CN221056223U - Computer motherboard performance detection device - Google Patents
Computer motherboard performance detection device Download PDFInfo
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- CN221056223U CN221056223U CN202322609211.2U CN202322609211U CN221056223U CN 221056223 U CN221056223 U CN 221056223U CN 202322609211 U CN202322609211 U CN 202322609211U CN 221056223 U CN221056223 U CN 221056223U
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- 238000001514 detection method Methods 0.000 title claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 230000006835 compression Effects 0.000 claims description 14
- 238000007906 compression Methods 0.000 claims description 14
- 238000004088 simulation Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 2
- 210000002421 cell wall Anatomy 0.000 claims 2
- 230000001105 regulatory effect Effects 0.000 claims 2
- 238000001125 extrusion Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Abstract
The utility model discloses a computer motherboard performance detection device, which comprises a bearing bottom block, wherein a bearing bottom plate is arranged at the lower end of the bearing bottom block, a detection cavity is formed in the middle of the left end of the bearing bottom block, a connecting plate is arranged on the bottom groove wall of the detection cavity, a movable chute is formed in the middle of the upper end of the connecting plate, a clamping mechanism is arranged in the movable chute, a conveying mechanism is arranged in the middle of the left end of the connecting plate, an analog heating mechanism is arranged at the front end and the rear end of the bearing bottom block, a bearing block is arranged in the middle of the upper end of the bearing bottom block, a cylinder is arranged at the upper end of the bearing block, a pressure sensor is arranged in the middle of the upper end of the cylinder, detection personnel can conveniently adjust the position of the detected computer motherboard, and the detection personnel can conveniently adjust the temperature of different actual detection cavities according to different analog environments by arranging the analog heating mechanism.
Description
Technical Field
The present utility model relates to the field of computer detection devices, and in particular, to a device for detecting performance of a computer motherboard.
Background
The computer hardware main board, namely a main board, a system board or a motherboard, is one of the most fundamental and important components of the computer, the motherboard is generally a rectangular circuit board, and main circuit systems forming the computer are arranged on the motherboard, and the motherboard generally comprises components such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light plug-in connector, an expansion slot, a direct current power supply plug-in connector of the motherboard and a plug-in card, and the like.
The traditional computer main board detection equipment is characterized in that the computer main board is clamped in the clamping equipment by the clamping equipment, then corresponding pressure is applied to the computer main board, the maximum pressure born by the computer main board is read through the pressure sensor to detect the breakage resistance and the pressure resistance of the computer main board, when the computer main board works, the case of the computer main board can generate heat, the breakage resistance and the pressure resistance of the computer main board are interfered, the environment temperature of the computer main board during working cannot be simulated by the traditional detection method, and the breakage resistance and the pressure resistance of the computer main board at different environment temperatures cannot be accurately detected.
Disclosure of utility model
The utility model mainly aims to provide a computer motherboard performance detection device which can effectively solve the problem that the computer motherboard cannot accurately detect the fracture resistance and pressure resistance of the computer motherboard at different environmental temperatures in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a computer motherboard performance detection device, includes the bearing bottom block, the bearing bottom block lower extreme is provided with the bearing bottom plate, the detection cavity has been seted up at bearing bottom block left end middle part, detection cavity bottom slot wall is provided with the connecting plate, the removal spout has been seted up at connecting plate upper end middle part, be provided with joint mechanism in the removal spout, connecting plate left end middle part is provided with conveying mechanism, bearing bottom block front end and rear end all are provided with the simulation mechanism that generates heat, bearing bottom block upper end middle part is provided with the bearing block, bearing block upper end is provided with the cylinder, cylinder upper end middle part is provided with pressure sensor.
Preferably, the clamping mechanism comprises an adjusting bottom plate, an adjusting sliding groove, clamping blocks, an adjusting threaded cross rod and an adjusting disc, the middle part of the upper end of the adjusting bottom plate is provided with the adjusting sliding groove, two groups of clamping blocks are connected in the adjusting sliding groove in a sliding manner, the lower parts of the clamping blocks are movably connected with the adjusting threaded cross rod in a threaded manner, the front end and the rear end of the adjusting threaded cross rod are inserted through the front groove wall and the rear groove wall of the adjusting sliding groove, and a group of adjusting discs are fixedly sleeved at the front end and the rear end of the adjusting threaded cross rod.
Preferably, two sets of clamping grooves are formed in opposite sides of the clamping blocks, a set of rubber pads are fixedly mounted on opposite groove walls of the clamping grooves, a set of compression screws are connected with the middle of the upper ends of the clamping blocks in a threaded mode, and the lower ends of the compression screws penetrate through the clamping grooves and are movably sleeved with a set of compression blocks.
Preferably, the conveying mechanism comprises a conveying strip block, a conveying rotary rod, an adjusting knob and a connecting supporting plate, wherein the middle thread of the front end of the conveying strip block is inserted into the conveying rotary rod in a movable mode, the left part of the outer surface of the conveying rotary rod is inserted into the moving sliding groove in a fixedly sleeved mode, the adjusting knob is fixedly connected with the upper end of the conveying strip block, and the connecting supporting plate is fixedly connected with the lower portion of the adjusting bottom plate to fixedly connect the conveying mechanism with the clamping mechanism.
Preferably, the simulation mechanism that generates heat includes the carrier block, generates heat cavity, temperature sensor, controller and heating resistor wire, carrier block front end downside fixedly connected with chamber that generates heat, the chamber left part that generates heat alternates and extends to the detection cavity through the bearing bottom block in, and the temperature sensor of multiunit evenly distributed is installed in chamber upper end left part that generates heat, carrier block upper end middle part fixed mounting has the controller, the heating resistor wire of multiunit evenly distributed is installed to the intracavity that generates heat, the simulation mechanism that generates heat passes through carrier block fixed mounting on the right side wall of bearing bottom block.
Preferably, the output end of the cylinder penetrates through the bearing block and the bearing bottom block to extend into the groove cavity of the detection cavity, and is fixedly connected with a stress pressing block, and the lower part of the stress pressing block is electrically connected with the pressure sensor.
Compared with the prior art, the utility model has the following beneficial effects:
1. According to the utility model, the clamping mechanism and the conveying mechanism are arranged, the distance between the two groups of clamping blocks is adjusted by adjusting the threaded cross rod in the clamping mechanism, the computer main board is clamped in the clamping groove between the two groups of clamping blocks, then the computer main board is pressed on the bottom wall of the clamping groove by using the compression screw, so that a detector can conveniently clamp the computer main board, and then the conveying rotary rod is rotated by rotating the adjusting knob in the conveying mechanism, so that the whole computer main board and the clamping mechanism are conveyed into the detection cavity, and the detector can conveniently adjust the position of the detected computer main board.
2. Through setting up the simulation mechanism that generates heat, be provided with the loading shoe in the simulation mechanism that generates heat, cavity, temperature sensor, controller and heating resistance wire, through controller control heating resistance wire work, use temperature sensor transmission to detect the interior true temperature of cavity, simulate out the temperature condition of computer motherboard when operational environment, the temperature of different actual detection cavities is adjusted according to different simulated environment to the inspector of being convenient for, more accurate detection of anti rupture, the withstand voltage performance of computer motherboard in different operational environment.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a device for detecting the performance of a motherboard of a computer according to the present utility model;
FIG. 2 is a left side view of a clamping mechanism and a conveying mechanism of a computer motherboard performance detection device according to the present utility model;
FIG. 3 is an exploded view of a connection board and a transport mechanism of a computer motherboard performance inspection apparatus according to the present utility model;
FIG. 4 is a schematic diagram showing the overall structure of a simulated heating mechanism of a computer motherboard performance detection device according to the present utility model;
FIG. 5 is a cross-sectional view of a heat generating chamber of a computer motherboard performance inspection apparatus according to the present utility model;
Fig. 6 is a cross-sectional view of a supporting base block of a computer motherboard performance test apparatus according to the present utility model. In the figure: 1. supporting the bottom block; 2. a supporting bottom plate; 3. detecting the cavity; 4. a connecting plate; 41. moving the chute; 5. a clamping mechanism; 51. adjusting the bottom plate; 52. adjusting the chute; 53. a clamping block; 531. a clamping groove; 532. a rubber pad; 533. a compression screw; 534. a compaction block; 54. adjusting the threaded cross bar; 55. an adjusting plate; 6. a conveying mechanism; 61. conveying the bar blocks; 62. conveying rotary rods; 63. an adjustment knob; 64. the supporting plate is connected; 7. simulating a heating mechanism; 71. a bearing block; 72. a heating chamber; 73. a temperature sensor; 74. a controller; 75. a heating resistance wire; 8. a support block; 9. a cylinder; 91. a stress briquetting; 10. a pressure sensor.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-6, a computer motherboard performance detection device comprises a supporting bottom block 1, wherein a supporting bottom plate 2 is arranged at the lower end of the supporting bottom block 1, a detection cavity 3 is formed in the middle of the left end of the supporting bottom block 1, a connecting plate 4 is arranged on the bottom groove wall of the detection cavity 3, a movable sliding groove 41 is formed in the middle of the upper end of the connecting plate 4, a clamping mechanism 5 is arranged in the movable sliding groove 41, a conveying mechanism 6 is arranged in the middle of the left end of the connecting plate 4, a simulated heating mechanism 7 is arranged at the front end and the rear end of the supporting bottom block 1, a supporting block 8 is arranged at the middle of the upper end of the supporting bottom block 1, a cylinder 9 is arranged at the upper end of the supporting block 8, and a pressure sensor 10 is arranged at the middle of the upper end of the cylinder 9.
The clamping mechanism 5 comprises an adjusting bottom plate 51, an adjusting chute 52, clamping blocks 53, an adjusting threaded cross rod 54 and an adjusting disk 55, wherein the middle part of the upper end of the adjusting bottom plate 51 is provided with the adjusting chute 52, two groups of clamping blocks 53 are connected in a sliding way in the adjusting chute 52, the lower parts of the two groups of clamping blocks 53 are movably connected with the adjusting threaded cross rod 54 through threads, the front end and the rear end of the adjusting threaded cross rod 54 are respectively inserted through the front wall and the rear wall of the adjusting chute 52, a group of adjusting disk 55 is fixedly sleeved at the front end and the rear end of the adjusting threaded cross rod 54, a group of clamping grooves 531 are respectively arranged on opposite surfaces of the two groups of clamping blocks 53, a group of rubber pads 532 are respectively fixedly arranged on opposite groove walls of the clamping grooves 531, a group of compression screws 533 are respectively connected in a threaded way at the middle part of the upper end of the clamping blocks 53, the lower ends of the compression screws 533 are respectively inserted through the clamping grooves 531, a group of compression blocks 534 are movably sleeved at the lower ends of the clamping grooves 534, the conveying mechanism 6 comprises a conveying strip block 61, a conveying rotary rod 62, an adjusting knob 63 and a connecting supporting plate 64, the middle part of the front end of the conveying strip block 61 is threaded and movably connected with the conveying rotary rod 62, the left part of the outer surface of the conveying rotary rod 62 is threaded and fixedly sleeved with the adjusting knob 63 through the moving chute 41, the upper end of the conveying strip block 61 is fixedly connected with the connecting supporting plate 64, the connecting supporting plate 64 is fixedly connected with the lower part of the adjusting bottom plate 51 to fixedly connect the conveying mechanism 6 with the clamping mechanism 5, the distance between the two groups of clamping blocks 53 is adjusted through adjusting the adjusting threaded cross rod 54 in the clamping mechanism 5, the computer main board is clamped in the clamping groove 531 between the two groups of clamping blocks 53, the pressing screw 533 is used for pressing the computer main board on the bottom wall of the clamping groove 531, the computer main board is conveniently clamped by a detector, then the computer main board is rotated through rotating the adjusting knob 63 in the conveying mechanism 6, thereby carry whole computer motherboard and joint mechanism 5 to detect in the cavity 3, the position of the computer motherboard that the inspection crew of being convenient for adjusted and detect, rubber pad 532 can cushion the extrusion force of grip block 53, prevents that the computer motherboard atress is too big.
The simulated heating mechanism 7 comprises a bearing block 71, a heating cavity 72, a temperature sensor 73, a controller 74 and heating resistance wires 75, the heating cavity 72 is fixedly connected to the lower side of the front end of the bearing block 71, the left part of the heating cavity 72 penetrates through the bearing bottom block 1 to extend into the detection cavity 3, a plurality of groups of uniformly distributed temperature sensors 73 are arranged at the left part of the upper end of the heating cavity 72, the controller 74 is fixedly arranged in the middle of the upper end of the bearing block 71, a plurality of groups of uniformly distributed heating resistance wires 75 are arranged in the inner cavity of the heating cavity 72, the simulated heating mechanism 7 is fixedly arranged on the right side wall of the bearing bottom block 1 through the bearing block 71, the heating resistance wires 75 are controlled to work through the controller 74, the real temperature in the detection cavity 3 is transmitted through the temperature sensor 73, the temperature condition of a computer main board in the working environment is simulated, and the temperature of different actual detection cavities 3 can be conveniently adjusted by detection personnel according to different simulated environments.
The output of cylinder 9 alternates through bearing piece 8 and bearing bottom block 1 and extends to the inslot that detects cavity 3, and the output fixedly connected with stress briquetting 91 of cylinder 9, stress briquetting 91 lower part and pressure sensor 10 electric connection, stress briquetting 91 and computer motherboard extrusion contact can pass through pressure sensor 10 accurate presentation with the extrusion force and give the inspector.
It should be noted that, in the use of the present utility model, the detecting personnel adjusts the distance between the two groups of clamping blocks 53 to a proper position by rotating the adjusting threaded cross bar 54, then places the computer motherboard between the two groups of clamping blocks 53, then reverses the adjusting threaded cross bar 54 to clamp the computer motherboard, the rubber pad 532 can buffer the extrusion force of the clamping blocks 53, so as to prevent the computer motherboard from being stressed too much, then adjusts the compression screw 533, uses the compression block 534 to compress the computer motherboard on the bottom wall of the clamping groove 531, then uses the adjusting knob 63 in the rotating conveying mechanism 6 to rotate the conveying screw 62, so that the whole computer motherboard and the clamping mechanism 5 are conveyed into the detecting cavity 3, the controller 74 in the simulated heating mechanism 7 is started, so that the heating resistor wire 75 works, the working temperature of the computer motherboard in different environments is simulated, the real-time temperature in the detecting cavity 3 is transmitted by the temperature sensor 73, the cylinder 9 is started, the output end of the cylinder 9 is pressed down, the compression force 91 is pressed on the clamping mechanism 5, and the computer motherboard is pressed against the clamping mechanism 5, so that the computer motherboard is not subjected to the detection of the overpressure performance of the computer motherboard.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a computer motherboard performance detection device, includes bearing bottom block (1), its characterized in that: the lower end of the bearing bottom block (1) is provided with a bearing bottom plate (2), the middle part of the left end of the bearing bottom block (1) is provided with a detection cavity (3), the bottom groove wall of the detection cavity (3) is provided with a connecting plate (4), the middle part of the upper end of the connecting plate (4) is provided with a movable chute (41), the movable chute (41) is internally provided with a clamping mechanism (5), the novel intelligent heating device is characterized in that a conveying mechanism (6) is arranged in the middle of the left end of the connecting plate (4), a simulated heating mechanism (7) is arranged at the front end and the rear end of the supporting bottom block (1), a supporting block (8) is arranged in the middle of the upper end of the supporting bottom block (1), an air cylinder (9) is arranged at the upper end of the supporting block (8), and a pressure sensor (10) is arranged in the middle of the upper end of the air cylinder (9).
2. The computer motherboard performance detection apparatus as recited in claim 1, wherein: clamping mechanism (5) are including adjusting bottom plate (51), adjusting spout (52), grip block (53), adjusting thread horizontal pole (54) and regulating disk (55), adjusting spout (52) have been seted up at adjusting bottom plate (51) upper end middle part, sliding connection has two sets of grip block (53) in adjusting spout (52), two sets of equal screw thread swing joint in grip block (53) lower part has adjusting thread horizontal pole (54), both ends all alternate around adjusting spout (52) cell wall around adjusting thread horizontal pole (54), just both ends are all fixed around adjusting thread horizontal pole (54) have cup jointed a set of regulating disk (55).
3. The computer motherboard performance detection apparatus as recited in claim 2, wherein: two sets of clamping grooves (531) have all been seted up to the opposite one side of grip block (53), the equal fixed mounting of opposite cell wall of clamping groove (531) has a set of rubber pad (532), the equal threaded connection in grip block (53) upper end middle part has a set of compression screw (533), compression screw (533) lower extreme has been passed through clamping groove (531) activity and has been cup jointed a set of compression block (534).
4. A computer motherboard performance testing apparatus according to claim 3, wherein: conveying mechanism (6) are including carrying stick (61), carrying dwang (62), adjust knob (63) and connection layer board (64), carry stick (61) front end middle part screw thread interlude swing joint to have and carry dwang (62), carry dwang (62) surface left part interlude through removal spout (41) fixed sleeve joint adjust knob (63), carry stick (61) upper end fixedly connected with connection layer board (64), connection layer board (64) and adjustment bottom plate (51) lower part fixed connection are in the same place conveying mechanism (6) and joint mechanism (5) fixed connection.
5. The computer motherboard performance detection apparatus as recited in claim 4, wherein: the simulation mechanism that generates heat (7) include carrier block (71), generate heat cavity (72), temperature sensor (73), controller (74) and heating resistor wire (75), carrier block (71) front end downside fixedly connected with chamber (72) that generates heat, chamber (72) left portion alternates in bearing bottom block (1) extends to detection cavity (3), and chamber (72) upper end left portion that generates heat installs multiunit evenly distributed temperature sensor (73), carrier block (71) upper end middle part fixed mounting has controller (74), generate heat and install multiunit evenly distributed heating resistor wire (75) in the cavity of cavity (72), simulation mechanism that generates heat (7) are on the right side wall of bearing bottom block (1) through carrier block (71) fixed mounting.
6. The computer motherboard performance detection apparatus as recited in claim 5, wherein: the output end of the air cylinder (9) penetrates through the bearing block (8) and the bearing bottom block (1) to extend into the groove cavity of the detection cavity (3), the output end of the air cylinder (9) is fixedly connected with the stress pressing block (91), and the lower part of the stress pressing block (91) is electrically connected with the pressure sensor (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322609211.2U CN221056223U (en) | 2023-09-26 | 2023-09-26 | Computer motherboard performance detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322609211.2U CN221056223U (en) | 2023-09-26 | 2023-09-26 | Computer motherboard performance detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221056223U true CN221056223U (en) | 2024-05-31 |
Family
ID=91223183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322609211.2U Active CN221056223U (en) | 2023-09-26 | 2023-09-26 | Computer motherboard performance detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221056223U (en) |
-
2023
- 2023-09-26 CN CN202322609211.2U patent/CN221056223U/en active Active
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