CN221048777U

CN221048777U - Semiconductor wafer cutting machine

Info

Publication number: CN221048777U
Application number: CN202322528623.3U
Authority: CN
Inventors: 王丹丹; 李真颜; 刘彤
Original assignee: Suzhou Hengxin Microelectronics Co ltd
Current assignee: Suzhou Hengxin Microelectronics Co ltd
Priority date: 2023-09-18
Filing date: 2023-09-18
Publication date: 2024-05-31
Anticipated expiration: 2033-09-18

Abstract

The utility model discloses a semiconductor wafer cutting machine, and relates to the technical field of wafer processing. The wafer placement device comprises a support seat, wherein a cutting assembly is arranged at the top of the support seat, a wafer placement table is arranged at the top of the support seat, and a lifting assembly is arranged on the surface of the wafer placement table. According to the utility model, the first motor drives the screw rod to rotate, the screw rod drives the sliding block to slide in the sliding sleeve, so that the rotating assembly and the spraying assembly are pulled to move up and down, the spraying height position is adjusted, the second motor drives the driving wheel to rotate, the driving wheel drives the driven wheel to rotate, so that the spraying assembly is driven to reciprocate at the outer side of the wafer placing table, the surface of the wafer placing table is fully sprayed and cleaned, the spraying assembly is used for spraying and cleaning the surface of equipment, and chips which are not easy to find and remain on the workbench are cleaned rapidly, so that the wafer placing table is beneficial to the use and maintenance of the equipment.

Description

Semiconductor wafer cutting machine

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a semiconductor wafer cutting machine.

Background

The semiconductor wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the polysilicon is dissolved and then doped with silicon crystal seeds, a silicon crystal bar is formed by pulling out, the silicon wafer is formed after grinding, polishing and slicing, and the wafer is cut and processed into various circuit element structures. The Chinese patent with the bulletin number of CN217394074U discloses a semiconductor wafer cutting machine which comprises a first box body, wherein a first rotating motor is fixedly arranged on the first box body, a first lead screw is fixedly connected with the first rotating motor, a first moving block is slidably connected with the first lead screw, and the first moving block is fixedly connected with a supporting rod and a telescopic rod.

To this open technology, in the use of current semiconductor wafer cutting machine, its emery wheel rotates and can drive the piece that the cutting produced and splash everywhere, and piece of wafer department is washed away by cooling water, but can remain the piece that is difficult for finding on the workstation, and the clearance is got up very laboriously, uses comparatively inconveniently.

For this purpose, a semiconductor wafer dicing machine is proposed.

Disclosure of utility model

The utility model aims at: in order to solve the above problems, the present utility model provides a semiconductor wafer dicing machine.

The utility model adopts the following technical scheme for realizing the purposes:

The utility model provides a semiconductor wafer cutting machine, includes the supporting seat, the top of supporting seat is provided with cutting assembly, the top of supporting seat is provided with the wafer and places the platform, the surface that the platform was placed to the wafer is provided with the lifting assembly, the removal end of lifting assembly is provided with rotating assembly, rotating assembly's bottom is provided with the cover and establishes to the wafer and place the spraying assembly in the platform outside, the surface of supporting seat is provided with the infusion subassembly to waste liquid reflux treatment.

Further, the supporting seat comprises a sliding rail, a bottom plate is fixedly arranged at the bottom of the sliding rail, and an operation table is arranged at the front side of the bottom plate.

Further, the lifting assembly comprises a connecting plate, the connecting plate is fixedly arranged on the front side of the wafer placing table, a sliding sleeve is fixedly arranged at the top of the connecting plate, a first motor is fixedly arranged at one end of the sliding sleeve, a screw is fixedly arranged at the output end of the first motor, a sliding block is arranged on the surface of the screw in a threaded manner, the sliding block is attached to the inner wall of the sliding sleeve, and a limiting rod is fixedly arranged at the top of the connecting plate.

Further, the rotating assembly comprises a sleeve plate, one side of the sliding block is fixedly provided with the sleeve plate, the limiting rod and the sleeve plate are in sliding connection, the top of the sleeve plate is fixedly provided with a second motor, the output end of the second motor is fixedly connected with a driving wheel, the bottom of the sleeve plate is provided with a driven wheel in a sliding manner, and the driving wheel is in meshed connection with the driven wheel.

