CN221057150U - High-efficient heat dissipation hard disk - Google Patents
High-efficient heat dissipation hard disk Download PDFInfo
- Publication number
- CN221057150U CN221057150U CN202322732675.2U CN202322732675U CN221057150U CN 221057150 U CN221057150 U CN 221057150U CN 202322732675 U CN202322732675 U CN 202322732675U CN 221057150 U CN221057150 U CN 221057150U
- Authority
- CN
- China
- Prior art keywords
- hard disk
- heat
- heat conduction
- shell
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 14
- 238000013016 damping Methods 0.000 claims description 8
- 241000886569 Cyprogenia stegaria Species 0.000 claims description 6
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000007787 solid Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high-efficiency heat-dissipation hard disk, which comprises a hard disk shell, a plurality of chips, a bearing plate, a heat conduction module and a fan assembly, wherein the chips are positioned in the hard disk shell; the heat conduction module is made of heat conduction materials and is arranged around the chip; an air flow outlet is formed in one side of the hard disk shell, an air flow inlet is formed in the other side of the hard disk shell, a fan assembly is arranged on one side of the hard disk shell, which is provided with the air flow inlet, and the fan assembly blows air into the hard disk shell through the air flow inlet. According to the high-efficiency heat dissipation hard disk, the bearing plate and the heat conduction module are used for guiding heat generated during the operation of the chip into the cavity of the hard disk shell, and the operation of the fan assembly can accelerate the airflow in the hard disk shell, so that the heat in the hard disk shell is guided out; through the structural design of the bearing plate, the heat conduction module and the fan assembly, the heat radiation performance of the hard disk is improved, and the service life of the hard disk is prolonged.
Description
Technical Field
The utility model relates to a high-efficiency heat-dissipation hard disk.
Background
A hard disk is a type of storage device. Most hard disks are fixed hard disks, permanently sealed in the hard disk drive. Early hard disk storage media were replaceable, but today typical hard disks were fixed storage media enclosed in hard disks (except for a filter hole to equalize air pressure). With the development of technology, removable hard disks are becoming popular and more kinds.
The hard disk is generally classified into a solid state hard disk, a hybrid hard disk, and a conventional hard disk. The solid state disk is a hard disk made of solid state electronic memory chip array, and is composed of a control unit, a memory unit (FLASH (FLASH) chip, and DRAM (dynamic random access memory) chip). The solid state disk is identical to the common hard disk in the aspects of interface specification, interface definition, interface function and interface using method, and is identical to the common hard disk in the aspects of product appearance and product size.
The solid state disk has high read-write speed, low power consumption and no noise, and is widely applied to the fields of military, vehicle-mounted, industrial control, video monitoring, network terminals, electric power, medical treatment, aviation, navigation equipment and the like, but when the solid state disk is used, the heat dissipation performance of the hard disk is poor, faults are easy to occur, and the service life of the hard disk is influenced.
Disclosure of utility model
The utility model provides a high-efficiency heat-dissipation hard disk, which aims to solve the technical problems of poor heat-dissipation performance and easy failure of the solid state hard disk.
The utility model solves the technical problems by the following technical proposal:
The utility model provides a high-efficiency heat-dissipation hard disk, which comprises a hard disk shell, a plurality of chips, a bearing plate, a heat conduction module and a fan assembly, wherein the chips are positioned in the hard disk shell; the heat conduction module is made of heat conduction materials and is arranged around the chip; an air flow outlet is formed in one side of the hard disk shell, an air flow inlet is formed in the other side of the hard disk shell, a fan assembly is arranged on one side of the hard disk shell, which is provided with the air flow inlet, and the fan assembly blows air into the hard disk shell through the air flow inlet.
In this technical scheme, the heat when carrier board, heat conduction module are with chip operation is leading-in to the cavity of hard disk casing in, and fan assembly operation can accelerate the air current flow in the hard disk casing this moment to derive the heat in the hard disk casing. The air flow generated by the fan assembly enters the hard disk shell through the air flow inlet and carries heat to flow out from the air flow outlet, so that the heat dissipation of the chip module can be quickened, the air flow outlet can ensure that the heat can be fully led out of the hard disk, the heat dissipation efficiency is improved, and the air flow of the heat dissipation fan can be uniformly led into the hard disk shell through the air flow inlet.
Preferably, the heat conduction module comprises a first heat conduction glue, wherein the first heat conduction glue is made of a heat conduction material, and the first heat conduction glue is arranged between the chip and the bearing plate.
In this technical scheme, first heat conduction glue can be with the heat conduction of chip production to the bearing board on, dispel the heat to the chip, has improved radiating efficiency.
Preferably, the heat conduction module comprises at least one radiating fin, and the radiating fin is attached to the side face of the chip.
In this technical scheme, heat is led into the hard disk casing cavity through the fin, is convenient for with the heat that produces when the chip operation export hard disk casing, has improved radiating efficiency.
Preferably, the chips are arranged in a plurality of rows along the direction from the air flow outlet to the air flow inlet, one radiating fin is shared by the same side of each row of chips, and a radiating air duct extending along the direction from the air flow outlet to the air flow inlet is formed between the adjacent radiating fins.
In this technical scheme, adjacent fin can form many heat dissipation wind channels in hard disk casing, can prevent to get into the indiscriminate running of air current in the hard disk casing, makes the air current export hard disk casing with the heat in the heat dissipation wind channel regularly, improves heat export's efficiency to radiating efficiency has been improved.
Preferably, the heat conduction module further comprises a second heat conduction glue, the second heat conduction glue is made of a heat conduction material, and the second heat conduction glue is arranged between the chip and the radiating fin.
In the technical scheme, the heat of the chip can be further conducted to the radiating fin through the second heat-conducting adhesive, so that the radiating efficiency of the chip is improved.
Preferably, the high-efficiency heat dissipation hard disk further comprises a connecting frame, the edge of the connecting frame is fixed with the side face of the hard disk shell, and the bearing plate is fixed on the connecting frame.
In this technical scheme, the carrier board can be fixed to the link, prevents that the chip from producing in hard disk casing and rocking, has kept the stability of chip.
Preferably, the high-efficiency heat dissipation hard disk further comprises a heat conduction pad, and the heat conduction pad is arranged between the bearing plate and the connecting frame.
In this technical scheme, the heat conduction pad can be with the heat part transfer of chip transmission to the carrier plate for the link, and the air current of being convenient for is derived the heat of chip, has improved radiating efficiency.
Preferably, the high-efficiency heat dissipation hard disk further comprises a third heat conduction adhesive, and the third heat conduction adhesive is arranged between the heat conduction pad and the bearing plate.
In the technical scheme, the heat on the bearing plate can be better transmitted to the heat conduction pad through the third heat conduction adhesive.
Preferably, the hard disk casing is provided with at least one fixing hole; the high-efficiency heat dissipation hard disk further comprises a heat dissipation column, the heat dissipation column is installed in the fixing hole and made of heat conduction materials, one end of the heat dissipation column is exposed in the hard disk shell, and the other end of the heat dissipation column is exposed out of the hard disk shell.
In this technical scheme, the heat dissipation post runs through the hard disk casing, and the one end of heat dissipation post exposes in the hard disk casing promptly, and the other end of heat dissipation post exposes outside the hard disk casing, can form an auxiliary heat dissipation passageway, makes the heat dissipation post absorb the heat in the hard disk casing after, and the usable is exposed the other end outside the hard disk casing and will absorb the heat and give off the hard disk casing, has improved radiating efficiency.
Preferably, the fan assembly comprises a fan housing, a radiator fan, a plurality of fixed slats and a plurality of shock-absorbing damping blocks, wherein the radiator fan is arranged in the fan housing, one end of each fixed slat is fixed on the outer side of the fan housing, and one end of each fixed slat, far away from the fan housing, is connected with the hard disk shell through the shock-absorbing damping blocks.
In the technical scheme, the fan assembly can actively radiate heat of the hard disk, and the radiating efficiency is improved in an active mode. The fixed slat and the damping block can be connected with the fan shell and the hard disk shell, and the damping block can prevent vibration generated when the cooling fan operates from affecting the use and connection of the hard disk; meanwhile, the fan shell is not closely connected with the hard disk shell through the fixed slat, so that when the cooling fan does not work, air flow in air can still enter from the air flow inlet and be guided out from the air flow outlet, and heat dissipation of the hard disk is prevented from being influenced when the fan component does not work.
On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the utility model.
The utility model has the positive progress effects that:
According to the high-efficiency heat dissipation hard disk, the bearing plate and the heat conduction module are used for guiding heat generated during the operation of the chip into the cavity of the hard disk shell, and the operation of the fan assembly can accelerate the airflow in the hard disk shell, so that the heat in the hard disk shell is guided out; through the structural design of the bearing plate, the heat conduction module and the fan assembly, the heat radiation performance of the hard disk is improved, and the service life of the hard disk is prolonged.
Drawings
Fig. 1 is a schematic perspective view of a high-efficiency heat dissipation hard disk of the present utility model.
Fig. 2 is a schematic diagram of the internal front view structure of the high-efficiency heat dissipation hard disk of the present utility model.
Fig. 3 is a schematic view of a partial enlarged structure at a in fig. 2.
Fig. 4 is a schematic diagram of an internal top view structure of the high-efficiency heat dissipation hard disk of the present utility model.
Fig. 5 is a schematic view of a partial enlarged structure at B in fig. 4.
FIG. 6 is a schematic view of the inner structure of the end face of the fan housing according to the present utility model.
Fig. 7 is a schematic diagram of an end-face explosion structure of a fan housing according to the present utility model.
Description of the reference numerals
Hard disk casing 1
Air flow outlet 11
Air inlet 12
Chip 2
Bearing plate 3
Heat conduction module 4
First heat conductive adhesive 411
Second heat-conductive adhesive 412
Heat sink 413
Fan assembly 5
Fan housing 51
Vent 511
End plate 512
Limiting groove 513
Radiator fan 52
Fixed slat 53
Shock absorbing damper block 54
Shielding module 55
Rotating shaft 551
Shutter 552
Limit edge 553
Connecting frame 6
Thermal pad 7
Third heat-conducting glue 8
Heat radiation column 9
Detailed Description
The utility model is further illustrated by means of examples which follow, without thereby restricting the scope of the utility model thereto.
Fig. 1 to 7 show an embodiment of a high-efficiency heat dissipation hard disk according to the present utility model. The high-efficiency heat dissipation hard disk comprises a hard disk shell 1, a plurality of chips 2, a supporting plate 3, a heat conduction module 4 and a fan assembly 5, wherein the chips 2 are positioned in the hard disk shell 1, the supporting plate 3 is fixedly arranged in the hard disk shell 1, and the chips 2 are arranged on the supporting plate 3; the heat conduction module 4 is made of a heat conduction material, and the heat conduction module 4 is arranged around the chip 2; an air flow outlet 11 is formed on one side of the hard disk shell 1, an air flow inlet 12 is formed on the other side of the hard disk shell 1, the fan assembly 5 is arranged on one side of the hard disk shell 1, which is provided with the air flow inlet 12, and the fan assembly 5 blows air into the hard disk shell 1 through the air flow inlet 12.
Specifically, the heat generated when the chip 2 is operated is guided into the cavity of the hard disk housing 1 by the support plate 3 and the heat conduction module 4, and the operation of the fan assembly 5 can accelerate the airflow in the hard disk housing 1, so that the heat in the hard disk housing 1 is guided out. At this time, the air flow generated by the fan assembly 5 enters the hard disk housing 1 through the air flow inlet 12 and carries heat to flow out from the air flow outlet 11, so that the heat dissipation of the chip 2 can be accelerated. The air outlet 11 can ensure that heat can sufficiently flow out of the hard disk, so that the heat dissipation efficiency is improved, and the air inlet 12 can enable the air of the fan assembly 5 to uniformly enter the hard disk housing 1.
As shown in fig. 2 to 5, the heat conduction module 4 includes a first heat conduction glue 411, the first heat conduction glue 411 is made of a heat conduction material, and the first heat conduction glue 411 is disposed between the chip 2 and the supporting plate 3. When the hard disk is in operation, the first heat-conducting adhesive 411 can conduct heat generated by the chip 2 to the supporting plate 3 to dissipate heat of the chip 2.
The heat conduction module 4 further comprises a plurality of cooling fins 413, and the cooling fins 413 are attached to the side face of the chip 2. The heat of the chip 2 can be introduced into the cavity of the hard disk housing 1 through the heat sink 413, so that the heat generated during the operation of the chip 2 can be conveniently led out of the hard disk housing 1.
As shown in fig. 2 to 5, the chips 2 are arranged in a plurality of rows along the direction from the air outlet 11 to the air inlet 12, one heat sink 413 is shared by the same side of each row of chips 2, and a heat dissipation air channel extending along the direction from the air outlet 11 to the air inlet 12 is formed between adjacent heat sinks 413.
Adjacent cooling fins 413 can form a plurality of cooling air channels in the hard disk shell 1, and the cooling air channels can prevent the air flow entering the hard disk shell 1 from running out, so that the air flow can regularly lead out the heat in the cooling air channels from the hard disk shell 1, the heat leading-out efficiency is improved, and the heat radiating efficiency is improved.
As shown in fig. 2 to 5, the heat conductive module 4 further includes a second heat conductive adhesive 412, the second heat conductive adhesive 412 is made of a heat conductive material, and the second heat conductive adhesive 412 is disposed between the chip 2 and the heat sink 413. The heat of the chip 2 can be better conducted to the heat sink 413 through the second heat conducting adhesive 412, so that the heat dissipation efficiency of the chip 2 is improved.
The structure of the heat conduction module 4 is a preferred heat conduction structure. In other embodiments, the heat conducting module 4 may have other heat conducting structures, and the number and shape of the heat dissipating fins 413 may be adaptively changed according to the arrangement layout of the chips 2.
As shown in fig. 2 to 5, the high-efficiency heat dissipation hard disk further comprises a connecting frame 6, wherein the edge of the connecting frame 6 is fixed with the side surface of the hard disk shell 1, and the supporting plate 3 is fixed on the connecting frame 6. The carrier plate 3 can be fixed to the link 6, prevents that chip 2 from producing rocking in hard disk housing 1, has kept the stability of chip 2.
As shown in fig. 2 to 5, the high-efficiency heat dissipation hard disk further includes a heat conducting pad 7, and the heat conducting pad 7 is disposed between the support plate 3 and the connecting frame 6. The heat conduction pad 7 can transfer the heat of the chip 2 to the bearing plate 3 to the connecting frame 6, so that the air flow is convenient to conduct out the heat of the chip 2, and the heat dissipation efficiency is improved.
As shown in fig. 2 to 5, the high-efficiency heat dissipation hard disk further includes a third heat-conducting glue 8, and the third heat-conducting glue 8 is disposed between the heat-conducting pad 7 and the supporting plate 3. The heat on the carrier plate 3 can be better transferred to the heat-conducting pad 7 by the third heat-conducting glue 8.
As shown in fig. 2 to 5, the hard disk casing 1 is provided with a plurality of fixing holes; the high-efficiency heat dissipation hard disk further comprises a heat dissipation column 9, wherein the heat dissipation column 9 is made of a heat conduction material, the heat dissipation column 9 is installed in the fixing hole, one end of the heat dissipation column 9 is exposed in the hard disk shell 1, and the other end of the heat dissipation column 9 is exposed outside the hard disk shell 1.
The heat dissipation column 9 penetrates through the hard disk casing 1, namely one end of the heat dissipation column 9 is exposed in the hard disk casing 1, the other end of the heat dissipation column 9 is exposed outside the hard disk casing 1, an auxiliary heat dissipation channel can be formed, after the heat dissipation column 9 absorbs heat in the hard disk casing 1, the other end exposed outside the hard disk casing 1 can be utilized to dissipate the absorbed heat to the hard disk casing 1, and heat dissipation efficiency is improved.
As shown in fig. 2 to 5, the fan assembly 5 includes a fan housing 51, a heat dissipation fan 52, a plurality of fixing slats 53 and a plurality of shock-absorbing damper blocks 54, the heat dissipation fan 52 is installed in the fan housing 51, one end of the fixing slats 53 is fixed to the outside of the fan housing 51, and one end of the fixing slats 53 away from the fan housing 51 is connected with the hard disk case 1 through the shock-absorbing damper blocks 54.
Specifically, the fan assembly 5 can actively dissipate heat of the hard disk, and the efficiency of heat dissipation is improved by an active manner. The fixed slat 53 and the shock-absorbing damping block 54 can be connected with the fan housing 51 and the hard disk housing 1, and the shock-absorbing damping block 54 can prevent the use and connection of the hard disk from being affected by the vibration generated when the cooling fan 52 operates; meanwhile, the fan housing 51 is not closely connected with the hard disk shell 1 through the fixing slat 53, so that when the cooling fan 52 does not work, air flow in air can still enter the hard disk shell 1 from the air flow inlet 12 and be led out from the air flow outlet 11, and heat dissipation of the hard disk is prevented from being influenced when the fan assembly 5 does not work.
As shown in fig. 6 and 7, the fan assembly 5 may further be provided with shielding modules 55, where the shielding modules 55 are disposed at two ends of the fan housing 51, and the shielding modules 55 are used to open or close the fan housing 51 to prevent dust from entering the fan housing 51.
Specifically, the end face of the fan housing 51 has two end plates 512 disposed parallel to the end face, a housing chamber for housing the shielding module 55 is formed between the two end plates 512, and a plurality of ventilation openings 511 penetrating the housing chamber in the axial direction are formed in the two end plates 512. The shielding module 55 comprises a rotating shaft 551, two ends of the rotating shaft 551 are respectively arranged on the two end plates 512, the rotating shaft 551 is positioned in the middle of the plurality of ventilation openings 511, and a plurality of shielding plates 552 distributed in an annular array are fixed on the peripheral surface of the rotating shaft 551. The shielding plate 552 is located in the accommodating cavity, the edge of the shielding plate 552 far away from the rotating shaft 551 forms a limiting edge 553, the vent 511 and the shielding plate 552 are both fan-shaped structures, and the area of the shielding plate 552 is larger than that of the vent 511. The edge of the receiving cavity forms a limit slot 513, and the limit edge 553 can move in the limit slot 513. By rotating the rotation shaft 551, the shielding plate 552 can be made to shield the vent 511 or open the vent 511, thereby realizing opening and closing of the fan housing 51.
Specifically, in cold weather, active heat dissipation by the fan assembly 5 is not required due to the low temperature around the hard disk. In order to reduce the energy consumption, the cooling fan 52 may be turned off at this time, and at the same time, in order to avoid the dust entering, the rotation shaft 551 drives the shielding plate 552 to rotate, so that the shielding plate 552 shields the ventilation opening 511, so that the fan housing 51 forms a seal, and the dust is prevented from entering the hard disk housing 1 to affect the use of the cooling fan 52.
The present utility model is not limited to the above-described embodiments, and any changes in shape or structure thereof are within the scope of the present utility model. The scope of the present utility model is defined by the appended claims, and those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and spirit of the present utility model, but these changes and modifications fall within the scope of the present utility model.
Claims (9)
1. The utility model provides a high-efficient heat dissipation hard disk, includes hard disk casing and a plurality of chip, the chip is located in the hard disk casing, its characterized in that, high-efficient heat dissipation hard disk still includes:
the bearing plate is fixedly arranged in the hard disk shell, and the chip is arranged on the bearing plate;
the heat conduction module is made of a heat conduction material and is arranged around the chip;
the fan assembly is arranged on one side of the hard disk shell, which is provided with the air inlet, and blows air into the hard disk shell through the air inlet;
The fan assembly comprises a fan shell, a cooling fan, a plurality of fixed slats and a plurality of shock-absorbing damping blocks, wherein the cooling fan is installed in the fan shell, one end of each fixed slat is fixed on the outer side of the fan shell, and one end of each fixed slat, far away from the fan shell, is connected with the hard disk shell through the shock-absorbing damping blocks.
2. The high efficiency heat dissipating hard disk of claim 1, wherein: the heat conduction module comprises first heat conduction glue, the first heat conduction glue is made of heat conduction materials, and the first heat conduction glue is arranged between the chip and the bearing plate.
3. The high efficiency heat dissipating hard disk of claim 1, wherein: the heat conduction module comprises at least one radiating fin, and the radiating fin is attached to the side face of the chip.
4. The high efficiency heat dissipating hard disk of claim 3, wherein: the chips are arranged in a plurality of rows along the direction from the air flow outlet to the air flow inlet, one radiating fin is shared by the same side of each row of chips, and a radiating air duct extending along the direction from the air flow outlet to the air flow inlet is formed between the adjacent radiating fins.
5. The high efficiency heat dissipating hard disk of claim 3, wherein: the heat conduction module further comprises second heat conduction glue, the second heat conduction glue is made of heat conduction materials, and the second heat conduction glue is arranged between the chip and the radiating fin.
6. The high efficiency heat dissipating hard disk of claim 1, wherein: the high-efficiency heat dissipation hard disk further comprises a connecting frame, the edge of the connecting frame is fixed with the side face of the hard disk shell, and the bearing plate is fixed on the connecting frame.
7. The high efficiency heat dissipating hard disk of claim 6, wherein: the high-efficiency heat dissipation hard disk further comprises a heat conduction pad, and the heat conduction pad is arranged between the bearing plate and the connecting frame.
8. The high efficiency heat dissipating hard disk of claim 7, wherein: the high-efficiency heat dissipation hard disk further comprises third heat conduction glue, and the third heat conduction glue is arranged between the heat conduction pad and the bearing plate.
9. The high efficiency heat dissipating hard disk of claim 1, wherein: at least one fixing hole is formed in the hard disk shell; the high-efficiency heat dissipation hard disk further comprises a heat dissipation column, the heat dissipation column is made of a heat conduction material, the heat dissipation column is installed in the fixing hole, one end of the heat dissipation column is exposed in the hard disk shell, and the other end of the heat dissipation column is exposed out of the hard disk shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322732675.2U CN221057150U (en) | 2023-10-11 | 2023-10-11 | High-efficient heat dissipation hard disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322732675.2U CN221057150U (en) | 2023-10-11 | 2023-10-11 | High-efficient heat dissipation hard disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221057150U true CN221057150U (en) | 2024-05-31 |
Family
ID=91199478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322732675.2U Active CN221057150U (en) | 2023-10-11 | 2023-10-11 | High-efficient heat dissipation hard disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221057150U (en) |
-
2023
- 2023-10-11 CN CN202322732675.2U patent/CN221057150U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107146923B (en) | Power battery pack uniform temperature heat dissipation device composed of cold plate arrays and processing method | |
| CN108990390A (en) | Mobile terminal radiator and mobile terminal | |
| CN115047961A (en) | Edge server cooling system and wide-ring-temperature edge server | |
| CN221057150U (en) | High-efficient heat dissipation hard disk | |
| CN220689013U (en) | Radiator module and photographic lamp | |
| CN211016321U (en) | Outdoor L ED display screen with 3.33MM spacing | |
| CN115863841B (en) | Outdoor lithium battery mobile power supply combined structure and use method | |
| CN219873698U (en) | Lithium battery heat radiation structure | |
| CN218385193U (en) | Chip stacking type packaging machine | |
| CN116454452A (en) | Heat abstractor of energy storage battery group | |
| CN214170075U (en) | Fan room capable of quickly dissipating heat | |
| CN212782724U (en) | External mobile hard disk device for computer | |
| CN212137421U (en) | Heat radiation assembly of motor housing | |
| CN210005702U (en) | CT detector temperature equal structure based on heat dissipation fin differential design | |
| CN213152703U (en) | Wireless PCBA that charges of external heat radiation structure | |
| CN221574017U (en) | Air-cooled fin type energy storage module | |
| CN216819996U (en) | One-way isolation optical gate with high safety performance | |
| CN219350401U (en) | Heat radiation assembly of energy storage battery | |
| CN110597373A (en) | Stirling heat dissipation device, server cabinet heat dissipation system and heat dissipation method thereof | |
| CN217061432U (en) | Solid state hard drives with heat radiation structure | |
| CN219811119U (en) | Projector with heat dissipation air duct | |
| CN218986336U (en) | New energy electric automobile tray | |
| CN221531175U (en) | Motor with heat radiation structure | |
| CN216218338U (en) | Power module with good heat dissipation effect | |
| CN214708275U (en) | Heat abstractor based on big data processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |