CN221043488U - Multilayer circuit board packaging structure - Google Patents
Multilayer circuit board packaging structure Download PDFInfo
- Publication number
- CN221043488U CN221043488U CN202322777449.6U CN202322777449U CN221043488U CN 221043488 U CN221043488 U CN 221043488U CN 202322777449 U CN202322777449 U CN 202322777449U CN 221043488 U CN221043488 U CN 221043488U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- blocks
- grooves
- packaging structure
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the field of circuit board packaging, in particular to a multilayer circuit board packaging structure, aiming at the problems that a circuit board is fixed in the packaging structure through bolts in the prior art, when the circuit board is overhauled and disassembled, the bolts are required to be disassembled, special tools are possibly required to be used for disassembling the circuit board in the process, the operation is complex, time and labor are wasted, and the scheme is provided.
Description
Technical Field
The utility model relates to the technical field of circuit board packaging, in particular to a multilayer circuit board packaging structure.
Background
After the single-layer or multi-layer circuit board is produced, the single-layer or multi-layer circuit board needs to be packaged through a shell, specifically, an integrated circuit bare chip produced by a foundry is placed on a substrate with a bearing function, the pins are led out, and then the integrated circuit bare chip is fixedly packaged into a whole.
Through retrieval, the patent with the bulletin number of CN218570646U discloses a multi-layer circuit board heat dissipation packaging structure, which comprises a placement shell, a circuit board arranged in the placement shell, a heat dissipation hole arranged at the bottom of the placement shell, an air filter arranged in the heat dissipation hole, and a sealing cover mechanism with a limiting function arranged on the placement shell; the sealing cover mechanism is placed on the placing shell from top to bottom, in the process, four groups of clamping hook heads are extruded by the port of the placing shell, so that the clamping hooks are bent and deformed to one side until the clamping hook heads are staggered to place the port of the placing shell, the clamping hook heads slide against the outer wall of the placing shell, and meanwhile, four groups of limiting pins penetrate through four groups of limiting holes in the circuit board and the placing shell until the clamping heads of the clamping hooks are clamped into the clamping grooves under the elastic action of the clamping hooks, and meanwhile, the rubber blocks are attached to the circuit board, so that the cover body is limited, the circuit board is limited in the placing shell, and the circuit board is convenient to install and detach by workers.
However, the technical scheme has the following problems: fix the circuit board in packaging structure through the bolt, when overhauling and dismantling the circuit board, need demolish the bolt, at this in-process, probably need specialized tool dismantle it, the operation is comparatively loaded down with trivial details, wastes time and energy.
Disclosure of utility model
The utility model aims to solve the defects that in the prior art, a circuit board is fixed in a packaging structure through bolts, the bolts are required to be removed when the circuit board is overhauled and disassembled, and in the process, special tools are possibly required to be used for disassembling the circuit board, so that the operation is complicated, and time and labor are wasted.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The utility model provides a multilayer circuit board packaging structure, includes bottom plate, top cap, casing, circuit board body and a plurality of reference column, the top of bottom plate and the bottom fixed connection of casing, the top cap sets up at the top of casing, a plurality of the one end and the bottom fixed connection of top cap of reference column, a plurality of the other end of reference column runs through circuit board body and extends to the top of bottom plate, set up a plurality of mounting holes of being convenient for installation on the bottom plate;
the fixing mechanism is arranged on the top cover and used for keeping the circuit board stable.
In one possible design, the fixing mechanism comprises two pull blocks, two moving holes, two clamping blocks, two clamping grooves and two moving rods, wherein the two moving holes are respectively formed in the top of the top cover, one ends of the two moving rods are fixedly connected with the bottoms of the two pull blocks, the two pull blocks are respectively located on two sides of the top cover, the other ends of the two moving rods are respectively fixedly connected with the tops of the two clamping blocks, one sides of the two clamping blocks, which are separated, are respectively matched with the two clamping grooves, and the two clamping grooves are respectively formed in the inner walls of two sides of the shell.
In one possible design, grooves for pushing the pull blocks are formed in the two pull blocks, and the edges of the two grooves are arc-shaped.
In one possible design, the inner walls of one side of the two moving holes are provided with round grooves, the inner walls of one side of the two round grooves are fixedly connected with springs, and one ends of the two springs are respectively and fixedly connected with one sides of the two moving rods.
