CN221088692U - Elastic grinding block for polishing ceramic tile - Google Patents
Elastic grinding block for polishing ceramic tile Download PDFInfo
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- CN221088692U CN221088692U CN202322568747.4U CN202322568747U CN221088692U CN 221088692 U CN221088692 U CN 221088692U CN 202322568747 U CN202322568747 U CN 202322568747U CN 221088692 U CN221088692 U CN 221088692U
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- piece
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- 238000005498 polishing Methods 0.000 title claims abstract description 203
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000011449 brick Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model relates to the technical field of ceramic tile polishing, in particular to an elastic grinding block for polishing ceramic tiles, which comprises a clamping head, an elastic layer and a polishing assembly which are sequentially stacked from bottom to top; the polishing assembly comprises a base and four groups of polishing parts arranged on the top surface of the base, the bottom surface of the base is connected with the elastic layer, the four groups of polishing parts are sequentially arranged from front to back, the base is of a front-back symmetrical structure, the first group of polishing parts are symmetrical with the fourth group of polishing parts in the front-back direction, the second group of polishing parts are symmetrical with the third group of polishing parts, and a first chip groove is arranged between every two adjacent polishing parts; the left side and the right side of the base are higher and lower, so that the top surface of the base is inclined. It can solve the problem that polishing scraps are difficult to discharge in the prior art.
Description
Technical Field
The utility model relates to the technical field of ceramic tile polishing, in particular to an elastic grinding block for polishing ceramic tiles.
Background
With the development of the building ceramic technology, the elastic grinding block is concerned by the manufacturers of the ground grinding tools and the ceramic decorative materials. In the prior art, the elastic grinding block is generally provided with chip grooves which are perpendicular to each other, but polishing scraps generated in the grinding and polishing processes of the ceramic tile are difficult to discharge through the chip grooves by means of cooling liquid, particularly the polishing scraps are easily accumulated in the middle of the chip grooves and cannot be discharged, and the polishing scraps can cause scratches on the surface of the ceramic tile in the subsequent grinding and polishing processes. For this reason, it is necessary to design a new elastic grinding block for polishing the tile to solve the above problems.
Disclosure of utility model
The utility model aims to provide an elastic grinding block for polishing ceramic tiles, and aims to solve the problem that polishing scraps are difficult to discharge in the prior art.
In order to achieve the above object, the present utility model provides an elastic abrasive block for polishing a ceramic tile, comprising a clamping head, an elastic layer and a polishing member which are sequentially laminated from bottom to top; the polishing assembly comprises a base and four groups of polishing parts arranged on the top surface of the base, the bottom surface of the base is connected with the elastic layer, the four groups of polishing parts are sequentially arranged from front to back, the base is of a front-back symmetrical structure, the first group of polishing parts are symmetrical with the fourth group of polishing parts in the front-back direction, the second group of polishing parts are symmetrical with the third group of polishing parts, and a first chip groove is arranged between every two adjacent polishing parts; the left side and the right side of the base are higher and lower, so that the top surface of the base is inclined.
Further, the whole of the first group of polishing parts is of a trapezoid structure with small front and big back, and the first group of polishing parts comprises three first polishing pieces; the three first polishing pieces are respectively in an equilateral triangle structure, are arranged from left to right, and are respectively in reverse, forward and reverse directions.
Further, the cross-sectional area of the first polishing piece near the base is larger than that of the first polishing piece far away from the base, and the corners of the first polishing piece far away from the base are all provided with chamfer structures.
Further, second chip grooves are arranged between the adjacent first polishing pieces, the width of each second chip groove is W2, and the width of each first chip groove is W1, wherein W1 is more than W2.
Further, the whole of the second group of polishing parts is in a rectangular structure, and the second group of polishing parts comprises a second polishing piece and four third polishing pieces; the second polishing piece is in a square structure and is placed in a diamond shape in the middle of the second group of polishing parts; the four third polishing pieces are of right triangle structures and are respectively placed on four sides of the second polishing piece, and the hypotenuses of the four third polishing pieces are respectively parallel to the four sides of the second polishing piece.
Further, the cross-sectional area of the second polishing piece near the base is larger than the cross-sectional area of the third polishing piece near the base, the cross-sectional area of the third polishing piece near the base is larger than the cross-sectional area of the third polishing piece near the base, and the corners of the second polishing piece and the third polishing piece near the base are both provided with chamfer structures.
Further, a third chip groove is arranged between the second polishing piece and the third polishing piece, the width of the third chip groove is W3, and the width of the first chip groove is W1, and W1 is more than W3.