Further, the spray assembly comprises a spray pipe, the bottom of the driven wheel is fixedly provided with the spray pipe, the surface of the spray pipe is fixedly provided with a connecting pipe orifice, the inner side of the spray pipe is fixedly connected with an inner spray head, the outer side of the spray pipe is fixedly connected with an outer spray head, the number of the inner spray head and the outer spray head is multiple groups, and the inner spray heads and the outer spray heads of the multiple groups are arranged in a circular array.

Further, the infusion assembly comprises a liquid collecting cover, the liquid collecting cover is fixedly arranged on the outer side of the sliding rail, a water tank is arranged at the bottom of the sliding rail, a filter box is arranged in the water tank in a sliding insertion mode, a water receiving cover is fixedly arranged on one side of the water tank and communicated with the bottom of the liquid collecting cover, a water suction pump is arranged on one side of the water tank, and a water conveying pipe is fixedly connected to the output end of the water suction pump.

The beneficial effects of the utility model are as follows:

1. According to the utility model, the first motor drives the screw rod to rotate, the screw rod drives the sliding block to slide in the sliding sleeve, so that the rotating assembly and the spraying assembly are pulled to move up and down, the spraying height position is adjusted, the second motor drives the driving wheel to rotate, the driving wheel drives the driven wheel to rotate, so that the spraying assembly is driven to reciprocate at the outer side of the wafer placing table, the surface of the wafer placing table is fully sprayed and cleaned, the spraying assembly is used for spraying and cleaning the surface of equipment, and the residual chips which are not easy to find on the working table are quickly cleaned, so that the use and maintenance of the equipment are facilitated, the filtered running water in the water tank is pumped to the spraying assembly through the water suction pump, the water source is recycled, and the consumption of water resources is reduced.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic bottom view of the present utility model;

FIG. 3 is a schematic elevational view in cross-section of the present utility model;

FIG. 4 is a schematic view in partial cross-section of the present utility model;

Reference numerals: 1. a support base; 101. a slide rail; 102. a bottom plate; 103. an operation table; 2. a cutting assembly; 3. a wafer placement stage; 4. a lifting assembly; 401. a connecting plate; 402. a sliding sleeve; 403. a first motor; 404. a screw; 405. a slide block; 406. a limit rod; 5. a rotating assembly; 501. a sleeve plate; 502. a second motor; 503. a driving wheel; 504. driven wheel; 6. a spray assembly; 601. a shower pipe; 602. a connecting pipe orifice; 603. an inner nozzle; 604. an outer spray head; 7. an infusion assembly; 701. a liquid receiving cover; 702. a water tank; 703. a filter box; 704. a water receiving cover; 705. a water pump; 706. a water pipe.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In describing embodiments of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "inner", "outer", "upper", etc. are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in place when the inventive product is used, are merely for convenience of description and simplification of description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

As shown in fig. 1, 2, 3 and 4, a semiconductor wafer cutting machine comprises a supporting seat 1, wherein a cutting assembly 2 is arranged at the top of the supporting seat 1, a wafer placing table 3 is arranged at the top of the supporting seat 1, a lifting assembly 4 is arranged on the surface of the wafer placing table 3, a rotating assembly 5 is arranged at the moving end of the lifting assembly 4, a spraying assembly 6 sleeved outside the wafer placing table 3 is arranged at the bottom of the rotating assembly 5, and an infusion assembly 7 for carrying out reflux treatment on waste liquid is arranged on the surface of the supporting seat 1; specifically, through the removal of drive cutting assembly 2 and wafer placement platform 3 on supporting seat 1, thereby carry out cutting process to placing the wafer on the wafer placement platform 3, drive rotating assembly 5 and spray subassembly 6 through lifting assembly 4 and reciprocate, thereby adjust the high position that sprays, drive the reciprocal rotation of spray subassembly 6 through rotating assembly 5, make and place the surface everywhere of platform 3 and carry out abundant washing treatment that sprays, receive the waste liquid that contains the piece through infusion subassembly 7 surface flow down of supporting seat 1, filter it, and carry again to spray subassembly 6 department and supply to spray the use, save the water source consumption.

As shown in fig. 1 and 2, the supporting seat 1 comprises a sliding rail 101, a bottom plate 102 is fixedly arranged at the bottom of the sliding rail 101, and an operation table 103 is arranged at the front side of the bottom plate 102; specifically, the slide rail 101 is used for the wafer placing table 3 to slide transversely thereon, and the operation of the device is regulated and controlled by the operation table 103.

As shown in fig. 1 and 4, the lifting assembly 4 comprises a connecting plate 401, wherein the connecting plate 401 is fixedly arranged on the front side of the wafer placing table 3, a sliding sleeve 402 is fixedly arranged at the top of the connecting plate 401, a first motor 403 is fixedly arranged at one end of the sliding sleeve 402, a screw 404 is fixedly arranged at the output end of the first motor 403, a sliding block 405 is arranged on the surface thread of the screw 404, the sliding block 405 is attached to the inner wall of the sliding sleeve 402, and a limiting rod 406 is fixedly arranged at the top of the connecting plate 401; specifically, the first motor 403 drives the screw 404 to rotate, the screw 404 drives the sliding block 405 to slide in the sliding sleeve 402, so that the rotating assembly 5 and the spraying assembly 6 are pulled to move up and down, the height position of spraying is adjusted, and the lifting of the rotating assembly 5 is guided and limited through the limiting rod 406, so that the moving process is more stable.

As shown in fig. 1, 3 and 4, the rotating assembly 5 comprises a sleeve plate 501, one side of a sliding block 405 is fixedly provided with the sleeve plate 501, a limit rod 406 is in sliding connection with the sleeve plate 501, the top of the sleeve plate 501 is fixedly provided with a second motor 502, the output end of the second motor 502 is fixedly connected with a driving wheel 503, the bottom of the sleeve plate 501 is slidably provided with a driven wheel 504, and the driving wheel 503 and the driven wheel 504 are in meshed connection; specifically, the second motor 502 drives the driving wheel 503 to rotate, and the driving wheel 503 drives the driven wheel 504 to rotate, so as to drive the spraying assembly 6 to reciprocate at the outer side of the wafer placing table 3, and perform sufficient spraying cleaning treatment on the surface of the wafer placing table.

As shown in fig. 1 and 4, the spray assembly 6 comprises a spray pipe 601, the bottom of the driven wheel 504 is fixedly provided with the spray pipe 601, the surface of the spray pipe 601 is fixedly provided with a connecting pipe orifice 602, the inner side of the spray pipe 601 is fixedly connected with an inner spray nozzle 603, the outer side of the spray pipe 601 is fixedly connected with an outer spray nozzle 604, the number of the inner spray nozzles 603 and the outer spray nozzles 604 is multiple, and the inner spray nozzles 603 and the outer spray nozzles 604 of the multiple groups are distributed in a circular array; specifically, spray cleaning is performed on the surface of the wafer placing table 3 through the inner spray head 603, spray cleaning is performed on the surface of the slide rail 101 through the outer spray head 604 following the movement of the wafer placing table 3, and chips which are not easy to find are remained on the workbench to be cleaned quickly, so that the use and maintenance of equipment are facilitated.

As shown in fig. 2 and 3, the infusion assembly 7 comprises a liquid receiving cover 701, the liquid receiving cover 701 is fixedly arranged on the outer side of the sliding rail 101, a water tank 702 is arranged at the bottom of the sliding rail 101, a filter box 703 is arranged in the water tank 702 in a sliding insertion manner, a water receiving cover 704 is fixedly arranged on one side of the water tank 702, the water receiving cover 704 is communicated with the bottom of the liquid receiving cover 701, a water suction pump 705 is arranged on one side of the water tank 702, and a water delivery pipe 706 is fixedly connected to the output end of the water suction pump 705; specifically, the liquid collection cover 701 is used for receiving the wastewater flowing down from the surface of the sliding rail 101, and the wastewater flows into the water tank 702 through the water collection cover 704, the scraps in the wastewater are filtered and collected into the filter box 703, and the filtered flowing water in the water tank 702 is pumped to the spraying assembly 6 through the water suction pump 705, so that the water source is recycled, and the consumption of water resources is reduced.

To sum up: the wafer to be processed is placed on the wafer placement table 3 by a worker, the cutting assembly 2 and the wafer placement table 3 are started to move on the sliding rail 101, the surface of the wafer is cut, splashed scraps in the cutting process fall on the surfaces of the wafer placement table 3 and the sliding rail 101, after the cutting operation is finished, the water delivery pipe 706 is connected with the connecting pipe orifice 602, the water suction pump 705 is started to pump water into the spraying pipe 601 through the water delivery pipe 706, the water is sprayed to the surfaces of the wafer placement table 3 and the sliding rail 101 from the positions of the inner spray head 603 and the outer spray head 604, the water is sprayed and cleaned, the residual scraps on the working table are quickly cleaned and removed, meanwhile, the first motor 403 is started to drive the screw 404 to rotate according to requirements, the screw 404 drives the sliding block 405 to slide in the sliding sleeve 402, so that the rotating assembly 5 and the spraying assembly 6 are pulled to move up and down, the second motor 502 is started to drive the driving wheel 503 to rotate, so that the spraying assembly 6 is driven to rotate reciprocally at the outer side of the wafer placement table 3, the equipment surface is sprayed and cleaned by the water, the residual scraps are filtered and discharged into the water tank 703, and the filtered waste water is fully flows into the water tank 703, and the filtered waste water is filtered and is recovered.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made therein without departing from the spirit and scope of the utility model, which is defined by the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a semiconductor wafer cutting machine, its characterized in that, including supporting seat (1), the top of supporting seat (1) is provided with cutting assembly (2), the top of supporting seat (1) is provided with wafer and places platform (3), the surface that platform (3) was placed to the wafer is provided with lifting assembly (4), the mobile terminal of lifting assembly (4) is provided with rotating assembly (5), the bottom of rotating assembly (5) is provided with the cover and establishes spray assembly (6) outside placing platform (3) to the wafer, the surface of supporting seat (1) is provided with infusion subassembly (7) to waste liquid reflux treatment.

2. The semiconductor wafer dicing machine according to claim 1, wherein the support base (1) comprises a slide rail (101), a bottom plate (102) is fixedly mounted at the bottom of the slide rail (101), and an operation table (103) is provided at the front side of the bottom plate (102).

3. The semiconductor wafer cutting machine according to claim 1, wherein the lifting assembly (4) comprises a connecting plate (401), the connecting plate (401) is fixedly installed on the front side of the wafer placing table (3), a sliding sleeve (402) is fixedly installed on the top of the connecting plate (401), a first motor (403) is fixedly installed at one end of the sliding sleeve (402), a screw (404) is fixedly installed at the output end of the first motor (403), a sliding block (405) is installed on the surface thread of the screw (404), the sliding block (405) is attached to the inner wall of the sliding sleeve (402), and a limiting rod (406) is fixedly installed on the top of the connecting plate (401).

4. A semiconductor wafer cutting machine according to claim 3, wherein the rotating assembly (5) comprises a sleeve plate (501), one side of the sliding block (405) is fixedly provided with the sleeve plate (501), the limiting rod (406) and the sleeve plate (501) are in sliding connection, the top of the sleeve plate (501) is fixedly provided with a second motor (502), the output end of the second motor (502) is fixedly connected with a driving wheel (503), the bottom of the sleeve plate (501) is slidably provided with a driven wheel (504), and the driving wheel (503) and the driven wheel (504) are in meshed connection.

5. The semiconductor wafer cutting machine according to claim 4, wherein the spray assembly (6) comprises a spray pipe (601), the bottom of the driven wheel (504) is fixedly provided with the spray pipe (601), the surface of the spray pipe (601) is fixedly provided with a connecting pipe orifice (602), the inner side of the spray pipe (601) is fixedly connected with an inner spray head (603), the outer side of the spray pipe (601) is fixedly connected with an outer spray head (604), the number of the inner spray heads (603) and the outer spray heads (604) is multiple, and the inner spray heads (603) and the outer spray heads (604) of the multiple groups are arranged in a circular array.

6. The semiconductor wafer cutting machine according to claim 2, wherein the infusion assembly (7) comprises a liquid receiving cover (701), the liquid receiving cover (701) is fixedly arranged on the outer side of the sliding rail (101), a water tank (702) is arranged at the bottom of the sliding rail (101), a filter box (703) is slidably inserted and installed in the water tank (702), a water receiving cover (704) is fixedly arranged on one side of the water tank (702), the water receiving cover (704) is communicated with the bottom of the liquid receiving cover (701), a water suction pump (705) is arranged on one side of the water tank (702), and a water delivery pipe (706) is fixedly connected to the output end of the water suction pump (705).