CN221041050U

CN221041050U - Semiconductor production temperature control equipment capable of avoiding high-temperature damage

Info

Publication number: CN221041050U
Application number: CN202322752183.XU
Authority: CN
Inventors: 武斌; 盛伟; 方童
Original assignee: Yasai Wuxi Semiconductor Technology Co ltd
Current assignee: Yasai Wuxi Semiconductor Technology Co ltd
Priority date: 2023-10-13
Filing date: 2023-10-13
Publication date: 2024-05-28
Anticipated expiration: 2033-10-13

Abstract

The utility model relates to the technical field of temperature control for semiconductor production, and discloses temperature control equipment for semiconductor production, which is used for avoiding high-temperature damage, and comprises a box body, a cooling water tank positioned at one side of the top of the box body and an air inlet head positioned at the middle position of two sides of the box body, wherein the box body comprises: the semiconductor refrigerator is characterized in that the mounting openings are formed in the middle positions of the two ends of the box body, sealing doors are arranged on two sides of the inside of the two groups of mounting openings, a semiconductor refrigerator is arranged in the middle position of the top of the cooling water tank, and a rotating motor is arranged in the middle position of the bottom of the cooling water tank. According to the utility model, the semiconductor refrigerator and the temperature-conducting copper sheet are used for cooling the cooling water in the cooling water tank, the rotating motor can drive the stirring frame to rotate through the rotating shaft, so that the cooling efficiency of the cooling water in the cooling water tank is higher, the cooling water is conveyed into the water pipe through the water pump, the cooling water is recycled, and the cooling effect of the temperature control device is better through continuously cooling the cooling water.

Description

Semiconductor production temperature control equipment capable of avoiding high-temperature damage

Technical Field

The utility model relates to the technical field of temperature control for semiconductor production, in particular to temperature control equipment for semiconductor production, which can avoid high-temperature damage.

Background

The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and in the production process of semiconductor equipment, the temperature of the equipment is controlled by temperature control equipment so as to ensure the production quality of the semiconductor equipment.

The application number is CN202110527117.5 discloses a temperature control equipment for semiconductor manufacturing, including temperature control box and cold water tank, the upper end of temperature control box is equipped with the opening, the both sides of temperature control box all are equipped with lifting unit, both sides be connected with the case lid between the lifting unit. The temperature control device solves the problem that the prior temperature control device for semiconductor production only adopts a refrigeration system to cool load equipment and cannot achieve ideal temperature control effect; this kind of control by temperature change equipment directly uses circulating water to the wind-force to the cooling, and the use of circulating water can lead to the temperature rising, leads to the cooling effect to production facility relatively poor, and is relatively poor to the inside ventilation effect of equipment, can not heat up and cool down production facility fast, leads to the practicality of control by temperature change equipment lower.

Disclosure of utility model

The present utility model is directed to a temperature control apparatus for semiconductor production, which avoids high temperature damage, and solves the problems set forth in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a avoid semiconductor manufacture of high temperature damage to use control by temperature change equipment, includes box, the coolant tank that is located box top one side and is located the air inlet head of box both sides intermediate position department, the box includes:

The mounting ports are arranged at the middle positions of the two ends of the box body, and sealing doors are arranged on two sides of the inside of the two groups of mounting ports.

Preferably, the intermediate position department at coolant tank top is provided with the semiconductor refrigerator, the intermediate position department of coolant tank bottom installs the rotation motor, the output of rotation motor is connected with the pivot that runs through to coolant tank does not, the pivot is located the inside one end of coolant tank and is provided with the stirring frame, the one end of coolant tank bottom is provided with the water pump, the bottom of water pump is provided with the raceway that runs through to the inside raceway of box, the inside one side of keeping away from of raceway of box is provided with the multiunit electrothermal tube.

Preferably, the two groups of air inlet heads are provided with gauze at one end far away from the box body, the two groups of air inlet heads are provided with fans inside, and the two sides of the bottom of the box body are provided with air outlet pipes.

Preferably, two groups of mounting shafts are arranged on two sides of the inside of the mounting opening, the mounting shafts penetrate through the inside of the sealing door, and a water injection pipe is arranged at one end of the top of the cooling water tank.

Preferably, the four corners of the bottom of the cooling water tank are provided with fixing rods, the cooling water tank is fixedly connected with the tank body through the fixing rods, and the semiconductor refrigerator is detachably connected with the cooling water tank through fixing bolts.

Preferably, the bottom of the semiconductor refrigerator is provided with a plurality of groups of temperature-conducting copper sheets penetrating into the cooling water tank, and the rotating motor is detachably connected with the cooling water tank through a fixing bolt.

Preferably, the middle position inside the stirring frame is provided with a mounting hole, the stirring frame is detachably connected with the rotating shaft through the mounting hole, and the stirring frame is in transmission connection with the rotating motor through the rotating shaft.

Preferably, the two ends of the bottom of the box body are provided with connecting pipes, the top end of the water pump is connected with one group of connecting pipes, and one end of the water pipe away from the water pump is connected with the other group of connecting pipes.

Preferably, the inside of two sets of air inlet heads all is provided with the mounting bracket, the fan passes through the mounting bracket and is connected with the air inlet head is detachable, the inside top of box is provided with temperature sensor.

Preferably, the two groups of air inlet heads are provided with mounting grooves at one ends far away from the box body, and the gauze is detachably connected with the air inlet heads through the mounting grooves.

Compared with the prior art, the utility model has the beneficial effects that:

1. According to the utility model, the semiconductor refrigerator and the temperature-conducting copper sheet are used for cooling the cooling water in the cooling water tank, the rotating motor can drive the stirring frame to rotate through the rotating shaft, so that the cooling efficiency of the cooling water in the cooling water tank is higher, the cooling water is conveyed into the water pipe through the water pump, the cooling water is recycled, and the cooling effect of the temperature control equipment is better through continuously cooling the cooling water;

2. According to the utility model, external air can enter the box body through the air inlet head, sundries can enter the box body through the gauze, the circulation effect of the air in the box body through the air outlet pipe is better, wind power is generated through the fan, and the wind power can be cooled and heated through the water delivery pipe and the electric heating pipe respectively, so that the load is cooled and heated, and the use effect of the temperature control equipment is better.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is a schematic diagram of the internal structure of the present utility model.

Fig. 3 is a cross-sectional view of the present utility model.

In the figure: 1. a case; 101. a mounting port; 102. sealing the door; 2. a cooling water tank; 201. a semiconductor refrigerator; 202. a rotating motor; 203. a rotating shaft; 204. a stirring rack; 205. a water pump; 206. a water pipe; 207. an electric heating tube; 3. an air inlet head; 301. a gauze; 302. a blower; 303. and (5) an air outlet pipe.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, an embodiment of a temperature control apparatus for semiconductor production for avoiding high temperature damage is provided in the present utility model: the utility model provides a avoid semiconductor manufacture of high temperature damage to use control by temperature change equipment, includes box 1, is located cooling water tank 2 of box 1 top one side and is located the air inlet head 3 of box 1 both sides intermediate position department, and box 1 includes: the mounting ports 101 are arranged at the middle positions of the two ends of the box body 1, sealing doors 102 are arranged on two sides of the inside of the two groups of mounting ports 101, and the mounting ports 101 can be sealed through the sealing doors 102.

Referring to fig. 1 and 2, a semiconductor refrigerator 201 is disposed at a middle position of a top of a cooling water tank 2, cooling water in the cooling water tank 2 can be cooled by the semiconductor refrigerator 201, a rotating motor 202 is mounted at a middle position of a bottom of the cooling water tank 2, an output end of the rotating motor 202 is connected with a rotating shaft 203 penetrating through the cooling water tank 2, one end of the rotating shaft 203, located in the cooling water tank 2, is provided with a stirring frame 204, the stirring frame 204 can be driven to rotate by the rotating motor 202 and the rotating shaft 203, cooling water can be cooled conveniently and rapidly, one end of the bottom of the cooling water tank 2 is provided with a water pump 205, a water pipe 206 penetrating through the inside of a tank 1 is disposed at a bottom end of the water pump 205, the water pipe 205 is recycled by the water pump 205, a cooling effect of temperature control equipment is better, one side, away from the water pipe 206, in the tank 1 is provided with a plurality of electric heating pipes 207, and the temperature control equipment can be heated.

Referring to fig. 1 and 3, two sets of air inlet heads 3 are provided with a gauze 301 at one end far away from the case 1, the air inlet heads 3 can be prevented from entering the case 1 by the gauze 301, fans 302 are provided in the two sets of air inlet heads 3 to generate wind force, so that the load can be cooled and warmed, and air outlet pipes 303 are provided at two sides of the bottom of the case 1.

Please refer to fig. 1 and 2 with emphasis, both sides inside two sets of installing ports 101 all are provided with the installation axle, and the installation axle runs through to inside the sealing door 102, can make sealing door 102 take place the activity, the one end at cooling water tank 2 top is provided with the water injection pipe, can pour into cooling water into inside cooling water tank 2 through the water injection pipe, cooling water tank 2 four corners department all is provided with the dead lever in bottom the cooling water tank 2, cooling water tank 2 passes through dead lever and box 1 fixed connection, fix cooling water tank 2 and box 1 through the dead lever, semiconductor refrigerator 201 passes through fixing bolt and cooling water tank 2 detachable connection, realize installing semiconductor refrigerator 201 at cooling water tank 2's top, semiconductor refrigerator 201's bottom is provided with the multiunit and runs through the heat conduction copper sheet to cooling water tank 2 inside, cooling effect to cooling water is better, rotating motor 202 passes through fixing bolt and cooling water tank 2 detachable connection, install the bottom at cooling water tank 2 with rotating motor 202, the inside intermediate position department of stirring frame 204 is provided with the mounting hole, stirring frame 204 passes through mounting hole and pivot 203 detachable connection, it is connected with rotating motor 202 through pivot 203, driving frame 205 and cooling water pump 205, the cooling water pump 2 is connected with the cooling water pump 2, the cooling water cooling device is connected with the both ends, thereby the cooling water pump is connected with the cooling water pump is of the cooling device is of the cooling down, the set is connected with the cooling water pump is of the cooling water, and the cooling device is connected with the cooling device is convenient for the cooling down, and the top end is set up, and cooling down, and the cooling device is connected with cooling device is easy to the cooling down, and can be cooled down to the cooling down, and can realize the cooling down, and can be realized.

Please refer to fig. 1 and 3 with emphasis, the inside of two sets of air inlet heads 3 all is provided with the mounting bracket, fan 302 can be through mounting bracket and air inlet head 3 detachable connection, can install fan 301 inside air inlet head 3, the inside top of box 1 is provided with temperature sensor, can monitor the inside temperature of box 1, and the one end that box 1 was kept away from to two sets of air inlet heads 3 all is provided with the mounting groove, and gauze 301 can be dismantled with air inlet head 3 through the mounting groove and be connected, realizes installing gauze 301 inside air inlet head 3, prevents debris entering box 1 inside.

Working principle: before the cooling water cooling device is used, cooling water is injected into the cooling water tank 2 through the water injection pipe, a load to be temperature-controlled is installed in the box body 1 through the installation port 101, the installation port 101 is sealed through the sealing door 102, when the cooling water cooling device is used, the temperature in the box body 1 is monitored through the temperature sensor, the cooling water in the cooling water tank 2 is cooled through the semiconductor refrigerator 201 and the temperature-conducting copper sheet, the rotating motor 202 can drive the stirring frame 204 to rotate through the rotating shaft 203, so that the cooling efficiency of the cooling water in the cooling water tank 2 is higher, the cooling water is conveyed into the water pipe 206 through the water pump 205, the cooling water is recycled, the cooling water is cooled continuously, the cooling effect of the temperature control device is better, external air can enter the box body 1 through the air inlet head 3, sundries can enter the box body 1 through the gauze 301, the ventilation effect of the air in the box body 1 is better through the air outlet pipe, the wind power 302 is generated, the wind power 302 and the wind power 206 and the electric heating pipe 207 can be used for cooling and heating respectively, and the cooling effect of the cooling water in the box body 1 is better, and the cooling effect of the cooling water is realized.

The foregoing is merely exemplary embodiments of the present utility model, and specific structures and features that are well known in the art are not described in detail herein. It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A avoid semiconductor manufacture of high temperature damage to use control by temperature change equipment, its characterized in that: including box (1), be located coolant tank (2) of box (1) top one side and be located air inlet head (3) of box (1) both sides intermediate position department, box (1) include:

The two groups of mounting ports (101) are arranged at the middle positions of two ends of the box body (1), and sealing doors (102) are arranged at two sides of the inside of the two groups of mounting ports (101).

2. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 1, wherein: the semiconductor refrigerator (201) is arranged at the middle position of the top of the cooling water tank (2), the rotating motor (202) is arranged at the middle position of the bottom of the cooling water tank (2), the output end of the rotating motor (202) is connected with a rotating shaft (203) penetrating through the cooling water tank (2), one end of the rotating shaft (203) positioned inside the cooling water tank (2) is provided with a stirring frame (204), one end of the bottom of the cooling water tank (2) is provided with a water pump (205), the bottom end of the water pump (205) is provided with a water pipe (206) penetrating through the inside of the tank (1), and one side, away from the water pipe (206), of the inside of the tank (1) is provided with a plurality of groups of electric heating pipes (207).

3. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 1, wherein: two sets of air inlet heads (3) are far away from one end of the box body (1) and are provided with gauze (301), the inside of the two sets of air inlet heads (3) is provided with a fan (302), and two sides of the bottom of the box body (1) are provided with air outlet pipes (303).

4. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 1, wherein: the two groups of mounting holes (101) are formed in two sides of the inside of the mounting holes, the mounting holes penetrate through the inside of the sealing door (102), and a water injection pipe is arranged at one end of the top of the cooling water tank (2).

5. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 2, wherein: the four corners of the bottom of the cooling water tank (2) are provided with fixing rods, the cooling water tank (2) is fixedly connected with the tank body (1) through the fixing rods, and the semiconductor refrigerator (201) is detachably connected with the cooling water tank (2) through fixing bolts.

6. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 2, wherein: the bottom of the semiconductor refrigerator (201) is provided with a plurality of groups of temperature-conducting copper sheets penetrating into the cooling water tank (2), and the rotating motor (202) is detachably connected with the cooling water tank (2) through fixing bolts.

7. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 2, wherein: the stirring frame (204) is provided with a mounting hole at the middle position inside, the stirring frame (204) is detachably connected with the rotating shaft (203) through the mounting hole, and the stirring frame (204) is in transmission connection with the rotating motor (202) through the rotating shaft (203).

8. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 2, wherein: the two ends of the bottom of the box body (1) are provided with connecting pipes, the top end of the water pump (205) is connected with one group of connecting pipes, and one end, far away from the water pump (205), of the water pipe (206) is connected with the other group of connecting pipes.

9. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 3, wherein: the two groups of air inlet heads (3) are provided with mounting frames, the fans (302) are detachably connected with the air inlet heads (3) through the mounting frames, and the top end of the inside of the box body (1) is provided with a temperature sensor.

10. A temperature control apparatus for semiconductor manufacturing avoiding high temperature damage as recited in claim 3, wherein: two groups of air inlet heads (3) are provided with mounting grooves at one ends far away from the box body (1), and the gauze (301) is detachably connected with the air inlet heads (3) through the mounting grooves.