CN221078050U - Split type acceleration acquisition device - Google Patents

Abstract

The application provides a split acceleration acquisition device, which comprises: an information processing module and a plurality of signal acquisition modules; the plurality of signal acquisition modules are respectively arranged in a plurality of directions of the equipment to be monitored and are configured to respectively acquire vibration signals of the equipment to be monitored in a plurality of directions; the plurality of signal acquisition modules are connected with the information processing module through cables and are configured to transmit vibration signals acquired in all directions to the information processing module through cables; the information processing module is connected with the external equipment, and is configured to process the vibration signal transmitted by the signal acquisition module and send the processed vibration signal to the external equipment. According to the application, the information processing modules and the signal acquisition modules are arranged separately, the signal acquisition modules are arranged in multiple directions of the equipment to be tested and share one information processing module, and the signal processing modules do not need to be additionally provided with elements for signal processing, so that the detection accuracy is improved and the cost is reduced.

Description

Split type acceleration acquisition device

Technical Field

The application relates to the field of sensors, in particular to a split acceleration acquisition device.

Background

The split acceleration acquisition device can monitor vibration signals in the running process of equipment, and plays a vital role in fault diagnosis and predictive maintenance of large-scale equipment. For example, when vibration of a bearing position of the device is monitored, because of directionality of transmission of vibration of the device, vibration values (such as horizontal direction, vertical direction and axial direction) in multiple directions are generally required to be monitored, at this time, vibration sensors are required to be arranged at corresponding positions, and then collected vibration signals are transmitted to a client for a diagnosis engineer to judge the running state of the bearing of the device, so that serious potential safety hazards or production stoppage accidents are avoided.

Currently, vibration sensors are generally arranged at positions corresponding to a plurality of directions to be monitored, so as to monitor vibration values of the plurality of directions. However, this approach requires more vibration sensors and requires higher sensor costs.

Disclosure of utility model

In view of the above, an object of the embodiments of the present application is to provide a split acceleration acquisition device, which can reduce the cost of a sensor.

In a first aspect, an embodiment of the present application provides a split acceleration acquisition device, including: an information processing module and a plurality of signal acquisition modules; the signal acquisition modules are respectively arranged in multiple directions of the equipment to be monitored and are configured to respectively acquire vibration signals of the equipment to be monitored in multiple directions; the plurality of signal acquisition modules are connected with the information processing module through cables and are configured to transmit vibration signals acquired in all directions to the information processing module through the cables; the information processing module is connected with external equipment and is configured to process the vibration signals transmitted by the signal acquisition module and send the processed vibration signals to the external equipment.

In the implementation process, the information processing module and the signal acquisition modules are separately arranged, the signal acquisition modules can be arranged in multiple directions of the equipment to be tested and used for acquiring vibration signals of the equipment to be tested in all directions, each signal acquisition module is connected with the information processing module, the signal acquisition modules share one information processing module, each single signal processing module does not need to be additionally provided with an element for signal processing, and the cost of the split acceleration acquisition device is reduced while the detection accuracy of the split acceleration acquisition device is improved.

In one embodiment, the signal acquisition module includes: the first shell and the first acquisition chip; the first acquisition chip is arranged inside the first shell, and the first shell is of a sealing structure; one end of the cable, which is connected with the signal acquisition module, penetrates through the first shell and is connected with the first acquisition chip.

In the implementation process, through setting up first collection chip and first casing in signal acquisition module, wherein, this first collection chip is used for acquireing to wait to monitor equipment signal, and first casing is used for keeping apart first collection chip and external environment, avoids external environment and external machinery to cause the damage to first collection chip, when realizing signal acquisition, increases signal acquisition module's life. In addition, as only the first shell and the first acquisition chip are needed to be arranged in the signal acquisition module, the structures such as the signal processing chip and the communication unit are not needed to be additionally arranged, the structure of the signal acquisition module is simplified, and the cost of the signal acquisition module is reduced.

In one embodiment, the first acquisition chip is a MEMS acceleration chip, or the first acquisition chip is a piezoelectric acceleration sub-module, or the first acquisition chip is a combination of the MEMS acceleration chip and the piezoelectric acceleration sub-module.

In one embodiment, the signal acquisition module further comprises: a first magnetic core; the first magnetic core is fixedly arranged on the outer wall of the first shell; the signal acquisition module is configured to be connected with the equipment to be monitored through the first magnetic core.

In the implementation process, the first magnetic core is arranged on the signal acquisition module so as to be connected with the equipment to be monitored through the first magnetic core. Because the first magnetic core is connected with the equipment to be monitored through magnetic force, the signal acquisition module can be installed on the equipment to be monitored or detached from the equipment to be monitored at any time according to actual conditions, and the flexibility of installing and detaching the signal acquisition module is improved.

In one embodiment, the number of the signal acquisition modules is two, and the split acceleration acquisition device is configured to acquire vibration signals in two directions or three directions of the equipment to be monitored; or the signal acquisition module is one, and the split acceleration acquisition device is configured to acquire vibration signals in one direction or two directions of the equipment to be monitored.

In one embodiment, the information processing module includes: a second housing and a main board; the main board is arranged inside the second shell, and the second shell is of a sealing structure; and one end of the cable, which is connected with the information processing module, penetrates through the second shell and is connected with the main board.

In the implementation process, the main board and the second shell are arranged in the information processing module, wherein the main board is used for receiving and processing the vibration signals sent by the signal acquisition module, the second shell is used for isolating the main board from the external environment, damage to the main board caused by the external environment and external machinery is avoided, and the service life of the information processing module is prolonged while the signal processing is carried out. In addition, all be connected with the mainboard in the information processing module through the cable in each signal acquisition module to the vibration signal transmission that gathers first collection chip to the mainboard, a plurality of signal acquisition modules share a mainboard and carry out information processing, can reduce the setting quantity of mainboard, and then reduce split type acceleration collection device's cost.

In one embodiment, the information processing module further includes: a communication unit; the communication unit is arranged inside the second shell; the main board is connected with the communication unit and is configured to transmit the processed vibration signal to the external device through the communication unit.

In the implementation process, since the main board is connected with each signal acquisition module, the main board can acquire the vibration signals acquired by each signal acquisition module, the communication unit is arranged in the information processing module and is connected with the main board, the main board can process the vibration signals acquired by the plurality of signal processing modules and then send the processed vibration signals to external equipment through the communication unit, and the whole split type acceleration acquisition device only needs to be correspondingly provided with one communication unit in the information processing module, so that the number of the communication units arranged by the split type acceleration acquisition device can be reduced, and the cost of the split type acceleration acquisition device is reduced.

In one embodiment, the communication unit is wirelessly connected with the external device.

In one embodiment, the information processing module further includes: an energy storage unit; the energy storage unit is arranged inside the second shell; the energy storage unit is connected with the main board and the communication unit and is configured to supply power to the main board and the communication unit; the energy storage unit is connected with the plurality of signal acquisition modules through the cable and is configured to supply power to the plurality of signal acquisition templates through the cable.

In the implementation process, the energy storage unit is connected with the main board, the communication unit, the signal acquisition module and the like, and then the energy storage unit can supply power to the signal acquisition module and the information processing module, so that the whole split type acceleration acquisition device only needs to be provided with one energy storage unit, the set quantity of the energy storage unit can be reduced, and the cost of the split type acceleration acquisition device is reduced. In addition, because the energy storage unit can store the electric quantity of certain capacity in advance, the split wireless multi-axis sensor can be used without connecting a power line during operation, so that wireless monitoring of vibration signals is realized, and the use convenience of the split wireless multi-axis sensor is improved.

In one embodiment, the energy storage unit is a battery.

In one embodiment, the information processing module further includes: a second acquisition chip; the second acquisition chip is arranged inside the second shell; the second acquisition chip is connected with the main board.

In the implementation process, the second acquisition chip is arranged in the information processing module and can be used for acquiring the vibration signal of the equipment to be monitored. When the equipment to be monitored is detected, vibration signals in the direction of the information processing module can be acquired through the information processing module, the number of the signal acquisition modules in the split type acceleration acquisition device is reduced, and the cost of the split type acceleration acquisition device is further reduced.

In one embodiment, the signal acquisition module comprises a first signal acquisition module and a second signal acquisition module; the first signal acquisition module is arranged in a first direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the first direction; the second signal acquisition module is arranged in a second direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the second direction; the information processing module is arranged in a third direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the third direction; the first direction, the second direction and the third direction are perpendicular to each other.

In the implementation process, the first signal acquisition module, the second signal acquisition module and the information processing module are respectively arranged in the first direction, the second direction and the third direction of the equipment to be monitored, and the first direction, the second direction and the third direction are perpendicular to each other, so that the vibration signals of the equipment to be monitored in all basic directions can be acquired, the comprehensive acquisition of the vibration signals of the equipment to be monitored is realized, and the accuracy of the acquisition of the vibration signals of the equipment to be monitored is improved.

In one embodiment, the information processing module further includes: a second magnetic core; the second magnetic core is fixedly arranged on the outer wall of the second shell; the information processing module is configured to be connected with the equipment to be monitored through the second magnetic core.

In the implementation process, the second magnetic core is arranged on the information processing module so as to be connected with the equipment to be monitored through the second magnetic core. Because the second magnetic core is connected with the equipment to be monitored through magnetic force, the information processing module can be installed on the equipment to be monitored or detached from the equipment to be monitored at any time according to actual conditions, and the flexibility of installing and detaching the signal acquisition module is improved.

In one embodiment, the split acceleration acquisition device further comprises: a first connector and a second connector; the first connector is fixedly connected with the signal acquisition module; one end of the cable connected with the signal acquisition module is configured to be connected with the signal acquisition module through the first connector; the second connector is fixedly connected with the information processing module; one end of the cable connected with the information processing module is configured to be connected with the information processing module through the second connector.

In the implementation process, the stability and the reliability of the cable connection are improved by arranging the first connector and the second connector and respectively fixing the two ends of the cable on the first connector and the second connector. In addition, because the first connector and the second connector are of pluggable plug and socket structures, when the cable connection and disconnection treatment is carried out, the difficulty of cable connection can be reduced by plugging the first connector and/or the second connector, the flexibility of the split type acceleration acquisition device for being connected with the information acquisition module of the information processing module is improved, and the application scene of the split type acceleration acquisition device is increased.

