CN221039537U - Single-fiber four-port Combo PON optical device - Google Patents

Abstract

The utility model relates to a single-fiber four-port Combo PON optical device, which comprises a transmitting end and a receiving end, wherein the receiving end is arranged in a second tube shell, the transmitting end is arranged in a first tube shell, and the transmitting end adopts a BOX packaging mode; the transmitting end comprises a first transmitting unit and a second transmitting unit, the first transmitting unit comprises an EML transmitting chip, a semiconductor refrigerator, a thermistor and a first substrate, the EML transmitting chip and the thermistor are arranged on the upper surface of the first substrate, and the first substrate is arranged on the upper surface of the semiconductor refrigerator; the second transmitting unit comprises a DFB transmitting chip and a second substrate, and the DFB transmitting chip is arranged on the upper surface of the second substrate. The transmitting end and the receiving end are respectively arranged in the tube shell, and the transmitting end adopts a BOX packaging mode, so that the structure is more compact, meanwhile, the good heat dissipation of the transmitting chip is facilitated, and only the TEC and the thermistor are arranged in the first transmitting unit, so that the constant temperature can be ensured, the hardware cost can be saved, and the overall power consumption is reduced.

Description

Single-fiber four-port Combo PON optical device

Technical Field

The utility model relates to the technical field of optical communication, in particular to a single-fiber four-port Combo PON optical device.

Background

In recent years, high bandwidth services in the communication field are rapidly developing. In an optical communication network, in order to save optical fiber resources and meet the transition requirement of forward-backward compatibility in the process of upgrading the bandwidth of a passive optical network, a hybrid passive optical network Combo PON scheme is adopted, that is, two sets of optical components are respectively arranged in one device. The specific structure generally adopts a mode of combining and packaging four discrete devices, namely an EML Chip light emission To, a DFB Chip light emission To and two light receiving To, the two light emission To are respectively fixed on a metal tube shell in a laser welding mode and the two light receiving To are respectively fixed on the metal tube shell in an adhesive mode, and an optical filter with a specified angle and a specified transmission and reflection wavelength is arranged in the metal tube shell To realize the branching and combining of four paths of signals with different wavelengths To one optical fiber.

In the optical device adopting the scheme, as the EML light-emitting chip is sensitive To temperature, the temperature change can influence signal transmission, the current emitting end To packaging form structure leads To the EML To chip To radiate heat only through the base, the radiating channel area is small, the final module with poor heat radiation of the device has high power consumption, the module is limited in use environment temperature, and meanwhile, the current 4 discrete To mounting sizes are large, so that the length of the whole device is longer, and the length reaches 32mm, thereby being unfavorable for meeting the requirements of miniaturized packaging.

Disclosure of utility model

The utility model aims To improve the defects in the prior art and provide a single-fiber four-port Combo PON optical device, wherein two light emitting chips are arranged in one metal tube shell, and two light receiving To are arranged in the other metal tube shell, so that a heat dissipation channel is increased, and the purpose of good heat dissipation of a device emitting end is achieved.

In order to achieve the above object, the embodiment of the present utility model provides the following technical solutions:

The single-fiber four-port Combo PON optical device comprises a transmitting end and a receiving end, wherein the receiving end is arranged in a second tube shell, the transmitting end is arranged in a first tube shell, and the transmitting end adopts a BOX packaging mode; the transmitting end comprises a first transmitting unit and a second transmitting unit, the first transmitting unit comprises an EML transmitting chip, a semiconductor refrigerator, a thermistor and a first substrate, the EML transmitting chip and the thermistor are arranged on the upper surface of the first substrate, and the first substrate is arranged on the upper surface of the semiconductor refrigerator; the second transmitting unit comprises a DFB transmitting chip and a second substrate, and the DFB transmitting chip is arranged on the upper surface of the second substrate.

Further preferably, the first emission unit further comprises a first collimating lens, and the second emission unit further comprises a second collimating lens. In the scheme, the collimation lens is arranged to output the emitted optical signals after collimation, so that the signal transmission efficiency and quality can be improved.

Further preferably, the second emission unit further comprises a support plate, and the second substrate and the second collimating lens are both disposed on the support plate. In this scheme, raise the height of second base plate and second collimating lens through setting up the backup pad for first emission unit and second emission unit can first second filter piece jointly, simplify overall structure, and reduce hardware cost, but also can reduce the structure size, realize miniaturized design.

The emission end also comprises a first filter and a second filter, and the optical signals emitted by the EML emission chip are collimated by the first collimating lens and then are incident to the second filter; the light signal emitted by the DFB emitting chip is collimated by the second collimating lens and then enters the first filter, and then is reflected to the second filter by the first filter.

In a further optimized scheme, the transmitting end further comprises an optical isolator, the optical signal output from the second filter is incident to the optical isolator, and the optical isolator is arranged in the second tube shell. In this scheme, the optical isolator sets up in the second tube shell, and other devices of transmitting end set up in first tube shell for installation space obtains more optimizing utilization like this, reduces the overall dimension of optical device in turn.

The receiving end comprises a first receiving unit and a second receiving unit, the first receiving unit comprises a first 0-degree optical filter and a first light receiving PD, the second receiving unit comprises a second 0-degree optical filter and a second light receiving PD, and the first light receiving PD and the second light receiving PD are respectively arranged at two opposite side ports of the second tube shell. In the scheme, the receiving end adopts a TO packaging mode, so that the original product is changed slightly, and the mechanical property is good.

The receiving end further comprises a third filter, a fourth filter and a fifth filter, the first 0-degree filter, the second 0-degree filter, the third filter, the fourth filter and the fifth filter are all arranged in the second tube shell, one path of optical signals in the two received optical signals sequentially passes through the fourth filter, the fifth filter and the first 0-degree filter and then is received by the first optical receiving PD, and the other path of received optical signals sequentially passes through the fourth filter, the third filter and the second 0-degree filter and then is received by the second optical receiving PD.

The optical isolator also comprises an optical receiving component, and the optical signals output from the optical isolator are sequentially output through the optical receiving component after passing through the third filter and the fourth filter.

Compared with the prior art, the utility model has the following beneficial effects:

1) The transmitting end and the receiving end are respectively packaged in different tube shells, so that a heat dissipation channel is increased, and the transmitting end dissipates heat well.

2) The transmitting end adopts a BOX packaging mode, so that the structural size can be reduced compared with TO packaging, and the miniaturized design is realized.

3) The first transmitting unit is provided with a semiconductor refrigerator and a thermistor, so that the EML transmitting chip can be maintained at a stable temperature, and reliable transmission of signals is guaranteed.

4) The DFB transmitting chip has low temperature requirement, and then the thermistor and the semiconductor refrigerator are not arranged, so that on one hand, the hardware cost of the thermistor and the semiconductor refrigerator can be reduced, on the other hand, the power consumption of the DFB transmitting chip can be reduced, and the electric energy is saved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of an internal structure of a single-fiber four-port Combo PON optical device according to an embodiment.

Fig. 2 is a top view of a single-fiber four-port Combo PON optical device according to an embodiment.

The marks in the figure: 10-a first tube shell; a 20-semiconductor refrigerator; 30-a thermistor; 40-a first substrate; a 50-EML transmitting chip; 60-a first collimating lens; 70-supporting plates; 80-a second substrate; a 90-DFB transmitting chip; 100-a second collimating lens; 110-a first filter; 120-a second filter; 130-an optical isolator; 140-a second 0 ° filter; 150-a second light receiving PD; 160-a fifth filter; 170-a light receiving component; 180-a first light receiving PD; 190-a first 0 ° filter; 200-a fourth filter; 210-a third filter; 220-second cartridge.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present utility model.

Referring to fig. 1 and 2, the single-fiber four-port Combo PON optical device provided in this embodiment includes a transmitting end, a receiving end and an optical receiving assembly 170, where the transmitting end includes a first transmitting unit and a second transmitting unit, the receiving end includes a first receiving unit and a second receiving unit, optical signals with different center wavelengths transmitted by the first transmitting unit and the second transmitting unit are transmitted by the optical receiving assembly 170, and optical signals with different wavelengths received by the optical receiving assembly 170 are received by the first receiving unit and the second receiving unit respectively. The first and second emission units are packaged in the first tube case 10, and a BOX packaging process is adopted; the first receiving unit and the second receiving unit are packaged in the second package 220 using a TO packaging process. In this structure, transmitting terminal and receiving terminal encapsulate respectively in different tube shells to this increase heat dissipation passageway makes the transmitting terminal good heat dissipation.

More specifically, referring to fig. 1, the first transmitting unit includes an EML transmitting chip 50, a first collimating lens 60, a semiconductor refrigerator 20, a thermistor 30 and a first substrate 40, wherein the EML transmitting chip 50 and the thermistor 30 are disposed on an upper surface of the first substrate 40, the first substrate 40 is disposed on an upper surface of the semiconductor refrigerator 20, and the semiconductor refrigerator 20 is disposed on an upper surface of the first package 10.

The second emission unit includes a DFB emission chip 90, a second collimating lens 100, a second substrate 80, and a support plate 70, where the DFB emission chip 90 is disposed on the upper surface of the second substrate 80, the second substrate 80 is disposed on the upper surface of the support plate 70, and the support plate 70 is disposed on the upper surface of the first package 10.

In the above structure, the EML emission chip 50 is sensitive to temperature, so the thermistor 30 and the semiconductor refrigerator 20 are provided, the thermistor 30 is used for monitoring the current temperature of the EML emission chip 50, feeding back the resistor to the controller of the TEC of the semiconductor refrigerator 20, the TEC controller calculates the current temperature according to the resistor fed back by the thermistor 30, and adjusts the current to the semiconductor refrigerator 20 to continuously approach the target temperature according to the difference between the current temperature and the target temperature, so that the EML emission chip 50 is maintained at a stable temperature, and then reliable transmission of signals is ensured.

The DFB transmitting chip 90 has no high temperature requirement, and the thermistor 30 and the semiconductor refrigerator 20 are not arranged, so that on one hand, the hardware cost of the thermistor 30 and the semiconductor refrigerator 20 can be reduced, and on the other hand, the power consumption of the semiconductor refrigerator can be reduced, and the electric energy is saved.

It should be noted that, the second substrate 80 is disposed on the upper surface of the support plate 70, and the main purpose of the support plate 70 is to raise the height of the second substrate 80, so that the first emission unit and the second emission unit can share a set of transmission lens groups (the first filter 110 and the second filter 120) for transmitting optical signals, which saves the cost of lens groups and installation space. In other designs, the support plate 70 may be omitted or replaced with other devices.

As shown in fig. 1, the transmitting end further includes a first filter 110, a second filter 120 and an optical isolator 130, where the first filter 110 and the second filter 120 are both disposed in the first tube shell 10, and the optical isolator 130 is disposed in the second tube shell 220. In this structure, the optical isolator 130 is not disposed in the first tube housing 10 but disposed in the second tube housing 220 as a component of the emission end, so as to fully utilize the installation space in the second tube housing 220 as much as possible, and reduce the space requirement on the first tube housing 10, so that the overall structural size is as small as possible, and the purpose of miniaturization is achieved.

With continued reference to fig. 1, the first receiving unit includes a first 0 ° filter 190 and a first light receiving PD180, the second receiving unit includes a second 0 ° filter 140 and a second light receiving PD150, the receiving end further includes a third filter 210, a fourth filter 200 and a fifth filter 160, the first 0 ° filter 190, the second 0 ° filter 140, the third filter 210, the fourth filter 200 and the fifth filter 160 are all disposed in a second tube 220, and the first light receiving PD180 and the second light receiving PD150 are disposed at two opposite side ports of the second tube 220.

After the EML emission chip 50 is powered on, an optical signal with a center wavelength of 1577nm is emitted, and is collimated by the first collimating lens 60 and then converted into collimated light, and then sequentially passes through the second filter 120, the optical isolator 130, the third filter 210 and the fourth filter 200 and enters the light receiving component 170.

After the DFB transmitting chip 90 is powered on, an optical signal with a center wavelength of 1490nm is transmitted, collimated by the second collimating lens 100 and then converted into collimated light, and then sequentially passes through the first filter 110, the second filter 120, the optical isolator 130, the third filter 210 and the fourth filter 200 and then enters the light receiving component 170.

The 1270nm optical signal received by the optical receiving element 170 passes through the fourth filter 200, the fifth filter 160, and the first 0 ° filter 190 in order, and is received by the first optical receiving PD 180.

The 1310nm optical signal received by the optical receiving assembly 170 passes through the fourth filter 200, the third filter 210, and the second 0 ° filter 140 in sequence, and is received by the second optical receiving PD 150.

The single-fiber four-port Combo PON optical device provided by the embodiment has the advantages that the receiving end is reserved for TO encapsulation, but the transmitting end adopts a BOX encapsulation mode, the structure is more compact, and meanwhile, good heat dissipation of the transmitting chip is facilitated.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (8)

1. The single-fiber four-port Combo PON optical device comprises a transmitting end and a receiving end, and is characterized in that the receiving end is arranged in a second tube shell, the transmitting end is arranged in a first tube shell, and the transmitting end adopts a BOX packaging mode; the transmitting end comprises a first transmitting unit and a second transmitting unit, the first transmitting unit comprises an EML transmitting chip, a semiconductor refrigerator, a thermistor and a first substrate, the EML transmitting chip and the thermistor are arranged on the upper surface of the first substrate, and the first substrate is arranged on the upper surface of the semiconductor refrigerator; the second transmitting unit comprises a DFB transmitting chip and a second substrate, and the DFB transmitting chip is arranged on the upper surface of the second substrate.

2. The single fiber four port Combo PON optical device according to claim 1, wherein the first transmitting unit further comprises a first collimating lens and the second transmitting unit further comprises a second collimating lens.

3. The single-fiber four-port Combo PON optical device according to claim 2, wherein the second emission unit further comprises a support plate, and the second substrate and the second collimating lens are both disposed on the support plate.

4. The single-fiber four-port Combo PON optical device according to claim 2, wherein the transmitting end further comprises a first filter and a second filter, and an optical signal transmitted by the EML transmitting chip is collimated by the first collimating lens and then is incident to the second filter; the light signal emitted by the DFB emitting chip is collimated by the second collimating lens and then enters the first filter, and then is reflected to the second filter by the first filter.

5. The single-fiber four-port Combo PON optical device according to claim 4, wherein the transmitting end further comprises an optical isolator, to which an optical signal output from the second filter sheet is incident, the optical isolator being disposed in the second package.

6. The single-fiber four-port Combo PON optical device according to claim 1 or 5, wherein the receiving end comprises a first receiving unit and a second receiving unit, the first receiving unit comprises a first 0 ° filter and a first optical receiving PD, the second receiving unit comprises a second 0 ° filter and a second optical receiving PD, and the first optical receiving PD and the second optical receiving PD are respectively disposed at opposite side ports of the second package.

7. The single-fiber four-port Combo PON optical device according to claim 6, wherein the receiving end further comprises a third filter, a fourth filter and a fifth filter, the first 0 ° filter, the second 0 ° filter, the third filter, the fourth filter and the fifth filter are all disposed in the second tube shell, one of the two received optical signals sequentially passes through the fourth filter, the fifth filter and the first 0 ° filter, and then is received by the first optical receiving PD, and the other received optical signal sequentially passes through the fourth filter, the third filter and the second 0 ° filter and then is received by the second optical receiving PD.

8. The single-fiber four-port Combo PON optical device according to claim 7, further comprising an optical receiving element, wherein an optical signal output from the optical isolator sequentially passes through the third filter and the fourth filter and is output through the optical receiving element.