Further, the top surface of the base is inclined at an angle of 2-4 degrees relative to the elastic layer.
Compared with the prior art, the elastic grinding block for polishing the ceramic tile provided by the utility model has the advantages that the left side and the right side of the base of the polishing component are higher and lower, so that the top surface of the base is inclined; similarly, the first chip groove, the second chip groove and the third chip groove are respectively inclined along the top surface of the base, and the inclined chip grooves have unidirectional guiding effect on the cooling liquid, so that polishing scraps generated in the grinding and polishing processes of the ceramic tile can move along the unidirectional flowing cooling liquid and cannot be accumulated in the middle of the chip grooves, and the polishing scraps can be rapidly discharged; the width W1 of first chip groove is greater than the width W2 of second chip groove, and the width W1 of first chip groove is greater than the width W3 of third chip groove, and the existence of three chip grooves has accelerated the discharge rate of polishing piece to be favorable to reducing the residue of polishing piece at the brick face, avoided the brick face to appear the mar effectively.
Drawings
FIG. 1 is a schematic overall elevational view of the present utility model;
Fig. 2 is a schematic top view of the polishing assembly of the present utility model.
Reference numerals illustrate:
1. A clamping head; 2. an elastic layer; 3. a polishing assembly; 30. a base; 31. a first set of polishing sections; 311. a first polishing member; 32. a second set of polishing sections; 321. a second polishing member; 322. a third polishing member; 33. a third set of polishing sections; 34. a fourth set of polishing sections; 35. a first junk slot; 36. a second junk slot; 37. a third junk slot; 38. chamfering structure.
Detailed Description
The present utility model will be described in detail with reference to specific examples.
In the present utility model, unless explicitly stated and limited otherwise, when terminology such as "disposed," "connected," or "connected" is intended to be interpreted broadly, such as, for example, a fixed connection, a removable connection, or an integral connection; may be directly connected or connected through one or more intermediaries. The specific meaning of the terms described above in the present utility model can be understood by those skilled in the art according to the specific circumstances. The direction words appearing in the utility model are used for better explaining the characteristics of the features and the relation among the features, and it is understood that when the arrangement direction of the utility model is changed, the characteristics of the features and the directions of the relation among the features are correspondingly changed, so that the direction words do not form absolute limiting effect on the characteristics of the features and the relation among the features in space, and only play a role in relative limiting.
The utility model provides an elastic grinding block for polishing ceramic tiles, which comprises a clamping head 1, an elastic layer 2 and a polishing component 3 which are sequentially laminated from bottom to top as shown in figures 1 to 2; the polishing assembly 3 comprises a base 30 and four groups of polishing parts arranged on the top surface of the base 30, the bottom surface of the base 30 is connected with the elastic layer 2, the four groups of polishing parts are sequentially arranged from front to back, the base 30 is of a front-back symmetrical structure, in the front-back direction, the first group of polishing parts 31 are symmetrical with the fourth group of polishing parts 34, the second group of polishing parts 32 are symmetrical with the third group of polishing parts 33, and a first chip removal groove 35 is arranged between the adjacent polishing parts; the left and right sides of the base 30 are inclined with each other so that the top surface of the base 30 is inclined.
Based on the above structure, the polishing assembly 3 has the left side and the right side of the base 30 with a height being equal to each other so that the top surface of the base 30 is inclined; similarly, the first chip groove 35, the second chip groove 36 and the third chip groove 37 are respectively inclined along the top surface of the base, and the inclined chip grooves have unidirectional guiding effect on the cooling liquid, so that polishing chips generated in the grinding and polishing processes of the ceramic tile can move along the unidirectional flowing cooling liquid and cannot be accumulated in the middle part of the chip grooves, and the polishing chips can be rapidly discharged; the width W1 of the first chip groove 35 is larger than the width W2 of the second chip groove 36, the width W1 of the first chip groove 35 is larger than the width W3 of the third chip groove 37, and the three chip grooves accelerate the discharge speed of polishing chips, are beneficial to reducing the residues of the polishing chips on the brick surface, and effectively avoid scratches on the brick surface.