In one possible design, the front side and the rear side of the two moving rods are fixedly connected with sliding blocks, the front side inner wall and the rear side inner wall of the two moving holes are provided with sliding grooves matched with the sliding blocks, and the sliding blocks are in sliding connection with the sliding grooves.
In one possible design, the bottom plate is provided with a heat dissipation hole for heat dissipation, the inner wall of the heat dissipation hole is provided with a mounting groove, the inner wall of the mounting groove is provided with a frame and a bolt hole, the bolt hole is in threaded connection with a fixing bolt, the inner wall of the frame is provided with a filter screen, the heat dissipation hole is fixedly connected with the filter screen through the frame and the fixing bolt, and the frame is provided with a reinforcing rod for reinforcing the strength of the frame.
When the circuit board is required to be disassembled, the pull block with the groove can be pulled, the pull block drives the moving rod and the sliding block to slide on the moving hole and the sliding groove, the spring in the circular groove is pulled, the moving rod drives the clamping block to move out of the clamping groove, then the positioning column on the top cover is taken out of the circuit board body, and the circuit board body is taken out of the shell for maintenance, so that the top cover can be fixed on the shell without bolts, the steps of disassembling and installing the bolts are reduced, the operation of installing and disassembling the circuit board body is simplified, the working efficiency is improved, meanwhile, the operation is performed without using additional tools, time and labor are saved, and the working principle of the circuit board body is the same as that of the bulletin number CN218570646U and is described in detail in a comparison document, and therefore, excessive details are omitted.
According to the multilayer circuit board packaging structure, through the fixing mechanism, the top cover can be fixed on the shell without bolts, the steps of disassembling and installing the bolts are reduced, the operation of installing and disassembling the circuit board body is simplified, the working efficiency is improved, and meanwhile, the operation is performed without using additional tools, so that time and labor are saved;
According to the utility model, the top cover can be fixed on the shell without bolts through the fixing mechanism, so that the steps of disassembling and installing the bolts are reduced, the operation of installing and disassembling the circuit board body is simplified, the working efficiency is improved, and meanwhile, the operation is performed without using additional tools, so that time and labor are saved.
Drawings
Fig. 1 is a schematic diagram of a front view of a multi-layer circuit board package structure according to the present utility model;
Fig. 2 is an exploded view of a multilayer circuit board package according to the present utility model;
Fig. 3 is a cross-sectional exploded view of a fixing structure of a multi-layer circuit board package structure according to the present utility model;
Fig. 4 is an exploded view of a heat dissipating structure of a multi-layer circuit board package according to the present utility model.
In the figure: 1. a bottom plate; 2. a housing; 3. a top cover; 4. pulling blocks; 5. a groove; 6. a fixing bolt; 7. positioning columns; 8. a moving hole; 9. a circuit board body; 10. a clamping block; 11. a clamping groove; 12. a moving rod; 13. a slide block; 14. a chute; 15. a spring; 16. a mounting groove; 17. a heat radiation hole; 18. a frame; 19. a reinforcing rod; 20. and (5) a filter screen.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
Referring to fig. 1-4, a multi-layer circuit board package structure is applied in the circuit board package field, and includes: the circuit board comprises a bottom plate 1, a top cover 3, a shell 2, a circuit board body 9 and a plurality of positioning columns 7, wherein the top of the bottom plate 1 is fixedly connected with the bottom of the shell 2, the top cover 3 is arranged at the top of the shell 2, one ends of the positioning columns 7 are fixedly connected with the bottom of the top cover 3, the other ends of the positioning columns 7 penetrate through the circuit board body 9 and extend to the top of the bottom plate 1, and a plurality of mounting holes convenient to mount are formed in the bottom plate 1;
And the fixing mechanism is arranged on the top cover 3 and used for keeping the circuit board stable.
Above-mentioned technical scheme through fixed establishment, can not need the bolt also can fix top cap 3 on casing 2, reduces the step of dismantling and installing the bolt, and then with the circuit board body 9 installation with the operation of dismantling become simple, increase work efficiency, need not use extra instrument to operate simultaneously, labour saving and time saving.
