CN220986093U

CN220986093U - Interconnection structure and quantum computer

Info

Publication number: CN220986093U
Application number: CN202322583074.XU
Authority: CN
Inventors: 赵勇杰
Original assignee: Benyuan Tiangong Zhengzhou Quantum Technology Co ltd
Current assignee: Benyuan Tiangong Zhengzhou Quantum Technology Co ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2024-05-17
Anticipated expiration: 2033-09-20

Abstract

The utility model discloses an interconnection structure and a quantum computer, wherein the interconnection structure is used for electrically connecting a flexible strip line with a quantum chip in a packaging box, a PCB (printed circuit board) is arranged in the packaging box, and the quantum chip is electrically connected with the PCB; the interconnection structure comprises: the device comprises an extrusion plate, a support plate and an elastic piece; wherein, the supporting plate is installed in the packaging box; one end of the elastic piece is fixed on the extrusion plate, the other end of the elastic piece is fixed on the supporting plate, and the expansion direction of the elastic piece is perpendicular to the contact surface of the PCB and the flexible strip line; one end of the extrusion plate, which is far away from the elastic piece, is arranged on the flexible strip line and is used for pressing the flexible strip line on the PCB, and a control signal transmitted on the flexible strip line is transmitted to the PCB through the press joint of the flexible strip line and the PCB. By arranging the interconnection structure, reliable electrical connection between the flexible strip line and the PCB is ensured, so that reliable electrical connection between the flexible strip line and the quantum chip is ensured.

Description

Interconnection structure and quantum computer

Technical Field

The utility model relates to the technical field of quantum computers, in particular to an interconnection structure and a quantum computer.

Background

In a quantum computer of a superconducting system, a quantum chip needs to operate in a very low temperature environment, for example, about 10mK, and is generally provided by a dilution refrigerator, and is mounted on the lowest layer with the lowest temperature of the dilution refrigerator. In order to control and measure the quantum chip at the bottommost layer, a line carrying a quantum measurement and control signal needs to enter the dilution refrigerator, sequentially passes through each cold disc of the dilution refrigerator and is connected with the quantum chip in the bottommost layer temperature zone.

With the rapid increase in the number of qubits, the required measurement and control signal transmission lines (also referred to as quantum measurement and control lines) have increased, and the space inside the dilution refrigerator is often limited. Currently, coaxial cables are generally used as signal transmission lines in measurement and control signal transmission lines, but the coaxial cables have the following disadvantages: the flexible strip line is difficult to realize a larger-scale miniaturization design in a longer time in the future, and as the flexible strip line is developed, the flexible strip line has the characteristics of small volume and high integration level, so that the design of replacing the coaxial cable by the flexible strip line is more and more, and when the flexible strip line is adopted, the reliability of the electric connection between the flexible strip line and the quantum chip is very important.

It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to those skilled in the art.

Disclosure of utility model

The utility model aims at: an interconnection structure and a quantum computer are provided, wherein the interconnection structure ensures reliable electrical connection between a flexible strip line and a quantum chip.

In order to achieve the above object, the present utility model provides the following technical solutions:

The first aspect of the utility model provides an interconnection structure for electrically connecting a flexible strip line with a quantum chip in a packaging box, wherein a PCB is arranged in the packaging box, and the quantum chip is electrically connected with the PCB;

the interconnect structure includes: the device comprises an extrusion plate, a support plate and an elastic piece;

Wherein the supporting plate is arranged in the packaging box;

One end of the elastic piece is fixed on the extrusion plate, the other end of the elastic piece is fixed on the supporting plate, and the expansion direction of the elastic piece is perpendicular to the contact surface of the PCB and the flexible strip line;

The one end that the stripper plate kept away from the elastic component is arranged in on the flexible strip line, be used for with flexible strip line pressure is located on the PCB board, the control signal of transmission on the flexible strip line passes through flexible strip line with the crimping department of PCB board is transmitted on the PCB board.

The interconnection structure as described above, further, the elastic member includes a spring and a housing having one end opened, one end of the spring is fixed to a bottom surface inside the housing, and the other end of the spring is fixed to the pressing plate; the shell is mounted on the support plate.

In the interconnection structure, a first clamping groove is further formed in the supporting plate, and the shell is clamped in the first clamping groove.

In the interconnection structure, further, a second clamping groove is formed in the side plate of the packaging box, and two ends of the supporting plate are arranged in the second clamping groove.

In the interconnection structure described above, further, the material of the plurality of central conductors integrated in the flexible strip line includes a superconducting material.

The second aspect of the utility model provides a quantum computer, comprising a quantum chip, a quantum measurement and control circuit and the interconnection structure;

The quantum measurement and control circuit comprises a flexible strip line, and the flexible strip line is electrically connected with the PCB electrically connected with the quantum chip through the interconnection structure.

The quantum computer further comprises a first PCB and a second PCB, wherein the first PCB is arranged at the bottom of the packaging box, and the second PCB is arranged on the side face of the packaging box;

A first transmission line is arranged on the first PCB, and a second transmission line is arranged on the second PCB;

One end of the first transmission line is electrically connected with one end of the second transmission line, the other end of the first transmission line is electrically connected with the pin of the quantum chip, and the other end of the second transmission line is electrically connected with the flexible strip line.

The quantum computer as described above, further, the lead of the quantum chip is electrically connected to the first transmission line through a bonding wire.

The quantum computer as described above, further, the first transmission line and the second transmission line are electrically connected by soldering or bonding wire.

The quantum computer as described above, further wherein the first transmission line and the second transmission line are coplanar waveguide transmission lines.

The utility model has the beneficial effects that:

Through the arrangement of the interconnection structure, reliable electrical connection between the flexible strip line and the PCB is ensured, so that reliable electrical connection between the flexible strip line and the quantum chip is ensured, and meanwhile, the interconnection structure realizes the tight contact between the flexible strip line and the PCB through crimping, so that the flexible strip line can be quickly connected and detached; specifically, because interconnect structure includes stripper plate, backup pad and elastic component, through setting up the elastic component for the stripper plate can be more nimble, reliably with flexible strip line and PCB board extrusion together, guarantee that the control signal on the flexible strip line can transition to on the PCB board effectively.

The quantum computer provided by the utility model comprises the interconnection structure, so that the quantum computer has the same beneficial effects and is not repeated here.

Drawings

FIG. 1 is a schematic diagram of an interconnect structure provided in an embodiment of the present utility model;

FIG. 2 is a cross-sectional view of an interconnect structure provided in an embodiment of the present utility model as applied in a quantum computer;

Fig. 3 is a top view of an interconnection structure provided in an embodiment of the present utility model when applied to a quantum computer, where a cover plate on a top end of a package box and a first transmission line on a first PCB are not shown;

FIG. 4 is a schematic diagram of a structure of an elastic member and an extrusion plate according to an embodiment of the present utility model;

In the reference numerals: 1. a flexible strip line; 2. packaging the box; 3. a quantum chip; 4. an extrusion plate; 5. a support plate; 6. an elastic member; 7. a first PCB board; 8. a second PCB board; 9. a first transmission line; 10. a second transmission line; 11. a slide block; 12. a chute; 13. a second clamping groove; 14. waist-shaped holes;

61. A spring; 62. a housing.

Detailed Description

In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

Fig. 1 is a schematic diagram of an interconnection structure provided by an embodiment of the present utility model, and fig. 2 is a cross-sectional view of the interconnection structure provided by the embodiment of the present utility model when applied in a quantum computer; as shown in fig. 1 and 2: the embodiment of the utility model discloses an interconnection structure which is used for electrically connecting a flexible strip line 1 with a quantum chip 3 in a packaging box 2, and is characterized in that a PCB (printed circuit board) is arranged in the packaging box 2, and the quantum chip 3 is electrically connected with the PCB;

the interconnect structure includes: a pressing plate 4, a supporting plate 5 and an elastic member 6;

wherein the supporting plate 5 is installed in the packaging box 2;

One end of the elastic piece 6 is fixed on the extrusion plate 4, the other end of the elastic piece 6 is fixed on the supporting plate 5, and the expansion and contraction direction of the elastic piece 6 is perpendicular to the contact surface of the PCB and the flexible strip line 1;

the one end that stripper plate 4 kept away from elastic component 6 is arranged in flexible strip line 1 is used for with flexible strip line 1 presses and locates on the PCB board, the control signal of transmission on the flexible strip line 1 pass through flexible strip line 1 with the crimping department of PCB board transmits on the PCB board.

