CN221099320U - Perovskite film heat treatment device - Google Patents
Perovskite film heat treatment device Download PDFInfo
- Publication number
- CN221099320U CN221099320U CN202323039682.0U CN202323039682U CN221099320U CN 221099320 U CN221099320 U CN 221099320U CN 202323039682 U CN202323039682 U CN 202323039682U CN 221099320 U CN221099320 U CN 221099320U
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- heat treatment
- fixedly connected
- vacuum furnace
- treatment device
- perovskite
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 239000010409 thin film Substances 0.000 claims description 25
- 239000010408 film Substances 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 13
- 238000003825 pressing Methods 0.000 abstract description 13
- 238000003475 lamination Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
The utility model discloses a perovskite film heat treatment device which comprises a vacuum furnace, wherein a bracket is fixedly connected to an inner cavity of the vacuum furnace, a groove plate is fixedly connected to the upper surface of the bracket, a concave base is arranged in the inner cavity of the groove plate, a pressing plate is attached to the upper surface of the concave base, the lower surface of the pressing plate is in clearance fit with the upper surface of the groove plate, and a copper rod is fixedly connected to the inner cavity of the pressing plate. When the vacuum furnace is used for carrying out heat treatment on the perovskite film, impurities can be effectively prevented from entering the inner cavity of the vacuum furnace through the lamination of the pressing plate and the groove plate, the influence of the impurities on the performance of the perovskite film is avoided, the treatment time is shortened, the treatment efficiency is improved, the heat is uniformly transferred, the loss and the waste of the heat can be reduced, and the uniformity and the stability of the heat treatment can improve the quality and the performance of the perovskite film.
Description
Technical Field
The utility model relates to the technical field of perovskite thin films, in particular to a perovskite thin film heat treatment device.
Background
The perovskite thin film needs to be subjected to heat treatment to optimize the structure and performance, a vacuum furnace is generally used for heat treatment, a perovskite thin film sample is placed into the vacuum furnace, proper temperature and time are set according to requirements, after the heat treatment is finished, the sample is taken out and cooled, the perovskite thin film needs to be treated in a high-temperature environment, and the desired crystallization degree can be obtained by controlling the heating speed and the environmental atmosphere, so that the photoelectric performance of the perovskite thin film is further improved, and the uniformity and the stability of the perovskite thin film are ensured.
However, when the perovskite thin film is subjected to heat treatment, some defects are encountered, impurities are introduced in the heat treatment process, the chemical composition of the thin film is changed by the impurities, the arrangement structure of perovskite molecules is affected, the electrical properties of the thin film are further affected, such as photoelectric conversion efficiency and the like, the crystal structure of the thin film is changed by the impurities, crystal defects are caused, the electrical properties and stability of the thin film are further affected, the thermal stability of the thin film is affected by the impurities, decomposition or chemical reaction of the thin film is caused in the heat treatment process, the properties of the thin film are further affected, additional resistance is possibly introduced by the impurities, and the charge transmission efficiency is further affected, so that the perovskite thin film heat treatment device is provided, and the problem that the impurities can enter in the heat treatment process is solved.
Disclosure of utility model
The utility model aims to provide a perovskite thin film heat treatment device which solves the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a perovskite film heat treatment device, includes the vacuum furnace, the inner chamber fixedly connected with support of vacuum furnace, the upper surface fixedly connected with recess board of support, the inner chamber of recess board is provided with the spill base, the upper surface laminating of spill base has the clamp plate, the lower surface of clamp plate with the upper surface clearance fit of recess board, the inner chamber fixedly connected with copper pole of clamp plate.
Preferably, the lower surface of the pressing plate is symmetrically and fixedly connected with a round rod, the side wall of the round rod is sleeved with the inner cavity of the groove plate, and the side wall of the round rod is in clearance fit with the inner cavity of the groove plate.
Preferably, the upper surface of the pressing plate is fixedly connected with two side weight blocks, and the two side weight blocks are symmetrically arranged.
Preferably, the inner cavity of the concave base is provided with a groove.
Compared with the prior art, the utility model has the beneficial effects that: when the vacuum furnace is used for carrying out heat treatment on the perovskite film, impurities can be effectively prevented from entering the inner cavity of the vacuum furnace through the lamination of the pressing plate and the groove plate, the influence of the impurities on the performance of the perovskite film is avoided, the treatment quality is ensured, the surface of the groove plate is provided with a groove, the concave base can be conveniently connected with the groove plate, the convenience and the stability of installation are improved, the groove design on the concave base can effectively guide the coating of the perovskite film, overflow is avoided, the uniformity and the integrity of the film are ensured, copper rods are uniformly dispersed on the surface of the pressing plate, and meanwhile, the copper rods are uniformly dispersed, so that the contact between the copper rods and the perovskite film raw material is good, the uniform heat transfer is realized, the efficiency and the effect of the heat treatment are improved, the perovskite film can reach the required temperature and the stability more quickly in the heat treatment process, the treatment time is shortened, the treatment efficiency is improved, the heat uniform transfer can also reduce the loss and the heat waste, and the uniformity and the stability of the heat treatment can improve the quality and the performance of the perovskite film.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a detailed view of the structure of the recess plate and the pressure plate of FIG. 1;
FIG. 3 is a perspective view of the structure of the recess plate of FIG. 1;
FIG. 4 is a perspective view of the platen of FIG. 1;
In the figure: 1. a vacuum furnace; 2. a bracket; 3. a groove plate; 4. a concave base; 5. a pressing plate; 6. a copper rod; 7. a round bar; 8. and a side weight.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model provides a perovskite thin film heat treatment device, which comprises a vacuum furnace 1, wherein a bracket 2 is fixedly connected to an inner cavity of the vacuum furnace 1, a groove plate 3 is fixedly connected to the upper surface of the bracket 2, a concave base 4 is arranged in the inner cavity of the groove plate 3, a pressing plate 5 is attached to the upper surface of the concave base 4, the lower surface of the pressing plate 5 is in clearance fit with the upper surface of the groove plate 3, and a copper rod 6 is fixedly connected to the inner cavity of the pressing plate 5.
When the vacuum furnace 1 is used for carrying out heat treatment on the perovskite thin film, firstly, the vacuum furnace 1 and the area to be treated are cleaned, no impurities and pollutants are ensured, then perovskite thin film raw materials are coated in the concave base 4, overflow of the perovskite thin film raw materials is avoided through concave design, then the concave base 4 is placed in the vacuum furnace 1 and is simultaneously attached to the groove plate 3, the concave base 4 is placed at the groove of the groove plate 3 and is vertically placed in sequence, then the pressing plate 5 is attached to the groove plate 3, the concave base 4 is shielded, heating and cooling curves of the vacuum furnace 1 are set, proper adjustment is carried out according to the characteristics of the perovskite thin film, the furnace door is closed, and vacuumizing is started, until reaching the required vacuum degree, a heating curve is set, heating is started, the temperature is generally required to be increased to the required temperature and kept for a certain time, the copper rod 6 is a material with good heat conduction performance, and heat can be quickly transferred to the surface of the cover body and the film, so that the heating process is accelerated, meanwhile, the copper rod 6 is uniformly dispersed, the contact between the copper rod and the perovskite film raw material is ensured to be good, the uniform transfer of heat is realized, impurities can be effectively prevented from entering the inner cavity of the vacuum furnace, the influence of the impurities on the performance of the perovskite film is avoided, the treatment quality is ensured, the perovskite film reaches the required phase state or the required chemical reaction is completed, and the heat treatment flow of the whole perovskite film is completed.
The lower surface symmetry fixedly connected with round bar 7 of clamp plate 5, the lateral wall of round bar 7 cup joints with the inner chamber of recess board 3 mutually, and through the setting of round bar 7, when installing clamp plate 5, round bar 7 can run through recess board 3 and slide, makes clamp plate 5's corner laminate with recess board 3 completely, avoids inside copper pole 6 and recess base 4 to appear the skew, prevents to influence follow-up heat treatment process.
The upper surface fixedly connected with side weight piece 8 of clamp plate 5, the quantity of side weight piece 8 is two, and for the symmetry setting, increases weight through side weight piece 8, makes clamp plate 5 and recess board 3's laminating effect better.
The inner cavity of the concave base 4 is provided with a groove.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A perovskite film heat treatment device is characterized in that: including vacuum furnace (1), the inner chamber fixedly connected with support (2) of vacuum furnace (1), the upper surface fixedly connected with recess board (3) of support (2), the inner chamber of recess board (3) is provided with spill base (4), the laminating of the upper surface of spill base (4) has clamp plate (5), the lower surface of clamp plate (5) with the upper surface clearance fit of recess board (3), the inner chamber fixedly connected with copper pole (6) of clamp plate (5).
2. A perovskite thin film heat treatment device as claimed in claim 1, wherein: the lower surface symmetry fixedly connected with round bar (7) of clamp plate (5), the lateral wall of round bar (7) with the inner chamber of recess board (3) cup joints mutually, the lateral wall of round bar (7) with the inner chamber clearance fit of recess board (3).
3. A perovskite thin film heat treatment device as claimed in claim 1, wherein: the upper surface of clamp plate (5) fixedly connected with side weight piece (8), the quantity of side weight piece (8) is two, and is symmetrical setting.
4. A perovskite thin film heat treatment device as claimed in claim 1, wherein: the inner cavity of the concave base (4) is provided with a groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323039682.0U CN221099320U (en) | 2023-11-10 | 2023-11-10 | Perovskite film heat treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323039682.0U CN221099320U (en) | 2023-11-10 | 2023-11-10 | Perovskite film heat treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN221099320U true CN221099320U (en) | 2024-06-07 |
Family
ID=91310902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202323039682.0U Active CN221099320U (en) | 2023-11-10 | 2023-11-10 | Perovskite film heat treatment device |
Country Status (1)
Country | Link |
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CN (1) | CN221099320U (en) |
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2023
- 2023-11-10 CN CN202323039682.0U patent/CN221099320U/en active Active
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