CN221094280U - Coating film carrier plate and coating film equipment - Google Patents
Coating film carrier plate and coating film equipment Download PDFInfo
- Publication number
- CN221094280U CN221094280U CN202323092686.5U CN202323092686U CN221094280U CN 221094280 U CN221094280 U CN 221094280U CN 202323092686 U CN202323092686 U CN 202323092686U CN 221094280 U CN221094280 U CN 221094280U
- Authority
- CN
- China
- Prior art keywords
- plate
- carrier plate
- conductive
- jacking
- conductive strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 27
- 239000011248 coating agent Substances 0.000 title claims abstract description 26
- 238000007665 sagging Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 9
- 229920000049 Carbon (fiber) Polymers 0.000 description 8
- 239000004917 carbon fiber Substances 0.000 description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000010891 electric arc Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005269 aluminizing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
The application discloses a coating support plate and coating equipment, and belongs to the field of solar cells. The coating support plate is used for coating equipment and also comprises a jacking hot plate, wherein the coating support plate comprises a frame and a tray, the tray is fixedly arranged on the frame, the frame comprises a plurality of ribs and conducting strips, which are arranged in a crisscross manner, and at least one conducting strip is arranged between any two ribs; the two ends of the conductive belt are fixedly connected with the corresponding ribs; the middle section of the conductive belt naturally sags, and the distance between the lowest point of the conductive belt and the lower surface of the rib is 0.5-5mm; after the jacking hot plate rises to a preset height, the conductive belt is in electrical contact with the jacking hot plate. According to the application, good contact between the carrier plate and the jacking hot plate is realized by arranging the conductive belt, so that the conductivity between the carrier plate and the jacking hot plate is improved, high-power radio frequency current can be born, the service life of equipment is prolonged, and the quality of a coated product is improved.
Description
Technical Field
The application belongs to the technical field of solar cells, relates to coating treatment, and in particular relates to a coating carrier plate and coating equipment.
Background
The capacitive coupling Plasma Enhanced Chemical Vapor Deposition (PECVD) vacuum coating line adopts a carrier plate dynamic transmission and static coating mode. The coating production line generally comprises a loading cavity, a preheating cavity, a process cavity and an unloading cavity. The carrier plate is driven by the roller, stays in the process chamber after passing through the loading chamber and the preheating chamber, and is fed by a power supply to generate plasma discharge for coating. An upper electrode is arranged in the PECVD process chamber, and a lower electrode of the capacitive coupling discharge structure is formed by a liftable heating aluminum plate and a coating carrier plate.
The carrier plate comprises a frame and a tray, and the carbon fiber frame and the tray are locked together through screws and corner brackets. The silicon chip is placed on the carrier plate, the carrier plate is conveyed through the heating cavity by the idler wheels, the carrier plate and the silicon chip are heated, and the silicon chip enters the process cavity after reaching a certain temperature. After the carrier plate is conveyed to the process cavity, the liftable heating aluminum plate jacks up the carrier plate to enable the carrier plate to be separated from the conveying roller, the bottom of the carrier plate frame is contacted with the liftable heating aluminum plate and is used as a lower electrode together to form a loop with an upper electrode, after the radio frequency power supply is fed in, plasma glow discharge can be generated between the upper electrode and the lower electrode, and process gas in the cavity is dissociated and deposited on a silicon wafer to realize film coating.
However, in the heating and coating processes, the bottom of the carbon fiber frame of the carrier plate cannot be fully contacted with the surface of the lifted heating aluminum plate, gaps are generated, and conductivity between the carbon fiber frame and the surface of the lifted heating aluminum plate is seriously affected; and when high-power radio frequency power is fed in, the existence of gaps easily causes discharge between the carrier plate frame and the heating aluminum plate, and a large amount of heat generated by electric arc instantaneously can damage the carbon fiber carrier plate and the heating aluminum plate, so that the service lives of the carrier plate and the heating aluminum plate are influenced, and meanwhile, the quality of a film plating product is influenced. Increasing the conductivity of the load plate and the heated aluminum plate is a major issue to be addressed.
Disclosure of utility model
The present application aims to solve at least one of the technical problems in the related art described above to some extent.
Therefore, the application aims to provide a coated carrier plate and a coated device, which realize good contact between the carrier plate and a jacking hot plate by arranging a conductive belt, improve the conductivity between the carrier plate and the jacking hot plate, bear high-power radio frequency current, prolong the service life of the device and improve the quality of a coated product.
In order to solve the technical problems, the application is realized as follows:
The embodiment of the application provides a coating carrier plate which is used for coating equipment and comprises a carrier plate and a jacking hot plate, wherein the carrier plate comprises a frame and a tray, the tray is fixedly arranged on the frame, the frame comprises a plurality of ribs and conductive strips, the ribs are arranged in a crisscross manner, and at least one conductive strip is arranged between any two ribs;
The two ends of the conductive belt are fixedly connected with the corresponding ribs; the middle section of the conductive belt sags and is in contact connection with the upper surface of the jacking hot plate after the jacking hot plate ascends to a preset position.
In addition, the coated carrier plate according to the application can also have the following additional technical characteristics:
In some of these embodiments, the middle section of the conductive strip naturally sags in particular: the distance between the lowest point of the conductive strip and the lower surface of the rib is 0.5-5mm.
In some embodiments, the conductive strip is an elongated flexible strip-like structure.
In some of these embodiments, the conductive strip includes fixed regions at both ends and a sagging region in the middle, which is partially or entirely under the ribs.
In some embodiments, the conductive strip includes a stainless steel inner strip and a conductive plating provided on a surface of the stainless steel inner strip.
In some embodiments, the conductive strip is made of conductive metal.
In some of these embodiments, the conductive strip has a thickness of 0.1-1mm.
In some embodiments, two ends of the conductive belt are fixedly connected with the corresponding ribs through locking corner brackets or bolts.
In some embodiments, the number of the conductive strips arranged between two adjacent ribs is 1-20.
The embodiment of the application also provides a coating device which comprises the coating carrier plate.
Compared with the prior art, the utility model has at least the following beneficial effects:
In the embodiment of the application, the provided coated carrier plate realizes good contact between the carrier plate and the jacking hot plate by arranging the conductive belt, improves the conductivity between the carrier plate and the jacking hot plate, can bear the feed-in of a high-power radio frequency power supply, and is not easy to generate the discharge phenomenon between the carrier plate frame and the hot plate, thereby avoiding the damage of a large amount of heat generated in the moment of discharge arc to the carbon fiber carrier plate and the jacking hot plate, prolonging the service lives of the carrier plate and the jacking hot plate, and improving the quality of a coated product;
in the embodiment of the application, the conductive belt of the coated carrier plate is drooping, so that the conductive belt can contact the jacking plate after the carrier plate is jacked, and the contact area is larger and larger along with the jacking plate, and the conductivity is better and better.
The coating equipment of the utility model comprises the coating carrier plate, so that the coating carrier plate has at least all the characteristics and advantages of the coating carrier plate, and the description is omitted herein. Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a schematic top view of a coated carrier plate according to an embodiment of the present application;
fig. 2 is a schematic side view of a coated carrier plate (where a conductive tape is disposed) according to an embodiment of the present application;
fig. 3 is a schematic perspective view of a coated carrier plate (where a conductive strip is disposed) according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a special-shaped conductive strip according to an embodiment of the present application;
FIG. 5 is a schematic diagram of an assembled structure of a profiled conductive tape according to an embodiment of the present application; wherein, (a) is a bottom view and (b) is a perspective view.
Reference numerals illustrate:
1-frame ribs; 2-conducting strips; 3-locking the corner connector;
21-a conductive strap fixing region; 22-conductive tape sagging area; 23-mounting screw holes.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The following describes embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 1, in some embodiments of the present application, a plating film carrier plate is provided, which can be applied to a plating apparatus, for example, in a process of manufacturing a solar cell, the plating film process involves a process of plating a battery piece, in which a lifting heating aluminum plate is required to lift a carrier plate containing a silicon wafer to a proper position for plating, and in a lifting state, the upper surface of the heating aluminum plate contacts with the lower surface of the carrier plate, and the plating film carrier plate can be used to achieve good contact between the heating aluminum plate (also referred to as a lifting heat plate) and the carrier plate, so as to solve the problems in the prior art that the conductivity is poor and arc discharge is easy to occur due to gaps between the heating aluminum plate and the carrier plate, thereby affecting the plating film quality and the service life of the heating aluminum plate and the carrier plate. In addition, the coated carrier plate can be used in other equipment or for conducting contact requirements of other types, and the embodiment of the application does not limit the specific use scene and working condition of the coated carrier plate.
Specifically, the coated carrier plate includes: the carrier plate and the conductive belt 2, the carrier plate comprises a frame and a tray, and the frame and the tray are fixed together through screws and corner brackets. The frame is carbon fiber material, and it includes a plurality of crisscross carbon fiber ribs 1, and the lower surface of rib 1 is planar structure.
The conductive strip 2 is of a strip-shaped structure and is mounted between two ribs on the inner side of the carrier plate frame, specifically, the conductive strip is additionally mounted between the first rib and the second rib on the left side and the right side of the carrier plate, two ends of the conductive strip 2 are fixed on corresponding ribs by using locking angle codes 3, the length of the conductive strip 2 is greater than the distance between the two ribs, sagging of the middle section of the conductive strip 2 is realized, and good contact connection is realized on the upper surface of a heating aluminum plate with the bottom for jacking.