Referring to fig. 1-3, the fixing mechanism includes two pull blocks 4, two moving holes 8, two clamping blocks 10, two clamping grooves 11, and two moving rods 12, wherein the two moving holes 8 are respectively arranged at the top of the top cover 3, one ends of the two moving rods 12 are fixedly connected with the bottoms of the two pull blocks 4, the two pull blocks 4 are respectively positioned at two sides of the top cover 3, the other ends of the two moving rods 12 are respectively fixedly connected with the tops of the two clamping blocks 10, one sides of the two clamping blocks 10 separated from each other are respectively matched with the two clamping grooves 11, and the two clamping grooves 11 are respectively arranged on the inner walls of two sides of the shell 2.
Above-mentioned technical scheme through fixed establishment, can not need the bolt also can fix top cap 3 on casing 2, reduces the step of dismantling and installing the bolt, and then with the circuit board body 9 installation with the operation of dismantling become simple, increase work efficiency, need not use extra instrument to operate simultaneously, labour saving and time saving.
Example two
Referring to fig. 1-4, an improvement is made on the basis of the first embodiment:
referring to fig. 1-3, grooves 5 for facilitating pushing of the pull blocks 4 are formed in the two pull blocks 4, and edges of the two grooves 5 are arc-shaped.
Above-mentioned technical scheme is through setting up the corner and be curved recess 5 on drawing piece 4, conveniently promotes drawing piece 4, is convenient for open top cap 3.
Referring to fig. 1-3, circular grooves are formed in inner walls of one sides of the two moving holes 8, springs 15 are fixedly connected to inner walls of one sides of the two circular grooves, and one ends of the two springs 15 are fixedly connected with one sides of the two moving rods 12 respectively.
According to the technical scheme, the spring 15 is arranged on the moving rod 12, so that after the pull block 4 is moved, the pull block 4 can restore to the original position by itself, and the top cover 3 can be detached and installed conveniently.
Referring to fig. 1-3, the front side and the rear side of the two moving rods 12 are fixedly connected with sliding blocks 13, sliding grooves 14 matched with the sliding blocks 13 are formed in the front side inner walls and the rear side inner walls of the two moving holes 8, and the sliding blocks 13 are in sliding connection with the sliding grooves 14.
According to the technical scheme, the sliding block 13 and the sliding groove 14 are directly arranged on the moving rod 12 and the moving hole 8, so that the moving rod 12 is smoother in moving, the obstruction is reduced, and the pulling block 4 is convenient to move.
Referring to fig. 4, a heat dissipation hole 17 for heat dissipation is formed in the base plate 1, a mounting groove 16 is formed in the inner wall of the heat dissipation hole 17, a frame 18 is arranged on the inner wall of the mounting groove 16, bolt holes are formed in the inner wall of the mounting groove 16, fixing bolts 6 are connected with the bolt holes in a threaded mode, a filter screen 20 is arranged on the inner wall of the frame 18, the heat dissipation hole 17 is fixedly connected with the filter screen 20 through the frame 18 and the fixing bolts 6, and a reinforcing rod 19 for reinforcing the strength of the frame 18 is arranged on the frame 18.
According to the technical scheme, the radiating holes 17 and the filter screen 20 are formed in the bottom plate 1, so that dust is prevented from being stained on the circuit board body 9 while the circuit board body 9 radiates heat, the safety of the circuit board body 9 is further ensured, the filter screen 20 is mounted on the inner wall of the radiating holes 17 through the fixing bolts 6 and the frame 18, and the filter screen 20 can be conveniently replaced or cleaned.
The present utility model is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present utility model and the inventive concept thereof, can be replaced or changed within the scope of the present utility model.
Claims (6)
1. The utility model provides a multilayer circuit board packaging structure, its characterized in that includes bottom plate (1), top cap (3), casing (2), circuit board body (9) and a plurality of reference column (7), the top of bottom plate (1) and the bottom fixed connection of casing (2), top cap (3) set up at the top of casing (2), a plurality of the one end of reference column (7) and the bottom fixed connection of top cap (3), a plurality of the other end of reference column (7) runs through circuit board body (9) and extends to the top of bottom plate (1), a plurality of mounting holes of being convenient for install have been seted up on bottom plate (1);
and the fixing mechanism is arranged on the top cover (3) and used for keeping the circuit board stable.
