CN221079990U

CN221079990U - Flexible circuit tape compatible with multiple pin space pad packages

Info

Publication number: CN221079990U
Application number: CN202322931246.8U
Authority: CN
Inventors: 时贺原; 廖观万; 王飞; 王垒
Original assignee: Beijing Wanlong Essential Technology Co ltd
Current assignee: Beijing Wanlong Essential Technology Co ltd
Filing date: 2023-10-31
Publication date: 2024-06-04
Anticipated expiration: 2033-10-31

Abstract

The utility model relates to a flexible circuit tape compatible with multiple pin space pad packages, comprising: a flexible circuit board including at least a first section and a second section; the first arrangement bonding pads are arranged on the top surface of the first section of the flexible circuit board; the first arrangement bonding pads on the bottom surface are arranged on the bottom surface of the first section of the flexible circuit board, the spacing is larger than that of the first arrangement bonding pads on the top surface, and the first arrangement bonding pads on the top surface are in one-to-one correspondence and are connected; the top surface second arrangement bonding pads are arranged on the top surface of the second section of the flexible circuit board, and the space between the top surface second arrangement bonding pads is equal to the space between the first arrangement bonding pads on the bottom surface; the bottom surface second arrangement bonding pads are arranged on the bottom surface of the second section of the flexible circuit board, have a distance larger than that of the top surface second arrangement bonding pads, and are in one-to-one correspondence and connected with the top surface second arrangement bonding pads. The utility model can realize compatible packaging of various pin pitches, has flexible application, meets the use requirements of most scenes in the current integrated circuit, and saves cost.

Description

Flexible circuit tape compatible with multiple pin space pad packages

Technical Field

The utility model relates to the technical field of electronics, in particular to a device packaging technology on an integrated circuit board, and specifically relates to a flexible circuit tape compatible with packaging of pads with various pin pitches.

Background

With the increase of the capability of integrated circuit manufacturing process, high-density pin devices are increasing, and particularly in intelligent devices, integrated circuits are becoming more and more functional and smaller in size, and pin densities are becoming higher and higher, which results in further improvement of the process level of PCB boards as carriers for integrated circuits. Taking BGA packaged integrated circuits as an example, in general industrial products, the center distance between pins of BGA packaged integrated circuits is mainly 1.0mm and 0.8mm, and each pin is 0.65mm, and at this time, the circuit boards are designed by adopting through hole connection (through holes are used for opening the circuit boards, so that connection of each layer of circuit can be realized, mechanical drilling is usually adopted, a certain requirement on the plate thickness and aperture ratio is generally not more than 10:1, that is, the circuit boards with the thickness of 2.0mm and the minimum through holes are 0.2mm. In the case of using high-density pin integrated circuits, such as pins with a center-to-center distance of 0.5mm,0.4mm or even smaller, the PCB needs to be connected by blind buried vias to solve the problem of fan-out of small pitch pins. The use of a circuit board with blind buried vias (regardless of the number of such vias) can greatly increase the difficulty of the manufacturing process, thus resulting in a multiple increase in cost.

Technological development advances, and various industries cross more and more, and powerful high-density pin devices are gradually applied to the industrial field, however, this presents a problem: the density of circuit boards of most industrial products is not particularly high, and the design of through holes is adopted. Because of the use of a high density device, the circuit board needs to be designed in a blind buried via way, which increases the cost of the circuit board by a multiple.

How to realize compatible packaging of different pin pitches under the condition of using a high-density pin device, and reduce the manufacturing difficulty and cost of the process becomes a problem to be solved urgently.

Disclosure of Invention

Aiming at the defect of the knowledge of the problems in the prior art, the utility model provides the flexible circuit tape compatible with the pad packaging with various pin pitches, which can realize the compatible packaging with various pin pitches, has flexible application and meets the use requirements of most of scenes in the current integrated circuits.