In some embodiments of the application the lowest point of the conductive strip 2 exceeds the lower surface of the frame rib by 0.5-5mm.
In some embodiments of the present application, the conductive tape 2 may be made of stainless steel aluminized material. Aluminum has good conductivity and corrosion resistance, so that the conductivity can be improved; the stainless steel has good elasticity and flexibility, so when the heating aluminum plate below the carrier plate is lifted, the conductive belt 2 is in contact with the heating aluminum plate, and the conductive belt has certain elasticity and flexibility, so that the conductive belt is beneficial to being in surface contact with the lifting hot plate, the contact area between the loading plate and the lifting hot plate can be greatly increased, and the conductivity between the loading plate and the lifting hot plate is increased; when the high-power VHF power supply is coated, the phenomenon of arc discharge can not be generated between the carrier plate and the jacking hot plate, so that the quality of products and the service lives of the jacking hot plate and the carrier plate are improved.
In some embodiments of the application, the thickness of the conductive strip 2 is between 0.1-1 mm.
Alternatively, the location of the conductive strips 2 is not limited to the ribs shown in fig. 1, and a plurality of conductive strips 2 may be disposed between any two adjacent ribs. The number of the conductive strips arranged between two adjacent ribs is 1-20.
In some embodiments, as shown in fig. 2 and 3, the locking bracket 3 has an "L" structure and includes two perpendicular rectangular plates with ends fixedly connected; one rectangular plate (which can be called as a first rectangular plate) is fixedly connected with ribs which are in the same direction as the arrangement direction of the conductive strip by bolts; the other right-angle plate (can be called as a second right-angle plate) is connected with the rib (namely, the rib perpendicular to the arrangement direction of the conductive belt) arranged at the end part of the conductive belt, and the concrete connection mode is that the bolt passes through the end part of the conductive belt and then is in threaded connection with the rib, so that the end part of the conductive belt is fixed. The two ends of the conductive belt are fixed by the locking corner fastener.
Optionally, the number of bolts on the first rectangular plate is one, and the number of bolts on the second rectangular plate for fixing the end part of the conductive belt is two.
In some embodiments of the present application, the two ends of the conductive strip 2 are not limited to be fixed on the corresponding ribs by using the locking corner brace 3, and may be directly fixed by using bolts.
In other embodiments of the present application, the conductive strip 2 is a special-shaped conductive strip, as shown in fig. 4, the conductive strip 2 includes a conductive strip fixing area 21 and a conductive strip sagging area 22, where the number of conductive strip fixing areas 21 of the special-shaped conductive strip is two, and the conductive strip fixing areas are horizontally separated at two ends of the conductive strip sagging area 22; the conductive strap sagging area 22 is also horizontally disposed and is located below the two conductive strap securing areas 21. The conductive belt fixing area 21 is provided with a mounting screw hole 23, and the conductive belt fixing area is rotatably connected with the corresponding rib through the mounting screw hole 23 and the locking angle code 3. The special-shaped conductive belt assembly structure is shown in fig. 5 (a) and 5 (b), the locking angle code 3 and the conductive belt 2 are arranged in a crossed mode, and the mounting screw hole 23 is rotatable relative to the locking angle code 3 and the rib 1, so that the height of the conductive belt 2 is adjustable in real time, and the special-shaped conductive belt assembly structure is suitable for mounting working conditions with different heights.
In this embodiment, when the width of the conductive strip sagging area 22 is less than or equal to the width of the rib 1, the conductive strip sagging area 22 is completely located under the rib 1, and when the width of the conductive strip sagging area 22 is greater than the width of the rib 1, the conductive strip sagging area 22 is partially located under the rib 1, which is advantageous for the anisotropic conductive strip to make surface contact with the lift plate, and the rib 1 presses the anisotropic conductive strip sagging area 22 to the upper surface of the lift plate, increasing the contact area between the load plate and the lift plate, thereby increasing the conductivity between the load plate and the lift plate.
Alternatively, the material of the conductive strip is not limited to stainless steel sheet aluminizing, but may be other metal materials.
When the heating aluminum plate jacking device works, due to the arrangement of the conductive belt 2, the conductive belt 2 is firstly contacted when the heating aluminum plate is jacked, the conductivity of the conductive belt 2 is higher than that of the carbon fiber ribs, and the contact area between the conductive belt and the heating aluminum plate is larger along with the higher top of the heating aluminum plate, so that the conductivity is better, the situation of poor conductivity caused by gaps between the carrier plate and the heating aluminum plate is reduced, arcing discharge between the carrier plate and the heating aluminum plate during starting is reduced, and the quality of a film plating product and the service lives of the heating aluminum plate and the carrier plate are improved.
The specific structure and operation principle of the temperature sensor, the controller, etc. may refer to the prior art, and the embodiment is not limited thereto, and will not be described in detail herein.
The utility model is not described in detail in a manner known to those skilled in the art.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.
Claims (10)
1. The coating support plate is used for coating equipment and also comprises a jacking hot plate, and comprises a frame and a tray, wherein the tray is fixedly arranged on the frame;
The two ends of the conductive belt are fixedly connected with the corresponding ribs; the middle section of the conductive belt sags and is in contact connection with the upper surface of the jacking hot plate after the jacking hot plate ascends to a preset position.
2. The coated carrier plate of claim 1, wherein the sagging of the middle section of the conductive strip is specifically: the distance between the lowest point of the conductive strip and the lower surface of the rib is 0.5-5mm.
3. The coated carrier of claim 1, wherein the conductive strip is an elongated flexible strip-like structure.
4. The coated carrier plate of claim 1, wherein the conductive strip includes a fixed region at both ends and a sagging region in the middle, the sagging region being partially or entirely under the ribs.
5. The coated carrier plate of claim 1, wherein the conductive strip comprises a stainless steel inner strip and a conductive layer disposed on a surface of the stainless steel inner strip.
6. The coated carrier of claim 1, wherein the conductive strip is metal.
7. The coated carrier of claim 1, wherein the conductive strip has a thickness of 0.1-1mm.
8. The coated carrier plate of claim 1, wherein two ends of the conductive strip are fixedly connected with the corresponding ribs by locking corner brackets or bolts.
9. The coated carrier plate of any one of claims 1-8, wherein the number of conductive strips disposed between two adjacent ribs is 1-20.
10. A plating apparatus comprising the plating carrier plate according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323092686.5U CN221094280U (en) | 2023-11-16 | 2023-11-16 | Coating film carrier plate and coating film equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323092686.5U CN221094280U (en) | 2023-11-16 | 2023-11-16 | Coating film carrier plate and coating film equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221094280U true CN221094280U (en) | 2024-06-07 |
Family
ID=91304130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323092686.5U Active CN221094280U (en) | 2023-11-16 | 2023-11-16 | Coating film carrier plate and coating film equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221094280U (en) |
-
2023
- 2023-11-16 CN CN202323092686.5U patent/CN221094280U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0782176A2 (en) | Deposited-film forming process and deposited-film forming apparatus | |
| US11616163B2 (en) | Firing furnace for firing electrode of solar cell element, method for manufacturing solar cell element, and solar cell element | |
| CN221094280U (en) | Coating film carrier plate and coating film equipment | |
| JP2004200421A (en) | Plasma cvd equipment, film forming method using the same, and manufacturing method of semiconductor device | |
| CN221071643U (en) | Coating film carrier plate and coating film equipment | |
| KR20180071550A (en) | Heat treatment method for membrane electrode assembly for fuel cell | |
| KR101075842B1 (en) | Inline type plasma processing apparatus for manufacturing solar cell | |
| US20120115273A1 (en) | Manufacturing method of photoelectric conversion device | |
| CN116765047A (en) | Dry cleaning device for graphite boat | |
| CN216872068U (en) | Baking clamp of novel drying system | |
| CN114672768A (en) | Thin film deposition apparatus | |
| CN205491411U (en) | Developments parallel -plate plasma generator | |
| CN211238276U (en) | Crystalline silicon solar cell panel repairing device | |
| CN216598008U (en) | Electrode grounding structure of coating cavity | |
| US20230223283A1 (en) | Heating apparatus for a semiconductor device, heating system, and semiconductor device | |
| CN102888596B (en) | Chamber device and there is the apparatus for processing plasma of this chamber device | |
| CN219123252U (en) | Heating and curing platform capable of effectively preventing surface bulge | |
| CN217417631U (en) | Aluminum strip deviation correcting device | |
| CN205258601U (en) | A silicon chip support plate for $descending coating film | |
| CN221918228U (en) | Electrode device and hot stove | |
| CN116770266A (en) | Film plating equipment and film plating method for amorphous silicon film of heterojunction battery | |
| CN219880420U (en) | Processing device for graphite negative plate | |
| CN218507898U (en) | Cathode assembly for vacuum coating equipment and vacuum coating equipment thereof | |
| CN218910507U (en) | Film-coated carrier plate of amorphous silicon film of heterojunction battery | |
| CN218417161U (en) | Coating base, coating device and coating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |