CN220976873U - Back adhesive assembly - Google Patents
Back adhesive assembly Download PDFInfo
- Publication number
- CN220976873U CN220976873U CN202322908838.8U CN202322908838U CN220976873U CN 220976873 U CN220976873 U CN 220976873U CN 202322908838 U CN202322908838 U CN 202322908838U CN 220976873 U CN220976873 U CN 220976873U
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- Prior art keywords
- layer
- conductive layer
- back adhesive
- adhesive
- area
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 30
- 239000010410 layer Substances 0.000 claims abstract description 93
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 230000003068 static effect Effects 0.000 abstract description 21
- 230000005611 electricity Effects 0.000 abstract description 20
- 238000002834 transmittance Methods 0.000 abstract description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000519995 Stachys sylvatica Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model relates to a back adhesive assembly, which comprises a conductive layer and a back adhesive layer which are sequentially laminated; the conductive layer is arranged in the edge area of the back adhesive layer; the gum layer is provided with a photosensitive hole area. The back adhesive component dissipates static electricity through the conductive layer on the premise of not affecting the light transmittance of the photosensitive hole by arranging the conductive layer, so that static electricity is prevented from being concentrated in the hole area, and the performance of the display device is prevented from being affected.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a back adhesive assembly.
Background
The adhesive-backed component plays an important role in the display device.
CN205691911U discloses a display device, which is used for improving the antistatic ability of the display device and prolonging the service life of the display device while realizing the narrow frame of the display device. The display device includes: a housing, a backlight module positioned in the housing, and a display panel positioned at the light emitting side of the backlight module; the reflecting sheet in the backlight module is provided with a plurality of lugs which are respectively communicated with the grounding end. In the display device disclosed by the disclosure, through a plurality of lugs arranged on the reflecting sheet, the lugs are respectively communicated with the grounding end, static electricity can enter the reflecting sheet (the periphery of the reflecting sheet is conductive) along the periphery of the backlight module, and then the static electricity is transmitted to the grounding end through the reflecting sheet.
CN216073658U discloses a waterproof antistatic composite flame retardant back adhesive, comprising: the back adhesive body is provided with a back adhesive flame-retardant layer; and a bonding protection layer positioned on the back adhesive flame-retardant layer, wherein the bonding protection layer comprises: the adhesive layer, the antistatic layer arranged on the adhesive layer, and the back adhesive base layer attached to the antistatic layer; and the waterproof installation layer is arranged on the back adhesive base layer.
In the prior art, when the back adhesive component is used for a display device, a photosensitive hole is formed, static accumulation at the position of a hole area cannot be dissipated, and abnormal brightness of the hole area occurs.
It is therefore important to develop a backing adhesive assembly that overcomes the above-mentioned drawbacks.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model aims to provide a back adhesive assembly, which can dissipate static electricity through a conductive layer on the premise of not influencing the light transmittance of a photosensitive hole by arranging the conductive layer, so as to avoid the static electricity from being concentrated in the hole area and influence the performance of a display device.
To achieve the purpose, the utility model adopts the following technical scheme:
The utility model provides a back adhesive assembly, which comprises a conductive layer and a back adhesive layer which are sequentially laminated;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
According to the utility model, the conductive layer is arranged on the back adhesive component, so that static electricity is dissipated through the conductive layer on the premise of not influencing the light transmittance of the light sensing hole area, and static electricity is prevented from being generated in the hole area in a concentrated manner, and the performance of the display device is prevented from being influenced.
Preferably, a substrate is further arranged on the outer side of the gum layer;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
In the utility model, the back adhesive component is connected to the copper leakage area (GND) of the substrate by arranging the conductive layer on the periphery of the back adhesive layer, and static electricity is led out along the conductive layer through the copper leakage area, so that the static electricity is prevented from accumulating in a photosensitive hole area and affecting the performance of the display device.
In the utility model, the substrate is a Panel (Panel), the copper leakage area is arranged on a flexible circuit board (FPC) of the substrate, and the position of the copper leakage area is designed according to actual needs.
Preferably, the thickness of the conductive layer is 0.02-0.07mm, e.g., 0.03mm, 0.04mm, 0.05mm, 0.06mm, etc.
In the utility model, the thickness of the conductive layer is 0.02-0.07mm, because: the overall consideration and the complete machine matching are carried out, and the thickness deviation of the complete machine can lead to larger avoiding space in the thickness direction (z direction) of the complete machine or increase the z direction thickness of the complete machine, which is contrary to the thinner development direction of electronic products such as mobile phones at the current market end; the thinner thickness can lead to the conductive layer being easy to be damaged in the module production process, and the static electricity dissipation is affected.
Preferably, the width of the conductive layer in the edge region of the backsize layer is 2-5mm, e.g. 2.5mm, 2.8mm, 3mm, 3.2mm, 3.5mm, 3.8mm, 4mm, 4.2mm or 4.5mm, etc.
Preferably, the thickness of the backsize layer is 0.2-0.3mm, such as 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, or 0.29mm, etc.
Compared with the prior art, the utility model has the following beneficial effects:
According to the utility model, the conductive layer is arranged on the back adhesive component, so that static electricity is dissipated through the conductive layer on the premise of not influencing the light transmittance of the photosensitive hole, and static electricity is prevented from being generated in the hole area in a concentrated manner, and the performance of the display device is prevented from being influenced.
Drawings
FIG. 1 is a schematic view of the adhesive-backed package of example 1;
Wherein, 1-conductive layer; 2-a gum layer.
Detailed Description
To facilitate understanding of the present utility model, examples are set forth below. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the utility model and are not to be construed as a specific limitation thereof.
The utility model provides a back adhesive assembly, which comprises a conductive layer and a back adhesive layer which are sequentially laminated;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
According to the utility model, the conductive layer is arranged on the back adhesive component, so that static electricity is dissipated through the conductive layer on the premise of not influencing the light transmittance of the light sensing hole area, and static electricity is prevented from being generated in the hole area in a concentrated manner, and the performance of the display device is prevented from being influenced.
Illustratively, a substrate is further arranged on the outer side of the gum layer;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
In the utility model, the back adhesive component is connected to the copper leakage area of the substrate by arranging the conductive layer on the periphery of the back adhesive layer, and static electricity is led out along the conductive layer through the copper leakage area, so that the static electricity is prevented from accumulating in the photosensitive hole area and affecting the performance of the display device.
In the utility model, the substrate is a panel, the copper leakage area is arranged on a flexible circuit board of the substrate, and the position of the copper leakage area is designed according to actual needs.
Illustratively, the conductive layer has a thickness of 0.02-0.07mm, such as 0.03mm, 0.04mm, 0.05mm, 0.06mm, and the like.
In the utility model, the thickness of the conductive layer is 0.02-0.07mm, because: the overall consideration and the complete machine matching are carried out, and the thickness deviation of the complete machine can lead to larger z-direction avoiding space or increase the z-direction thickness of the complete machine, which is contrary to the thinner development direction of electronic products such as mobile phones at the current market end; the thinner thickness can lead to the conductive layer being easy to be damaged in the module production process, and the static electricity dissipation is affected.
Illustratively, the width of the conductive layer at the edge region of the backsize layer is 2-5mm, such as 2.5mm, 2.8mm, 3mm, 3.2mm, 3.5mm, 3.8mm, 4mm, 4.2mm, 4.5mm, or the like.
Illustratively, the backsize layer has a thickness of 0.2-0.3mm, such as 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, or 0.29mm, etc.
Example 1
The embodiment provides a back adhesive assembly, the structural schematic diagram of which is shown in fig. 1, wherein the back adhesive assembly comprises a conductive layer 1 and a back adhesive layer 2 which are sequentially laminated;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
A substrate is arranged on the outer side of the gum layer, and is not shown in the figure;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
The thickness of the conductive layer was 0.05mm.
The width of the conductive layer in the edge area of the gum layer is 3mm.
The thickness of the gum layer is 0.25mm.
Specifically, the material of the gum layer is foam double faced adhesive tape.
The conducting layer is made of aluminum foil.
Example 2
The embodiment provides a back adhesive assembly, which comprises a conductive layer and a back adhesive layer which are sequentially stacked;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
A substrate is further arranged on the outer side of the back adhesive layer;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
The thickness of the conductive layer was 0.02mm.
The width of the conductive layer in the edge area of the gum layer is 2mm.
The thickness of the gum layer is 0.2mm.
Specifically, the material of the gum layer is foam double faced adhesive tape.
The conductive layer is made of copper foil.
Example 3
The embodiment provides a back adhesive assembly, which comprises a conductive layer and a back adhesive layer which are sequentially stacked;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
A substrate is further arranged on the outer side of the back adhesive layer;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
The thickness of the conductive layer was 0.07mm.
The width of the conductive layer in the edge area of the gum layer is 5mm.
The thickness of the gum layer is 0.3mm.
Specifically, the material of the gum layer is foam double faced adhesive tape.
The conducting layer is made of aluminum foil.
Comparative example 1
This comparative example differs from example 1 in that no conductive layer was included, and the rest was the same as example 1.
According to the utility model, the conductive layer is arranged on the back adhesive component, so that static electricity is dissipated through the conductive layer on the premise of not influencing the light transmittance of the photosensitive hole, and static electricity is prevented from being generated in the hole area in a concentrated manner, and the performance of the display device is prevented from being influenced. For example, in comparative example 1, in the electrostatic discharge test (ESD test), black spots appear at ±6kV, and the cracking of the encapsulation adhesive appears to be functionally poor at ±8 kV; examples 1-3 were tested for no black and white spots, no functional failure at + -10 kV.
The applicant states that the detailed method of the present utility model is illustrated by the above examples, but the present utility model is not limited to the detailed method described above, i.e. it does not mean that the present utility model must be practiced in dependence upon the detailed method described above. It should be apparent to those skilled in the art that any modification of the present utility model, equivalent substitution of raw materials for the product of the present utility model, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present utility model and the scope of disclosure.
Claims (5)
1. The back adhesive assembly is characterized by comprising a conductive layer and a back adhesive layer which are sequentially laminated;
The conductive layer is arranged in the edge area of the back adhesive layer;
the gum layer is provided with a photosensitive hole area.
2. The adhesive-backed assembly of claim 1, wherein a substrate is further disposed outside the adhesive-backed layer;
The substrate is provided with a copper leakage area;
The conductive layer is connected to the copper leakage region.
3. The adhesive-backed assembly of claim 1, wherein the conductive layer has a thickness of 0.02-0.07mm.
4. The adhesive-backed assembly of claim 1, wherein the conductive layer at the edge region of the adhesive-backed layer has a width of 2-5mm.
5. The adhesive backed assembly of claim 1, wherein the adhesive backed layer has a thickness of 0.2-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322908838.8U CN220976873U (en) | 2023-10-27 | 2023-10-27 | Back adhesive assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322908838.8U CN220976873U (en) | 2023-10-27 | 2023-10-27 | Back adhesive assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220976873U true CN220976873U (en) | 2024-05-17 |
Family
ID=91055993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322908838.8U Active CN220976873U (en) | 2023-10-27 | 2023-10-27 | Back adhesive assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220976873U (en) |
-
2023
- 2023-10-27 CN CN202322908838.8U patent/CN220976873U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |