CN221056901U - Heat dissipation memory strip - Google Patents

Abstract

The utility model provides a heat dissipation memory strip, comprising: the memory function component is limited in a containing cavity formed by assembling the heat dissipation plate and the limiting component; a first limiting part and a second limiting part are formed between the radiating plate and the limiting component; the first limiting part is at least used for limiting the relative movement of the radiating plate and the limiting assembly in a first direction, the second limiting part is at least used for limiting the relative movement of the radiating plate and the limiting assembly in a second direction, and the directions of the first direction and the second direction are opposite. The heat dissipation memory strip is simple in structure and reliable in assembly, the reliable assembly of the memory strip is realized through the combined limitation of the first limiting part and the second limiting part, the problem of loose engagement caused by the fact that the thickness of the metal heat dissipation plate is thinner is solved, and the stability of assembly is improved; the whole structure is easy to assemble, and the manufacturing cost can be effectively reduced.

Description

Heat dissipation memory strip

Technical Field

The utility model relates to the technical field of memory banks, in particular to a heat dissipation memory bank.

Background

The memory bar is a computer component which can be addressed by the CPU through a bus and performs read-write operation. Memory sticks have historically been an extension of the main memory of personal computers. With the continuous updating demands of computer software and hardware technology, the memory bank becomes the whole of the read-write memory. The size of computer memory (RAM) is referred to as the total memory size of the memory bank.

With the rapid development of internet technology, the performance requirement and the frequency requirement of the memory bank are gradually improved, so that the heat dissipation capability of the memory bank is more highly required. In order to avoid the excessive temperature of the memory bank, on one hand, the heat dissipation capacity of the chassis can be improved, for example, a CPU heat dissipation air duct is adjusted, and an air cooling component, a water cooling component and the like are additionally arranged; on the other hand, it is necessary to improve the heat dissipation capability of the memory bank itself, such as adding heat dissipation fins to the memory bank. However, in general, because of the size and weight limitation of the memory bank, the metal heat sink is generally thinner, which has a certain difficulty in designing the heat sink to be assembled and assembled in terms of assembly, and when the memory bank heats, the memory bank will expand in heat, especially the position coated with the heat sink, so as to further increase the requirement on the reliability of the memory bank assembly. Under the restriction that the metal radiating fin is thinner, challenges are presented to stability and reliability of assembly, the assembly mode with too complex structure can increase manufacturing cost to a certain extent, and reliable assembly cannot be realized if the structure is too simple.

Disclosure of utility model

The utility model aims to at least solve one of the technical problems that the assembly mode of the heat dissipation memory strip is not reliable enough, the use requirement is difficult to meet, and the production cost is easy to increase due to the excessively complex assembly structure in the prior art.

Therefore, the utility model provides a heat dissipation memory bank.

The utility model provides a heat dissipation memory strip, comprising: the memory function component is limited in a containing cavity formed by assembling the heat dissipation plate and the limiting component;

A first limiting part and a second limiting part are formed between the radiating plate and the limiting component; the first limiting part is at least used for limiting the relative movement of the radiating plate and the limiting assembly in a first direction, the second limiting part is at least used for limiting the relative movement of the radiating plate and the limiting assembly in a second direction, and the directions of the first direction and the second direction are opposite.

According to the technical scheme of the utility model, the heat dissipation memory bank can also have the following additional technical characteristics:

In the above technical scheme, be formed with first recess on the radiating plate, spacing subassembly is formed with the first arch that matches with first recess, first recess and first protruding mortise-tenon joint form first spacing portion.

In the above technical scheme, the spacing subassembly has spacing face, spacing face and the top surface butt cooperation of heat dissipation plate form second spacing portion.

In the above technical solution, the contact surface where the first groove and the first protrusion form the restriction in the first direction is defined as a first contact surface, the contact surface where the limiting surface of the limiting component and the top surface of the heat dissipating plate form is defined as a second contact surface, and the area of the second contact surface is larger than that of the first contact surface.

In the above technical scheme, the heat dissipation plate further comprises a fixing clamping piece, wherein the fixing clamping piece is used for limiting the heat dissipation plate and the limiting component to move relatively in a third direction, and the third direction is perpendicular to the first direction and the second direction.

In the above technical scheme, spacing subassembly is equipped with first assembly groove, the heat dissipation plate is equipped with the second assembly groove that matches with first assembly groove position, first assembly groove link up with the second assembly groove and form the assembly region, fixed clamping piece centre gripping forms the restriction to heat dissipation plate and spacing subassembly in the third direction in the assembly region.

In the above technical scheme, the limiting component comprises a light-transmitting lamp strip.

In the above technical scheme, the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, and the first heat dissipation plate and the second heat dissipation plate are respectively connected with the limiting assembly and form the accommodating cavity.

In the above technical scheme, the heat dissipation device further comprises a first heat dissipation adhesive and a second heat dissipation adhesive, wherein the first heat dissipation plate is contacted with the memory functional component through the first heat dissipation adhesive, and forms a heat conduction path; the second heat dissipation plate is contacted with the memory functional component through second heat dissipation glue and forms a heat conduction path.

In the above technical solution, the memory functional component includes a substrate, and memory particles and memory heating elements disposed on the substrate.

In summary, due to the adoption of the technical characteristics, the utility model has the beneficial effects that: the heat dissipation memory strip is simple in structure and reliable in assembly, the reliable assembly of the memory strip in the vertical direction is realized through the combined limitation of the first limiting part and the second limiting part, and the problem of loose engagement caused by the thinner thickness of the metal heat dissipation plate is solved; the reliable assembly of the memory strip in the horizontal direction is further realized through the metal clamping piece, and the assembly stability is further improved; the whole structure is simple, the assembly is easy, and the manufacturing cost can be effectively reduced.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of an overall assembly of a heat dissipating memory stripe according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram illustrating a combination of heat dissipating memory banks according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram illustrating an assembly of a heat dissipating plate and a limiting assembly in a heat dissipating memory bank according to an embodiment of the present utility model;

fig. 4 is a schematic diagram illustrating an assembly principle of a heat dissipating plate and a limiting assembly in a heat dissipating memory bank according to an embodiment of the present utility model.

The correspondence between the reference numerals and the component names in fig. 1 to 4 is:

1. A heat dissipating plate; 2. a limit component; 3. a memory function component; 4. a receiving chamber; 5. fixing the clamping piece; 6. a first heat-dissipating adhesive; 7. a second heat-dissipating adhesive;

11. A first groove; 12. a second fitting groove; 13. a first heat dissipation plate; 14. a second heat dissipation plate; 21. a first protrusion; 22. a limiting surface; 23. a first fitting groove;

31. A substrate; 32. memory particles; 33. a memory heating element.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced otherwise than as described herein, and therefore the scope of the present utility model is not limited to the specific embodiments disclosed below.

A heat dissipation memory bank according to some embodiments of the present utility model is described below with reference to fig. 1 to 4.

Some embodiments of the present application provide a heat dissipating memory bank.

As shown in fig. 1, a first embodiment of the present utility model provides a heat dissipation memory bank, including: the heat dissipation plate 1, the limiting component 2 and the memory function component 3, wherein the memory function component 3 is limited in a containing cavity 4 formed by assembling the heat dissipation plate 1 and the limiting component 2; the memory function assembly 3 is a core component of a memory bank, and is used for realizing a memory function, and is a source of heating of the memory bank, specifically, the memory function assembly 3 includes a substrate 31, and memory particles 32 and memory heating elements 33 disposed on the substrate 31; the heat dissipation plate 1 is a detachable shell made of metal materials, and the heat dissipation plate 1 is used for rapidly conducting heat emitted by the memory function assembly 3 to the outside, so that the influence of temperature on the performance of the memory function assembly 3 is reduced; as shown in fig. 2, the memory function assembly 3 is fixed in the accommodating cavity 4 formed by the limit assembly 2 and the heat dissipation plate 1, and it is understood that the accommodating cavity 4 may be a full-surrounding or half-surrounding space.

In order to realize reliable assembly of the heat dissipation plate 1 and the limiting assembly 2, a first limiting part and a second limiting part are formed between the heat dissipation plate 1 and the limiting assembly 2; the first limiting part is at least used for limiting the relative movement of the heat dissipation plate 1 and the limiting assembly 2 in a first direction, the second limiting part is at least used for limiting the relative movement of the heat dissipation plate 1 and the limiting assembly 2 in a second direction, and the directions of the first direction and the second direction are opposite. The first limiting part and the second limiting part are arranged to form an interlocking structure, so that the tendency that the heat dissipation plate 1 and the limiting assembly 2 are mutually separated is mainly limited. It should be noted that the first limiting portion and the second limiting portion are not formed in the same groove. Specifically, when the first direction is vertically upward, i.e., the heat dissipating plate 1 will be separated from the spacing assembly 2 in the vertically upward direction, the second spacing portion will provide a vertically downward force to the heat dissipating plate 1 to limit the disengagement of the heat dissipating plate 1; when the second direction is vertically upwards, i.e. the heat sink member 1 will be separated from the spacing assembly 2 in a vertically upwards direction, the first spacing will now provide a vertically downwards force to the heat sink member 1. It will be appreciated that the first and second directions are not specific to a particular direction, but are used to describe the opposite of the first and second stop directions, i.e. the interlocked state.

In some embodiments, as shown in fig. 3, a first groove 11 is formed on the heat dissipating plate 1, the limiting component 2 is formed with a first protrusion 21 matching with the first groove 11, and the first groove 11 and the first protrusion 21 are in mortise-tenon connection to form a first limiting part. By forming the first position limitation between the heat dissipating plate 1 and the limiting component 2 in this way, it can be understood that the cooperation of the first groove 11 and the first protrusion 21 already has a certain limiting capability for preventing the heat dissipating plate 1 from being separated from the limiting component 2.

In some embodiments, since the thickness of the metal plate used in the heat dissipating plate 1 is thinner, it is difficult to make the first groove 11 have enough depth, that is, the limiting capability of the first limiting portion is insufficient, so that the limiting surface 22 is further disposed on the limiting component 2, so that the limiting surface 22 is in abutting engagement with the top surface of the heat dissipating plate 1 to form a second limiting portion, as shown in fig. 3, the top surface of the heat dissipating plate 1 is processed into a V-shaped surface, and similarly, a V-shaped surface matched with the top surface of the heat dissipating plate 1 is processed on the limiting component 2, and the limiting surface 22 abuts against the top surface of the heat dissipating plate 1 to form a second position between the heat dissipating plate 1 and the limiting component 2. It will be appreciated that the tendency of the heat sink plate 1 to disengage upwardly from the spacing assembly 2 will be limited by the spacing surface 22.

In one embodiment, as shown in fig. 4, the protrusion formed between the upper inner surface of the first recess 11 and the top surface of the heat dissipating plate 1 is just limited to the recess formed between the first protrusion 21 and the limiting surface 22.

In some embodiments, the contact surface where the first recess 11 and the first protrusion 21 form a restriction in the first direction is defined as a first contact surface, and the contact surface where the limit surface 22 of the limit component 2 and the top surface of the heat dissipating plate 1 form a second contact surface, and the area of the second contact surface is larger than that of the first contact surface. It can be seen that the arrangement of the second contact surface increases the whole limiting area, so that the limiting is more stable and reliable. When the memory strip continuously generates heat, the heat dissipation silica gel in the memory strip is heated and expanded, and the heat dissipation plate is subjected to outward force under the action of expansion, and in general, the area of the heat dissipation silica gel does not meet the contact with the inner surface of the whole heat dissipation plate, as shown in fig. 1, the heat dissipation silica gel (the first heat dissipation gel 6 and the second heat dissipation gel 7) is only contacted with the lower part of the heat dissipation plate, when the heat dissipation silica gel is heated and expanded, the heat dissipation plate is subjected to upward torsion force as shown in fig. 4, and at the moment, the torsion force of the part is offset under the limitation of the second contact surface, so that the outward expansion of the heat dissipation plate is prevented from causing structural deformation.

In some embodiments, the heat dissipation plate further includes a fixing clip 5, where the fixing clip 5 is clamped between the limiting component 2 and the heat dissipation plate 1, so that the limiting component 2 and the heat dissipation plate 1 are further assembled into a whole, and in particular, the fixing clip 5 is used to limit the heat dissipation plate 1 and the limiting component 2 to move relatively in a third direction, and the third direction is perpendicular to the first direction and the second direction. Referring to fig. 1, when the first direction and the second direction are vertically upward and vertically downward, respectively, the third direction indicates a horizontal direction.

In a specific embodiment, the limiting component 2 is provided with a first assembling groove 23, the heat dissipating plate 1 is provided with a second assembling groove 12 matched with the first assembling groove 23 in position, the first assembling groove 23 and the second assembling groove 12 are communicated to form an assembling area, and the fixing clamping piece 5 is clamped in the assembling area to limit the heat dissipating plate 1 and the limiting component 2 in a third direction. Through the arrangement, the whole surface of the memory strip is kept flat, and as preferable, the area of the fixing clamping piece 5 and the area of the assembly area are the same, the adaptation degree is increased, and the assembly reliability is further improved.

In some embodiments, in order to meet the aesthetic or indication requirement of the memory bank, a light-transmitting light band is further disposed on the memory bank, and in this embodiment, in order to improve the integration level of the memory bank, the light-transmitting light band is integrated on the limiting component 2.

In some embodiments, the heat dissipating plate 1 includes a first heat dissipating plate 13 and a second heat dissipating plate 14, where the first heat dissipating plate 13 and the second heat dissipating plate 14 are respectively connected to the spacing assembly 2 and form the accommodating cavity 4. The first heat dissipation plate 13 and the second heat dissipation plate 14 are made of metal, are mutually independent and are respectively connected with the limiting component 2 in a matched mode, and specifically, the first heat dissipation plate 13 and the second heat dissipation plate 14 are respectively arranged on two sides of the limiting component 2.

In some embodiments, the heat dissipation device further comprises a first heat dissipation glue 6 and a second heat dissipation glue 7, wherein the first heat dissipation plate 13 is contacted with one side of the memory function assembly 3 through the first heat dissipation glue 6 and forms a heat conduction path; the second heat dissipation plate 14 contacts with the other side of the memory functional component 3 through the second heat dissipation glue 7, and forms a heat conduction path.

In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A heat dissipating memory bank, comprising: the memory comprises a heat dissipation plate (1), a limiting assembly (2) and a memory functional assembly (3), wherein the memory functional assembly (3) is limited in a containing cavity (4) formed by assembling the heat dissipation plate (1) and the limiting assembly (2);

A first limiting part and a second limiting part are formed between the radiating plate (1) and the limiting assembly (2); the first limiting part is at least used for limiting the relative movement of the radiating plate (1) and the limiting assembly (2) in a first direction, the second limiting part is at least used for limiting the relative movement of the radiating plate (1) and the limiting assembly (2) in a second direction, and the directions of the first direction and the second direction are opposite.

2. The heat dissipation memory chip as set forth in claim 1, wherein the heat dissipation plate (1) is formed with a first groove (11), the limit component (2) is formed with a first protrusion (21) matched with the first groove (11), and the first groove (11) and the first protrusion (21) are connected in a mortise-tenon manner to form a first limit portion.

3. The heat dissipation memory chip as recited in claim 2, wherein the limit component (2) has a limit surface (22), and the limit surface (22) is in abutting fit with the top surface of the heat dissipation plate (1) to form a second limit portion.

4. A heat dissipating memory stripe according to claim 3, wherein the contact surface of the first recess (11) and the first protrusion (21) forming a limit in the first direction is defined as a first contact surface, and the contact surface of the limit surface (22) of the limit component (2) and the top surface of the heat dissipating plate (1) is defined as a second contact surface, and the area of the second contact surface is larger than the area of the first contact surface.

5. The heat dissipating memory chip of claim 1, further comprising a fixing clip (5), wherein the fixing clip (5) is configured to limit the heat dissipating plate (1) and the limiting component (2) to move relatively in a third direction, and the third direction is perpendicular to the first direction and the second direction.

6. The heat dissipation memory chip as recited in claim 5, wherein the limit component (2) is provided with a first assembly groove (23), the heat dissipation plate (1) is provided with a second assembly groove (12) matched with the first assembly groove (23), the first assembly groove (23) and the second assembly groove (12) are communicated to form an assembly area, and the fixing clip (5) is clamped in the assembly area to limit the heat dissipation plate (1) and the limit component (2) in a third direction.

7. A heat dissipating memory stripe according to claim 1, wherein said spacing component (2) comprises a light transmissive light strip.

8. A heat dissipating memory stripe according to claim 1, wherein the heat dissipating plate (1) comprises a first heat dissipating plate (13) and a second heat dissipating plate (14), and the first heat dissipating plate (13) and the second heat dissipating plate (14) are respectively connected to the limiting component (2) and form the accommodating cavity (4).

9. The heat dissipation memory chip according to claim 8, further comprising a first heat dissipation glue (6) and a second heat dissipation glue (7), wherein the first heat dissipation plate (13) is contacted with the memory function component (3) through the first heat dissipation glue (6) and forms a heat conduction path; the second radiating plate (14) is contacted with the memory functional component (3) through the second radiating glue (7) and forms a heat conduction path.

10. A heat dissipating memory stripe according to claim 1, wherein said memory functional component (3) comprises a substrate (31) and memory particles (32) and memory heating elements (33) arranged on the substrate (31).