CN221102057U - Chip plastic package device for integrated circuit production - Google Patents
Chip plastic package device for integrated circuit production Download PDFInfo
- Publication number
- CN221102057U CN221102057U CN202323008087.0U CN202323008087U CN221102057U CN 221102057 U CN221102057 U CN 221102057U CN 202323008087 U CN202323008087 U CN 202323008087U CN 221102057 U CN221102057 U CN 221102057U
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- CN
- China
- Prior art keywords
- chip
- connecting plate
- integrated circuit
- plate
- circuit production
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- 239000004033 plastic Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 28
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 238000007731 hot pressing Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 5
- 239000007858 starting material Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of chip processing equipment, in particular to a chip plastic package device for integrated circuit production. The utility model provides a chip plastic package device for integrated circuit production, which comprises a frame, a first connecting plate, connecting sleeves, a hot pressing plate, supporting shafts and placing plates, wherein the first connecting plate for placing chips is arranged at the top of the frame, four connecting sleeves are fixedly connected to the first connecting plate, the supporting shafts are fixedly connected to the connecting sleeves, the placing plates are arranged on the four supporting shafts in a sliding mode, and the placing plates slide downwards to plastic package the chips on the first connecting plate. Through opening the motor, the motor drives the screw rod through the shaft coupling and rotates, makes the kicking block remove rightwards and will place the chip that the board is plastic envelope good ejecting to can realize carrying out automatic material return to the chip that the plastic envelope is good, need not the manual work and carry out the material return, save the manpower, improve the security of chip material return.
Description
Technical Field
The utility model relates to the technical field of chip processing equipment, in particular to a chip plastic package device for integrated circuit production.
Background
The plastic package of the integrated circuit chip refers to the process of protecting the bonded semi-finished product package by using plastic package resin under certain pressure and temperature conditions.
The integrated circuit chip plastic packaging operation is characterized in that the die is placed in the position for placing the chip on the substrate through the grabbing component during the integrated circuit chip plastic packaging operation, the integrated circuit chip is placed through the grabbing component, the plastic packaging operation is further carried out, workers need to take the integrated circuit chip after plastic packaging is completed, at present, the chip needs to be manually taken after plastic packaging is completed, the thermoplastic plate and the just packaged chip are high in temperature, the manual taking is easy to be scalded, the manual taking safety is low, and the taking efficiency is low.
Therefore, it is necessary to design a chip molding device for integrated circuit production capable of automatically discharging materials, so as to solve the above problems.
Disclosure of utility model
In order to overcome the defects that the chip plastic package is mainly carried out in a thermoplastic mode, the temperature of a thermoplastic plate and a chip which is just packaged is high, manual material taking is easy to scald, the manual material taking safety is low, and the material taking efficiency is low, the utility model provides the chip plastic package device for integrated circuit production, which can automatically return materials.
The technical proposal is as follows: the utility model provides a chip plastic envelope device is used in integrated circuit production, including the frame, first connecting plate, the adapter sleeve, the hot pressing board, the back shaft is with placing the board, frame top installs the first connecting plate that is used for placing the chip, fixedly connected with four adapter sleeves on the first connecting plate, the rigid coupling has the back shaft on the adapter sleeve, four epaxial slidingtype of support are provided with places the board jointly, place the board and slide downwards in order to carry out the plastic envelope to the chip on the first connecting plate, still including the material return subassembly, first connecting plate left side is provided with the material return subassembly, after the chip plastic envelope is accomplished, start the material return subassembly in order to carry out the material return to the chip that the plastic envelope is good on the first connecting plate.
As the improvement of above-mentioned scheme, the material return subassembly is including first fixed plate, the hob, the guide bar, kicking block and motor, first connecting plate left part rigid coupling has first fixed plate, first fixed plate upper portion front side rigid coupling has the guide bar, first fixed plate upper portion rear side rotation is provided with the hob, the hob is last the screw thread to be provided with the kicking block, the kicking block slides on the guide bar, the motor is installed in first fixed plate left side, the output shaft of motor passes through the shaft coupling and is connected with the hob, through the starter motor, with drive hob rotation makes the kicking block slide the chip that will plastic envelope is good to the right side release.
