CN220971345U - High-power semiconductor device press-fitting device - Google Patents
High-power semiconductor device press-fitting device Download PDFInfo
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- CN220971345U CN220971345U CN202322884615.2U CN202322884615U CN220971345U CN 220971345 U CN220971345 U CN 220971345U CN 202322884615 U CN202322884615 U CN 202322884615U CN 220971345 U CN220971345 U CN 220971345U
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- sliding sleeve
- press
- turntable
- connecting shaft
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 description 6
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor device assembly and discloses a high-power semiconductor device press-mounting device which comprises a base and a support, wherein the support is arranged on one side of the base, a connecting frame is fixedly arranged on the support, a hydraulic cylinder is arranged on the top surface of the connecting frame, a plurality of groups of sliding rods are fixedly arranged in the connecting frame, a press plate is slidably arranged on the plurality of groups of sliding rods, a turntable is arranged on the base, a plurality of groups of open grooves are formed in the peripheral edges of the turntable, and workpiece conveying components for bearing and conveying semiconductor devices are arranged in the open grooves in the periphery of the turntable. When the workpiece conveying assembly rotates to the position right below the pressing plate with the semiconductor device, the magnetic attraction block plays a role in magnetic attraction to the sliding sleeve, and at the moment, the plug pin block is inserted into the pin hole on the top surface of the connecting shaft, so that the whole workpiece conveying assembly is fixedly distributed, and the effect of stable press fitting is achieved through the cooperation of the magnetic attraction block and the sliding sleeve.
Description
Technical Field
The utility model relates to the technical field of semiconductor device assembly, in particular to a high-power semiconductor device press-fitting device.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions.
When the high-power semiconductor device press-mounting device is used, some devices are not provided with workpiece conveying mechanisms, so that the transfer conveying of semiconductor workpieces greatly reduces the press-mounting efficiency, and some press-mounting equipment provided with the workpiece conveying mechanisms have the defect of low stability when the workpieces on the conveying mechanisms are pressed, so that the press-mounting process is easy to misplace, and the press-mounting quality is influenced.
Therefore, we propose a high-power semiconductor device press-fitting device.
Disclosure of utility model
The utility model mainly solves the technical problems and provides a high-power semiconductor device press-fitting device.
In order to achieve the above purpose, the utility model adopts the following technical scheme that the high-power semiconductor device press-mounting device comprises a base and a bracket, wherein the bracket is arranged on one side of the base, a connecting frame is fixedly arranged on the bracket, a hydraulic cylinder is arranged on the top surface of the connecting frame, a plurality of groups of sliding rods are fixedly arranged in the connecting frame, a press plate is slidably arranged on the plurality of groups of sliding rods, the output end of the hydraulic cylinder is fixedly connected with the press plate, the press plate is controlled to lift through the hydraulic cylinder, the semiconductor device is press-mounted through the press plate, a turntable is arranged on the base, a plurality of groups of notch grooves are formed in the peripheral edges of the turntable, and workpiece conveying components for bearing and conveying the semiconductor device are arranged in the notch grooves around the turntable;
The top surface of the base is fixedly provided with a fixed plate, the axis of the base is rotatably provided with a rotary table, the upper end of the rotary table vertically extends upwards through the fixed plate, the rotary table is fixedly connected with the rotary table, the fixed plate is fixedly provided with magnetic attraction blocks, and the magnetic attraction blocks are distributed at positions corresponding to the pressing plates;
The workpiece conveying assembly comprises a load-carrying column and a connecting shaft, the connecting shaft is fixedly arranged in a groove formed in the rotary table, the load-carrying column is rotatably arranged on the connecting shaft, a load-carrying disc is fixedly arranged at the upper end of the load-carrying column, and an electric push rod is arranged on the top surface of the rotary table.
Preferably, the load post is fixedly sleeved with a fixed sleeve, the load post is slidably provided with a sliding sleeve, the fixed sleeve is connected with the sliding sleeve through a plurality of groups of connecting tension springs, and the sliding sleeve is driven by the tension action of the plurality of groups of connecting tension springs to be distributed on one side close to the fixed sleeve.
Preferably, rectangular grooves are formed in the left and right side wall surfaces of the sliding sleeve in a penetrating mode, and two ends of the connecting shaft penetrate through the corresponding rectangular grooves to extend outwards.
Preferably, the top surface of the connecting shaft is provided with a pin hole corresponding to the rectangular groove, and the inner top surface of the rectangular groove on the side wall surface of the sliding sleeve is provided with a plug block.
Preferably, when the sliding sleeve slides downwards along the load-carrying column, the plug pin blocks are inserted into the pin holes, the load-carrying column is distributed on the connecting shaft in a relatively fixed mode, and when the sliding sleeve drives the plug pin blocks to slide upwards and separate from the pin holes, the load-carrying column is distributed on the connecting shaft in a movable mode.
Preferably, the bottom surface of the load post is provided with a circular groove, and an auxiliary roller is movably arranged in the circular groove.
Advantageous effects
The utility model provides a high-power semiconductor device press-fitting device. The beneficial effects are as follows:
(1) When the high-power semiconductor device press-mounting device works, a semiconductor device is placed on a carrying disc, the turntable is driven to rotate through the turntable, the workpiece conveying assembly drives the semiconductor device to rotate along with the turntable under the rolling action of the auxiliary roller, when the workpiece conveying assembly drives the semiconductor device to rotate right below the press-mounting plate, the magnetic attraction block plays a magnetic attraction role on the sliding sleeve, the sliding sleeve is enabled to slide downwards under the influence of magnetic force, at the moment, the plug pin block is inserted into a pin hole in the top surface of the connecting shaft, the whole workpiece conveying assembly is fixedly distributed, the press-mounting plate is controlled to press downwards through the hydraulic cylinder, the semiconductor device placed on the workpiece conveying assembly is pressed, and the workpiece conveying assembly is enabled to be stably distributed below the press-mounting plate through the cooperation of the magnetic attraction block and the sliding sleeve, so that the effect of stable press-mounting is achieved.
(2) When the workpiece conveying assembly rotates to one side deviating from the support, the sliding sleeve resets under the action of the pulling force of the connecting tension spring, the plug pin block is separated from the pin hole, the electric push rod pushes the workpiece conveying assembly outwards from inside to outside, the loading column is enabled to turn outwards by taking the connecting shaft as the center, at this time, the semiconductor devices distributed on the loading disc are automatically fed, people can conveniently replace the next group of semiconductor devices needing to be pressed on the loading disc, and the workpiece conveying assemblies in different states can be freely adjusted through the arrangement, so that the effect of facilitating automatic feeding is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those skilled in the art from this disclosure that the drawings described below are merely exemplary and that other embodiments can be derived from the drawings provided without the inventive effort.
The structures, proportions, sizes, etc. shown in the present specification are shown only for the purposes of illustration and description, and are not intended to limit the scope of the utility model, which is defined by the claims, so that any structural modifications, changes in proportions, or adjustments of sizes, which do not affect the efficacy or the achievement of the present utility model, should fall within the ambit of the technical disclosure.
FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;
FIG. 2 is a perspective view of a base and turntable of the present utility model;
FIG. 3 is a schematic perspective view of a workpiece transport assembly according to the present utility model;
FIG. 4 is a schematic view of the bottom perspective of the load column of the present utility model.
Legend description:
1. A base; 2. a turntable; 3. a workpiece transport assembly; 4. a bracket; 5. a connecting frame; 6. a slide bar; 7. pressing the plate; 8. a hydraulic cylinder; 9. a fixing plate; 10. a turntable; 11. a magnetic suction block; 12. an electric push rod; 31. a load-carrying column; 32. a connecting shaft; 33. a carrying tray; 34. a fixed sleeve; 35. a sliding sleeve; 36. connecting a tension spring; 37. a latch block; 38. and an auxiliary roller.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples: 1-4, the high-power semiconductor device press-mounting device comprises a base 1 and a bracket 4, wherein a turntable 2 is arranged on the base 1, a plurality of groups of open grooves are formed in the peripheral edge of the turntable 2, and a workpiece conveying assembly 3 for bearing and conveying semiconductor devices is arranged in the open grooves around the turntable 2;
The support 4 is arranged on one side of the base 1, a connecting frame 5 is fixedly arranged on the support 4, a hydraulic cylinder 8 is arranged on the top surface of the connecting frame 5, a plurality of groups of sliding rods 6 are fixedly arranged in the connecting frame 5, a pressing plate 7 is slidably arranged on the plurality of groups of sliding rods 6, the output end of the hydraulic cylinder 8 is fixedly connected with the pressing plate 7, the pressing plate 7 is controlled to lift through the hydraulic cylinder 8, and the semiconductor devices placed on the workpiece conveying assembly 3 are pressed through the pressing plate 7;
The top surface of the base 1 is fixedly provided with a fixed plate 9, the top surface of the base 1 is rotatably provided with a rotary table 10, the upper end of the rotary table 10 vertically extends upwards through the fixed plate 9, the rotary table 2 is fixedly connected with the rotary table 10, the rotary table 2 is driven to freely rotate by the rotary table 10, the fixed plate 9 is fixedly provided with magnetic attraction blocks 11, and the magnetic attraction blocks 11 are distributed at positions corresponding to the pressing plates 7;
The workpiece conveying assembly 3 comprises a load column 31 and a connecting shaft 32, the connecting shaft 32 is fixedly arranged in a notch formed in the rotary table 2, the load column 31 is rotatably arranged on the connecting shaft 32, a load tray 33 is fixedly arranged at the upper end of the load column 31, when the workpiece conveying assembly is used, a semiconductor device is placed on the load tray 33, a fixed sleeve 34 is fixedly sleeved on the load column 31, a sliding sleeve 35 is slidably arranged on the load column 31, the fixed sleeve 34 is connected with the sliding sleeve 35 through a plurality of groups of connecting tension springs 36, the sliding sleeve 35 is driven to be distributed on one side close to the fixed sleeve 34 through the pulling force of the plurality of groups of connecting tension springs 36, rectangular grooves are formed in a penetrating manner on the left side wall surface and the right side wall surface of the sliding sleeve 35, two ends of the connecting shaft 32 penetrate through the corresponding rectangular grooves to be outwards extended, pin holes are formed in positions corresponding to the rectangular grooves on the top surface of the connecting shaft 32, a plug pin block 37 is arranged on the inner top surface of the rectangular groove of the side wall surface of the sliding sleeve 35, when the sliding sleeve 35 is pulled downwards to enable the sliding sleeve 35 to slide downwards along the load column 31, the sliding sleeve 35 to slide downwards, the sliding sleeve 37 is inserted into the pin holes and is distributed on one side of the sliding sleeve 35, and is relatively distributed on the side of the sliding sleeve 32, and is in a shape of the pin hole and is in a shape of being connected with the sliding sleeve 32 when the sliding sleeve 35 and is in a state and separated from the sliding sleeve 35;
the bottom surface of the load post 31 is provided with a circular groove, an auxiliary roller 38 is movably arranged in the circular groove, during operation, a semiconductor device is placed on the carrying tray 33, the turntable 2 is driven to rotate by the turntable 10, the workpiece conveying assembly 3 brings the semiconductor device to rotate along with the turntable 2 under the rolling action of the auxiliary roller 38, when the workpiece conveying assembly 3 brings the semiconductor device to the position right below the pressing plate 7, the magnetic attraction block 11 plays a role in magnetic attraction to the sliding sleeve 35, so that the sliding sleeve 35 slides downwards under the influence of magnetic force, at the moment, the bolt block 37 is inserted into a pin hole on the top surface of the connecting shaft 32, the whole workpiece conveying assembly 3 is in fixed distribution, the pressing plate 7 is controlled to press downwards by the hydraulic cylinder 8, the semiconductor device placed on the workpiece conveying assembly 3 is pressed by the pressing plate 7, and after the pressing of the semiconductor device on the workpiece conveying assembly 3 is completed, the turntable 2 continues to rotate, so that the next workpiece conveying assembly 3 brings the semiconductor device to continue to press;
The top surface of carousel 2 is provided with electric putter 12, and when work piece conveying assembly 3 rotated to the one side that deviates from support 4, sliding sleeve 35 resets under the pulling force effect of connecting extension spring 36, and at this moment bolt piece 37 breaks away from in the pinhole, electric putter 12 outwards pushes out work piece conveying assembly 3 from inside to make the loading post 31 outwards overturn with connecting axle 32 as the center, and at this moment the semiconductor device that distributes on the loading dish 33 will automatic unloading, makes things convenient for people to place the semiconductor device of next group needs pressure equipment again on loading dish 33.
The working principle of the utility model is as follows:
When the semiconductor device pressing machine works, a semiconductor device is placed on the carrying disc 33, the turntable 10 drives the turntable 2 to rotate, the workpiece conveying assembly 3 brings the semiconductor device to rotate along with the turntable 2 under the rolling action of the auxiliary roller 38, when the workpiece conveying assembly 3 brings the semiconductor device to rotate right below the pressing plate 7, the magnetic attraction block 11 plays a magnetic attraction role on the sliding sleeve 35, the sliding sleeve 35 is enabled to slide downwards under the influence of magnetic force, at the moment, the plug block 37 is inserted into a pin hole in the top surface of the connecting shaft 32, the whole workpiece conveying assembly 3 is distributed in a fixed mode, the pressing plate 7 is controlled to press downwards through the hydraulic cylinder 8, the pressing plate 7 presses the semiconductor device placed on the workpiece conveying assembly 3, and after the pressing of the semiconductor device on one group of workpiece conveying assemblies 3 is completed, the turntable 2 continues to rotate, so that the next group of workpiece conveying assemblies 3 can continue to press the semiconductor device.
When the workpiece conveying assembly 3 rotates to one side deviating from the support 4, the sliding sleeve 35 resets under the action of the tensile force of the connecting tension spring 36, at this time, the plug pin block 37 is separated from the pin hole, the electric push rod 12 pushes the workpiece conveying assembly 3 outwards from inside to outside, so that the load column 31 turns outwards with the connecting shaft 32 as the center, at this time, the semiconductor devices distributed on the carrying tray 33 will automatically discharge, and people can conveniently replace the next group of semiconductor devices needing to be pressed on the carrying tray 33.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a high-power semiconductor device pressure equipment device, includes base (1) and support (4), support (4) set up in one side of base (1), fixed mounting has link (5) on support (4), the top surface of link (5) is provided with pneumatic cylinder (8), and the inside fixed mounting of link (5) has multiunit slide bar (6), multiunit slidable mounting has pressure plate (7) on slide bar (6), the output and the pressure plate (7) fixed connection of pneumatic cylinder (8), goes up and down through pneumatic cylinder (8) control pressure plate (7), carries out pressure equipment through pressure plate (7) semiconductor device, its characterized in that: the semiconductor device conveying device is characterized in that a turntable (2) is arranged on the base (1), a plurality of groups of grooves are formed in the peripheral edges of the turntable (2), and workpiece conveying components (3) for bearing and conveying semiconductor devices are arranged in the grooves around the turntable (2);
the top surface of the base (1) is fixedly provided with a fixed plate (9), the axis of the base (1) is rotatably provided with a rotary table (10), the upper end of the rotary table (10) vertically extends upwards through the fixed plate (9), the rotary table (2) is fixedly connected with the rotary table (10), the fixed plate (9) is fixedly provided with magnetic attraction blocks (11), and the magnetic attraction blocks (11) are distributed at positions corresponding to the pressing plates (7);
The workpiece conveying assembly (3) comprises a load carrying column (31) and a connecting shaft (32), the connecting shaft (32) is fixedly arranged in a groove formed in the rotary table (2), the load carrying column (31) is rotatably arranged on the connecting shaft (32), a load carrying disc (33) is fixedly arranged at the upper end of the load carrying column (31), and an electric push rod (12) is arranged on the top surface of the rotary table (2).
2. The high-power semiconductor device press-fitting apparatus according to claim 1, wherein: fixed cover (34) has been cup jointed on the heavy duty column (31) fixedly, slidable mounting has sliding sleeve (35) on the heavy duty column (31), fixed cover (34) through multiunit connection extension spring (36) with sliding sleeve (35) are connected, and the pulling force effect of multiunit connection extension spring (36) drives sliding sleeve (35) and distributes in the one side that is close to fixed cover (34).
3. The high-power semiconductor device press-fitting apparatus according to claim 2, wherein: rectangular grooves are formed in the left side wall surface and the right side wall surface of the sliding sleeve (35) in a penetrating mode, and two ends of the connecting shaft (32) penetrate through the corresponding rectangular grooves to extend outwards.
4. A high power semiconductor device press-fitting apparatus according to claim 3, wherein: the top surface of connecting axle (32) corresponds rectangular groove position department and has seted up the pinhole, the inside top surface in sliding sleeve (35) lateral wall face rectangular groove is equipped with bolt piece (37).
5. The high-power semiconductor device press-fitting apparatus according to claim 4, wherein: when the sliding sleeve (35) slides downwards along the load-carrying column (31), the bolt blocks (37) are inserted into the pin holes, the load-carrying column (31) is distributed on the connecting shaft (32) in a relatively fixed mode, and when the sliding sleeve (35) drives the bolt blocks (37) to slide upwards and separate from the pin holes, the load-carrying column (31) is distributed on the connecting shaft (32) in a movable mode.
6. The high-power semiconductor device press-fitting apparatus according to claim 1, wherein: a round groove is formed in the bottom surface of the load column (31), and an auxiliary roller (38) is movably arranged in the round groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322884615.2U CN220971345U (en) | 2023-10-26 | 2023-10-26 | High-power semiconductor device press-fitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322884615.2U CN220971345U (en) | 2023-10-26 | 2023-10-26 | High-power semiconductor device press-fitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220971345U true CN220971345U (en) | 2024-05-17 |
Family
ID=91059109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322884615.2U Active CN220971345U (en) | 2023-10-26 | 2023-10-26 | High-power semiconductor device press-fitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220971345U (en) |
-
2023
- 2023-10-26 CN CN202322884615.2U patent/CN220971345U/en active Active
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