2. The multilayer circuit board packaging structure according to claim 1, wherein the fixing mechanism comprises two pull blocks (4), two moving holes (8), two clamping blocks (10), two clamping grooves (11) and two moving rods (12), the two moving holes (8) are respectively arranged at the top of the top cover (3), one ends of the two moving rods (12) are fixedly connected with the bottoms of the two pull blocks (4), the two pull blocks (4) are respectively arranged at two sides of the top cover (3), the other ends of the two moving rods (12) are respectively fixedly connected with the tops of the two clamping blocks (10), one sides of the two clamping blocks (10) which are separated are respectively matched with the two clamping grooves (11), and the two clamping grooves (11) are respectively arranged on the inner walls of two sides of the shell (2).
3. The multilayer circuit board packaging structure according to claim 2, wherein grooves (5) for facilitating pushing of the pull blocks (4) are formed in the two pull blocks (4), and edges of the two grooves (5) are arc-shaped.
4. The multilayer circuit board packaging structure according to claim 2, wherein circular grooves are formed in inner walls of one sides of the two moving holes (8), springs (15) are fixedly connected to inner walls of one sides of the two circular grooves, and one ends of the two springs (15) are fixedly connected to one sides of the two moving rods (12) respectively.
5. The multilayer circuit board packaging structure according to claim 2, wherein the front side and the rear side of the two moving rods (12) are fixedly connected with sliding blocks (13), sliding grooves (14) matched with the sliding blocks (13) are formed in the front side inner walls and the rear side inner walls of the two moving holes (8), and the sliding blocks (13) are in sliding connection with the sliding grooves (14).
6. The multilayer circuit board packaging structure according to claim 1, wherein a heat dissipation hole (17) for heat dissipation is formed in the bottom plate (1), a mounting groove (16) is formed in the inner wall of the heat dissipation hole (17), a frame (18) is arranged on the inner wall of the mounting groove (16) and provided with a bolt hole, the bolt hole is in threaded connection with a fixing bolt (6), a filter screen (20) is arranged on the inner wall of the frame (18), the heat dissipation hole (17) is fixedly connected with the filter screen (20) through the frame (18) and the fixing bolt (6), and a reinforcing rod (19) for reinforcing the strength of the frame (18) is arranged on the frame (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322777449.6U CN221043488U (en) | 2023-10-17 | 2023-10-17 | Multilayer circuit board packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322777449.6U CN221043488U (en) | 2023-10-17 | 2023-10-17 | Multilayer circuit board packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221043488U true CN221043488U (en) | 2024-05-28 |
Family
ID=91170095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322777449.6U Active CN221043488U (en) | 2023-10-17 | 2023-10-17 | Multilayer circuit board packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221043488U (en) |
-
2023
- 2023-10-17 CN CN202322777449.6U patent/CN221043488U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211554881U (en) | CPU cooling fan | |
| CN221043488U (en) | Multilayer circuit board packaging structure | |
| CN210983263U (en) | Split type computer motherboard | |
| CN216873623U (en) | Aluminum-based printed circuit board | |
| CN211698847U (en) | Heat dissipation device for big data server | |
| CN214586779U (en) | Heat abstractor for computer | |
| CN217213627U (en) | Positioning assembly for computer | |
| CN220137628U (en) | Heat dissipation fan installation mechanism and computer case | |
| CN213876612U (en) | Heat radiator for be used for computer chip | |
| CN218587550U (en) | Circuit board convenient to mount for computer science | |
| CN219269288U (en) | Controller shell convenient to location installation | |
| CN216067809U (en) | High-efficient cardboard drilling equipment | |
| CN220340660U (en) | Radiator for computer | |
| CN218556438U (en) | Novel machine tool dust cover | |
| CN219881036U (en) | Stamping forming device for U disk shell hardware | |
| CN216346108U (en) | Novel heat dissipation explosion-proof lamp panel | |
| CN220823540U (en) | Anti-interference communication module external structure | |
| CN221281490U (en) | Computer motherboard fixing device | |
| CN212460451U (en) | A stable form mainboard for computer | |
| CN220028390U (en) | Sampling punching device for bolt manufacturing | |
| CN213694620U (en) | Constant current source machine case heat radiation structure | |
| CN221020532U (en) | Positioning tool for die bearing plate | |
| CN207704360U (en) | A kind of more frame fixed structures of hard disc of computer | |
| CN221121527U (en) | Air-cooled self-circulation water ring vacuum pump unit | |
| CN217064399U (en) | Nixie tube with good heat dissipation effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |