CN221039783U - Maskless photoetching machine base - Google Patents
Maskless photoetching machine base Download PDFInfo
- Publication number
- CN221039783U CN221039783U CN202322690027.5U CN202322690027U CN221039783U CN 221039783 U CN221039783 U CN 221039783U CN 202322690027 U CN202322690027 U CN 202322690027U CN 221039783 U CN221039783 U CN 221039783U
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- CN
- China
- Prior art keywords
- base
- silicon wafer
- pair
- screw rod
- linkage
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Links
- 238000001259 photo etching Methods 0.000 title abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 230000002441 reversible effect Effects 0.000 claims abstract description 4
- 238000001459 lithography Methods 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 41
- 229910052710 silicon Inorganic materials 0.000 abstract description 41
- 239000010703 silicon Substances 0.000 abstract description 41
- 238000000034 method Methods 0.000 abstract description 17
- 230000002457 bidirectional effect Effects 0.000 abstract description 7
- 238000007599 discharging Methods 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract description 2
- 230000000670 limiting effect Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a maskless photoetching machine base, which relates to the field of photoetching machine bases and comprises a base, wherein a pair of slidable clamping seats are arranged at the top of the base, a circular accommodating space is formed when the clamping seats are butted, a detachable placing table is arranged in the accommodating space, linkage seats are arranged on the side surfaces of the clamping seats, a bidirectional screw rod is arranged on the linkage seats in a penetrating manner, and the linkage seats are respectively arranged at the forward and reverse screw threads of the bidirectional screw rod. The utility model can movably adjust the distance between the pair of clamping seats, expands the accommodating space, is convenient for silicon wafer discharging, reduces the friction and collision phenomena in the silicon wafer placing process, has a protective effect on the silicon wafer, and improves the portability in the silicon wafer discharging process. Then, the silicon wafer can be clamped, the positioning operation of the silicon wafer is implemented, the silicon wafer is driven to be positioned at the right center position above the base in the placing process, and the distribution accuracy of the silicon wafer is ensured.
Description
Technical Field
The utility model relates to the field of photoetching machine bases, in particular to a maskless photoetching machine base.
Background
In the chip manufacturing process, a photolithography machine is used to form photoresist patterns on a silicon wafer as a template for manufacturing circuits. The lithography machine irradiates the photoresist on the silicon wafer with ultraviolet light or other light source and projects a pattern onto the silicon wafer through a projection optical system to form the desired minute structure and pattern. Photolithography machines are used to process minute structures and patterns during chip fabrication. Accurate patterns and designs of micrometer or even nanometer level can be manufactured by photoetching technology. These structures and patterns are the basis for fabricating functional elements such as circuits, transistors, capacitors, and resistors in the chip.
The existing maskless photoetching machine base is characterized in that before exposure operation is carried out on a silicon wafer, the silicon wafer is required to be placed on the inner side of the base in a blanking mode and is tightly connected with the base, stability of the silicon wafer and the base in the synchronous moving process is maintained, exposure precision is guaranteed, in the blanking process, collision and friction phenomena are easily generated on the silicon wafer and the part of the surface of the base, which is used for containing the silicon wafer, abrasion of the silicon wafer is easily caused, and normal exposure operation of the silicon wafer is affected.
Disclosure of utility model
In view of the above, the present application provides a maskless lithography machine pedestal.
In order to achieve the above purpose, the present application provides the following technical solutions: the maskless photoetching machine base comprises a base, wherein the top of the base is provided with a pair of slidable clamping seats, a pair of clamping seats form a circular accommodating space when being butted, and a detachable placing table is arranged in the accommodating space.
The side of a pair of grip slipper all installs the linkage seat, run through on the linkage seat and be provided with two-way screw rod, and a pair of the linkage seat is installed respectively in two-way screw rod's forward, reverse screw thread department, two-way screw rod's surface just is close to both ends position and all installs the counterpoint frame, the upper surface of base is installed to the counterpoint frame, and the servo motor rather than looks adaptation is installed to two-way screw rod's one end, can drive two-way screw rod and rotate, a pair of grip slipper slides, enlarges accommodation space.
Further, a plurality of limiting holes are formed in the surface of the base, through holes corresponding to the limiting holes one by one are formed in the end portions of the clamping seat, the through holes distributed from top to bottom and the limiting holes are connected through limiting pins, and butt joint portions are mounted at the tops of the limiting pins.
Further, a pair of connecting parts above the same clamping seat are provided with the same linkage rod, a plurality of air cylinders are arranged above the base, and the push rod ends of the air cylinders are arranged below the linkage rod.
Furthermore, the surface of the clamping seat is provided with an alignment channel penetrating through the seat body, the air cylinder is positioned at the outer side of the alignment channel, and the air cylinder is positioned at a position opposite to the opening end of the alignment channel.
Further, the guide channels are all offered to the both sides of base, a pair of the bottom of grip slipper is all fixedly connected with slider, when a pair of the grip slipper removes, the slider slides in the inboard of guide channels.
Furthermore, the bottom of placing the platform all fixedly connected with a plurality of locating levers that are annular structure and arrange, a plurality of positioning bolts that run through the base, with the bottom threaded connection of locating lever are installed to the bottom of base.
In summary, the utility model has the technical effects and advantages that:
The utility model can movably adjust the distance between the pair of clamping seats, expands the accommodating space, is convenient for silicon wafer discharging, reduces the friction and collision phenomena in the silicon wafer placing process, has a protective effect on the silicon wafer, and improves the portability in the silicon wafer discharging process. Then, the silicon wafer can be clamped, the positioning operation of the silicon wafer is implemented, the silicon wafer is driven to be positioned at the right center position above the base in the placing process, and the distribution accuracy of the silicon wafer is ensured.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of the present utility model.
Fig. 2 is a schematic view of a second view structure according to the present utility model.
FIG. 3 is a schematic view of a partial cross-sectional structure of the present utility model.
Fig. 4 is a schematic view of a third view structure according to the present utility model.
In the figure: 1. a base; 11. positioning bolts; 12. a limiting hole; 13. a guide channel; 2. a clamping seat; 21. a linkage seat; 22. a bidirectional screw; 23. an alignment frame; 24. a servo motor; 25. an alignment channel; 26. a slide block; 3. a placement table; 31. a positioning rod; 4. a limiting pin; 5. a butt joint part; 6. a linkage rod; 7. and (3) a cylinder.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples: referring to fig. 1 and 2, a maskless lithography machine base includes a base 1, a pair of slidable clamping holders 2 are disposed on top of the base 1, and when the pair of clamping holders 2 are butted, a circular accommodating space is formed, and a detachable placement table 3 is disposed in the accommodating space. In the process of processing the silicon wafer, the silicon wafer is positioned at the inner side of the accommodating space and is placed on the surface of the placing table 3, so that the stability of the silicon wafer in the photoetching process is ensured.
The side of a pair of grip slipper 2 all installs the linkage seat 21, runs through on the linkage seat 21 and is provided with two-way screw rod 22, and a pair of linkage seat 21 are installed respectively in two-way screw rod 22 forward, reverse screw thread department, and two-way screw rod 22's surface just is close to both ends position and all installs counterpoint frame 23, counterpoint frame 23 installs the upper surface of base 1, can keep two-way screw rod 22's stability. And one end of the bidirectional screw rod 22 is provided with a servo motor 24 matched with the bidirectional screw rod, so that the bidirectional screw rod 22 can be driven to rotate, a pair of clamping seats 2 slide, and the accommodating space is enlarged. The silicon wafer can be smoothly placed on the surface of the placing table 3.
Then, the servo motor 24 runs again, the bidirectional screw rod 22 rotates, the linkage seat 21 drives the clamping seat 2 to be in butt joint smoothly, the silicon wafer is clamped, friction and collision phenomena in the silicon wafer placing process can be reduced, the silicon wafer is protected, and portability in the silicon wafer discharging process is improved. The silicon wafer is driven to be positioned at the right center position above the base 1 in the placing process, so that the distribution accuracy of the silicon wafer is ensured.
As shown in fig. 3, a plurality of limiting holes 12 are formed in the surface of the base 1, through holes corresponding to the limiting holes 12 one by one are formed in the end portion of the clamping seat 2, the through holes distributed from top to bottom and the limiting holes 12 are connected through limiting pins 4, and butt joint portions 5 are mounted at the top portions of the limiting pins 4. Under the natural state, the locating pin 4 can lock clamping seat 2 and install in the surface of base 1, effectively avoids the silicon chip in the course of working, because base 1 and clamping seat 2 constantly remove, the clamping seat 2 that leads to produces the phenomenon of rocking, skew, has ensured the stability that clamping seat 2 and silicon chip are connected.
As shown in fig. 3, the same link lever 6 is mounted on a pair of abutting portions 5 located above the same holder 2, a plurality of cylinders 7 are mounted above the base 1, and a push rod end of each cylinder 7 is mounted below the link lever 6. If the clamping seat 2 needs to be moved. When the silicon wafer is placed, the air cylinder 7 can run, the purposes of pushing the linkage rod 6, the butt joint parts 5 positioned at the two ends of the linkage rod 6 and the pair of limiting pins 4 to synchronously rise are achieved, the locking state of the limiting pins 4 to the clamping seat 2 is released, and the clamping seat 2 can smoothly slide.
As shown in fig. 3, the surface of the clamping seat 2 is provided with alignment channels 25 penetrating through the seat body, the air cylinder 7 is located at the outer side of the alignment channels 25, and the air cylinder 7 is located at a position opposite to the opening ends of the alignment channels 25. When the clamping seat 2 slides, the alignment channel 25 can pass through the cylinder 7, so that the blocking of the cylinder 7 to the clamping seat 2 is avoided.
As shown in fig. 2 and 3, guide channels 13 are formed on both sides of the base 1, and the bottom ends of the pair of clamping holders 2 are fixedly connected with sliding blocks 26, and when the pair of clamping holders 2 move, the sliding blocks 26 slide inside the guide channels 13. The connection of the sliding block 26 and the inner side of the guide channel 13 can ensure the linearity of the clamping seat 2 in the moving process, reduce the moving deviation, avoid the phenomenon of deviation of the clamping seat 2, and further ensure the accuracy of the clamping seat 2 in the abutting process.
As shown in fig. 4, the bottom of the placement table 3 is fixedly connected with a plurality of positioning rods 31 arranged in an annular structure, the bottom of the base 1 is provided with a plurality of positioning bolts 11 penetrating through the base 1 and in threaded connection with the bottom end of the positioning rods 31, the positioning bolts 11 can firmly mount the placement table 3 above the base 1 and are opposite to the inner side of the accommodating space formed by the clamping seat 2, so that the silicon wafer on the surface of the placement table is in a stable state, and the stability of the silicon wafer in the processing process is ensured.
Finally, it should be noted that: the foregoing description of the preferred embodiments of the present utility model is not intended to be limiting, but rather, although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (6)
1. Maskless lithography machine base, comprising a base (1), characterized in that: the top of the base (1) is provided with a pair of slidable clamping seats (2), when the clamping seats (2) are in butt joint, a circular accommodating space is formed, and a detachable placing table (3) is arranged in the accommodating space;
The side of a pair of grip slipper (2) is all installed linkage seat (21), run through on linkage seat (21) and be provided with bi-directional screw rod (22), and a pair of linkage seat (21) are installed respectively in the forward and reverse screw thread department of bi-directional screw rod (22), counterpoint frame (23) are all installed to the surface of bi-directional screw rod (22) and be close to both ends position, counterpoint frame (23) are installed in the upper surface of base (1), and servo motor (24) rather than the looks adaptation are installed to the one end of bi-directional screw rod (22), can drive bi-directional screw rod (22) rotation, and a pair of grip slipper (2) slides, enlarges accommodation space.
2. The maskless lithography machine base of claim 1, wherein: the surface of base (1) has seted up a plurality of spacing holes (12), the through-hole with a plurality of spacing holes (12) one-to-one is seted up to the tip of grip slipper (2), and through-hole, spacing hole (12) from top to bottom that distribute are connected through spacer pin (4), butt joint portion (5) are all installed at the top of spacer pin (4).
3. A maskless lithography machine base as claimed in claim 2, characterized in that: the pair of connecting parts (5) above the same clamping seat (2) are provided with the same linkage rod (6), a plurality of air cylinders (7) are arranged above the base (1), and the push rod ends of the air cylinders (7) are arranged below the linkage rod (6).
4. A maskless lithography machine base as claimed in claim 3, characterized in that: the surface of the clamping seat (2) is provided with an alignment channel (25) penetrating through the seat body, the air cylinder (7) is positioned at the outer side of the alignment channel (25), and the air cylinder (7) is positioned at a position opposite to the opening end of the alignment channel (25).
5. The maskless lithography machine base of claim 1, wherein: guide channels (13) are formed in two sides of the base (1), a pair of clamping bases (2) are fixedly connected with sliding blocks (26) at the bottom ends, and when the clamping bases (2) move, the sliding blocks (26) slide on the inner sides of the guide channels (13).
6. The maskless lithography machine base of claim 1, wherein: the bottom of place platform (3) all fixedly connected with a plurality of locating levers (31) that are annular structure and arrange, a plurality of locating bolts (11) that run through base (1), with the bottom threaded connection of locating lever (31) are installed to the bottom of base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322690027.5U CN221039783U (en) | 2023-10-08 | 2023-10-08 | Maskless photoetching machine base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322690027.5U CN221039783U (en) | 2023-10-08 | 2023-10-08 | Maskless photoetching machine base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221039783U true CN221039783U (en) | 2024-05-28 |
Family
ID=91173099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322690027.5U Active CN221039783U (en) | 2023-10-08 | 2023-10-08 | Maskless photoetching machine base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221039783U (en) |
-
2023
- 2023-10-08 CN CN202322690027.5U patent/CN221039783U/en active Active
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| GR01 | Patent grant |