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a split acceleration acquisition device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a signal acquisition module according to an embodiment of the present application;

FIG. 3 is a block diagram of an information processing module according to an embodiment of the present application;

Fig. 4 is an installation schematic diagram of a split acceleration acquisition device according to an embodiment of the present application.

Description of the drawings: 100-signal acquisition module, 110-first casing, 120-first collection chip, 130-first magnetic core, 200-information processing module, 210-second casing, 220-mainboard, 230-communication unit, 240-energy storage unit, 250-second collection chip, 260-second magnetic core, 300-first connector, 400-second connector, 20-cable.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.

In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or directions or positional relationships conventionally visited when applying for a product, are merely for convenience in describing the present application and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present application.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, or may be internal communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

It should be noted that the features of the embodiments of the present application may be combined with each other without conflict.

Compared with the traditional wired sensor, the wireless sensor has the advantages of no wiring, low cost and the like, and the wireless sensor is generally composed of a signal acquisition module and a signal processing module. The signal acquisition module generally comprises one or more sensitive elements, one sensitive element can sense a vibration signal in one direction, and the corresponding sensor is a wireless single-axis sensor; the plurality of sensitive elements can sense vibration signals in a plurality of directions, and the corresponding sensors are wireless split type acceleration acquisition devices. The signal acquisition module is mainly used for converting vibration signals into electric signals and outputting the electric signals to the signal processing module. The signal processing module comprises a main board, a radio frequency board, a battery and the like, can supply power to the signal acquisition module, processes and transmits an electric signal output by the signal acquisition module to the client, and can also receive a corresponding instruction of the client.

Currently, the installation arrangement of the wireless sensor on the device may have the following schemes:

In the first scheme, three wireless single-shaft vibration sensors are respectively arranged at the horizontal position, the vertical position and the axial position to monitor vibration signals in three directions.

And in the second scheme, a wireless triaxial sensor is arranged at any position of the equipment bearing seat. For example, mounted in a horizontal position, one axis of the sensor monitors vibration signals in the horizontal direction, one axis monitors vibration signals in the vertical direction, and the other axis monitors vibration signals in the axial direction.

However, the inventor of the present application has found through long-term research that, for the first scheme, three positions are respectively used for testing vibration signals in three directions, and although the measured result is relatively accurate, the scheme needs three sets of signal processing communication modules, and the cost is relatively high. For the scheme II, the triaxial sensor can only be selectively installed at one position to monitor vibration in three directions, but vibration signals of equipment are usually related to the position, and the vibration signals in the same direction at different positions have the same change trend, but the amplitude of the signals sometimes have larger difference, and the accuracy of the monitored vibration signals is lower.

In view of this, the present application provides a split acceleration acquisition device, in which an information processing module and a signal acquisition module are separately disposed, and a plurality of signal acquisition modules may be disposed in a plurality of directions of a device to be tested, so as to obtain vibration signals of the device to be tested in all directions, and each signal acquisition module is connected with the information processing module, so that the plurality of signal acquisition modules may share one information processing module, and each single signal processing module does not need to be additionally provided with an element for signal processing. The cost of the split type acceleration acquisition device is reduced while the detection accuracy of the split type acceleration acquisition device is improved.

As shown in fig. 1, the split acceleration acquisition device provided by the embodiment of the application includes: an information processing module 200 and a plurality of signal acquisition modules 100.

The signal acquisition modules 100 are respectively arranged in multiple directions of the equipment to be monitored, the signal acquisition modules 100 are connected with the information processing module 200 through the cable 20, and the information processing module 200 is connected with external equipment.

The signal acquisition module 100 is configured to acquire vibration signals of the device to be monitored, and the plurality of signal acquisition modules 100 are configured to acquire vibration signals in a plurality of directions of the device to be monitored. Each signal acquisition module 100 is configured to acquire a vibration signal in a direction in which the signal acquisition module 100 is located.

It should be appreciated that an acceleration chip may be included in the signal acquisition module 100, and the signal acquisition module 100 may be used to acquire vibration signals of the device to be monitored.

In some embodiments, the signal acquisition module 100 is further configured to transmit the vibration signals acquired in various directions to the information processing module 200 through the cable 20. Only elements for signal acquisition may be provided in the signal acquisition module 100. Such as a MEMS acceleration chip or a piezoelectric acceleration electronics module.

Specifically, the signal acquisition module 100 may be configured to convert the acquired vibration information into an electrical signal, and output the converted electrical signal to the signal processing module.

The above-described information processing module 200 is configured to process the vibration signal transmitted from the signal acquisition module 100 and transmit the processed vibration signal to an external device.

The information processing module 200 may have a main board 220, a communication unit 230, a power supply, and other components. The main board 220 is used for signal processing, the communication unit 230 is used for communication with internal and/or external components, and the power supply is used for providing power for the information processing module 200 and/or the signal acquisition component.

The main board 220 may be used to process the vibration signal transmitted from the signal acquisition module 100, and transmit the processed signal to an external component, and may also receive an instruction from the external component. Alternatively, the signal processing module may be a single chip microcomputer, a programmable controller, or the like. The specific type of the signal processing module can be selected according to actual conditions.

As can be appreciated, the elements for signal acquisition in the signal acquisition module 100 are connected to the information processing module 200 through the cable 20, and transmit the acquired vibration signal to the information processing module 200 through the cable 20, and the information processing module 200 processes the vibration signal correspondingly after acquiring the vibration signal sent by the signal acquisition module 100.

