CN221102386U - Miniaturized surface-mounted broadband bridge - Google Patents
Miniaturized surface-mounted broadband bridge Download PDFInfo
- Publication number
- CN221102386U CN221102386U CN202323210783.XU CN202323210783U CN221102386U CN 221102386 U CN221102386 U CN 221102386U CN 202323210783 U CN202323210783 U CN 202323210783U CN 221102386 U CN221102386 U CN 221102386U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- line layer
- layer printed
- coupling line
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008878 coupling Effects 0.000 claims abstract description 57
- 238000010168 coupling process Methods 0.000 claims abstract description 57
- 238000005859 coupling reaction Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000004891 communication Methods 0.000 claims abstract description 11
- 230000008054 signal transmission Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000002194 synthesizing effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 51
- 238000000926 separation method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a miniaturized surface-mounted broadband bridge, which relates to the technical fields of power amplifiers, wireless communication, radars and test systems, and comprises the following components: the plurality of the coupling line layer printed circuit boards are used for synthesizing and distributing power in the microwave communication system; the dielectric substrates are provided with a plurality of dielectric substrates, and each dielectric substrate is arranged between every two coupling line layer printed circuit boards. This miniaturized surface mounting formula broadband bridge separates the use of a plurality of coupling line layer printed circuit boards through the dielectric substrate, can be when guaranteeing the result of use, does not influence between its in-process a plurality of coupling line layer printed circuit boards to ensure the effect of use, and this miniaturized surface mounting formula broadband bridge through coupling mechanism's use, can not need carry out "lack ground" processing when a plurality of coupling line layer printed circuit boards of intercommunication when using, avoids the short circuit, makes the device can not use.
Description
Technical Field
The utility model relates to the technical field of power amplifiers, wireless communication, radars and test systems, in particular to a miniaturized surface-mounted broadband bridge.
Background
The increasing sophistication of microwave integrated circuits, such as low noise and small signal amplifiers, power amplifiers, mixers, oscillators, frequency synthesizers, has led to the direct availability of monolithic microwave integrated circuit products.
With the rapid development of communication technology, the operating frequency of the communication system is higher and the bandwidth is wider, so that the volume of the device is required to be reduced as much as possible, and the conventional laminated surface mount bridge is usually used to distribute the wires on two sides of the printed circuit board.
The utility model discloses a miniaturized surface mounting microwave 90 bridge is recorded to authorization publication No. CN203103481U, it includes casing (1), the leading-out end, cavity (6) and circuit board (7), casing (1) side is provided with input leading-out end (5), keep apart leading-out end (3), four leading-out ends of coupling leading-out end (2) and direct leading-out end (4), cavity (6) are provided with in casing (1), be provided with in cavity (6) through rivet (8) and casing (1) fixed connection's circuit board (7), circuit board (7) adopt multilayer structure to constitute, copper foil circuit line adopts the stripline structure in circuit board (7) to adopt the mode of buckling wiring. The system has strong performance and small volume, does not need to be grooved and installed on the printed board and the cavity, can be directly installed on the printed board, realizes surface mounting, facilitates and optimizes the design and the realization of the microstrip circuit and the system, and ensures that the application field of the microstrip circuit and the system is wider.
The system has strong performance and small volume, does not need to be grooved and installed on the printed board and the cavity, can be directly installed on the printed board, realizes surface mounting, is convenient and optimizes the design and the realization of a microstrip circuit and a microstrip system, and ensures that the application field is wider, but the system uses a single-layer coupling line layer, the efficiency in the use process cannot be ensured, and the interval between lines cannot be too small, otherwise, the index can be influenced, and the volume is limited.
Disclosure of utility model
The utility model provides a miniaturized surface-mounted broadband bridge, which is characterized in that a plurality of coupling line layer printed circuit boards are separated through a dielectric substrate, so that the use effect is ensured, meanwhile, the plurality of coupling line layer printed circuit boards are not influenced in the process, the use effect is ensured, and the 'ground shortage' treatment is not needed when the plurality of coupling line layer printed circuit boards are communicated during the use through a connecting mechanism, so that the short circuit is avoided, and the device cannot be used.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: a miniaturized surface mount broadband bridge comprising:
The coupling line layer printed circuit board is provided with a plurality of coupling line layer printed circuit boards, and the plurality of coupling line layer printed circuit boards are used for power synthesis and distribution in a microwave communication system;
The dielectric substrates are arranged in a plurality, and each dielectric substrate is arranged between every two coupling line layer printed circuit boards; and
The connecting mechanism is arranged on the plurality of coupling line layer printed circuit boards and connected with the plurality of medium substrates for connecting and installing the plurality of coupling line layer printed circuit boards and the plurality of medium substrates.
Furthermore, the connecting mechanism is a plurality of metallized through holes, the metallized through holes are arranged, the metallized through holes are all arranged at four corners of the dielectric substrates, and the metallized through holes are all penetrated through the printed circuit boards of the coupling line layers.
Furthermore, each coupling line layer printed circuit board is fixedly connected with a signal transmission line.
Furthermore, one side of the outer surface of the two coupling line layer printed circuit boards is provided with a separation lining plate.
Further, shielding lining plates are arranged on one sides, away from each other, of the outer surfaces of the two separation lining plates.
The utility model provides a miniaturized surface-mounted broadband bridge. The beneficial effects are as follows:
(1) The miniaturized surface-mounted broadband bridge can separate the plurality of the coupling line layer printed circuit boards through the dielectric substrate, so that the use effect is ensured, and meanwhile, the plurality of the coupling line layer printed circuit boards are not influenced in the process, so that the use effect is ensured.
(2) The miniaturized surface-mounted broadband bridge can avoid 'ground shortage' treatment when a plurality of coupling line layer printed circuit boards are communicated during use through the use of the connecting mechanism, and avoid short circuit, so that the device cannot be used.
Drawings
FIG. 1 is an exploded view of the present utility model;
FIG. 2 is a perspective view of the present utility model;
FIG. 3 is a return loss plot of the present utility model;
fig. 4 is an insertion loss diagram of the present utility model.
In the figure: 1. a coupled line layer printed circuit board; 2. a signal transmission line; 3. a dielectric substrate; 4. a separation liner; 5. a shielding liner; 6. and metallizing the via hole.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present utility model are within the protection scope of the present utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: a miniaturized surface mount broadband bridge comprising:
The microwave communication system comprises a plurality of coupling line layer printed circuit boards 1, wherein the plurality of coupling line layer printed circuit boards 1 are used for synthesizing and distributing power in the microwave communication system;
The dielectric substrates 3 are provided, and each dielectric substrate 3 is arranged between every two coupling line layer printed circuit boards 1; and
The connecting mechanism is arranged on the plurality of coupling line layer printed circuit boards 1 and connected with the plurality of medium substrates 3 for connecting and installing the plurality of coupling line layer printed circuit boards 1 and the plurality of medium substrates 3.
In this embodiment: the utility model is divided into three-stage coupling line layer printed circuit boards 1, wherein the first-stage coupling line layer printed circuit board 1 with the strongest coupling degree is arranged in the middle part, the two-stage coupling line layer printed circuit boards 1 with weaker coupling degree are respectively arranged on the upper side and the lower side of the first-stage coupling line layer printed circuit board 1, the two sides of a dielectric substrate 3 are covered with copper wires, the different coupling line layer printed circuit boards 1 are separated by the dielectric substrate 3 with copper-free double sides, a connecting mechanism connects the plurality of coupling line layer printed circuit boards 1 with the plurality of dielectric substrates 3, the connection is ensured, all sides of a product except four signal ports and four signal connecting holes of all layers are covered with copper and gold, and signal leakage is avoided.
Specifically, the connection mechanism is a plurality of metallized via holes 6, the metallized via holes 6 are provided with a plurality of, the metallized via holes 6 are all arranged at four corners of the dielectric substrates 3, and the metallized via holes 6 are all penetrated through the coupling line layer printed circuit boards 1.
In this embodiment: the metallized via holes 6 are communicated with the three-layer coupling line layer printed circuit board 1, so that electric signals are conducted between the coupling line layer printed circuit boards 1 of different layers, the size of the bridge is greatly reduced, copper foils around the metallized via holes 6 are etched, short circuits between the circuit and a grounding layer are avoided, the short circuits caused by connection between the metallized via holes 6 and the grounding layer are also required to be avoided during installation, the metallized via holes 6 can be changed into blind holes, the processing difficulty is greatly increased, and compared with the blind holes, the metallized via holes 6 are required to be prevented from being contacted with a ground plane, the processing difficulty is reduced, and the processing cost is greatly reduced.
Specifically, each coupling line layer printed circuit board 1 is fixedly connected with a signal transmission line 2.
In this embodiment: the signal transmission line 2 is used to couple the use of the line layer printed circuit board 1.
Specifically, a separation lining board 4 is arranged on one side of the outer surface of the two coupling line layer printed circuit boards 1.
In this embodiment: the separation lining board 4 separates the coupling line layer printed circuit boards 1 on two sides, so that the use is ensured, and the influence is avoided.
Specifically, the shielding liners 5 are installed on the sides of the outer surfaces of the two separation liners 4, which are far away from each other.
In this embodiment: the shielding liner 5 ensures the safety of the internal components and prevents them from being damaged.
When the three-layer coupling line layer printed circuit board is used, the three-layer coupling line layer printed circuit board 1 and the medium substrate 3 between the three-layer coupling line layer printed circuit board 1 are laminated, four through holes at the communication position of the three-layer coupling line layer printed circuit board 1 are subjected to hole metallization to form metallized through holes 6, after the lamination is finished, the three-layer coupling line layer printed circuit board is laminated with the separation lining board 4 and the shielding lining board 5 at the upper side and the lower side of the coupling line layer printed circuit board 1, and four signal ports are subjected to hole metallization for assembly and use.
The control mode of the utility model is controlled by manually starting and closing the switch, the wiring diagram of the power element and the supply of the power supply are common knowledge in the field, and the utility model is mainly used for protecting the mechanical device, so the utility model does not explain the control mode and the wiring arrangement in detail.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (5)
1. Miniaturized surface mounting type broadband bridge, characterized by comprising:
The microwave communication system comprises a coupling line layer printed circuit board (1), wherein a plurality of coupling line layer printed circuit boards (1) are arranged, and the plurality of coupling line layer printed circuit boards (1) are used for power synthesis and distribution in the microwave communication system;
The dielectric substrates (3) are arranged in a plurality, and each dielectric substrate (3) is arranged between every two coupling line layer printed circuit boards (1); and
The connecting mechanism is arranged on the plurality of coupling line layer printed circuit boards (1) and connected with the plurality of medium substrates (3) for connecting and installing the plurality of coupling line layer printed circuit boards (1) and the plurality of medium substrates (3).
2. The miniaturized surface-mounted broadband bridge according to claim 1, wherein the connecting mechanism is a plurality of metallized through holes (6), the metallized through holes (6) are arranged, the metallized through holes (6) are all arranged at four corners of the dielectric substrates (3), and the metallized through holes (6) are all penetrated through the coupling line layer printed circuit boards (1).
3. The miniaturized surface-mounted broadband bridge according to claim 2, characterized in that each of said coupling line layer printed circuit boards (1) is fixedly connected with a signal transmission line (2).
4. A miniaturized surface-mounted broadband bridge according to claim 3, wherein a spacer plate (4) is mounted on one side of the outer surface of both said coupling line layer printed circuit boards (1).
5. The miniaturized surface-mounted broadband bridge according to claim 4, characterized in that the side of the outer surfaces of the two separating liners (4) facing away from each other is provided with a shielding liner (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323210783.XU CN221102386U (en) | 2023-11-28 | 2023-11-28 | Miniaturized surface-mounted broadband bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323210783.XU CN221102386U (en) | 2023-11-28 | 2023-11-28 | Miniaturized surface-mounted broadband bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221102386U true CN221102386U (en) | 2024-06-07 |
Family
ID=91320227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323210783.XU Active CN221102386U (en) | 2023-11-28 | 2023-11-28 | Miniaturized surface-mounted broadband bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221102386U (en) |
-
2023
- 2023-11-28 CN CN202323210783.XU patent/CN221102386U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5631807A (en) | Electronic circuit structure with aperture suspended component | |
| JP5285842B2 (en) | Integrated circuit mounting board and power line communication device | |
| EP2676321B1 (en) | Coupling arrangement | |
| WO2012028064A1 (en) | Connection structure between bare chip and printed circuit board, printed circuit board and communication equipment | |
| CN113013134B (en) | Component carrier, manufacturing method and using method thereof and intelligent device | |
| CN102082317A (en) | Waveguide transfer device | |
| CN205005138U (en) | Camera module and electronic equipment | |
| CN115500004B (en) | Electromagnetic compatibility radio frequency system based on thick film multilayer integrated circuit and implementation method | |
| CN110797616B (en) | Multilayer digital-analog mixed pressing plate based on substrate integrated coaxial line structure | |
| EP2763323B1 (en) | High-frequency module | |
| CN108023147A (en) | Combiner, phase shifter package and antenna | |
| EP0906666A1 (en) | Printed circuit board having integrated broadside microwave coupler | |
| CN114256575B (en) | Multichannel miniaturized microwave component and metal matrix composite substrate structure thereof | |
| CN221102386U (en) | Miniaturized surface-mounted broadband bridge | |
| CN112533358A (en) | High-frequency microwave multilayer circuit board and high-frequency microwave assembly | |
| JP2001345419A (en) | Integrated high-frequency radio circuit module | |
| US6946927B2 (en) | Suspended substrate low loss coupler | |
| CN216958468U (en) | Coupling piece structure | |
| WO2023016024A1 (en) | Circuit board, antenna structure, and electronic device | |
| CN113395826B (en) | High-thermal-conductivity circuit substrate structure for lumped parameter nonreciprocal magnetic device of PCB (printed circuit board) | |
| CN112018481A (en) | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line | |
| CN209845436U (en) | Radio frequency switch circuit board | |
| JP2001088097A (en) | Millimeter wave multi-layer substrate module and its manufacture | |
| EP4366095A1 (en) | Connector, connector assembly, radio frequency module and communication device | |
| JP2003309423A (en) | Antenna integrated high frequency circuit module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |