CN221102042U

CN221102042U - Positioning device for IC spot removal

Info

Publication number: CN221102042U
Application number: CN202322937953.8U
Authority: CN
Inventors: 蓝春合; 张佳天; 黄炳艳; 郑广源
Original assignee: Dongguan Liyang Chip Testing Co ltd
Current assignee: Dongguan Liyang Chip Testing Co ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2024-06-07
Anticipated expiration: 2033-10-31

Abstract

The present disclosure discloses a positioning device for IC spot removal, comprising: the base is of a step structure and comprises a low surface and a high surface, a boss, a first sliding component positioned on the left side of the boss and a second sliding component positioned on the right side of the boss are arranged on the high surface of the base, a first positioning component is arranged between the first sliding component and the second sliding component, and the middle of the boss is provided with an IC point groove removing position; the front side of boss is provided with the third slip subassembly that is located the base low side, be provided with the second locating component between the slide rail that is located on the boss and is close to the boss rear side, the second locating component with first locating component alternately sets up. The first positioning component and the second positioning component can slide and position the IC to be dotted.

Description

Positioning device for IC spot removal

Technical Field

The disclosure belongs to the technical field of IC testing, and particularly relates to a positioning device for IC spot removal.

Background

Before and after the IC test, need to divide by judging the IC through artifical point and judge whether unusual, but in artifical point removes the in-process, because the IC interval is little, and lacks IC positioner at present, and electronic wind is criticized by manual control, can't steadily control wind when the operation criticizes vibrations to can cause the yields to be cut off the risk.

Patent CN219476664U discloses an IC carrier board convenient for positioning and mounting a chip, as shown in fig. 1, which includes a positioning frame 21, a transverse positioning rule 22 and a longitudinal positioning rule 23, and a plurality of transverse positioning grooves 211 and longitudinal positioning grooves 212 are provided on the positioning frame. The IC carrier plate utilizes the positioning rule to fix a position the welding disc, when needs to fix a position, need take out the positioning rule from a constant head tank manually, then put into another constant head tank again, because the taking and putting of positioning rule all need manual operation, obviously can influence the operating efficiency of device. Moreover, the carrier is difficult to use for spot removal of the IC because of the inability to form a space between the lateral and longitudinal alignment bars.

Disclosure of utility model

To the not enough among the prior art, the aim at of this disclosure provides a positioner for IC point removes, and the device is through setting up the track at the regional week side of location for locating component can be through sliding on the track to the chip location, compares among the prior art through manual getting and put the location chi can improve positioning efficiency.

In order to achieve the above object, the present disclosure provides the following technical solutions:

a positioning device for IC spot removal, comprising:

a base which is of a step structure and comprises a low surface and a high surface,

A boss, a first sliding component positioned on the left side of the boss and a second sliding component positioned on the right side of the boss are arranged on the high surface of the base, a first positioning component is arranged between the first sliding component and the second sliding component, and the middle of the boss is provided with an IC point slot removing position;

The front side of boss is provided with the third slip subassembly that is located the base low side, be provided with the second locating component between the slide rail that is located on the boss and is close to the boss rear side, the second locating component with first locating component alternately sets up.

Preferably, the first sliding component comprises a first rail, and a first sliding block is arranged on the first rail; the second sliding assembly comprises a second track, and a second sliding block is arranged on the second track.

Preferably, the third sliding assembly comprises a third rail, and a third sliding block is arranged on the third rail.

Preferably, the first positioning component comprises a first fixed stop bar fixed on the first sliding component and the second sliding component in position and a first U-shaped stop bar with movable position.

Preferably, the second positioning assembly comprises a second fixed stop bar fixed on the third sliding assembly in position and a second U-shaped stop bar with movable position.

Preferably, the two ends of the first U-shaped baffle strip and the second U-shaped baffle strip are both provided with adjusting grooves.

Preferably, the two sides of the bottom ends of the first sliding block, the second sliding block and the third sliding block are provided with fixing pieces, the fixing pieces are wrapped on two sides of the track, and the fixing pieces are provided with jacks.

Preferably, the IC spot removal slot is provided with a slot near the slide rail.

Preferably, a clamping strip is arranged at the notch.

Preferably, a bump is arranged on one side of the clamping strip facing the notch.

Compared with the prior art, the beneficial effects that this disclosure brought are:

1. According to the IC to be removed, the sliding assembly is arranged, so that the positioning assembly can slide and position the IC to be removed;

2. The distance between the U-shaped stop bar and the fixed stop bar is adjusted, so that ICs with different sizes can be subjected to spot removal.

Drawings

FIG. 1 is a schematic diagram of an IC carrier plate for facilitating chip positioning and mounting;

FIG. 2 is a schematic diagram of a positioning device for IC spot removal according to one embodiment of the present disclosure;

FIG. 3 is an enlarged schematic view of a first slider and stator of the device of FIG. 2;

FIG. 4 is a schematic illustration of the connection of the second fixed rail and the second U-shaped rail to the slide rail in the apparatus of FIG. 2;

The reference numerals are explained as follows:

1. A base; 2. a first track; 3. a second track; 4-1, a first sliding block; 4-2, a second sliding block; 5. the first U-shaped baffle strip; 6, a first fixed stop bar; 7. a second fixed stop bar; 8. the second U-shaped baffle strip; 9. a slide rail; 10. clamping strips; 11. a notch; 12. a rubber pad; 13. a boss; 14. a third track; 15. removing the slot position of the IC point; 16. a jack; 17. a fixing piece; 18. and an adjusting groove.

Detailed Description

Specific embodiments of the present disclosure will be described in detail below with reference to fig. 1 to 4. While specific embodiments of the disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It should be noted that certain terms are used throughout the description and claims to refer to particular components. Those of skill in the art will understand that a person may refer to the same component by different names. The specification and claims do not identify differences in terms of components, but rather differences in terms of the functionality of the components. As used throughout the specification and claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The description hereinafter sets forth the preferred embodiments for carrying out the present disclosure, but is not intended to limit the scope of the disclosure in general, as the description proceeds. The scope of the present disclosure is defined by the appended claims.

For the purposes of promoting an understanding of the embodiments of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific examples, without the intention of being limiting the embodiments of the disclosure.

In one embodiment, as shown in fig. 2, the present disclosure provides a positioning device for IC spot removal, comprising:

The base 1, the base 1 is of a step structure and comprises a low surface and a high surface,

A boss 13, a first sliding component positioned on the left side of the boss 13 and a second sliding component positioned on the right side of the boss 13 are arranged on the high surface of the base 1, a first positioning component is arranged between the first sliding component and the second sliding component, and an IC point dividing slot position 15 is arranged in the middle of the boss 13;

The front side of boss 13 is provided with the third slip subassembly that is located the base low side, be provided with the second locating component between the slide rail 9 that is located on the boss 13 and is close to boss 13 rear side, the second locating component with the cross setting of first locating component.

In this embodiment, through setting up first slip subassembly and second slip subassembly to and through setting up third slip subassembly and slide rail for first locating component and second locating component can slide, thereby can overcome in the device shown in fig. 1 need get and put the location chi through manual, and then can improve the operating efficiency of device.

In another embodiment, the first sliding assembly comprises a first track 2, and a first sliding block 4-1 is arranged on the first track 2; the second sliding assembly comprises a second track 3, and a second sliding block 4-2 is arranged on the second track 3.

In this embodiment, the first rail 2 is fixed on the upper surface of the base 1 through screw holes (i.e. circles drawn on the first rail in fig. 2), two ends of the bottom side of the first slider 4-1 are provided with fixing pieces 17 (as shown in fig. 3), the fixing pieces 17 are wrapped on two sides of the first rail 2, the fixing pieces 17 are provided with insertion holes 16, and fixing pieces such as screws, bolts, etc. are arranged in the insertion holes 16.

The second track 3 is fixed on the high surface of the base 1 through screw holes on the second track, fixing pieces are also arranged at two ends of the bottom side of the second sliding block 4-2, the fixing pieces are wrapped on two sides of the second track 3, and insertion holes are formed in the fixing pieces.

When the first positioning component is required to be moved, the fixing pieces on the fixing pieces at the two ends of the bottom sides of the first sliding block and the second sliding block are only required to be taken out, and the first sliding block and the second sliding block can slide on the first track and the second track, so that the first positioning component can be driven to slide on the tracks. When the sliding block slides to enable the first positioning component to reach the area where the IC to be dispensed is located, the fixing piece is inserted into the jack, and then the first sliding block and the second sliding block can be fixed on the first track and the second track, so that positioning is completed.

In another embodiment, the third sliding assembly includes a third rail 14, and a third slider (not labeled in the figure) is disposed on the third rail 14.

In this embodiment, like the first slider and the second slider, the two ends of the bottom side of the third slider are also provided with fixing pieces, and the third slider is also fixed on the third rail through the insertion holes on the fixing pieces.

Meanwhile, it should be noted that, since the IC point removing slot 15 needs to be provided with the slot 11, and since the third sliding component is disposed on the lower surface of the base, if the fourth sliding component is disposed at the opposite position of the third sliding component, that is, the position where the boss is close to the slot, the second positioning component cannot be kept horizontal, and positioning cannot be completed. Thus, the present embodiment enables the second positioning assembly to be kept horizontal by providing the slide rail 9 and placing the other side of the second positioning assembly in the slide groove in the slide rail 9 as shown in fig. 4.

In another embodiment, the first positioning component comprises a first fixed stop strip 6 fixed on the first sliding component and the second sliding component in position and a first U-shaped stop strip 5 with movable position.

In this embodiment, the first slider is provided with 4 screw holes, where two screw holes are used for fixing one end of the first fixed stop strip, and the other two screw holes are used for fixing one end of the first U-shaped stop strip; similarly, 4 screw holes are formed in the second sliding block, two of the screw holes are used for fixing the other end of the first fixed stop strip, and the other two screw holes are used for fixing the other end of the first U-shaped stop strip. In addition, two ends of the first U-shaped baffle strip are respectively provided with 2 adjusting grooves 18, and each adjusting groove is fixed on a screw hole of the sliding block through a screw. Because the ICs to be dotted-removed are generally stripe-shaped and have different sizes, in the actual dotted-removal process, the gap distance between the first U-shaped bar and the first fixed bar needs to be adjusted, and the specific adjustment mode is as follows: the screw is screwed out from the adjusting grooves at two ends of the first U-shaped baffle strip, then the first U-shaped baffle strip moves on the first sliding block and the second sliding block to adjust the clearance distance between the first U-shaped baffle strip and the first fixed baffle strip, and after the first U-shaped baffle strip is adjusted to a proper clearance distance, the screw is screwed in from the adjusting grooves to enable the first U-shaped baffle strip to be fixed on the first sliding block and the second sliding block again.

In another embodiment, the second positioning assembly comprises a second fixed stop 7 fixed on the third sliding assembly and a second U-shaped stop 8 with movable position.

In this embodiment, one ends of the second U-shaped bar 8 and the second fixed bar 7 are disposed on a third slider (not labeled in the figure), and the other ends of the second U-shaped bar 8 and the second fixed bar 7 are disposed in a sliding slot of the sliding rail 9.

The second U-shaped shelves strip is provided with two adjustment grooves equally in the one end on the third slip subassembly, and the principle is the same with first U-shaped shelves strip, and this is not repeated here. The other end of the second U-shaped baffle strip is arranged in the sliding groove of the sliding rail and can freely slide in the sliding rail.

In the process of carrying out the IC spot removing operation, the first U-shaped baffle strip and the first fixed baffle strip are required to be moved to the position above the IC to be spot removed, then the second U-shaped baffle strip and the second fixed baffle strip are required to be moved to the position above the IC to be spot removed (because the third track for supporting the second U-shaped baffle strip and the second fixed baffle strip is positioned on the bottom surface of the base, the first track and the second track for supporting the first U-shaped baffle strip and the first fixed baffle strip are positioned on the upper surface of the base, the first U-shaped baffle strip and the first fixed baffle strip are required to be positioned higher than the second U-shaped baffle strip and the second fixed baffle strip, and therefore, the first U-shaped baffle strip and the second U-shaped baffle strip are parallel in space in the moving process, and do not overlap), after the first U-shaped baffle strip and the second U-shaped baffle strip are all moved to the position above the IC to be spot removed, a sealed square space is formed, and the square space corresponds to the IC to be spot removed, wind is vertically placed into the sealed space, and the air is ground around the space to polish the IC, and the air is limited in the sealed space, and the sealed space is not limited in the process due to vibration.

In another embodiment, the IC spot removal slot 15 is provided with a slot 11 near the slide rail.

In another embodiment, a clamping strip 10 is arranged at the notch 11, and a protruding block 13 is arranged on the side of the clamping strip 10 facing the notch 11.

In this embodiment, after the chip is put into the point through the notch and removes the trench, card strip and notch closure, the chip is pushed to the operation position under the effect of the lug that sets up in card strip towards notch one side, simultaneously, the lug can also play the effect to the chip is fixed to prevent that the wind from criticizing and leading the position and leading to the wrong chip of beating at the point in-process of removing the operation.

In another embodiment, the bump 13 is made of a flexible gel material.

In this embodiment, the bump is made of a flexible colloid material, so as to avoid damaging the chip due to collision with the chip.

Although the present disclosure has been described above with reference to exemplary embodiments, the protective scope of the present disclosure is not limited to the embodiments described above. It will be apparent to persons skilled in the relevant art that various changes and modifications in form and detail can be made therein without departing from the scope and spirit of the disclosure. The scope of the invention is defined only by the following claims and their equivalents.

Claims

1. A positioning device for IC spot removal, comprising:

2. The apparatus of claim 1, wherein the first slide assembly comprises a first rail having a first slider disposed thereon; the second sliding assembly comprises a second track, and a second sliding block is arranged on the second track.

3. The apparatus of claim 2, wherein the third slide assembly comprises a third rail having a third slider disposed thereon.

4. The apparatus of claim 1, wherein the first positioning assembly comprises a first fixed rail positionally fixed to the first and second slide assemblies and a positionally movable first U-shaped rail.

5. The apparatus of claim 4, wherein the second positioning assembly includes a second fixed rail positionally fixed to the third sliding assembly and a second U-shaped rail positionally movable.

6. The device of claim 5, wherein both ends of the first and second U-shaped bars are provided with adjustment slots.

7. The device of claim 3, wherein the first, second and third sliders are provided with fixing pieces at both sides of the bottom ends thereof, the fixing pieces are wrapped at both sides of the rail, and the fixing pieces are provided with insertion holes.

8. The device of claim 1, wherein the IC spot removal slot is provided with a notch proximate the slide rail.

9. The device of claim 8, wherein a snap-in strip is provided at the notch.

10. The device of claim 9, wherein a side of the clip facing the slot is provided with a tab.