Through the arrangement of the interconnection structure, reliable electrical connection between the flexible strip line 1 and the PCB is ensured, so that reliable electrical connection between the flexible strip line 1 and the quantum chip 3 is ensured, and meanwhile, the flexible strip line 1 and the PCB are tightly contacted through crimping by the interconnection structure, so that quick connection and disassembly can be realized; specifically, since the interconnection structure comprises the extrusion plate 4, the support plate 5 and the elastic piece 6, the extrusion plate 4 can more flexibly and reliably extrude the flexible strip line 1 and the PCB together by arranging the elastic piece 6, so that control signals on the flexible strip line 1 can be effectively transited to the PCB.

Specifically, the flexible strip line 1 is generally a layered structure including at least a center conductor layer, and first and second dielectric layers (illustratively, the first and second dielectric layers are polyimide layers) disposed on both sides of the center conductor layer, respectively, the center conductor layer integrating a plurality of center conductors; further, some flexible strip lines 1 further comprise a first metal layer (forming a first ground plane) disposed above the first dielectric layer and a second metal layer (forming a second ground plane) disposed below the second dielectric layer; further, the flexible strip line 1 further comprises a first insulating layer arranged above the first metal layer and a second insulating layer arranged below the second metal layer.

Specifically, when the flexible strip line 1 is pressed on the PCB board, the central conductor of the flexible strip line 1 at the contact surface with the PCB board is exposed (i.e. the surface layer of the flexible strip line 1 at the contact surface needs to be removed or the control signal on the middle layer of the flexible strip line 1 is transited to the surface layer through the blind hole), and is in contact with the transmission line on the PCB board, so that the control signal transmitted on the flexible strip line 1 is transmitted to the PCB board.

Further, in some implementations of the present embodiment, the side of the extrusion plate 4 close to the flexible strip line 1 is provided with an elastic layer, which may be, for example, a plurality of elastic protrusions; by arranging a plurality of elastic bulges, the contact area between the extrusion plate 4 and the flexible strip line 1 is increased, and the abrasion and damage of the extrusion plate 4 to the flexible strip line 1 are reduced while the reliable connection between the flexible strip line 1 and the quantum chip 3 is ensured.

Further, in some implementations of the present embodiment, a plurality of compression plates 4 may be disposed in the length direction of the support plate 5, and as illustrated in fig. 1, for example, 3 compression plates 4 are disposed on the support plate 5, and each compression plate 4 is connected to the support plate 5 through one elastic member 6. By arranging a plurality of extrusion plates 4 on the supporting plate 5, different parts of the same flexible strip line 1 can be extruded, and reliable connection of the flexible strip line 1 and the PCB is realized; of course, in a quantum computer, as the number of quantum bits increases, a plurality of flexible strip lines 1 are required to meet the requirements of quantum measurement and control, at this time, a plurality of extrusion plates 4 can realize simultaneous extrusion of a plurality of flexible strip lines 1, and since the interconnection structure is provided with the elastic members 6, even when the thicknesses of the plurality of flexible strip lines 1 are inconsistent, the plurality of flexible strip lines 1 can be extruded simultaneously, so that reliable electrical contact between each flexible strip line 1 and a corresponding transmission line on the PCB board is realized.

As further shown in fig. 1, specifically, the elastic member 6 includes a spring 61 and a housing 62 having one end opened, one end of the spring 61 is fixed to the bottom surface inside the housing 62, and the other end of the spring 61 is fixed to the pressing plate 4; the housing 62 is mounted on the support plate 5. By providing the elastic member 6 in the above-described structure, the installation between the pressing plate 4 and the supporting plate 5 is achieved. Further, the spring 61 is made of alloy material, so that the spring 61 maintains high elasticity at low temperature, and the spring 61 material includes steel, copper alloy, nickel alloy, and the like.

Fig. 4 is a schematic view of another structure of the elastic member 6 and the extrusion plate 4 according to the embodiment of the present utility model; as can be seen from fig. 4: in some implementations of the present embodiment, on the basis of the elastic member 6 and the pressing plate 4 in fig. 1, a sliding block 11 is further disposed on the pressing plate, and a sliding groove 12 is disposed on the housing 62, where the sliding block 11 slides along the sliding groove 12. By providing the slider 11 and the slide groove 12, the pressing plate 4 is made to move more smoothly in the expansion and contraction direction of the spring 61.

Specifically, in some implementations of the present embodiment, a first clamping groove is provided on the support plate 5, and the housing 62 of the elastic member 6 is clamped in the first clamping groove. By providing the first clamping groove, the installation between the elastic member 6 and the support plate 5 is realized. Preferably, in order to further secure the reliability of the installation, after the housing 62 is clamped in the first clamping groove, the housing and the first clamping groove may be fixed by a screw or may be fixed by welding.

FIG. 3 is a top view of an interconnect structure provided in an embodiment of the present utility model as applied in a quantum computer; as can be seen from fig. 3: in some implementations of this embodiment, the side plates of the packaging box 2 are provided with second clamping grooves 13, and two ends of the supporting plate 5 are disposed in the second clamping grooves 13. By providing the second clamping groove 13, the mounting between the package 2 and the support plate 5 is achieved.

Further, the specific mounting relationship between the second clamping groove 13 and the support plate 5 includes the following:

First kind: the size of the second clamping groove 13 is matched with the sizes of two ends of the supporting plate 5, the supporting plate 5 is clamped in the second clamping groove 13, and in order to further ensure the reliability of installation, mounting holes can be formed in the packaging box 2 and the supporting plate 5, and the packaging box and the supporting plate are fixed together through screws. Further, a plurality of second clamping grooves 13 may be provided along a direction perpendicular to the PCB board, and the mounting position may be adjusted by mounting the support plate 5 in different second clamping grooves 13, so as to adjust the expansion and contraction condition of the spring 61 in the elastic member 6, and further adjust the extrusion force of the elastic member 6 to the flexible strip line 1.

Second kind: in the direction parallel to the extension and contraction direction (first direction) of the spring 61, the size of the second clamping groove 13 is larger than the size of the supporting plate 5, a kidney-shaped hole 14 is arranged on the second clamping groove 13, a threaded hole is arranged on the supporting plate 5, and the supporting plate 5 is fixed in the second clamping groove 13 of the packaging box 2 through the kidney-shaped hole 14 and the threaded hole by a screw. Since the size of the second clamping groove 13 is larger than the size of the supporting plate 5 in the first direction, the supporting plate 5 can move in the second clamping groove 13 along the first direction, and the expansion and contraction condition of the spring 61 in the elastic piece 6 can be adjusted, so that the extrusion force of the elastic piece 6 on the flexible strip line 1 is adjusted, and after the position is determined, the supporting plate 5 is fixed in the second clamping groove 13 of the packaging box 2 through the waist-shaped hole 14 and the threaded hole by the screw.

Further, in some implementations of the present embodiment, the material of the plurality of central conductors integrated in the flexible strip line 1 includes a superconducting material. Illustratively, the material of the central conductor is one or more of niobium nitride (NbN), titanium nitride (TiN) or niobium titanium nitride, and by adopting the superconducting material, the flexible strip line 1 has the characteristic of near zero resistance at low temperature, so that the power consumption of the flexible strip line 1 is low, the heat generation is reduced, and the transmission efficiency is improved.

Based on the same application conception, the embodiment of the application also provides a quantum computer which comprises a quantum chip 3, a quantum measurement and control circuit and the interconnection structure;

The quantum measurement and control circuit comprises a flexible strip line 1, and the flexible strip line 1 is electrically connected with a PCB (printed circuit board) electrically connected with the quantum chip 3 through the interconnection structure. By using the flexible strip line 1 to replace a coaxial cable, the occupied space in the dilution refrigerator is greatly reduced, the integration level of the circuit at the interface of the quantum chip 3 is improved, and by arranging the interconnection structure, the reliable electric connection between the flexible strip line 1 and the PCB is ensured, so that the reliable electric connection between the flexible strip line 1 and the quantum chip 3 is ensured.

FIG. 2 is a cross-sectional view of an interconnect structure provided in an embodiment of the present utility model as applied in a quantum computer; as shown in fig. 2: in some embodiments of the present embodiment, the specific structure of the PCB board is as follows: the PCB comprises a first PCB 7 and a second PCB 8, the first PCB 7 is arranged at the bottom of the packaging box 2, and the second PCB 8 is arranged at the side surface of the packaging box 2; a first transmission line 9 is arranged on the first PCB 7, and a second transmission line 10 is arranged on the second PCB 8; one end of the first transmission line 9 is electrically connected with one end of the second transmission line 10, the other end of the first transmission line 9 is electrically connected with a pin of the quantum chip 3, and the other end of the second transmission line 10 is electrically connected with the flexible strip line 1. Through setting up first PCB board 7 and second PCB board 8, the electricity between flexible strip line 1 and the quantum chip 3 is connected, guarantees promptly that flexible strip line 1 and the electricity of second PCB board 8 be connected can, because second PCB board 8 arranges along the side of encapsulation box 2 for flexible strip line 1 need not buckle can the crimping on second PCB board 8.

Of course, in some embodiments of the present disclosure, the PCB board may also have the following structure: the PCB board is the third PCB board of setting in the encapsulation 2 bottom, sets up the third transmission line on the third PCB board, the one end of third transmission line with the pin electricity of quantum chip 3 is connected, the other end of third transmission line with flexible strip line 1 electricity is connected. Specifically, since in the dilution refrigerator, the quantum measurement and control circuit is arranged along the height direction of the dilution refrigerator, and the quantum chip 3 is arranged in the vertical height direction, in this embodiment, the flexible strip line 1 needs to be bent and then is arranged on the third PCB board, and then the flexible strip line 1 and the third PCB board are crimped together through the above interconnection structure.

Specifically, in some implementations of the present embodiment, the leads of the quantum chip 3 are electrically connected to the first transmission line 9 through bonding wires.

Specifically, in some implementations of the present embodiment, the first transmission line 9 and the second transmission line 10 are soldered or electrically connected by a bonding wire. Of course, in some implementations of the present embodiment, the first transmission line 9 and the second transmission line 10 may also be electrically connected by a signal connector.

Further, in some implementations of the present embodiment, the first transmission line 9 and the second transmission line 10 are coplanar waveguide transmission lines. By adopting the coplanar waveguide transmission line, the coaxial cable has lower transmission loss and higher anti-interference capability.

In the description of the present specification, reference to the term "some embodiments" or "examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

The foregoing is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the utility model without departing from the scope of the technical solution of the utility model, and the technical solution of the utility model is not departing from the scope of the utility model.

Claims

1. An interconnection structure for electrically connecting a flexible strip line with a quantum chip in a packaging box, wherein a PCB is arranged in the packaging box, the quantum chip is electrically connected with the PCB, and the interconnection structure is characterized in that,

Wherein the supporting plate is arranged in the packaging box;

2. The interconnect structure of claim 1, wherein said elastic member comprises a spring and a housing having one end opened, one end of said spring being fixed to a bottom surface inside said housing, the other end of said spring being fixed to said pressing plate; the shell is mounted on the support plate.

3. The interconnect structure of claim 2 wherein the support plate has a first slot therein, the housing being captured within the first slot.

4. The interconnect structure of claim 1, wherein a second slot is provided in a side plate of the package box, and two ends of the support plate are disposed in the second slot.

5. The interconnect structure of claim 1, wherein the material of the plurality of center conductors integrated within the flexible stripline comprises a superconducting material.

6. A quantum computer comprising a quantum chip, a quantum measurement and control circuit, and the interconnect structure of any one of claims 1-5;

7. The quantum computer of claim 6, wherein the PCB comprises a first PCB and a second PCB, the first PCB disposed at a bottom of the enclosure and the second PCB disposed at a side of the enclosure;

8. The quantum computer of claim 7, wherein the pins of the quantum chip are electrically connected to the first transmission line by bond wires.

9. The quantum computer of claim 7, wherein the first transmission line and the second transmission line are electrically connected by soldering or bonding wires.

10. The quantum computer of claim 7, wherein the first and second transmission lines are coplanar waveguide transmission lines.