In addition, the information processing module 200 may transmit the processed vibration signal to an external device through the communication unit 230 after processing the corresponding signal.

The external device may be an upper computer. Such as a cell phone, computer, terminal controller, etc. The external device can be adjusted according to the actual situation.

Of course, the signal processing module may also be connected to a power supply in the information processing module 200 through the cable 20 to obtain a power supply required for operation.

It should be understood that the split acceleration acquisition device in the embodiment of the present application may be used to acquire a vibration value of a device to be monitored.

In some embodiments, the cable 20 may be a teflon signal cable, PVC, PUR, or the like. The cable 20 may be a split-two cable, a split-three cable, or the like. The specific type and configuration of the cable 20 may be selected according to the actual circumstances.

It should be appreciated that the cable 20 may also be shielded by a metal sheath.

In one possible implementation manner, the number of the signal acquisition modules 100 in the split acceleration acquisition device is two, and the split acceleration acquisition device is configured to acquire vibration signals in two directions or three directions of the equipment to be monitored;

Or, the signal acquisition module 100 in the split acceleration acquisition device is one, and the split acceleration acquisition device is configured to acquire vibration signals in one direction or two directions of the equipment to be monitored.

In the above implementation process, by separately setting the information processing module 200 and the signal acquisition modules 100, the plurality of signal acquisition modules 100 may be set in a plurality of directions of the device to be tested, for obtaining vibration signals of the device to be tested in all directions, and each signal acquisition module 100 is connected with the information processing module 200, where the plurality of signal acquisition modules 100 share one information processing module 200, and each individual signal processing module does not need to be additionally provided with an element for signal processing. The cost of the split type acceleration acquisition device is reduced while the detection accuracy of the split type acceleration acquisition device is improved.

In one possible implementation, as shown in fig. 2, the signal acquisition module 100 includes: a first housing 110 and a first acquisition chip 120.

The first collecting chip 120 is disposed inside the first housing 110, and one end of the cable 20 connected to the signal collecting module 100 passes through the first housing 110 to be connected to the first collecting chip 120.

The first housing 110 is provided here as a sealing structure. The first housing 110 may be an integral structure or a split structure, and the structure of the first housing 110 may be selected according to practical situations, which is not particularly limited in the present application.

In an embodiment, if the first housing 110 is a split structure, the first housing 110 may include a first top cover, a first base, and a first housing 110 body, where the first top cover and the first base are fixedly connected with the first housing 110 body. For example, a connection method such as bolting, bonding, welding, or the like. The connection mode between the first top cover and the first housing 110 body and the connection mode between the first base and the first housing 110 body may be the same or different, and the connection mode between the first top cover and the first housing 110 body and the connection mode between the first base and the first housing 110 body may be selected according to practical situations.

It should be understood that, when the first housing 110 is of a split type structure, the end of the cable 20 connected to the signal acquisition module 100 is connected to the first acquisition chip 120 through the housing body.

The first acquisition chip 120 is a chip for acquiring a vibration signal. For example, the MEMS acceleration chip, the piezoelectric acceleration sub-module, etc., the first acquisition chip 120 may be selected according to practical situations.

In one possible implementation, the first acquisition chip 120 is a MEMS acceleration chip, or the first acquisition chip 120 is a piezoelectric acceleration sub-module, or the first acquisition chip 120 is a combination of a MEMS acceleration chip and a piezoelectric acceleration sub-module.

In the above implementation process, through setting up first collection chip 120 and first casing 110 in signal acquisition module 100, wherein, this first collection chip 120 is used for obtaining the vibration signal of waiting the monitoring equipment, and first casing 110 is used for keeping apart first collection chip 120 and external environment, avoids external environment and external machinery to cause the damage to first collection chip 120, when realizing vibration signal acquisition, increases signal acquisition module 100's life. In addition, since the signal acquisition module 100 only needs to be provided with the first housing 110 and the first acquisition chip 120, and no additional structures such as a signal processing chip and the communication unit 230 are needed, the structure of the signal acquisition module 100 is simplified, and the cost of the signal acquisition module 100 is reduced. In one possible implementation, the signal acquisition module 100 further includes: a first magnetic core 130.

Wherein the first magnetic core 130 is fixedly disposed on an outer wall of the first housing 110. The first magnetic core 130 may be connected to the first housing 110 by means of bolting, welding, bonding, integral arrangement, etc., and the connection mode of the first magnetic core 130 and the first housing 110 may be selected according to practical situations.

The signal acquisition module 100 is here configured to be connected to the device to be monitored via a first magnetic core 130.

It should be understood that if the device to be monitored is a metal device, the signal acquisition module 100 may be installed on the device to be monitored by using the magnetism of the first magnetic core 130 and the magnetic attraction manner of the device to be monitored.

In one embodiment, after the signal acquisition module 100 is magnetically connected to the device to be monitored through the first magnetic core 130, the signal acquisition module may be further connected by adhesion, bolting, or the like.

In another embodiment, the signal acquisition module 100 and the device to be monitored may be directly connected by adhesion, bolting, or the like. The connection mode between the signal acquisition module 100 and the equipment to be monitored can be adjusted according to actual conditions.

In the above implementation process, the first magnetic core 130 is disposed on the signal acquisition module 100 to connect with the device to be monitored through the first magnetic core 130. Because the first magnetic core 130 is connected with the equipment to be monitored through magnetic force, the signal acquisition module 100 can be installed on the equipment to be monitored or detached from the equipment to be monitored at any time according to actual conditions, and the flexibility of installing and detaching the signal acquisition module 100 is improved.

In one possible implementation, as shown in fig. 3, the information processing module 200 includes: a second housing 210 and a main board 220.

Wherein the main board 220 is disposed inside the second housing 210, and an end of the cable 20 connected to the information processing module 200 passes through the second housing 210 to be connected to the main board 220.

The second housing 210 is provided in a sealing structure. The second housing 210 may be an integral structure or a split structure, and the structure of the second housing 210 may be selected according to practical situations, which is not particularly limited in the present application.

In an embodiment, if the second housing 210 is a split structure, the first housing 110 may include a second top cover, a second base, and a second housing 210 body, where the second top cover and the second base are fixedly connected with the second housing 210 body. For example, a connection method such as bolting, bonding, welding, or the like. The connection mode between the second top cover and the second housing 210 body and the connection mode between the second base and the second housing 210 body may be the same or different, and the connection mode between the second top cover and the second housing 210 body and the connection mode between the second base and the second housing 210 body may be selected according to practical situations.

It should be understood that, when the second housing 210 is of a split type structure, the end of the cable 20 connected to the signal acquisition module 100 is connected to the first acquisition chip 120 through the housing body.

The motherboard 220 may be an integrated circuit chip with signal processing capability. The motherboard 220 may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP for short), etc.; but may also be a digital signal processor (DIGITAL SIGNAL processor, DSP for short), application SPECIFIC INTEGRATED Circuit (ASIC for short), field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components. The vibration signal acquired by the signal acquisition module 100 may be processed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

It should be understood that the first acquisition chip 120 in each signal acquisition module 100 is connected to the main board 220 in the information processing module 200 through the cable 20 to transmit the vibration signal acquired by the first acquisition chip 120 to the main board 220. That is, the plurality of signal acquisition modules 100 share one main board 220 for information processing.

In the above implementation process, by setting the main board 220 and the second housing 210 in the information processing module 200, where the main board 220 is used to receive and process the vibration signal sent by the signal acquisition module 100, the second housing 210 is used to isolate the main board 220 from the external environment, so as to avoid damage to the main board 220 caused by the external environment and the external machine, and increase the service life of the information processing module 200 while performing signal processing. In addition, each signal acquisition module 100 is connected with the main board 220 in the information processing module 200 through the cable 20, so that the vibration signals acquired by the first acquisition chip 120 are transmitted to the main board 220, and the plurality of signal acquisition modules 100 share one main board 220 for information processing, so that the number of the main boards 220 can be reduced, and the cost of the split acceleration acquisition device is further reduced.

In one possible implementation, the information processing module 200 further includes: a communication unit 230.

The communication unit 230 is disposed inside the second housing 210, and the motherboard 220 is connected to the communication unit 230.

The communication unit 230 is configured to transmit the processed vibration signal to an external device through the communication unit 230. The communication unit 230 may be a radio frequency board, a bluetooth sub-module, a WiFi sub-module, a ZigBee wireless communication module, TPUNB modules, and the like. The specific structure and arrangement of the communication unit 230 may be selected according to practical situations.

It should be understood that the communication unit 230 may establish a communication connection between the main board 220 and an external device to transmit the vibration signal processed by the main board 220 to the external device.

In one possible implementation, the communication unit 230 is wirelessly connected with an external device. Such as a WiFi connection, a bluetooth connection, etc.

In some embodiments, each signal acquisition module 100 may also be connected to the communication unit 230 by a cable 20. The communication unit 230 is configured to transmit the vibration signal transmitted from the signal acquisition module 100 to an external processor, so as to process the vibration signal acquired by the signal acquisition module 100 through the external processor.

It will be appreciated that when the communication unit 230 is disposed in the information processing module 200, the second top cover of the information processing module 200 may be made of a non-metallic material to reduce the influence of the second top cover on the signal emission of the communication unit 230. For example, the second top cover may be plastic, rubber, glass, or the like. The material of this second top cap can be according to actual conditions selection. In the above implementation process, since the main board 220 is connected with each signal acquisition module 100, the main board 220 can acquire the vibration signals acquired by each signal acquisition module 100, and the communication unit 230 is arranged in the information processing module 200, and the communication unit 230 is connected with the main board 220, the main board 220 can process the signals acquired by the plurality of signal processing modules and send the processed signals to the external device through the communication unit 230, and only one communication unit 230 is required to be correspondingly arranged in the information processing module 200 in the whole split acceleration acquisition device, so that the number of the communication units 230 arranged in the split acceleration acquisition device can be reduced, and the cost of the split acceleration acquisition device is reduced.

In one possible implementation, the information processing module 200 further includes: and an energy storage unit 240.

The energy storage unit 240 is disposed inside the second housing 210, the energy storage unit 240 connects the motherboard 220 and the communication unit 230, and the energy storage unit 240 is connected to the plurality of signal acquisition modules 100 through the cable 20.

The energy storage unit 240 is configured to supply power to the main board 220 and the communication unit 230, and is configured to supply power to the plurality of signal acquisition templates through the cable 20.

In one possible implementation, the energy storage unit 240 is a battery.

Alternatively, the energy storage unit 240 may be a chargeable power source and a non-chargeable power source. Such as a dry cell, a secondary battery, etc., the specific type of the energy storage unit 240 may be selected according to actual conditions.

In the above implementation process, the energy storage unit 240 is connected with the main board 220, the communication unit 230, the signal acquisition module 100 and the like, so that power can be supplied to the signal acquisition module 100 and the information processing module 200 through the energy storage unit 240, and the whole split acceleration acquisition device only needs to be provided with one energy storage unit 240, so that the number of the energy storage units 240 can be reduced, and the cost of the split acceleration acquisition device is reduced. In addition, because the energy storage unit can store the electric quantity of certain capacity in advance, the split wireless multi-axis sensor can be used without connecting a power line during operation, so that wireless monitoring of vibration signals is realized, and the use convenience of the split wireless multi-axis sensor is improved.

In one possible implementation, the information processing module 200 further includes: and a second acquisition chip 250.

The second collecting chip 250 is disposed inside the second housing 210, and the second collecting chip 250 is connected to the motherboard 220. The second collection chip 250 is fixedly disposed inside the second housing 210. For example, the second acquisition chip 250 is fixedly disposed inside the second housing 210 by welding, riveting, clamping, or the like.

The second acquisition chip 250 here is a chip for acquiring a vibration signal. For example, PT100, MEMS acceleration chip, piezoelectric acceleration sub-module, etc., the second acquisition chip 250 may be selected according to the actual situation.

It should be appreciated that the second acquisition chip 250 is typically the same type of chip as the first acquisition chip 120. Of course, in some special cases, the second acquisition chip 250 may also be a different type of chip from the first acquisition chip 120.

It is understood that by providing the second acquisition chip 250 in the information processing module 200, the information processing module 200 can also acquire a vibration signal of the installation direction of the information processing module 200.

For example, if the split acceleration acquisition device is a dual-axis sensor, the dual-axis sensor may include a signal acquisition module 100 and an information processing module 200. The dual-axis sensor is used for acquiring vibration signals of equipment to be monitored in the length direction and the width direction. The signal acquisition module 100 may be installed in the length direction of the device to be monitored and the information processing module 200 may be installed in the width direction of the device to be monitored when the dual-axis sensor is installed. Further, the signal acquisition module 100 can acquire a vibration signal of the device to be monitored in the length direction, and the information processing module 200 can acquire a vibration signal of the device to be monitored in the width direction.

If the split acceleration acquisition device is a three-axis sensor, the three-axis sensor may include two signal acquisition modules 100 and one information processing module 200. The triaxial sensor is used for acquiring vibration signals of equipment to be monitored in the length direction, the width direction and the height direction. Then, when the triaxial sensor is installed, one signal acquisition module 100 may be installed in the length direction of the device to be monitored, the other signal acquisition module 100 may be installed in the width direction of the device to be monitored, and the information processing module 200 may be installed in the height direction of the device to be monitored. Further, vibration signals of the device to be monitored in the length direction and the width direction can be obtained through the signal acquisition module 100, and vibration signals of the device to be monitored in the height direction can be obtained through the information processing module 200.

In one embodiment, the second acquisition chip 250 may not be disposed in the information processing module 200. When the second acquisition chip 250 is not disposed in the information processing module 200, the information processing module 200 may be disposed on the device to be monitored or may not be disposed on the device to be monitored.

It should be understood that the structure and the installation manner of the split type acceleration acquisition device are only exemplary, and the structure and the installation manner of the split type acceleration acquisition device can be adjusted according to practical situations.

In the above implementation, by providing the second acquisition chip 250 in the information processing module 200, the second acquisition chip 250 may be used to acquire the vibration signal of the device to be monitored. When the equipment to be monitored is detected, vibration signals in the direction of the information processing module 200 can be collected through the information processing module 200, so that the number of the signal collecting modules 100 in the split type acceleration collecting device is reduced, and the cost of the split type acceleration collecting device is further reduced.

In one possible implementation, the split acceleration acquisition device is used to acquire a vibration value of the device to be monitored. The signal acquisition module 100 includes a first signal acquisition module and a second signal acquisition module.

The first signal acquisition module is arranged in a first direction of the equipment to be monitored, the second signal acquisition module is arranged in a second direction of the equipment to be monitored, and the information processing module 200 is arranged in a third direction of the equipment to be monitored. The first signal acquisition module is configured to acquire a vibration value of the device to be monitored in a first direction, the second signal acquisition module is configured to acquire a vibration value of the device to be monitored in a second direction, and the information processing module 200 is configured to acquire a vibration value of the device to be monitored in a third direction.

The first direction, the second direction and the third direction are perpendicular to each other.

It can be understood that if the device to be monitored is a stereoscopic device, the first direction, the second direction and the third direction may be the length direction, the width direction and the height direction of the device to be monitored, respectively.

Of course, the coordinate system of the device to be monitored may also be established, where the first direction is the direction of the X axis in the coordinate system of the device to be monitored, the second direction is the direction of the Y axis in the coordinate system of the device to be monitored, and the third direction is the direction of the Z axis in the coordinate system of the device to be monitored.

Optionally, the first direction, the second direction and the third direction may also be some deflection directions on the device to be monitored. For example, the first direction is a direction in which the coordinate system X-axis direction of the device to be monitored is offset by 30 °, the second direction is a direction in which the coordinate system Y-axis direction of the device to be monitored is offset by 30 °, the third direction is a direction in which the coordinate system Z-axis direction of the device to be monitored is offset by 30 °, and so on. The first direction, the second direction and the third direction can be adjusted according to actual detection requirements.

It should be appreciated that the first signal acquisition module, the second signal acquisition module, and the information processing module 200 may be installed on the same plane in order to reduce the difference in signals acquired by the information acquisition device.

Illustratively, as depicted in FIG. 4, the first signal acquisition module is disposed at location A, the second signal acquisition module is disposed at location B, and the information processing module 200 is disposed at location module C in FIG. 4. Wherein, between position A and position B is 90. The first signal acquisition module is used for acquiring signals of the equipment to be monitored in the Z-axis direction, the second signal acquisition module is used for acquiring vibration signals of the equipment to be monitored in the X-axis direction, and the information processing module 200 is used for acquiring vibration signals of the equipment to be monitored in the Y-axis direction.

In another embodiment, the signal acquisition module 100 includes a first signal acquisition module, a second signal acquisition module, and a third signal acquisition module.

The first signal acquisition module is arranged in a first direction of equipment to be monitored, the second signal acquisition module is arranged in a second direction of the equipment to be monitored, and the third signal acquisition module is arranged in a third direction of the equipment to be monitored. The first signal acquisition module is configured to acquire a vibration value of the equipment to be monitored in a first direction, the second signal acquisition module is configured to acquire a vibration value of the equipment to be monitored in a second direction, and the third signal acquisition module is configured to acquire a vibration value of the equipment to be monitored in a third direction.

The information processing module 200 may or may not be disposed on the device to be monitored. If the information processing module 200 is disposed on the device to be monitored, the information processing module 200 may be disposed at any position of the device to be monitored.

In the implementation process, the first signal acquisition module, the second signal acquisition module and the information processing module 200 are respectively arranged in the first direction, the second direction and the third direction of the equipment to be monitored, and the first direction, the second direction and the third direction are perpendicular to each other, so that vibration signals of the equipment to be monitored in all basic directions can be acquired, comprehensive acquisition of signals of the equipment to be monitored is realized, and accuracy of acquiring the signals of the equipment to be monitored is improved.

In one possible implementation, the information processing module 200 further includes: a second magnetic core 260.

Wherein the second magnetic core 260 is fixedly disposed on the outer wall of the second housing 210. The second magnetic core 260 may be connected to the second housing 210 by bolting, welding, bonding, integrally arranging, etc., and the connection mode of the second magnetic core 260 and the second housing 210 may be selected according to practical situations.

The information processing module 200 is here configured to be connected to the device to be monitored via a second magnetic core 260.

It should be understood that if the device to be monitored is a metal device, the information processing module 200 may be installed on the device to be monitored by using the magnetism of the second magnetic core 260 and the magnetic attraction manner of the device to be monitored.

In one embodiment, after the information processing module 200 is magnetically connected to the device to be monitored through the second magnetic core 260, the device to be monitored may be further connected by adhesion, bolting, or the like. The connection mode between the information processing module 200 and the device to be monitored can be adjusted according to actual situations.

In the above implementation, the second magnetic core 260 is disposed on the information processing module 200 to connect with the device to be monitored through the second magnetic core 260. Since the second magnetic core 260 is connected with the device to be monitored through magnetic force, the information processing module 200 can be mounted on or dismounted from the device to be monitored at any time according to actual conditions, and flexibility of mounting and dismounting the signal acquisition module 100 is improved.

In one possible implementation manner, the split acceleration acquisition device further includes: a first connector 300 and a second connector 400.

The first connector 300 is fixedly connected with the signal acquisition module 100, one end of the cable 20 connected with the signal acquisition module 100 is configured to be connected with the signal acquisition module 100 through the first connector 300, the second connector 400 is fixedly connected with the information processing module 200, and one end of the cable 20 connected with the information processing module 200 is configured to be connected with the information processing module 200 through the second connector 400.

The first connector 300 and the second connector 400 herein may include a plug and a socket. The receptacle of the first connector 300 is disposed on the signal acquisition module 100, and the receptacle of the second connector 400 is disposed on the information processing module 200.

One end of the cable 20 connected to the signal acquisition module 100 is fixed to the plug of the first connector 300 by welding, and one end of the cable 20 connected to the information processing module 200 is fixed to the plug of the second connector 400 by welding.

It should be understood that when the cable 20 is connected, the connection between the cable 20 and the signal processing module and the information processing module 200 can be completed by connecting the plug of the first connector 300 with the socket of the first connector 300 and connecting the plug of the second connector 400 with the socket of the second connector 400.

When a certain signal acquisition module 100 needs to be disconnected from the information processing module 200, the plug of the first connector 300 may be directly disconnected from the socket of the first connector 300. The flexibility of connection and disconnection of the cable 20 with the signal acquisition module 100 and the information processing module 200 can be realized through the first connector 300 and the second connector 400, and then the same split type acceleration acquisition device can be used for signal detection of multi-directional scenes of equipment to be monitored.

For example, the triaxial sensor may collect vibration signals of the device to be monitored in two directions, may collect vibration signals of the device to be monitored in three directions, and may collect vibration signals of the device to be monitored in one direction. Only the plug and socket of the first connector 300 need be connected or disconnected by plugging.

In the above implementation process, by providing the first connector 300 and the second connector 400 and fixing the two ends of the cable 20 to the first connector 300 and the second connector 400, respectively, the stability and reliability of the connection of the cable 20 are improved. In addition, since the first connector 300 and the second connector 400 are in pluggable plug and socket structures, when the cable 20 is connected and disconnected, the difficulty in connection of the cable 20 can be reduced by plugging the first connector 300 and/or the second connector 400, the flexibility of the split type acceleration acquisition device in accessing the information acquisition module of the information processing module 200 can be improved, and the application scene of the split type acceleration acquisition device can be increased.

The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily appreciate variations or alternatives within the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (14)

1. A split acceleration acquisition device, comprising: an information processing module and a plurality of signal acquisition modules;

The signal acquisition modules are respectively arranged in multiple directions of the equipment to be monitored and are configured to respectively acquire vibration signals of the equipment to be monitored in multiple directions;

The plurality of signal acquisition modules are connected with the information processing module through cables and are configured to transmit vibration signals acquired in all directions to the information processing module through the cables;

The information processing module is connected with external equipment and is configured to process the vibration signals transmitted by the signal acquisition module and send the processed vibration signals to the external equipment.

2. The split acceleration acquisition apparatus of claim 1, wherein the signal acquisition module comprises: the first shell and the first acquisition chip;

The first acquisition chip is arranged inside the first shell, and the first shell is of a sealing structure;

One end of the cable, which is connected with the signal acquisition module, penetrates through the first shell and is connected with the first acquisition chip.

3. The split acceleration acquisition device of claim 2, wherein the first acquisition chip is a MEMS acceleration chip, or the first acquisition chip is a piezoelectric acceleration sub-module, or the first acquisition chip is a combination of the MEMS acceleration chip and the piezoelectric acceleration sub-module.

4. The split acceleration acquisition apparatus of claim 2, wherein the signal acquisition module further comprises: a first magnetic core;

the first magnetic core is fixedly arranged on the outer wall of the first shell;

the signal acquisition module is configured to be connected with the equipment to be monitored through the first magnetic core.

5. The split acceleration acquisition device of claim 1, wherein the number of signal acquisition modules is two, and the split acceleration acquisition device is configured to acquire vibration signals in two directions or three directions of the equipment to be monitored;

Or the signal acquisition module is one, and the split acceleration acquisition device is configured to acquire vibration signals in one direction or two directions of the equipment to be monitored.

6. The split acceleration acquisition apparatus of claim 1, wherein the information processing module comprises: a second housing and a main board;

The main board is arranged inside the second shell, and the second shell is of a sealing structure;

and one end of the cable, which is connected with the information processing module, penetrates through the second shell and is connected with the main board.

7. The split acceleration acquisition device of claim 6, wherein the information processing module further comprises: a communication unit;

the communication unit is arranged inside the second shell;

The main board is connected with the communication unit and is configured to transmit the processed vibration signal to the external device through the communication unit.

8. The split acceleration acquisition apparatus of claim 7, wherein the communication unit is wirelessly connected with the external device.

9. The split acceleration acquisition device of claim 7, wherein the information processing module further comprises: an energy storage unit;

The energy storage unit is arranged inside the second shell;

The energy storage unit is connected with the main board and the communication unit and is configured to supply power to the main board and the communication unit;

The energy storage unit is connected with the plurality of signal acquisition modules through the cable and is configured to supply power to the plurality of signal acquisition templates through the cable.

10. The split acceleration acquisition apparatus of claim 9, wherein the energy storage unit is a battery.

11. The split acceleration acquisition device of claim 6, wherein the information processing module further comprises: a second acquisition chip;

The second acquisition chip is arranged inside the second shell;

The second acquisition chip is connected with the main board.

12. The split acceleration acquisition device of claim 11, wherein the signal acquisition module includes a first signal acquisition module and a second signal acquisition module;

The first signal acquisition module is arranged in a first direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the first direction;

the second signal acquisition module is arranged in a second direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the second direction;

the information processing module is arranged in a third direction of the equipment to be monitored and is configured to acquire a vibration value of the equipment to be monitored in the third direction;

The first direction, the second direction and the third direction are perpendicular to each other.

13. The split acceleration acquisition device of claim 6, wherein the information processing module further comprises: a second magnetic core;

The second magnetic core is fixedly arranged on the outer wall of the second shell;

The information processing module is configured to be connected with the equipment to be monitored through the second magnetic core.

14. The split acceleration acquisition apparatus of any one of the claims 1-13, further comprising: a first connector and a second connector;

The first connector is fixedly connected with the signal acquisition module;

One end of the cable connected with the signal acquisition module is configured to be connected with the signal acquisition module through the first connector;

the second connector is fixedly connected with the information processing module;

one end of the cable connected with the information processing module is configured to be connected with the information processing module through the second connector.