In the present embodiment, the first group polishing portion 31 has a trapezoid structure with a small front and a large rear as a whole, and the first group polishing portion 31 includes three first polishing members 311; the three first polishing pieces 311 are respectively in an equilateral triangle structure, the three first polishing pieces 311 are arranged from left to right, and the directions of the three first polishing pieces 311 are respectively reverse, forward and reverse. Because the first group polishing parts 31 and the fourth group polishing parts 34 are symmetrical, the whole of the fourth group polishing parts 34 has a trapezoid structure with large front and small back, and the fourth group polishing parts 34 comprise three first polishing pieces 311; the three first polishing pieces 311 are respectively in an equilateral triangle structure, the three first polishing pieces 311 are arranged from left to right, and the directions of the three first polishing pieces 311 are respectively forward, reverse and forward.
In this embodiment, the cross-sectional area of the side of the first polishing member 311 close to the base 30 is larger than the cross-sectional area of the side away from the base 30, and the corners of the side of the first polishing member 311 away from the base 30 are provided with chamfer structures 38, which is beneficial for polishing scraps to easily enter the junk slots.
In this embodiment, a second junk slot 36 is disposed between adjacent first polishing members 311, the width of the second junk slot 36 is W2, and the width of the first junk slot 35 is W1, W1> W2. The presence of the second junk slots 36 accelerates the removal rate of polishing debris and advantageously reduces the residue of polishing debris on the brick surface, effectively avoiding scratches on the brick surface. Since the first junk slot 35 is the main junk slot, the coolant and polishing chips in the second junk slot 36 are mostly converged into the first junk slot 35, and the second junk slot 36 can be regarded as a tributary of the first junk slot 35, so that the flow rate of the second junk slot 36 is smaller than that of the first junk slot 35, the width of the second junk slot 36 can be designed to be smaller, and in turn, the polishing area of the first polishing member 311 can be designed to be larger, thereby improving the polishing effect.
In this embodiment, the second polishing part 32 has a rectangular structure, and the second polishing part 32 includes a second polishing member 321 and four third polishing members 322; the second polishing member 321 has a square structure and is placed in a diamond shape in the middle of the second group polishing section 32; the four third polishing members 322 are all in a right triangle structure and are respectively placed on four sides of the second polishing member 321, and the hypotenuses of the four third polishing members 322 are respectively parallel to four sides of the second polishing member 321. Since the second group polishing parts 32 are symmetrical to the third group polishing parts 33, the third group polishing parts 33 have a rectangular structure as a whole, and the third group polishing parts 33 include one second polishing member 321 and four third polishing members 322; the second polishing member 321 has a square structure and is placed in a diamond shape in the middle of the third group polishing section 33; the four third polishing members 322 are all in a right triangle structure and are respectively placed on four sides of the second polishing member 321, and the hypotenuses of the four third polishing members 322 are respectively parallel to four sides of the second polishing member 321.
In this embodiment, the cross-sectional area of the second polishing member 321 near the base 30 is larger than the cross-sectional area of the third polishing member 322 near the base 30, and the cross-sectional area of the third polishing member 322 near the base 30 is larger than the cross-sectional area of the third polishing member near the base 30, and the corners of the second polishing member 321 and the third polishing member 322 near the base 30 are both provided with chamfer structures 38, which is beneficial for polishing scraps to easily enter the junk slots.
In this embodiment, a third junk slot 37 is disposed between the second polishing member 321 and the third polishing member 322, the width of the third junk slot 37 is W3, and the width of the first junk slot 35 is W1, W1> W3. The third junk slot 37 accelerates the discharge speed of the polishing scraps, is beneficial to reducing the residues of the polishing scraps on the brick surface, and effectively avoids scratches on the brick surface. Since the first junk slot 35 is the main junk slot, most of the coolant and polishing scraps in the third junk slot 37 are converged into the first junk slot 35, the third junk slot 37 can be regarded as a tributary of the first junk slot 35, so that the flow rate of the third junk slot 37 is smaller than that of the first junk slot 35, the width of the third junk slot 37 can be designed to be smaller, and the polishing area of the second polishing member 321 can be designed to be larger in turn, so that the polishing effect is improved.
In this embodiment, the top surface of the chassis 30 is inclined at an angle of 2 to 4 degrees with respect to the elastic layer 2. It should be noted that, when the inclination angle of the top surface of the base 30 relative to the elastic layer 2 is too high, the polishing piece on the high side is easily worn too fast, and the polishing piece on the low side is too much and remains, so that the polishing piece is easy to move unevenly, and polishing defects such as scratches occur on the brick surface, etc., thus the service life of the elastic grinding block is also reduced, and the use cost is increased; when the inclination angle of the top surface of the base 30 with respect to the elastic layer 2 is too low, the chip removing effect is not obvious, and scratches are easily generated on the brick surface as well. In this embodiment, the inclination angle of the top surface of the base 30 with respect to the elastic layer 2 is 2-4 degrees, so that the polishing effect of the polishing member on the tile is ensured, the service life is also ensured, the discharge speed of polishing scraps can be increased, and scratches on the tile surface are avoided.
In summary, the elastic grinding block for polishing the ceramic tile can solve the problem that polishing scraps are difficult to discharge in the prior art.
The above-described embodiments and features of the embodiments may be combined with each other without conflict.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (8)
1. An elastic grinding block for polishing ceramic tiles, which is characterized in that: comprises a clamping head (1), an elastic layer (2) and a polishing component (3) which are sequentially stacked from bottom to top;
the polishing assembly (3) comprises a base (30) and four groups of polishing parts arranged on the top surface of the base (30), the bottom surface of the base (30) is connected with the elastic layer (2), the four groups of polishing parts are sequentially arranged from front to back, the base (30) is of a front-back symmetrical structure, in the front-back direction, the first group of polishing parts (31) are symmetrical with the fourth group of polishing parts (34), the second group of polishing parts (32) are symmetrical with the third group of polishing parts (33), and a first chip removal groove (35) is arranged between the adjacent polishing parts;
the left side and the right side of the base (30) are one high and one low, so that the top surface of the base (30) is inclined.
2. The resilient abrasive block for polishing ceramic tiles according to claim 1, wherein: the whole of the first group of polishing parts (31) is in a trapezoid structure with small front and large back, and the first group of polishing parts (31) comprises three first polishing pieces (311); the three first polishing pieces (311) are respectively in an equilateral triangle structure, the three first polishing pieces (311) are arranged from left to right, and the directions of the three first polishing pieces are respectively reverse, forward and reverse.
3. The resilient abrasive block for polishing ceramic tiles according to claim 2, wherein: the cross-sectional area of one side of the first polishing piece (311) close to the base (30) is larger than that of one side of the first polishing piece far away from the base (30), and the corners of one side of the first polishing piece (311) far away from the base (30) are provided with chamfer structures (38).
4. The resilient abrasive block for polishing ceramic tiles according to claim 2, wherein: a second chip groove (36) is arranged between the adjacent first polishing pieces (311), the width of the second chip groove (36) is W2, and the width of the first chip groove (35) is W1, wherein W1 is more than W2.
5. The resilient abrasive block for polishing ceramic tiles according to claim 1, wherein: the whole of the second group of polishing parts (32) is in a rectangular structure, and the second group of polishing parts (32) comprises a second polishing piece (321) and four third polishing pieces (322); the second polishing piece (321) is in a square structure and is placed in a diamond shape in the middle of the second group of polishing parts (32); the four third polishing members (322) are of right triangle structures and are respectively arranged on four sides of the second polishing member (321), and the hypotenuses of the four third polishing members (322) are respectively parallel to the four sides of the second polishing member (321).
6. The resilient abrasive block for polishing ceramic tiles according to claim 5, wherein: the cross-sectional area of one side of the second polishing piece (321) close to the base (30) is larger than that of one side of the second polishing piece far away from the base (30), the cross-sectional area of one side of the third polishing piece (322) close to the base (30) is larger than that of one side of the third polishing piece far away from the base (30), and corners of one side of the second polishing piece (321) and one side of the third polishing piece (322) far away from the base (30) are both provided with chamfer structures (38).
7. The resilient abrasive block for polishing ceramic tiles according to claim 5, wherein: a third chip groove (37) is arranged between the second polishing piece (321) and the third polishing piece (322), the width of the third chip groove (37) is W3, and the width of the first chip groove (35) is W1, wherein W1 is more than W3.
8. The resilient sanding block for polishing ceramic tiles according to any one of claims 1 to 7, wherein: the inclination angle of the top surface of the base (30) relative to the elastic layer (2) is 2-4 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568747.4U CN221088692U (en) | 2023-09-21 | 2023-09-21 | Elastic grinding block for polishing ceramic tile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568747.4U CN221088692U (en) | 2023-09-21 | 2023-09-21 | Elastic grinding block for polishing ceramic tile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221088692U true CN221088692U (en) | 2024-06-07 |
Family
ID=91308176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322568747.4U Active CN221088692U (en) | 2023-09-21 | 2023-09-21 | Elastic grinding block for polishing ceramic tile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221088692U (en) |
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2023
- 2023-09-21 CN CN202322568747.4U patent/CN221088692U/en active Active
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