CN220983175U - Micro-heat pipe cold plate performance testing device - Google Patents
Micro-heat pipe cold plate performance testing device Download PDFInfo
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- CN220983175U CN220983175U CN202322645499.9U CN202322645499U CN220983175U CN 220983175 U CN220983175 U CN 220983175U CN 202322645499 U CN202322645499 U CN 202322645499U CN 220983175 U CN220983175 U CN 220983175U
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- cold plate
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- heat pipe
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- 238000012360 testing method Methods 0.000 title claims abstract description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000110 cooling liquid Substances 0.000 claims description 8
- 238000004088 simulation Methods 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 230000000007 visual effect Effects 0.000 claims description 5
- 238000009529 body temperature measurement Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 238000012800 visualization Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses a micro-heat pipe cold plate performance testing device, which comprises: the device comprises a temperature control device, a micro heat pipe cold plate, a simulated heat source device, a power supply and a temperature acquisition instrument, wherein the temperature control device is connected with the micro heat pipe cold plate, the simulated heat source device is arranged on the surface of the micro heat pipe cold plate, the simulated heat source device is connected with the power supply, a temperature measuring point is arranged on the surface of the simulated heat source device, and the temperature measuring point is connected with the temperature acquisition instrument. The testing of performance difference of different micro heat pipe cold plates under the airborne condition is realized, the temperature in the testing process can be adjusted by arranging the temperature control device, the thermal infrared imager is calibrated by the platinum resistor, and the measuring precision and accuracy are ensured.
Description
Technical Field
The utility model belongs to the field of equipment testing, and particularly relates to a micro-heat pipe cold plate performance testing device.
Background
With the rapid development of aviation industry and electronic integration technology, the on-board electronic equipment has the characteristics of multifunction, high-density packaging, high-speed operation and the like, thereby bringing about continuous improvement of the heating value of electronic elements and continuous reduction of the volume requirement. The problem of heat dissipation of high heat flux components has become one of the key technical problems affecting the design of electronic devices, and is also a guarantee that airborne devices can reliably and stably operate under specific environmental conditions.
Considering the complex variability of the airborne conditions, the heat pipe technology has the advantages of extremely high heat conductivity, excellent isothermicity, heat flow density variability, flow direction reversibility, thermostability, good environmental adaptability and the like, and the micro heat pipe is adopted as a heat path between the liquid cooling rack cold plate and the device to become an effective method. Many researches on micro heat pipe technology have been carried out, but the influence of wind speed, liquid filling rate, inclination angle and the like on the performance of the micro heat pipe or the micro heat pipe cold plate is concentrated, and the researches on the performance difference of different micro heat pipe cold plates under the airborne condition are not carried out systematically.
Disclosure of utility model
The utility model provides a micro-heat pipe cold plate performance testing device, which aims to solve the problem that the prior art does not systematically develop the research on the performance difference of different micro-heat pipe cold plates under the airborne condition, realizes the performance difference test of different micro-heat pipe cold plates under the airborne condition, and ensures the quality of the micro-heat pipe cold plates.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a little heat pipe cold plate capability test device, includes temperature control device, little heat pipe cold plate, simulation heat source device, power and temperature acquisition appearance, and temperature control device is connected with little heat pipe cold plate, and simulation heat source device sets up at little heat pipe cold plate surface, and simulation heat source device links to each other with the power, and simulation heat source device surface is provided with the temperature measurement point, and the temperature measurement point links to each other with the temperature acquisition appearance.
Preferably, the micro heat pipe cooling plate comprises a micro heat pipe to be measured, an upper cooling plate and a lower cooling plate, the micro heat pipe to be measured is positioned between the upper cooling plate and the lower cooling plate, and the simulated heat source device is arranged on the surface of the micro heat pipe to be measured.
Preferably, the simulated heat source device comprises a heating resistor, and the heating resistor is arranged on the surface of the micro heat pipe to be measured.
Preferably, the temperature control device comprises a liquid cooling source, a cold water inlet pipe and a cold water outlet pipe, wherein the liquid cooling source is connected with one ends of the upper cold plate and the lower cold plate through the cold water inlet pipe, and the liquid cooling source is connected with the other ends of the upper cold plate and the lower cold plate through the cold water outlet pipe.
Preferably, the liquid cold source is a YKK2 cooling circulation machine, the set temperature is 20 ℃, and the cooling liquid is No. 65 cooling liquid.
Preferably, the temperature acquisition instrument comprises a platinum resistor and an infrared thermal imager, the platinum resistor and a temperature measuring point are adhered through silver paste, the platinum resistor is used for calibrating the emissivity of the infrared thermal imager, and the infrared thermal imager is used for measuring the temperature of the micro heat pipe cold plate in a four-wire measurement mode.
Preferably, the temperature control device further comprises a temperature control box, the temperature control box comprises a box body, a temperature sensor and a visual window, the visual window is arranged on one side of the box body, a temperature adjusting knob and an indicator lamp are arranged on the surface of the box body, the temperature sensor is arranged inside the box body, and the temperature sensor is connected with the indicator lamp.
Therefore, the utility model has the following beneficial effects:
1. testing the performance difference of different micro heat pipe cold plates under the airborne condition is realized;
2. the temperature in the test process can be adjusted by arranging a temperature control device;
3. The thermal infrared imager is calibrated through the platinum resistor, so that the measurement precision and accuracy are ensured.
Drawings
Fig. 1 is a schematic view of the structure of the device of the present embodiment.
Fig. 2 is a schematic view of another device structure of the present embodiment.
In the figure: 1. the temperature control device 2, the micro-heat pipe cold plate 3, the simulated heat source device 4, the power supply 5, the temperature acquisition instrument 11, the liquid cooling source 12, the cold water inlet pipe 13, the cold water outlet pipe 14, the temperature control box 21, the upper cold plate 22, the lower cold plate 23, the micro-heat pipe 31 to be tested, the temperature measuring point 51, the thermal infrared imager 141, the box 142, the temperature sensor 143, the visual window 1411, the temperature adjusting knob 1412 and the indicator lamp.
Detailed Description
The utility model is further described below with reference to the drawings and detailed description.
As shown in FIG. 1, the micro heat pipe cold plate performance testing device comprises a temperature control device 1, a micro heat pipe cold plate 2, a simulated heat source device 3, a power supply 4 and a temperature acquisition instrument 5, wherein the temperature control device 1 is connected with the micro heat pipe cold plate 2, the simulated heat source device 3 is arranged on the surface of the micro heat pipe cold plate 2, the simulated heat source device 3 is connected with the power supply 4, a temperature measuring point is arranged on the surface of the simulated heat source device 3, and the temperature measuring point is connected with the temperature acquisition instrument 5.
Specifically, the technical scheme of the utility model can be used for carrying out test research under normal temperature and high and low temperature conditions aiming at the micro heat pipe cold plates 2 with different types and different configuration modes so as to examine the performance differences of the different micro heat pipe cold plates 2 in terms of heat transfer, environmental adaptability and the like under normal temperature and high and low temperature airborne conditions, and provides a certain reference for the cooling scheme of the airborne electronic equipment.
The normal temperature test aims to measure the basic heat transfer performance by measuring the hot spot temperature and the characteristic point temperature of the heating resistor on the micro heat pipe cold plate 2, and the performance is poor due to the large thermal resistance and the small maximum heat transfer quantity, and the hot spot temperature and the characteristic point temperature are relatively high.
Alternatively, the micro heat pipe cold plate 2 comprises a micro heat pipe 23 to be measured, an upper cold plate 21 and a lower cold plate 22, the micro heat pipe 23 to be measured is positioned between the upper cold plate 21 and the lower cold plate 22, and the simulated heat source device 3 is arranged on the surface of the micro heat pipe 23 to be measured.
Optionally, the simulated heat source device 3 includes a heating resistor, and the heating resistor is disposed on the surface of the micro heat pipe 23 to be measured.
Optionally, the temperature control device 1 includes a liquid cooling source 11, a cold water inlet pipe 12 and a cold water outlet pipe 13, the liquid cooling source 11 is connected to one end of the upper cold plate 21 and the lower cold plate 22 through the cold water inlet pipe 12, and the liquid cooling source 11 is connected to the other end of the upper cold plate 21 and the lower cold plate 22 through the cold water outlet pipe 13.
Optionally, the liquid cooling source 11 is a YKK2 cooling circulation machine, the set temperature is 20 ℃, and the cooling liquid is No. 65 cooling liquid.
Optionally, the temperature collector 5 includes a platinum resistor and a thermal infrared imager 51, the platinum resistor and the temperature measuring point are adhered by silver paste, the platinum resistor is used for calibrating the emissivity of the thermal infrared imager 51, and the thermal infrared imager 51 samples the temperature of the micro heat pipe cold plate 2 in a four-wire measurement mode.
In a specific embodiment, the normal temperature test device is composed of a micro heat pipe cold plate 2, an analog heat source device 3 (heating resistor), a thermal infrared imager 51, a data acquisition instrument, a thermocouple, a platinum resistor, a liquid cold source 11 and the like. The liquid cold source 11 is provided by a YKK2 cooling circulation machine, the set temperature is 20 ℃, and the cooling liquid is No. 65 cooling liquid; the heating of the electronic module is simulated by a heating resistor (25 micro-strip resistor) positioned in the center of the surface of the cold plate; the temperature of each heat pipe cold plate is measured by adopting a platinum resistor Pt100 and a thermal infrared imager 51, and the measurement error of a wire in thermal resistance measurement is eliminated by adopting four-wire system in consideration of the fact that the error of a two-wire system measurement mode is higher than 3 ℃. The platinum resistor Pt100 is bonded on the cold plate by silver paste, and after the silver paste is dried, the silicon rubber is used for reinforcing each device and the leads. The platinum resistance was used to calibrate the emissivity of the thermal infrared imager 51 prior to testing.
Fig. 2 is a schematic view of another device structure according to an embodiment of the present invention. In fig. 2, the temperature control device 1 is a temperature control box 14, the temperature control box 14 includes a box body 141, a temperature sensor 142 and a visualization window 143, the visualization window 143 is disposed on one side of the box body 141, a temperature adjusting knob 1411 and an indicator lamp 1412 are disposed on the surface of the box body 141, the temperature sensor 142 is disposed inside the box body 141, and the temperature sensor 142 is connected with the indicator lamp 1412.
Optionally, the temperature control device 1 further includes a temperature control box 14, the temperature control box 14 includes a box body 141, a temperature sensor 142 and a visualization window 143, the visualization window 143 is disposed on one side of the box body 141, a temperature adjusting knob 1411 and an indicator lamp 1412 are disposed on the surface of the box body 141, the temperature sensor 142 is disposed inside the box body 141, and the temperature sensor 142 is connected with the indicator lamp 1412.
The main purpose of the high-low temperature test is to test the starting performance and steady state performance of the micro heat pipe cold plate under the low temperature and high temperature conditions, so as to examine the difference between the micro heat pipe condensation (namely complete freezing) and the starting time under the high temperature conditions, and between the steady state temperature and the normal temperature conditions, and the method is a key for measuring whether the micro heat pipe cold plate can be used for certain high heat flux devices or not, and the instant hot spot temperature overheating phenomenon does not occur.
In a specific embodiment, the main body part of the high-low temperature test device is the same as the normal temperature test device, except that the main body part is placed in a temperature control box, and a liquid cooling source is not required. A user can adjust the testing temperature by operating a temperature adjusting knob on the surface of the temperature control box, when the temperature control box is stabilized to low temperature, normal temperature or high temperature, a power supply is turned on, and data of the change of the hot spot temperature along with time is measured through a data acquisition instrument, so that the performance difference of the micro heat pipe cold plate under different environmental conditions is compared.
The foregoing embodiments are provided for further explanation of the present utility model and are not to be construed as limiting the scope of the present utility model, and some insubstantial modifications and variations of the present utility model, which are within the scope of the utility model, will be suggested to those skilled in the art in light of the foregoing teachings.
Claims (7)
1. A micro-heat pipe cold plate performance testing device, comprising: temperature control device (1), little hot tube cold plate (2), simulation heat source device (3), power (4) and temperature acquisition instrument (5), temperature control device (1) with little hot tube cold plate (2) are connected, simulation heat source device (3) set up little hot tube cold plate (2) surface, simulation heat source device (3) with power (4) link to each other, simulation heat source device (3) surface is provided with temperature measurement point (31), temperature measurement point (31) with temperature acquisition instrument (5) link to each other.
2. The micro heat pipe cold plate performance testing device according to claim 1, wherein the micro heat pipe cold plate (2) comprises a micro heat pipe (23) to be tested, an upper cold plate (21) and a lower cold plate (22), the micro heat pipe (23) to be tested is located between the upper cold plate (21) and the lower cold plate (22), and the simulated heat source device (3) is arranged on the surface of the micro heat pipe (23) to be tested.
3. A micro heat pipe cold plate performance testing apparatus according to claim 2, wherein the simulated heat source device (3) comprises a heating resistor, and the heating resistor is arranged on the surface of the micro heat pipe (23) to be tested.
4. The micro-heat pipe cold plate performance testing device according to claim 2, wherein the temperature control device (1) comprises a liquid cold source (11), a cold water inlet pipe (12) and a cold water outlet pipe (13), the liquid cold source (11) is connected with one ends of the upper cold plate (21) and the lower cold plate (22) through the cold water inlet pipe (12), and the liquid cold source (11) is connected with the other ends of the upper cold plate (21) and the lower cold plate (22) through the cold water outlet pipe (13).
5. The micro-heat pipe cold plate performance testing device according to claim 4, wherein the liquid cooling source (11) is a YKK2 cooling circulation machine, the set temperature is 20 ℃, and the cooling liquid is No. 65 cooling liquid.
6. The micro-thermal tube cold plate performance testing device according to claim 4, wherein the temperature acquisition instrument (5) comprises a platinum resistor and a thermal infrared imager (51), the platinum resistor is adhered to the temperature measuring point (31) through silver paste, the platinum resistor is used for calibrating the emissivity of the thermal infrared imager (51), and the thermal infrared imager (51) is used for measuring the temperature of the micro-thermal tube cold plate (2) in a four-wire measurement mode.
7. The micro heat pipe cold plate performance testing device according to claim 1, wherein the temperature control device (1) further comprises a temperature control box (14), the temperature control box (14) comprises a box body (141), a temperature sensor (142) and a visual window (143), the visual window (143) is arranged on one side of the box body (141), a temperature adjusting knob (1411) and an indicator lamp (1412) are arranged on the surface of the box body (141), the temperature sensor (142) is arranged inside the box body (141), and the temperature sensor (142) is connected with the indicator lamp (1412).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322645499.9U CN220983175U (en) | 2023-09-27 | 2023-09-27 | Micro-heat pipe cold plate performance testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322645499.9U CN220983175U (en) | 2023-09-27 | 2023-09-27 | Micro-heat pipe cold plate performance testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220983175U true CN220983175U (en) | 2024-05-17 |
Family
ID=91060684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322645499.9U Active CN220983175U (en) | 2023-09-27 | 2023-09-27 | Micro-heat pipe cold plate performance testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220983175U (en) |
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2023
- 2023-09-27 CN CN202322645499.9U patent/CN220983175U/en active Active
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