CN221077114U - Silicon wafer drying rack for photonic crystal processing - Google Patents
Silicon wafer drying rack for photonic crystal processing Download PDFInfo
- Publication number
- CN221077114U CN221077114U CN202322973881.2U CN202322973881U CN221077114U CN 221077114 U CN221077114 U CN 221077114U CN 202322973881 U CN202322973881 U CN 202322973881U CN 221077114 U CN221077114 U CN 221077114U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- drying
- rack
- placing
- photonic crystal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 238000001035 drying Methods 0.000 title claims abstract description 37
- 238000012545 processing Methods 0.000 title claims abstract description 16
- 239000004038 photonic crystal Substances 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 230000009471 action Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 24
- 238000012546 transfer Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The utility model relates to the technical field of silicon wafer processing equipment, in particular to a silicon wafer drying rack for photonic crystal processing, which comprises a drying top seat, wherein a heater is arranged in the drying top seat; when the operation of drying is carried out to the silicon chip, through putting into the standing groove with the silicon chip is batch, come the stoving footstock through electric telescopic machine and come down and will place the whole gomphosis of base in stoving footstock, thereby heat inside rack through the heater heating and dry the silicon chip, then come the inside steam of discharge through the venthole, can be quick effectual heat the silicon chip in batches, can improve efficiency, and can play certain guard action to the silicon chip when drying.
Description
Technical Field
The utility model relates to the technical field of silicon wafer processing equipment, in particular to a silicon wafer drying rack for photonic crystal processing.
Background
The silicon wafer heating mainly comprises a heating system, a heat transfer system and a control system. The heating system provides heat through the heating element, the heat transfer system transfers the heat to the silicon wafer through air flow or radiation conduction, and the control system is responsible for controlling the heating and heat transfer processes.
The current silicon chip heating equipment heats the stoving to the silicon chip through the laminating face of the equipment of support or centre gripping mainly through the mode of thermal conduction, because the heating face is less and then leads to the holistic heating efficiency of silicon chip slower, and then leads to drying efficiency lower. Therefore, we propose a silicon wafer drying rack for photonic crystal processing.
Disclosure of utility model
Aiming at the problems in the prior art, the utility model provides a silicon wafer drying rack for photonic crystal processing.
The technical scheme adopted by the utility model for solving the technical problems is that the silicon wafer drying rack for photonic crystal processing comprises a drying top seat, wherein a heater is arranged in the drying top seat, a top fixing frame is arranged in the heater, and a fixing groove is formed in the bottom end of the top fixing frame;
The drying top seat comprises a drying top seat, and is characterized in that an electric telescopic machine is fixedly connected to one side wall of the drying top seat, an extension end of the electric telescopic machine is installed inside a connecting piece in a penetrating mode, the connecting piece is fixedly connected to the side wall of a placing base, a plurality of placing racks are fixedly connected to the top end of the placing base, and placing grooves matched with the fixing grooves are formed in the top ends of the placing racks.
Through adopting above-mentioned technical scheme, when needs are dried the operation to the silicon chip, through putting into the standing groove with the silicon chip is batch, come down through electric telescopic machine and dry the footstock and come to place the whole gomphosis of base in stoving footstock, thereby heat the inside rack through the heater heating and dry the silicon chip afterwards, thereby discharge inside steam through the venthole, can be quick effectual heats the silicon chip in batches, can improve efficiency, and can play certain guard action to the silicon chip when drying.
Specifically, the inner side of the placement base faces one end of the placement frame and is provided with a fitting groove.
Through adopting above-mentioned technical scheme, use to place the silicon chip through fitting recess cooperation rack.
Specifically, the top of placing the base is provided with a spacing groove between the placing frames, and the surface of the spacing groove is fixedly connected with a plurality of fixing brackets.
Through adopting above-mentioned technical scheme, fix fixture through the fixed bolster of erectting in the spacing inslot.
Specifically, the top fixedly connected with of fixed bolster is little telescopic link, little telescopic link's lateral wall fixed mounting has the grip block that is used for the centre gripping silicon chip.
By adopting the technical scheme, the clamping plate is driven to fix or send the silicon wafer through the micro telescopic rod.
Specifically, the inner walls of the placing groove and the fixing groove are made of high-temperature-resistant plastic materials.
By adopting the technical scheme, the damage to the silicon wafer is avoided by the high-temperature-resistant plastic material.
Compared with the prior art, the utility model has the following beneficial effects:
according to the technical scheme, through the structural design of the electric telescopic machine, the placement base, the placement frame, the placement groove, the heater, the top fixing frame, the fixing groove, the spacing groove, the fixing support, the micro telescopic rod and the clamping plate, when silicon wafers are placed in the placement groove at the top end of the placement frame in batches, the silicon wafers are clamped and fixed, and are heated and dried, so that the wet silicon wafers during processing can be effectively dried in batches and rapidly, and the drying efficiency is relatively improved.
Drawings
The utility model will be further described with reference to the drawings and examples.
FIG. 1 is an isometric view of the present utility model;
FIG. 2 is a schematic view of the structure of the placement base of the present utility model;
FIG. 3 is a schematic diagram showing the structure of a drying top base of the present utility model;
In the figure: 1. drying the top seat; 2. an electric telescopic machine; 3. a connecting piece; 4. placing a base; 5. fitting the groove; 6. a placing rack; 7. a placement groove; 8. a heater; 9. a top mount; 10. a fixing groove; 11. a spacing groove; 12. a fixed bracket; 13. a micro telescopic rod; 14. and a clamping plate.
Detailed Description
The utility model is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Referring to fig. 1-3, the embodiment of the utility model provides a technical scheme: the silicon wafer drying rack for photonic crystal processing comprises a drying top seat 1, wherein a heater 8 is arranged in the drying top seat 1, a top fixing frame 9 is arranged in the heater 8, and a fixing groove 10 is formed in the bottom end of the top fixing frame 9;
the drying top seat is characterized in that an electric telescopic machine 2 is fixedly connected to one side wall of the drying top seat 1, the extending end of the electric telescopic machine 2 is installed inside the connecting piece 3 in a penetrating mode, the connecting piece 3 is fixedly connected to the side wall of the placing base 4, a plurality of placing racks 6 are fixedly connected to the top end of the placing base 4, and placing grooves 7 matched with the fixing grooves 10 are formed in the top end of the placing racks 6.
When the use, when needs are to carry out the stoving operation to the silicon chip, through putting into the standing groove 7 with the silicon chip is in batches, will place the whole gomphosis of base 4 in stoving footstock 1 through electric telescopic machine 2 descent stoving footstock 1 afterwards, heat the stoving to the inner space through heating machine 8 heating afterwards, discharge inside steam through the venthole afterwards, can be quick effectual heats the silicon chip in batches, can improve efficiency, and can play certain guard action to the silicon chip when drying.
As shown in the figure, the inner side of the placement base 4 is provided with a fitting groove 5 towards one end of the placement frame 6.
When in use, the silicon wafer is placed by matching the groove 5 with the placing frame 6.
As shown in the figure, a spacing groove 11 is arranged between the top end of the placement base 4 and the placement frame 6, and a plurality of fixing brackets 12 are fixedly connected to the surface of the spacing groove 11.
In use, the clamping mechanism is secured by a securing bracket 12 which rides in the spacer slot 11.
As shown in the figure, the top end of the fixing support 12 is fixedly connected with a micro-telescopic rod 13, and the side wall of the micro-telescopic rod 13 is fixedly provided with a clamping plate 14 for clamping a silicon wafer.
When in use, the clamping plate 14 is driven by the micro telescopic rod 13 to fix or send out the silicon wafer.
As shown in the figure, the inner walls of the placing groove 7 and the fixing groove 10 are made of high-temperature-resistant plastic materials.
When in use, the damage to the silicon wafer is avoided by the high-temperature-resistant plastic material.
The working principle and the using flow of the utility model are as follows: firstly, a placing base 4 is put down through an electric telescopic machine 2, then a silicon wafer is placed in a placing groove 7 formed in the top end of a placing rack 6, the side edge of the silicon wafer is inserted into a fitting groove 5, then a plurality of spacing grooves 11 on the surface of a spacing groove 11 are operated through micro telescopic rods 13 supported by a fixing support 12 to enable a clamping plate 14 to be close to the silicon wafer and clamp the silicon wafer, then the electric telescopic machine 2 contracts, the placing base 4 is driven by a connecting piece 3 to be placed into the drying top 1, a fixing groove 10 formed in the bottom end of a top fixing frame 9 is clamped at the top end of the silicon wafer, and then a heater 8 is operated to heat the top fixing frame 9, so that the silicon wafer is dried.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the foregoing examples, and that the foregoing description and description are merely illustrative of the principles of this utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. The silicon wafer drying rack for photonic crystal processing is characterized by comprising a drying top seat (1), wherein a heater (8) is arranged in the drying top seat (1), a top fixing rack (9) is arranged in the heater (8), and a fixing groove (10) is formed in the bottom end of the top fixing rack (9);
The drying top seat is characterized in that an electric telescopic machine (2) is fixedly connected to one side wall of the drying top seat (1), the extending end of the electric telescopic machine (2) is installed inside a connecting piece (3) in a penetrating mode, the connecting piece (3) is fixedly connected to the side wall of a placing base (4), a plurality of placing frames (6) are fixedly connected to the top end of the placing base (4), and a placing groove (7) matched with the fixing groove (10) is formed in the top end of the placing frame (6).
2. The silicon wafer drying rack for photonic crystal processing according to claim 1, wherein the inner side of the placement base (4) is provided with a fitting groove (5) toward one end of the placement rack (6).
3. The silicon wafer drying rack for photonic crystal processing according to claim 1, wherein a spacing groove (11) is arranged between the top end of the placing base (4) and the placing rack (6), and a plurality of fixing brackets (12) are fixedly connected to the surface of the spacing groove (11).
4. The silicon wafer drying rack for photonic crystal processing according to claim 3, wherein a micro-telescopic rod (13) is fixedly connected to the top end of the fixing support (12), and a clamping plate (14) for clamping the silicon wafer is fixedly arranged on the side wall of the micro-telescopic rod (13).
5. The silicon wafer drying rack for photonic crystal processing according to claim 1, wherein the inner walls of the placing groove (7) and the fixing groove (10) are made of high-temperature-resistant plastic materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322973881.2U CN221077114U (en) | 2023-11-03 | 2023-11-03 | Silicon wafer drying rack for photonic crystal processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322973881.2U CN221077114U (en) | 2023-11-03 | 2023-11-03 | Silicon wafer drying rack for photonic crystal processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221077114U true CN221077114U (en) | 2024-06-04 |
Family
ID=91259027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322973881.2U Active CN221077114U (en) | 2023-11-03 | 2023-11-03 | Silicon wafer drying rack for photonic crystal processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221077114U (en) |
-
2023
- 2023-11-03 CN CN202322973881.2U patent/CN221077114U/en active Active
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