The utility model is realized in the following way:

A flexible circuit tape compatible with multiple pin pitch pad packages, comprising:

a flexible circuit board including at least a first section and a second section;

the first arrangement bonding pads are arranged on the top surface of the first section of the flexible circuit board;

The first arrangement bonding pads on the bottom surface are arranged on the bottom surface of the first section of the flexible circuit board, the spacing is larger than that of the first arrangement bonding pads on the top surface, and the first arrangement bonding pads on the top surface are in one-to-one correspondence and are connected with each other;

The top surface second arrangement bonding pads are arranged on the top surface of the second section of the flexible circuit board, and the space between the top surface second arrangement bonding pads is equal to the space between the bottom surface first arrangement bonding pads;

The bottom surface second arrangement bonding pads are arranged on the bottom surface of the second section of the flexible circuit board, have a distance larger than that of the top surface second arrangement bonding pads, and are in one-to-one correspondence and connected with the top surface second arrangement bonding pads.

Preferably, the flexible circuit board further includes a third section, and the flexible circuit tape further includes:

The third arrangement bonding pads are arranged on the top surface of the third section of the flexible circuit board, and the space between the third arrangement bonding pads is equal to the space between the second arrangement bonding pads on the bottom surface;

The third arrangement bonding pads on the bottom surface are arranged on the bottom surface of the third section of the flexible circuit board, the distance between the third arrangement bonding pads on the bottom surface is larger than that between the third arrangement bonding pads on the top surface, and the third arrangement bonding pads on the top surface are in one-to-one correspondence and are connected with each other.

Preferably, the flexible circuit board further includes a fourth section, and the flexible circuit tape further includes:

The top surface fourth arrangement bonding pads are arranged on the top surface of the fourth section of the flexible circuit board, and the space is equal to the space of the bottom surface third arrangement bonding pads;

the bottom surface fourth arrangement bonding pads are arranged on the bottom surface of the fourth section of the flexible circuit board, have a distance larger than that of the top surface fourth arrangement bonding pads, and are in one-to-one correspondence and connected with the top surface fourth arrangement bonding pads.

Preferably, the first arrangement pad spacing of the top surface is 0.4mm, and the first arrangement pad spacing of the bottom surface is 0.5mm;

The space between the second arranged pads on the top surface is 0.5mm, and the space between the second arranged pads on the bottom surface is 0.65mm.

Preferably, the third-arrangement bonding pad spacing of the top surface is 0.65mm, and the third-arrangement bonding pad spacing of the bottom surface is 0.8mm.

Preferably, the pitch of the fourth array pads on the top surface is 0.8mm, and the pitch of the fourth array pads on the bottom surface is 1.0mm.

Preferably, the first top surface arrangement bonding pad and the first bottom surface arrangement bonding pad, the second top surface arrangement bonding pad and the second bottom surface arrangement bonding pad, the third top surface arrangement bonding pad and the third bottom surface arrangement bonding pad, and the fourth top surface arrangement bonding pad and the fourth bottom surface arrangement bonding pad are all connected through small-aperture through holes.

Preferably, the small-aperture via hole is a laser drilling 0.1mm aperture or a mechanical drilling 0.15mm aperture.

Preferably, the flexible circuit board has a board thickness of not more than 0.1mm.

Preferably, the package is a BGA package, an SOP package or a QFP package.

Compared with the prior art, the utility model has the beneficial effects that: the utility model provides a flexible circuit tape compatible with multiple pin space pad packages, which can be provided with one or more (2-4) package transfer modules on one circuit tape, flexibly cut according to the needs, not only can obtain a flexible circuit board with single pin space, but also can realize compatible package from 0.4mm space to 1.0mm space by superposing two or more different flexible circuit tapes, is flexible to apply, and meets the use requirements of most scenes in the current integrated circuit. The packaging compatible conversion flexible circuit tape solves the fan-out problem of a high-density small-space pin device, avoids the use of blind buried holes, and can reduce the process manufacturing difficulty and cost when the high-density pin device is used. It should be understood that the implementation of any of the embodiments of the utility model is not intended to simultaneously possess or achieve some or all of the above-described benefits.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those skilled in the art from this disclosure that the drawings described below are merely exemplary and that other embodiments may be derived from the drawings provided without undue effort.

The structures, proportions, sizes, etc. shown in the present specification are shown only for the purposes of illustration and description, and are not intended to limit the scope of the utility model, which is defined by the claims, but rather by the claims.

FIG. 1 schematically illustrates a 9x9 array 0.4mm pitch integrated circuit package;

FIG. 2 is a schematic diagram illustrating direct extraction of outermost bond pad wires at a 0.4mm pitch corresponding to the 9x9 array of FIG. 1;

FIG. 3 schematically illustrates the routing of secondary peripheral bond pads through vias corresponding to the first inner layer of FIG. 1;

FIG. 4 schematically illustrates a package-compatible converting flexible circuit strip of one embodiment of the present utility model;

FIG. 5 illustrates a compatible schematic of 0.4mm pitch to 0.5mm pitch for one embodiment of the utility model;

fig. 6 exemplarily shows a schematic diagram of a pad arrangement corresponding to fig. 5;

FIG. 7 illustrates a schematic diagram of a top-bottom pad connection perspective corresponding to FIG. 6;

FIG. 8 illustrates a compatible schematic of 0.5mm pitch to 0.65mm pitch for one embodiment of the utility model;

FIG. 9 schematically illustrates a top-bottom pad connection perspective view corresponding to FIG. 8;

FIG. 10 illustrates a single compatible flexible circuit board cut schematic diagram of one embodiment of the utility model;

FIG. 11 schematically illustrates an adhesive attachment of an embodiment of the present utility model.

Like or corresponding reference characters indicate like or corresponding parts throughout the several views.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the present utility model will be described in further detail with reference to the embodiments and the accompanying drawings. The exemplary embodiments of the present utility model and their descriptions herein are for the purpose of explaining the present utility model, but are not to be construed as limiting the utility model.

In the description of the present utility model, the terms "comprises/comprising," "consists of … …," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product, apparatus, process, or method that comprises a list of elements does not include only those elements but may, if desired, include other elements not expressly listed or inherent to such product, apparatus, process, or method. Without further limitation, an element defined by the phrases "comprising/including … …," "consisting of … …" does not exclude that an additional identical element is present in a product, apparatus, process or method comprising the element.

It is to be understood that unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be further understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "center," and the like are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate describing the present utility model and to simplify the description, and do not indicate or imply that the devices, components, or structures referred to must have a particular orientation, be constructed or operated in a particular orientation, and are not to be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance, or as implying a limitation on the number of technical features indicated, or on the order of precedence. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In integrated circuit fabrication, the pin pitch of the high-density pin device is not greater than 0.5mm, and the fan-out can only use vias with 0.1mm (laser drilling) or 0.15mm (mechanical drilling) aperture, and the thickness of the PCB cannot exceed 0.1mm and 1mm. The board thickness of the circuit board in the industrial field is often higher than 1mm and is more than 1.6mm, which causes the problem of fan-out of the via hole to be difficult to solve. If the fan-out of the via hole adopts a blind buried hole mode, namely the whole circuit board is not drilled, only a certain dielectric layer (such as via holes with the depth of 0.1mm are drilled one by using laser drilling with the depth of 0.1 mm) is drilled, the requirement of fan-out can be met, and only one-time depth control drilling can cause about 50% increase in production cost (compared with one-time through hole).

From this, three problems are known here:

(1) The high-density small-pitch device (0.4 mm,0.5mm pitch) fanned out the via requires the use of a small hole (laser drill 0.1mm aperture, mechanical drill 0.15mm aperture);

(2) The thickness of the drilled hole is relatively large, and the plate thickness is required to be relatively thin (the plate thickness of 0.1mm of the laser drill and the plate thickness of 1mm of the mechanical drill) when small holes are drilled;

(3) The thickness of the circuit board of the industrial product is not too thin (usually more than 1.6 mm), and the cost of the blind buried hole mode is extremely high.

A BGA package of a 9x9 array 0.4mm center-to-center pitch small pitch device is exemplified as described in detail below.

As shown in fig. 1, the package of an integrated circuit with a 9x9 array and a 0.4mm pitch has 9*9 =81 pads, a center-to-center spacing of the pads of 0.4mm, a circular shape with a diameter of 0.24mm, and an air gap between the pads of 0.16mm.

If the device is used directly, the device is fanned out by 0.1mm via hole, 0.1mm aperture and 0.25mm hole plate without considering plate thickness, and after fanning out, the device is as shown in fig. 2: the outermost bonding pad does not need to be perforated and can be directly led out from the lead.

Because the gap between adjacent bonding pads is only 0.16mm, the minimum 0.075mm wire cannot be led out, and only the wire led out from the inner layer can be punched out. The first inner layer can lead out the bonding pad of the secondary periphery through the via hole, as shown in fig. 3, at this time, the via hole punched by the bonding pad inside cannot lead out the lead, the bonding pad of the secondary periphery already leads out the signal wire through the via hole, and the via hole punched by the bonding pad inside cannot lead out the signal wire, because the via hole of the secondary periphery blocks the lead channel. Therefore, an integrated circuit with a 0.4mm bond pad center-to-center spacing cannot fan out the lead through the via.

The present utility model solves this problem using a flexible circuit compatible package design, described below as a 9x9 array 0.4mm center-to-center pitch small pitch device BGA package designed to be compatible with 1.0mm pitch pads, comprising:

(1) Using the top surface of the very thin flexible circuit board to make alignment pads (i.e., packages) consistent with high-density, small-pitch devices;

(2) Fanning out small-aperture (0.1 mm) vias on a flexible circuit board;

(3) BGA package with 0.5mm pad center-to-center spacing is formed on the bottom surface of the flexible circuit board;

(4) The 0.5mm BGA package was converted to a 0.65mm BGA package in the same manner;

(5) Converting the 0.65mm BGA package into a 0.8mm BGA package;

(6) The 0.8mm BGA package was then converted to a 1.0mm BGA package.

Based on this, the utility model designs a flexible circuit tape compatible with pad packages with different pin pitches, as shown in fig. 4, the flexible circuit tape comprises a flexible circuit board, the flexible circuit board can be of a strip-shaped structure, the material and the thickness are consistent with those of the flexible circuit board, and the flexible circuit board at least comprises a first section and a second section; the top bonding pads and the bottom bonding pads are respectively arranged at different positions on the top surface and the bottom surface of the flexible circuit board at intervals, and are connected in a one-to-one conduction mode through the through holes to form a plurality of packaging switching modules.

Specifically, referring to fig. 4, the first arrangement of pads on the top surface is disposed on the top surface (i.e., the first position of the top surface) of the first section of the flexible circuit board, for example, at or near one end of the flexible circuit board; the first arrangement bonding pads on the bottom surface are arranged on the bottom surface (the first position of the bottom surface) of the first section of the flexible circuit board, correspond to the first arrangement bonding pads on the top surface, have a larger distance than the first arrangement bonding pads on the top surface, and are connected with the first arrangement bonding pads on the top surface one by one. According to the utility model, the first arrangement pad spacing of the top surface is 0.4mm, and the first arrangement pad spacing of the bottom surface is 0.5mm, so that a first package transfer module is formed, and the package transfer module converts the 0.4mm pad spacing into 0.5mm, so that a compatible package with 0.5mm from 0.4mm spacing is formed.

The second arrangement pads are arranged on the top surface (namely, the second position of the top surface) of the second section of the flexible circuit board, and the second position is for example, a position, close to the first position, of the flexible circuit board and spaced a certain distance; the bottom surface second arrangement bonding pads are arranged on the bottom surface (namely the second position of the bottom surface) of the second section of the flexible circuit board, have a larger spacing than the top surface second arrangement bonding pads, and are in one-to-one correspondence and connected with the top surface second arrangement bonding pads; the first array bonding pads on the top surface and the first array bonding pads on the bottom surface have the same spacing of 0.5mm, and the second array bonding pads on the bottom surface have the spacing of 0.65mm, so that a second packaging transfer module is formed, and the packaging transfer module converts the spacing of 0.5mm bonding pads into 0.65mm, so that a compatible package with 0.65mm from the spacing of 0.5mm is formed.

Referring also to fig. 4, the flexible circuit board further includes a third section, and the third arrangement pads on the top surface are disposed on the top surface (i.e., a third position on the top surface) of the third section of the flexible circuit board, where the third position is, for example, on the flexible circuit board near the second position and spaced apart from the second position; the third arrangement bonding pads on the bottom surface are arranged at a third position on the bottom surface of the flexible circuit board, have a larger interval than the third arrangement bonding pads on the top surface, and are in one-to-one correspondence and connected with the third arrangement bonding pads on the top surface; the third arrangement bonding pads on the top surface and the second arrangement bonding pads on the bottom surface have the same spacing of 0.65mm, and the third arrangement bonding pads on the bottom surface have the spacing of 0.8mm, so that a third packaging transfer module is formed, and the packaging transfer module converts the spacing of the bonding pads of 0.65mm into the spacing of 0.8mm, so that a compatible package with the spacing of 0.65mm to the spacing of 0.8mm is formed.

With continued reference to fig. 4, the flexible circuit board further includes a fourth section, and the fourth pad on the top surface is disposed on the top surface (i.e., a fourth position on the top surface) of the fourth section of the flexible circuit board, where the fourth position is, for example, on the flexible circuit board near the third position and at a distance apart from the third position, that is, at the other end of the flexible circuit board or near the one end of the flexible circuit board; the bottom surface fourth arrangement bonding pads are arranged at a fourth position of the bottom surface of the flexible circuit board, have a distance larger than that of the top surface fourth arrangement bonding pads, and are in one-to-one correspondence and connected with the top surface fourth arrangement bonding pads. The space between the fourth arranged bonding pads on the top surface and the third arranged bonding pads on the bottom surface is 0.8mm, and the space between the fourth arranged bonding pads on the bottom surface is 1.0mm, so that a fourth packaging transfer module is formed, and the packaging transfer module converts the space between the bonding pads of 0.8mm into 1.0mm, so that a compatible package with 1.0mm from the space of 0.8mm is formed.

The flexible circuit tape compatible with the pad packages with different pin pitches has 4 package transfer modules at the same time, and can respectively convert the pad pitch of 0.4mm into 0.5mm, the pad pitch of 0.5mm into 0.65mm, the pad pitch of 0.65mm into 0.8mm and the pad pitch of 0.8mm into 1.0mm. The flexible circuit tape compatible with different pin pitch pad packages is designed as a 20x20 array (other numbers may also be 20x20 may include most of the required scenarios) of pad arrays.

In addition, the flexible circuit tape compatible with the pad packages with different pin pitches can be cut into 4 package transfer modules to obtain any one compatible flexible circuit board, more importantly, any two, three or four package transfer modules can be overlapped as required to obtain compatible flexible circuit boards with various different specifications, most of the requirements on the market are met, and the flexible and universal flexible circuit board is flexible and universal.

For compatibility from 0.4mm pitch to 0.5mm pitch, the specific solution is as follows:

S10, selecting a flexible circuit board (for convenience of subsequent description, the flexible circuit board is called a first flexible circuit board); the flexible circuit board can be made thin enough, 0.05mm, 0.1mm and the like, so that a minimum through hole of 0.1mm can be used, and the requirement of thickness-to-diameter ratio can be met.

S20, arranging bonding pads consistent with the high-density small-pitch pin devices (which are called as top surface first arranging bonding pads for convenience of subsequent explanation) are formed on the top surface of the first flexible circuit board, as shown in FIG. 5, namely, 0.4mm arranging bonding pads, and the pin pitch of the high-density small-pitch pin devices is 0.4mm.

Meanwhile, first arrangement bonding pads of the bottom surface, which are consistent with the first conversion pin devices, are made on the bottom surface of the first flexible circuit board, the pin spacing of the first arrangement bonding pads of the bottom surface is larger than that of the high-density small-spacing pin devices, as shown in fig. 5, namely, the arrangement bonding pads of 0.5mm, and the pin spacing is 0.5mm.

As shown in fig. 6, small circles in the figure respectively show the first arrangement pads on the top surface, the center distance is 0.4mm, the first arrangement pads on the bottom surface, the center distance is 0.5mm, the number and the positions of the pads are in one-to-one correspondence, and the centers are aligned.

S30, fanning out small-aperture through holes on the first flexible circuit board; for a 0.1mm flexible circuit board, a laser drilling process can be used to fan out 0.1mm aperture vias, which are not shown in fig. 5.

The above steps can be completed together when the flexible circuit board is manufactured.

S40, connecting the first arrangement bonding pads on the top surface of the first flexible circuit board and the first arrangement bonding pads on the bottom surface in a one-to-one correspondence manner through small-aperture through holes, namely connecting the 0.4mm arrangement bonding pads on the top surface and the 0.5mm arrangement bonding pads on the bottom surface in a one-to-one correspondence manner through the small-aperture through holes to form conduction.

Based on the pad array shown in fig. 6, the fan-out via hole, as shown in the perspective view of fig. 7, has a center double-circle of 0.1mm aperture through holes (i.e., via holes), the first top surface arrangement pads and the first bottom surface arrangement pads are connected in a one-to-one correspondence manner through wires, the small circles connected at two ends of the wires respectively represent the pads of the top surface and the bottom surface, wherein the left side of the center line of the pad array is the bottom surface pad, the center distance is 0.5mm, the right side of the wire is the top surface pad, the center distance is 0.4mm, the right side of the center line of the pad array is the bottom surface pad, the center distance is 0.5mm, the left side of the wire is the top surface pad, and the center distance is 0.4mm.

It should be noted that, the connection of the array pads on the top surface and the bottom surface of the first flexible circuit board in a one-to-one correspondence manner by using the small-aperture via holes is specifically as follows:

if the upper and lower corresponding bonding pads are not deviated too much and have a relatively short distance, the bonding pads on the top and bottom surfaces of the flexible circuit board can be directly connected by soldering tin at the edges of the small-aperture through holes.

If the upper and lower corresponding pads are offset more, the distance is longer, and a short wire needs to pass through the small-aperture via hole to connect the arranged pads on the top surface and the bottom surface of the flexible circuit board.

The method of the utility model can enable the integrated circuit with the spacing of 0.4mm to be compatible with the packaging type of 0.5mm, can easily enlarge the spacing of the bonding pads of the integrated circuit so as to be compatible with the packaging type with larger spacing, and solves the problem that the integrated circuit with the center distance of the bonding pads with small spacing can not lead out wires through the fan-out of the through holes.

It should be understood that the foregoing description is given by taking the example of the 0.4mm pitch integrated circuit compatible with the 0.5mm package, but the pin pitch of the small pitch pin device of the present utility model may be any one of 0.4mm, 0.5mm, 0.65mm or 0.8mm, and the pin pitch of the first conversion pin device may be any one of 0.5mm, 0.65mm, 0.8mm or 1.0mm, as long as the pin pitch of the first conversion pin device is larger than the pin pitch of the small pitch pin device. Thus, the method can be compatible in a single stage, such as from 0.4mm to 0.5mm directly, or in a override stage, such as from 0.4mm to 1.0mm directly, or can be compatible continuously, i.e. the method is compatible for a plurality of times, such as from 0.4mm to 0.5mm, 0.5mm to 0.65mm, 0.65mm to 0.8mm and finally from 0.8mm to 1.0mm, so that the method has universality and is more flexible in practical application.

For the progressive expansion of the bond pad pitch of an integrated circuit by continuing to stack different numbers of flexible circuit boards, an integrated circuit such as a 0.4mm pitch can be compatible with package types of different pitches, e.g., 0.5mm, 0.65mm, 0.8mm, 1.0mm, etc. The detailed description is continued below.

Compatibility of 0.5mm pitch to 0.65mm pitch, comprising:

S50, as shown in FIG. 8, selecting a second flexible circuit board; the second flexible circuit board is identical to the first flexible circuit board in material and thickness.

S60, respectively manufacturing a top surface second arrangement bonding pad and a bottom surface second arrangement bonding pad on the top surface and the bottom surface of the second flexible circuit board, wherein the top surface second arrangement bonding pad is consistent with the bottom surface first arrangement bonding pad, namely, the distance between the bottom surface second arrangement bonding pad and the second conversion pin device is 0.5mm, and the pin distance of the second conversion pin device is larger than that of the first conversion pin device, namely, the pin distance of the second conversion pin device is 0.65mm which is required to be compatible in the link;

S70, fanning out small-aperture through holes on a second flexible circuit board;

S80, connecting the second arrangement bonding pads on the top surface of the second flexible circuit board and the second arrangement bonding pads on the bottom surface in a one-to-one correspondence manner through small-aperture through holes;

Similarly, as shown in the perspective view of fig. 9, the center double circles are through holes (i.e., vias) with apertures of 0.1mm, the top second arrangement pads and the bottom second arrangement pads are connected in one-to-one correspondence through wires, the small circles connected at the two ends of the wires respectively represent the pads of the top and the bottom, similarly to fig. 8, the left side of the center line of the pad array is the pad of the bottom, the center distance is 0.65mm, the right side of the wire is the pad of the top, the center distance is 0.5mm, the right side of the center line of the pad array is the pad of the bottom, the center distance is 0.65mm, the left side of the wire is the pad of the top, and the center distance is 0.5mm. For bent wires, meaning that the top and bottom pads are far apart, the vias are far apart from both the top and bottom pads, and need to be connected in a broken line.

And S90, stacking and connecting the second flexible circuit board to the bottom surface of the first flexible circuit board, wherein as shown in fig. 8, the 0.5mm pad interval device is further compatible to 0.65mm interval and compatible to 0.5mm interval together with 0.4mm interval, so that the 0.4mm pad interval device is compatible to 0.65mm interval at one time, and the use requirement is met.

The same applies to the compatibility of 0.65mm pitch to 0.8mm pitch and 0.8mm pitch to 1.0mm pitch.

It will be readily appreciated that individual circuit strips may be trimmed when a 10x10 compatible array is desired. As shown in fig. 10, taking the 9x9 array cut out as 8x8 as an example, the periphery is cut out along the box marking line in the figure, so as to form the 8x8 compatible flexible circuit board.

In addition, as shown in fig. 11, the edge position can be further reinforced by adopting a dispensing mode, and the whole compatible device can be molded to form a newly packaged component.

The present utility model is described with a 9×9 pad array, and other numbers of pads are processed in a uniform manner.

It should be noted that the present utility model is described with the conversion of a small-pitch BGA package and a larger-pitch BGA package, and the method may be generalized to convert the small-pitch BGA package into other package forms such as an SOP package and a QFP package.

The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvements in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

While several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the utility model. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable subcombination.

Claims

1. A flexible circuit tape compatible with multiple pin pitch pad packages, comprising:

2. The flexible circuit tape of claim 1, wherein the flexible circuit board further comprises a third section, the flexible circuit tape further comprising:

3. The flexible circuit tape of claim 2, wherein the flexible circuit board further comprises a fourth section, the flexible circuit tape further comprising:

4. The flexible circuit tape of claim 1, wherein:

The first arrangement pad spacing of the top surface is 0.4mm, and the first arrangement pad spacing of the bottom surface is 0.5mm;

5. The flexible circuit tape of claim 2, wherein:

The third-arrangement bonding pad spacing of the top surface is 0.65mm, and the third-arrangement bonding pad spacing of the bottom surface is 0.8mm.

6. A flexible circuit tape according to claim 3, wherein:

The space between the fourth array pads on the top surface is 0.8mm, and the space between the fourth array pads on the bottom surface is 1.0mm.

7. A flexible circuit tape according to claim 3, wherein:

The first arrangement bonding pads on the top surface and the first arrangement bonding pads on the bottom surface, the second arrangement bonding pads on the top surface and the second arrangement bonding pads on the bottom surface, the third arrangement bonding pads on the top surface and the third arrangement bonding pads on the bottom surface, and the fourth arrangement bonding pads on the top surface and the fourth arrangement bonding pads on the bottom surface are all connected through small-aperture through holes.

8. The flexible circuit tape of claim 7 wherein:

The small-aperture via hole is a laser drilling 0.1mm aperture or a mechanical drilling 0.15mm aperture.

9. The flexible circuit tape of claim 1, wherein:

The flexible circuit board has a board thickness of not more than 0.1mm.

10. The flexible circuit tape according to any one of claims 1 to 9, wherein:

the package is a BGA package, an SOP package or a QFP package.