As an improvement of the scheme, the hot pressing plate also comprises an elastic piece, and the elastic piece for resetting the hot pressing plate is sleeved on the supporting shaft.
As an improvement of the scheme, the device further comprises a second connecting plate, a collecting box and a cover, wherein the second connecting plate is arranged at the right lower part of the frame, the collecting box is arranged on the second connecting plate, and the cover is arranged on the collecting box in a sliding mode.
As an improvement of the scheme, the device further comprises a buffer net, and the buffer net is arranged at the lower part in the collecting box.
As the improvement of above-mentioned scheme, still including fixed block and second fixed plate, place the board right side rigid coupling and have the fixed block, the rigid coupling has the second fixed plate on the fixed block.
As an improvement of the scheme, the heating box is also included, and the heating box is arranged at the rear part of the right side of the second connecting plate.
As an improvement of the scheme, the novel hanger also comprises a hanger, and two hangers are arranged on the frame.
The utility model has the following advantages: 1. through opening the motor, the motor drives the screw rod through the shaft coupling and rotates, makes the kicking block remove rightwards and will place the chip that the board is plastic envelope good ejecting to can realize carrying out automatic material return to the chip that the plastic envelope is good, need not the manual work and carry out the material return, save the manpower, improve the security of chip material return.
2. When the ejector block moves rightwards and the chip which is well packaged on the placing plate is ejected out, the chip falls into the collecting box, the buffer net can buffer the chip, the chip is prevented from being damaged by impact, and the collecting box can collect the chip and can prevent the chip from being scattered.
Drawings
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic perspective view of the fixing block and the second fixing plate according to the present utility model.
Fig. 3 is a schematic perspective view of the screw rod and the top block of the first fixing plate according to the present utility model.
Fig. 4 is a schematic perspective view showing a second connection plate, a cover and a buffer net according to the present utility model.
Reference numerals in the figures: the device comprises a frame 1, a first connecting plate 2, a connecting sleeve 3, a hot pressing plate 4, an elastic piece 401, a supporting shaft 5, a placing plate 6, a first fixing plate 7, a spiral rod 8, a top block 9, a guide rod 10, a motor 11, a second connecting plate 12, a collecting box 13, a cover 14, a buffer net 15, a fixing block 16, a second fixing plate 17, a heating box 18 and a hook 19.
Detailed Description
The following describes the technical scheme with reference to specific embodiments, and it should be noted that: terms indicating orientations, such as up, down, left, right, etc., are used herein only with respect to the position of the illustrated structure in the corresponding drawings. The parts themselves are numbered herein, for example: first, second, etc. are used solely to distinguish between the described objects and do not have any sequential or technical meaning. The application is as follows: connection, coupling, unless specifically stated otherwise, includes both direct and indirect connection (coupling).
Example 1
The utility model provides a chip plastic package device for integrated circuit production, see fig. 1-3, including frame 1, first connecting plate 2, adapter sleeve 3, hot pressing board 4, back shaft 5 and place board 6, first connecting plate 2 that is used for placing the chip is installed through bolted connection's mode at frame 1 top, be equipped with four adapter sleeves 3 through welded mode fixedly connected with on the first connecting plate 2, four adapter sleeves 3 are rectangular distribution on first connecting plate 2, the rigid coupling has back shaft 5 on adapter sleeve 3, be provided with on four back shaft 5 and place board 6 jointly the slidingtype, place board 6 slides down in order to carry out the plastic package to the chip on the first connecting plate 2, still including the material return subassembly, be provided with the material return subassembly in order to carry out the material return to the chip that has been moulded on the first connecting plate 2 after the chip plastic package is accomplished, still including elastic component 401, the cover is equipped with the elastic component 401 that is used for making hot pressing board 4 reset on the back shaft 5, both ends are connected with 3 and board 4 respectively, still including couple 19, install the couple 19 through two modes that connect on the frame 1, can take the couple 19 when work is convenient.
Referring to fig. 1-3, the material returning assembly comprises a first fixing plate 7, a screw rod 8, a guide rod 10, a top block 9 and a motor 11, wherein the left part of the first connecting plate 2 is fixedly connected with the first fixing plate 7 in a welding mode, the guide rod 10 is fixedly connected with the front side of the upper part of the first fixing plate 7 in a welding mode, the screw rod 8 is rotatably arranged on the rear side of the upper part of the first fixing plate 7, the top block 9 is arranged on the screw rod 8 in a threaded mode, the top block 9 slides on the guide rod 10, the motor 11 is arranged on the left side of the first fixing plate 7, an output shaft of the motor 11 is connected with the screw rod 8 through a coupler, and the motor 11 is started to drive the screw rod 8 to rotate so that the top block 9 slides rightwards to push out a molded chip.
When using this equipment to carry out the plastic envelope to the chip, the staff earlier places the material in placing the board 6, after placing, the staff pushes down hot pressing plate 4 and carries out the plastic envelope to the chip, simultaneously the elastic component 401 on the back shaft 5 is compressed, loosen hot pressing plate 4 after the plastic envelope is accomplished, the elastic component 401 resumes original state and drives hot pressing plate 4 and slide upwards and reset, the staff starts motor 11, motor 11 passes through the shaft coupling and drives hob 8 rotation, hob 8 rotates and drives ejector block 9 and moves rightwards, make ejector block 9 remove rightwards and will place the chip that the plastic envelope is good on board 6 and push out, thereby can realize carrying out automatic material returning to the chip that the plastic envelope is good, improve the security that the chip returned material, after accomplishing the chip returned material, the output shaft reversal of staff control motor 11, make ejector block 9 remove leftwards and reset, close motor 11 afterwards.
Example 2
On the basis of embodiment 1, referring to fig. 1, 2 and 4, the device further comprises a second connecting plate 12, a collecting box 13 and a cover 14, wherein the second connecting plate 12 is arranged at the right lower part of the frame 1, the collecting box 13 is arranged on the second connecting plate 12, the cover 14 is arranged on the collecting box 13 in a sliding manner, the device further comprises a buffer net 15, and the buffer net 15 is arranged at the inner lower part of the collecting box 13 in a bolt connection manner.
When the plastic packaged chips need to be returned, a worker slides the cover 14 rightwards to open the collecting box 13, when the ejector block 9 moves rightwards to eject the chips which are placed on the plate 6 and are packaged, the chips fall into the collecting box 13, the buffer net 15 can buffer the chips, the chips are prevented from being damaged by impact, the collecting box 13 collects the chips, scattering of the chips can be avoided, and then the worker slides the cover 14 rightwards to close the collecting box 13.
Referring to fig. 1 and 2, the device further comprises a fixing block 16 and a second fixing plate 17, the right side of the placing plate 6 is fixedly connected with the fixing block 16, the second fixing plate 17 is fixedly connected to the fixing block 16 in a bolt connection mode, and the top of the second fixing plate 17 is flush with the placing plate 6.
When the ejector block 9 moves rightwards to eject the chip which is packaged on the placing plate 6, the chip is pushed onto the second fixing plate 17, and the second fixing plate 17 guides the chip, so that the chip can accurately fall into the collecting box 13.
Referring to fig. 1, the heating box 18 is further included, the heating box 18 is installed at the rear portion of the right side of the second connecting plate 12, and the heating box 18 is aligned to the second fixing plate 17.
When the ejector block 9 ejects the chip onto the second fixing plate 17, a worker opens the heating box 18 to heat the plastic packaging material on the surface of the chip, so that the chip is further subjected to thermoplastic molding.
The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. All equivalents and alternatives falling within the spirit of the utility model are intended to be included within the scope of the utility model. What is not elaborated on the utility model belongs to the prior art which is known to the person skilled in the art.
Claims (8)
1. The utility model provides a chip plastic envelope device is used in integrated circuit production, including frame (1), first connecting plate (2), adapter sleeve (3), hot clamp plate (4), back shaft (5) and place board (6), first connecting plate (2) that are used for placing the chip are installed at frame (1) top, fixedly connected with four adapter sleeves (3) on first connecting plate (2), the rigid coupling has back shaft (5) on adapter sleeve (3), be provided with on four back shafts (5) and place board (6) jointly slidingtype, place board (6) and slide downwards and carry out the plastic envelope to the chip on first connecting plate (2), characterized by still including material returning subassembly, first connecting plate (2) left side is provided with material returning subassembly, after the chip plastic envelope is accomplished, start material returning subassembly in order to carry out the material returning to the chip that the plastic envelope was good on first connecting plate (2).
2. The chip plastic package device for integrated circuit production according to claim 1, wherein the material returning assembly comprises a first fixing plate (7), a screw rod (8), a guide rod (10), a jacking block (9) and a motor (11), wherein the first fixing plate (7) is fixedly connected to the left part of the first connecting plate (2), the guide rod (10) is fixedly connected to the front side of the upper part of the first fixing plate (7), the screw rod (8) is rotatably arranged on the rear side of the upper part of the first fixing plate (7), the jacking block (9) is arranged on the screw rod (8) in a threaded manner, the jacking block (9) slides on the guide rod (10), the motor (11) is arranged on the left side of the first fixing plate (7), an output shaft of the motor (11) is connected with the screw rod (8) through a coupler, and the motor (11) is started to drive the screw rod (8) to rotate so as to enable the jacking block (9) to slide rightwards to push out the molded chip.
3. The chip molding device for integrated circuit production according to claim 1, further comprising an elastic member (401), wherein the elastic member (401) for resetting the hot pressing plate (4) is sleeved on the supporting shaft (5).
4. The chip plastic package device for integrated circuit production according to claim 1, further comprising a second connecting plate (12), a collecting box (13) and a cover (14), wherein the second connecting plate (12) is installed at the right lower part of the frame (1), the collecting box (13) is installed on the second connecting plate (12), and the cover (14) is arranged on the collecting box (13) in a sliding mode.
5. The chip molding device for integrated circuit production according to claim 4, further comprising a buffer net (15), wherein the buffer net (15) is installed at the lower part in the collection box (13).
6. The chip plastic package device for integrated circuit production according to claim 1, further comprising a fixing block (16) and a second fixing plate (17), wherein the fixing block (16) is fixedly connected to the right side of the placing plate (6), and the second fixing plate (17) is fixedly connected to the fixing block (16).
7. The chip molding device for integrated circuit production of claim 4, further comprising a heating box (18), wherein the heating box (18) is mounted at the rear right side of the second connecting plate (12).
8. A chip molding apparatus for integrated circuit production as claimed in claim 1, further comprising hooks (19), wherein the frame (1) is provided with two hooks (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323008087.0U CN221102057U (en) | 2023-11-08 | 2023-11-08 | Chip plastic package device for integrated circuit production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323008087.0U CN221102057U (en) | 2023-11-08 | 2023-11-08 | Chip plastic package device for integrated circuit production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221102057U true CN221102057U (en) | 2024-06-07 |
Family
ID=91329352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323008087.0U Active CN221102057U (en) | 2023-11-08 | 2023-11-08 | Chip plastic package device for integrated circuit production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221102057U (en) |
-
2023
- 2023-11-08 CN CN202323008087.0U patent/CN221102057U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |