a transmission connecting rod 7, a first bearing 8, a bottom plate 9, a through hole 10, a second bearing 11, a conical screen 12, a wafer tray 13, an arc-shaped stop block 14 and an arc-shaped gasket 15, wherein the driving motor 5 is fixedly arranged on the outer surface of the upper end of the base 4, the rotating shaft 6 is fixedly arranged on the outer surface of the upper end of the driving motor 5, the transmission connecting rod 7 is connected with the outer surface of the upper end of the rotating shaft 6 in a transmission manner, the first bearing 8 is fixedly arranged on the outer wall of the upper end of the transmission connecting rod 7, the bottom plate 9 is fixedly arranged on the outer wall of the first bearing 8, the bottom plate 9 is positioned on the inner wall of the cleaning liquid collecting box 1, and the first bearing 8 is arranged, so that the transmission connecting rod 1 is driven by the driving motor 5 to rotate without being influenced.

Further, through holes 10 are formed in the outer surface of the bottom plate 9, the number of the through holes 10 is two, the through holes 10 are communicated with the output pipe 4, and the cleaning liquid can be conveniently and rapidly discharged out of the cleaning liquid collecting box 1 through the arranged through holes 10.

Further, the outer surface of the upper end of the transmission connecting rod 7 is fixedly provided with a second bearing 11, the second bearing 11 is positioned at the upper end of the bottom plate 9, and the normal use of the conical screen 12 is not affected when the transmission connecting rod 7 rotates through the second bearing 11.

Further, the outer wall of the second bearing 11 is fixedly provided with a conical screen 12, the conical screen 12 is positioned on the inner wall of the cleaning fluid collecting box 1, the outer surface of one end of the upper end of the transmission connecting rod 7 is fixedly provided with a wafer tray 13, and large objects or impurities can be prevented from falling into the input pipe 4 through the arranged conical screen 12 and flowing into the vacuum pump to damage the input pipe.

Further, the outer surface fixed mounting has arc dog 14 and arc gasket 15 all around the upper end of wafer tray 13, and the quantity of arc dog 14, arc gasket 15 is four sets of, through the arc gasket 15 that sets up, when wasing the wafer, can effectually prevent that the washing liquid from remaining on the back of wafer.

Principle of operation

Firstly, through the cleaning assembly 2 that sets up, place the wafer on the wafer tray 13 earlier, cushion the wafer through arc gasket 15, prevent to have remaining washing liquid to adsorb on the wafer in the cleaning process, at start driving motor 5, under driving motor 5's rotation, drive wafer tray 13 and carry out high-speed rotation, rotatory simultaneously, spray the washing liquid on the wafer through the nozzle and wash, after wasing, through the vacuum pump of connecting on output tube 4, make the washing liquid collecting box 1 in with the outside form the atmospheric pressure difference, make the quick whereabouts of splashed dropping to the lower extreme of toper screen cloth 12, thereby can effectually prevent that the washing liquid from splashing back on the surface of wafer when wasing the surface of wafer with the washing liquid, avoid causing secondary pollution to the wafer, further improved the yield of wafer production.

It should be noted that in this document, relational terms such as first and second (first and second), and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a wafer belt cleaning device, includes washing liquid collecting box (1), its characterized in that: the cleaning device is characterized in that a cleaning assembly (2) is fixedly arranged on the inner wall of the cleaning liquid collecting box (1), output pipes (3) are fixedly arranged on the outer walls of the left side and the right side of the cleaning liquid collecting box (1), and a base (4) is fixedly arranged on the outer surface of the lower end of the cleaning liquid collecting box (1).

2. A wafer cleaning apparatus according to claim 1, wherein: the cleaning assembly (2) comprises a driving motor (5), a rotating shaft (6), a transmission connecting rod (7), a first bearing (8), a bottom plate (9), a through hole (10), a second bearing (11), a conical screen (12), a wafer tray (13), an arc-shaped stop block (14) and an arc-shaped gasket (15), wherein the driving motor (5) is fixedly arranged on the outer surface of the upper end of the base (4), the rotating shaft (6) is fixedly arranged on the outer surface of the upper end of the driving motor (5), the transmission connecting rod (7) is connected with the outer surface of the upper end of the rotating shaft (6) in a transmission manner, the first bearing (8) is fixedly arranged on the outer wall of the first bearing (7), the bottom plate (9) is fixedly arranged on the outer wall of the first bearing (8), and the cleaning liquid on the inner wall of the collecting box (1).

3. A wafer cleaning apparatus according to claim 2, wherein: the outer surface of the bottom plate (9) is provided with through holes (10), the number of the through holes (10) is two, and the through holes (10) are communicated with the output pipe (3).

4. A wafer cleaning apparatus according to claim 2, wherein: the outer surface of the upper end of the transmission connecting rod (7) is fixedly provided with a second bearing (11), and the second bearing (11) is positioned at the upper end of the bottom plate (9).

5. A wafer cleaning apparatus according to claim 2, wherein: the outer wall of the second bearing (11) is fixedly provided with a conical screen (12), the conical screen (12) is positioned on the inner wall of the cleaning fluid collecting box (1), and the outer surface of one end of the upper end of the transmission connecting rod (7) is fixedly provided with a wafer tray (13).

6. A wafer cleaning apparatus according to claim 2, wherein: the outer surface around the upper end of the wafer tray (13) is fixedly provided with an arc-shaped stop block (14) and an arc-shaped gasket (15), and the number of the arc-shaped stop blocks (14) and the number of the arc-shaped gaskets (15) are four.