CN212806284U - Silicon wafer drying device - Google Patents
Silicon wafer drying device Download PDFInfo
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- CN212806284U CN212806284U CN202021535839.2U CN202021535839U CN212806284U CN 212806284 U CN212806284 U CN 212806284U CN 202021535839 U CN202021535839 U CN 202021535839U CN 212806284 U CN212806284 U CN 212806284U
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Abstract
The utility model relates to a silicon chip drying device, it includes: a trough body; the air boxes are arranged on two opposite sides of the tank body, a plurality of transverse strip-shaped air outlet openings are formed in the side face of the upper portion of each air box, and the air outlet openings are communicated with the inner cavity of the tank body; the heating mechanism is arranged in the air box; the air inducing cavity is arranged at the bottom of the groove body, an outlet of the air inducing cavity is communicated with the lower part of the air box, and an inlet of the air inducing cavity is communicated with an inner cavity of the groove body; the fan blade is arranged in the air inducing cavity and is driven by the driving piece to rotate. The air current circulates among the air inducing cavity, the air box and the inner cavity of the groove body to continuously dry the silicon wafer, and the drying efficiency is high. The transverse strip-shaped air outlet openings on the air box enable air flow to blow towards the silicon wafers in a flat shape, and the air flow can easily enter gaps among the silicon wafers, so that the drying of moisture among the silicon wafers is promoted.
Description
Technical Field
The utility model relates to a drying device especially relates to a silicon chip drying device.
Background
After the silicon wafer is subjected to texturing and water washing, liquid drops are carried on the surface of the silicon wafer, and the next process cannot be directly carried out, so that the silicon wafer needs to be dried.
If the drying efficiency can be improved, the production efficiency can be improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a silicon chip drying device has great drying efficiency.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a silicon chip drying device, it includes:
a trough body;
the air boxes are arranged on two opposite sides of the tank body, a plurality of transverse strip-shaped air outlet openings are formed in the side face of the upper portion of each air box, and the air outlet openings are communicated with the inner cavity of the tank body;
the heating mechanism is arranged in the air box;
the air inducing cavity is arranged at the bottom of the groove body, an outlet of the air inducing cavity is communicated with the lower part of the air box, and an inlet of the air inducing cavity is communicated with an inner cavity of the groove body;
the fan blade is arranged in the air inducing cavity and is driven by the driving piece to rotate.
Preferably, the heating mechanism is an infrared heating tube.
Preferably, a support frame is arranged in the air box, and the heating mechanism is installed on the support frame.
Preferably, the bellows is attached to an inner side surface of the tank body in a flat shape.
Preferably, the fan blade is a turbofan.
Preferably, a groove cover is arranged on the groove body.
Preferably, the air outlet openings are arranged in a plurality of rows in the vertical direction.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model discloses a silicon chip drying device, owing to be provided with cell body, bellows, heating mechanism, induced air chamber and flabellum, the flabellum is rotatory by the driving piece drive, produces the air current, and the air current is heated by heating mechanism in the induced air chamber entering bellows to the silicon chip in the cell body is blown to the air-out opening discharge from bellows, dries the silicon chip. The air current circulates among the air inducing cavity, the air box and the inner cavity of the groove body to continuously dry the silicon wafer, and the drying efficiency is high. The transverse strip-shaped air outlet openings on the air box enable air flow to blow towards the silicon wafers in a flat shape, and the air flow can easily enter gaps among the silicon wafers, so that the drying of moisture among the silicon wafers is promoted.
Drawings
Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic perspective view of a silicon wafer drying apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a front perspective view of the device shown in FIG. 1;
FIG. 3 is a left perspective view of FIG. 1;
wherein the reference numerals are as follows:
1. a trough body;
2. an air box; 21. an air outlet opening;
3. a heating mechanism;
4. a wind inducing cavity;
5. a fan blade;
6. a drive member;
7. a support frame;
8. a flower basket.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, the silicon wafer drying device comprises a tank body 1 and a wind box 2, and hot air comes out from the wind box 2. Solar silicon wafers to be dried (or other silicon wafers can be dried) are loaded in the flower basket 8 (the silicon wafers are not shown in the figure), and the flower basket 8 is placed in the inner cavity of the tank body 1.
The part (belonging to the upper part of the bellows 2) of the bellows 2, which is positioned in the tank body 1, is provided with a plurality of air outlet openings 21 on the side surface, and the air outlet openings 21 are communicated with the inner cavity of the tank body 1. The air outlet opening 21 is in a horizontal strip shape, namely a horizontally extending strip shape, so that the air outlet is in a flat shape, and the flat airflow easily penetrates between the silicon wafers, thereby improving the drying efficiency. Furthermore, the air outlet openings 21 are arranged in a plurality of rows in the vertical direction, so that the airflow is blown to the silicon wafers in the flower basket 8 in a stacked manner, the airflow is easy to penetrate into gaps among the silicon wafers, and the drying efficiency is further improved.
The air box 2 is flat and attached to the two opposite side surfaces in the tank body 1, and does not occupy too much space.
As shown in the front perspective view of fig. 2, a heating mechanism 3 is provided in the wind box 2 for heating the air flow. The heating mechanism 3 of the embodiment is an infrared heating pipe, three infrared heating pipes are arranged on each side, the infrared heating pipes are distributed at equal intervals in the vertical direction, and the heating efficiency is high. In order to fix the infrared heating pipe better, a supporting frame 7 is also arranged in the air box 2, and the heating mechanism 3 (namely the infrared heating pipe) is arranged on the supporting frame 7. A groove is formed in the supporting frame 7, and the infrared heating pipe is embedded in the groove.
As shown in fig. 2 and 3, the bottom of the tank body 1 is provided with an air inducing cavity 4, the outlet of the air inducing cavity 4 is communicated with the lower part of the air box 2, and the inlet of the air inducing cavity 4 is communicated with the inner cavity of the tank body 1. The air inducing cavity 4 is provided with a fan blade 5, and the fan blade 5 is driven by a driving piece 6 to rotate. The drive 6 is a motor or other drive. Due to the rotation of the fan blades 5, the fan blades 5 axially suck the air in the tank body 1 and radially discharge the air into the air box 2. The fan blades 5 in this example are turbo fans, so that the air flow can be accelerated.
In this example, two sets of fan blades 5 and corresponding motors are provided, which improves the wind power.
The tank body 1 of the embodiment is also provided with a tank cover (not shown), and the tank cover is covered during the drying operation, so that the heat preservation effect is achieved, and the energy is saved.
In summary, in the silicon wafer drying apparatus of this embodiment, the fan blades 5 in the air inducing cavity 4 rotate to axially suck air in the tank body 1 and radially discharge the air into the air box 2, and flat air flow is discharged from the horizontal strip-shaped air outlet opening 21 of the air box 2, and the flat air flow is favorable for blowing in gaps between silicon wafers to rapidly dry the silicon wafers, and the air flow is also heated by the infrared heating pipe in the air box 2 to form hot air to accelerate drying of the silicon wafers, so that the air flow forms a circulation, and the silicon wafers are dried after the circulation for several times, thereby achieving rapid silicon wafer drying.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (7)
1. A silicon wafer drying device is characterized by comprising:
a tank body (1);
the air box (2) is arranged on two opposite sides of the tank body (1), a plurality of transverse strip-shaped air outlet openings (21) are formed in the side face of the upper portion of the air box (2), and the air outlet openings (21) are communicated with the inner cavity of the tank body (1);
the heating mechanism (3), the said heating mechanism (3) is set up in the said bellows (2);
the air inducing cavity (4) is arranged at the bottom of the groove body (1), an outlet of the air inducing cavity (4) is communicated with the lower part of the air box (2), and an inlet of the air inducing cavity (4) is communicated with an inner cavity of the groove body (1);
the fan blade (5) is arranged in the air inducing cavity (4), and the fan blade (5) is driven by a driving piece (6) to rotate.
2. The silicon wafer drying apparatus according to claim 1, wherein: the heating mechanism (3) is an infrared heating pipe.
3. The silicon wafer drying apparatus according to claim 1, wherein: a supporting frame (7) is arranged in the air box (2), and the heating mechanism (3) is installed on the supporting frame (7).
4. The silicon wafer drying apparatus according to claim 1, wherein: the air box (2) is attached to the inner side surface of the tank body (1) in a flat shape.
5. The silicon wafer drying apparatus according to claim 1, wherein: the fan blades (5) are turbofan.
6. The silicon wafer drying apparatus according to claim 1, wherein: the tank body (1) is provided with a tank cover.
7. The silicon wafer drying apparatus according to claim 1, wherein: the air outlet openings (21) are arranged in a plurality of rows in the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021535839.2U CN212806284U (en) | 2020-07-29 | 2020-07-29 | Silicon wafer drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021535839.2U CN212806284U (en) | 2020-07-29 | 2020-07-29 | Silicon wafer drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212806284U true CN212806284U (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021535839.2U Active CN212806284U (en) | 2020-07-29 | 2020-07-29 | Silicon wafer drying device |
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| Country | Link |
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| CN (1) | CN212806284U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115388619A (en) * | 2022-08-23 | 2022-11-25 | 上海提牛机电设备有限公司 | Silicon wafer drying box |
| WO2024108914A1 (en) * | 2022-11-23 | 2024-05-30 | 江苏亚电科技有限公司 | Photovoltaic silicon wafer drying apparatus having two paths |
-
2020
- 2020-07-29 CN CN202021535839.2U patent/CN212806284U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115388619A (en) * | 2022-08-23 | 2022-11-25 | 上海提牛机电设备有限公司 | Silicon wafer drying box |
| WO2024108914A1 (en) * | 2022-11-23 | 2024-05-30 | 江苏亚电科技有限公司 | Photovoltaic silicon wafer drying apparatus having two paths |
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