CN220965293U - Pressing device - Google Patents
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- CN220965293U CN220965293U CN202322528392.6U CN202322528392U CN220965293U CN 220965293 U CN220965293 U CN 220965293U CN 202322528392 U CN202322528392 U CN 202322528392U CN 220965293 U CN220965293 U CN 220965293U
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 307
- 238000009423 ventilation Methods 0.000 claims description 38
- 238000004891 communication Methods 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 51
- 238000010030 laminating Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a pressing device, and belongs to the technical field of product pressing. The pressing device comprises a device body, a first adsorption platform and a second adsorption platform. The device body is provided with a vacuum chamber; the first adsorption platform is arranged in the vacuum chamber; the second adsorption platform is arranged in the vacuum chamber and is opposite to the first adsorption platform; the first adsorption platform is provided with a first vacuum adsorption cavity, a first adsorption hole and a second adsorption hole are formed in the first adsorption platform, the first adsorption hole is communicated with the first vacuum adsorption cavity, and the second adsorption hole is communicated with the vacuum cavity; the second adsorption platform is provided with a second vacuum adsorption cavity, and is provided with a third adsorption hole which is communicated with the second vacuum adsorption cavity. The laminating device provided by the application can effectively prevent the horizontal dislocation when the first substrate and the second substrate are laminated, and improves the laminating precision of the multilayer product.
Description
Technical Field
The application relates to the technical field of lamination, in particular to a lamination device.
Background
When the product is composed of multiple layers, the layers are sequentially laminated by vacuum lamination to form the final product. The vacuum lamination device in the prior art comprises an upper cavity and a lower cavity which can be mutually combined or separated, an upper adsorption platform and a lower adsorption platform are respectively arranged in the upper cavity and the lower cavity, the upper adsorption platform and the lower adsorption platform are respectively used for adsorbing an upper substrate and a lower substrate, and vacuum is pumped after the upper cavity and the lower cavity are combined to form a vacuum cavity (bubbles are generated between the substrates when the substrates are bonded in a vacuum environment).
However, in the prior art, the adsorption force of the vacuum chamber when the vacuum chamber is used for extracting vacuum is larger than that of the upper adsorption platform, so that the upper substrate can drift in the horizontal direction, and when the lower substrate is heavy enough, the sum of the gravity and the adsorption force of the lower adsorption platform is larger than that of the vacuum chamber, the lower substrate is not easy to drift in the horizontal direction, so that the upper substrate and the lower substrate are horizontally misplaced when being bonded, and the problem of low bonding precision of the multilayer product is further caused.
Disclosure of utility model
Therefore, the present application is directed to a pressing device for overcoming the defects in the prior art.
In order to solve the technical problems, the application provides:
A bonding apparatus, comprising:
a device body having a vacuum chamber;
the first adsorption platform is arranged in the vacuum chamber;
The second adsorption platform is arranged in the vacuum chamber and is opposite to the first adsorption platform;
The first adsorption platform is provided with a first vacuum adsorption cavity, a first adsorption hole and a second adsorption hole are formed in the first adsorption platform, the first adsorption hole is communicated with the first vacuum adsorption cavity, and the second adsorption hole is communicated with the vacuum cavity;
The second adsorption platform is provided with a second vacuum adsorption cavity, and is provided with a third adsorption hole, and the third adsorption hole is communicated with the second vacuum adsorption cavity.
In addition, the pressing device according to the application can also have the following additional technical characteristics:
in some embodiments of the present application, the second adsorption platform is provided with a fourth adsorption hole, and the fourth adsorption hole is communicated with the vacuum chamber.
In some embodiments of the present application, a first ventilation slot is formed on a side of the first adsorption platform away from the second adsorption platform, and the second adsorption hole is communicated with the vacuum chamber through the first ventilation slot.
In some embodiments of the present application, a second ventilation slot is formed on a side of the second adsorption platform away from the first adsorption platform, and the fourth adsorption hole is communicated with the vacuum chamber through the second ventilation slot.
In some embodiments of the present application, a first vacuum pipe is disposed in the first vacuum adsorption cavity, a second vacuum pipe is disposed in the second vacuum adsorption cavity, the first vacuum pipe is in communication with the first adsorption hole, and the second vacuum pipe is in communication with the third adsorption hole.
In some embodiments of the present application, the first vacuum pipe, the second vacuum pipe, and the vacuum chamber are respectively connected to a negative pressure device, and the pressure values of the first vacuum pipe and the second vacuum pipe are smaller than the pressure value of the vacuum chamber.
In some embodiments of the present application, the first vacuum pipe is circumferentially disposed around the outer circumference of the first adsorption platform, and the second adsorption hole is located in the inner circumference of the first vacuum pipe;
The second vacuum pipeline surrounds and sets up in the periphery of second adsorption platform, the fourth absorption hole is located the interior circumference of second vacuum pipeline.
In some embodiments of the present application, at least one third vacuum pipe is further disposed in the first vacuum adsorption cavity, and the third vacuum pipe is located at an inner circumference of the first vacuum pipe and is in communication with the first vacuum pipe;
And at least one fourth vacuum pipeline is further arranged in the second vacuum adsorption cavity, is positioned at the inner circumference of the second vacuum pipeline and is communicated with the second vacuum pipeline.
In some embodiments of the present application, a first profiling fixture is disposed on a side of the first adsorption platform adjacent to the second adsorption platform, and a second profiling fixture is disposed on a side of the second adsorption platform adjacent to the first adsorption platform.
In some embodiments of the application, the device body includes a first body and a second body, the first adsorption platform is disposed in the first body, the second adsorption platform is disposed in the second body, the first body is combined with or separated from the second body, and the first body is combined with the second body to define the vacuum chamber.
Compared with the prior art, the application has the beneficial effects that:
The application provides a pressing device, which comprises a device body, a first adsorption platform and a second adsorption platform, wherein the device body is provided with a vacuum chamber, the first adsorption platform and the second adsorption platform are oppositely arranged in the vacuum chamber, and the first adsorption platform and the second adsorption platform are respectively provided with a first vacuum adsorption cavity and a second vacuum adsorption cavity. The first adsorption holes communicated with the first vacuum adsorption cavity are formed in the first adsorption platform so as to realize the adsorption function of the first substrate, and the third adsorption holes communicated with the second vacuum adsorption cavity are formed in the second adsorption platform so as to realize the adsorption function of the second substrate.
Simultaneously, through offer the second adsorption port with vacuum cavity intercommunication on first adsorption platform to further promote the adsorption to first base plate, make the adsorption affinity of cavity evacuation and the adsorption affinity of first adsorption platform sum of being greater than the cavity evacuation like this, thereby make first base plate drift in the horizontal direction be difficult to take place, and the second base plate also is difficult to take place drift in the horizontal direction because the weight is heavier, and then horizontal dislocation when effectively preventing first base plate and second base plate laminating has promoted the laminating precision of multilayer product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of a compression device in some embodiments of the application;
FIG. 2 is a perspective view of a first adsorption platform according to some embodiments of the application;
FIG. 3 illustrates another perspective view of a first adsorption platform in accordance with some embodiments of the application;
FIG. 4 is a schematic diagram of a first vacuum adsorption chamber according to some embodiments of the present application;
FIG. 5 is a schematic diagram showing a second embodiment of the first vacuum adsorption chamber;
FIG. 6 is a perspective view of a second adsorption platform according to some embodiments of the application;
FIG. 7 illustrates another perspective view of a second adsorption platform in accordance with certain embodiments of the application;
FIG. 8 is a schematic diagram of a second vacuum adsorption chamber in accordance with some embodiments of the application;
Fig. 9 shows a second schematic structural view of a second vacuum adsorption chamber in some embodiments of the application.
Description of main reference numerals:
100-a pressing device; 110-a device body; 111-vacuum chamber; 112-a first body; 113-a second body; 120-a first adsorption platform; 121-a first vacuum adsorption chamber; 1211-a first vacuum conduit; 1212-a third vacuum line; 122-a first adsorption hole; 123-a second adsorption hole; 124-a first vent slot; 130-a second adsorption stage; 131-a second vacuum adsorption chamber; 1311-a second vacuum conduit; 1312-fourth vacuum line; 132-a third adsorption hole; 133-fourth adsorption holes; 134-a second vent slot; 140-a movement mechanism; 200-a first substrate; 300-a second substrate.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1, an embodiment of the present application provides a laminating apparatus 100, which is mainly used for laminating a multi-layered product. The pressing device 100 includes a device body 110, a first adsorption platform 120, and a second adsorption platform 130. The apparatus body 110 has a vacuum chamber 111, the first adsorption platform 120 is disposed in the vacuum chamber 111, and the second adsorption platform 130 is also disposed in the vacuum chamber 111 and opposite to the first adsorption platform 120.
Referring to fig. 2, the first adsorption platform 120 has a first vacuum adsorption cavity 121, and is provided with a first adsorption hole 122 and a second adsorption hole 123, wherein the first adsorption hole 122 is communicated with the first vacuum adsorption cavity 121, and the second adsorption hole 123 is communicated with the vacuum chamber 111.
In some embodiments of the present application, the first vacuum adsorption cavities 121 may be optionally disposed on rows and/or columns of the outer circumference of the first adsorption platform 120, and may be disposed around the outer circumference of the first adsorption platform 120 in a full circle, or may be disposed around the outer circumference of the first adsorption platform 120 in multiple segments at intervals.
Referring to fig. 6, the second adsorption platform 130 has a second vacuum adsorption cavity 131, and a third adsorption hole 132 is formed, and the third adsorption hole 132 is communicated with the second vacuum adsorption cavity 131.
In some embodiments of the present application, the second vacuum adsorption cavities 131 may be optionally disposed on rows and/or columns of the outer circumference of the second adsorption platform 130, and may be disposed around the outer circumference of the second adsorption platform 130 in a full circle, or may be disposed around the outer circumference of the second adsorption platform 130 in multiple segments at intervals.
In the pressing device 100 provided by the embodiment of the application, the first adsorption platform 120 is provided with the first adsorption hole 122 communicated with the first vacuum adsorption cavity 121 to realize the adsorption function on the first substrate 200, and the second adsorption platform 130 is provided with the third adsorption hole 132 communicated with the second vacuum adsorption cavity 131 to realize the adsorption function on the second substrate 300. Meanwhile, the second adsorption holes 123 communicated with the vacuum chamber 111 are formed in the first adsorption platform 120 so as to further improve the adsorption effect on the first substrate 200, so that the sum of the adsorption force of the vacuum pumping of the chamber and the adsorption force of the first adsorption platform 120 is larger than the adsorption force of the vacuum pumping of the chamber, the first substrate 200 is not easy to drift in the horizontal direction, the second substrate 300 is not easy to drift in the horizontal direction due to the heavy weight, and the horizontal dislocation when the first substrate 200 and the second substrate 300 are attached is further effectively prevented, and the attachment precision of a multilayer product is improved.
Note that, when the first body 112 and the second body 113 are not yet combined, the vacuum chamber 111 does not have a vacuum degree at this time, so the first substrate 200 and the second substrate 300 can only adsorb the first substrate 200 through the first adsorption hole 122 in the approaching process, so as to avoid falling off. Further, the third adsorption holes 132 are added to adsorb the second substrate 300 for more stability.
As shown in fig. 1, 3 and 7, in some embodiments of the present application, optionally, the second adsorption platform 130 is provided with a fourth adsorption hole 133, and the fourth adsorption hole 133 communicates with the vacuum chamber 111.
It should be noted that, in some cases, when the weight of the second substrate 300 is light, the sum of the gravity and the adsorption force of the second adsorption platform 130 is smaller than the adsorption force of the chamber vacuumized, which may cause the second substrate 300 to drift in the horizontal direction, so that the first substrate 200 and the second substrate 300 are horizontally dislocated when being attached, and the problem of low attaching precision of the multi-layer product is caused.
In this embodiment, the fourth adsorption hole 133 communicated with the vacuum chamber 111 is formed on the second adsorption platform 130, so as to further improve the adsorption effect on the second substrate 300, and since the adsorption force of the fourth adsorption hole 133 is derived from the vacuum chamber 111 and the adsorption force of the vacuum chamber 111 is larger, the overall adsorption force is increased, so that the second substrate 300 is not easy to drift in the horizontal direction, further horizontal dislocation when the first substrate 200 and the second substrate 300 are attached is effectively prevented, and the attachment precision of the multilayer product is improved.
As shown in fig. 1, 3 and 7, in the above embodiment of the present application, optionally, a first ventilation groove 124 is formed on a side of the first adsorption platform 120 away from the second adsorption platform 130, a second ventilation groove 134 is formed on a side of the second adsorption platform 130 away from the first adsorption platform 120, the second adsorption hole 123 is in communication with the vacuum chamber 111 through the first ventilation groove 124, and the fourth adsorption hole 133 is in communication with the vacuum chamber 111 through the second ventilation groove 134.
In some embodiments of the present application, optionally, a first ventilation groove 124 is formed at the bottom of the first vacuum adsorption cavity 121 on the outer circumference of the first adsorption platform 120, the first ventilation groove 124 may be formed by combining a single groove or more than two parallel grooves, and the width of the single groove or the total width of multiple parallel grooves forming the first ventilation groove 124 may be changed correspondingly with the specification of the first vacuum adsorption cavity 121.
In the present embodiment, the first ventilation grooves 124 are provided as single grooves, and are respectively provided at the bottoms of the first vacuum adsorption chambers 121 in the outer circumference of the first adsorption platform 120. Meanwhile, in order to achieve rapid gas circulation, at least one first ventilation groove 124 and another first ventilation groove 124 are disposed opposite to each other.
Specifically, when the first ventilation slots 124 are located at the front of the first adsorption platform 120, another first ventilation slot 124 may be located at the rear of the first adsorption platform 120. Or when the first ventilation slots 124 are located at the left side of the first adsorption platform 120, another first ventilation slot 124 may be located at the right side of the first adsorption platform 120. This arrangement ensures a rapid flow of the gas entering from the first vent groove 124, thereby improving the ventilation efficiency.
In this embodiment, the first ventilation groove 124 respectively communicating with the second adsorption hole 123 and the vacuum chamber 111 is formed on the side of the first adsorption platform 120 far away from the second adsorption platform 130, so that the gas can flow between the second adsorption hole 123 and the vacuum chamber 111, thereby realizing the function of gas conduction and further improving the adsorption effect on the first substrate 200. In some embodiments of the present application, optionally, a second ventilation groove 134 is formed at the bottom of the second vacuum adsorption cavity 131 on the outer circumference of the second adsorption platform 130, the second ventilation groove 134 may be formed by combining a single groove or more than two parallel grooves, and the width of the single groove or the total width of multiple parallel grooves forming the second ventilation groove 134 may be changed correspondingly with the specification of the second vacuum adsorption cavity 131.
In the present embodiment, the second ventilation grooves 134 are provided as single grooves, and are respectively provided at the bottoms of the second vacuum adsorption chambers 131 in the outer circumference of the second adsorption platform 130. Meanwhile, in order to achieve rapid gas circulation, at least one second ventilation groove 134 and another second ventilation groove 134 are disposed opposite to each other.
In particular, when the second ventilation groove 134 is located at the front of the second adsorption platform 130, another second ventilation groove 134 may be located at the rear of the second adsorption platform 130. Or when the second ventilation groove 134 is located at the left side of the second adsorption platform 130, another second ventilation groove 134 may be located at the right side of the second adsorption platform 130. This arrangement ensures rapid ventilation of the gas entering from the second ventilation groove 134, thereby improving ventilation efficiency.
In this embodiment, the second ventilation groove 134 respectively communicating with the fourth adsorption hole 133 and the vacuum chamber 111 is formed on the side of the second adsorption platform 130 far from the first adsorption platform 120, so that the gas can flow between the fourth adsorption hole 133 and the vacuum chamber 111, thereby realizing the function of gas conduction and further improving the adsorption effect on the second substrate 300. As shown in fig. 2, 4, 6 and 8, in the above-described embodiment of the present application, optionally, a first vacuum pipe 1211 is provided in the first vacuum adsorption chamber 121, a second vacuum pipe 1311 is provided in the second vacuum adsorption chamber 131, the first vacuum pipe 1211 communicates with the first adsorption hole 122, and the second vacuum pipe 1311 communicates with the third adsorption hole 132.
In the present embodiment, the adsorption function of the first substrate 200 is achieved by providing the first vacuum pipe 1211 communicating with the first adsorption hole 122 in the first vacuum adsorption chamber 121, and the adsorption function of the second substrate 300 is achieved by providing the second vacuum pipe 1311 communicating with the third adsorption hole 132 in the second vacuum adsorption chamber 131. By providing the first vacuum duct 1211 and the second vacuum duct 1311, the vacuum duct is narrower, and thus the vacuum degree rises faster, compared to the entire vacuum adsorption chamber, and thus the efficiency is higher.
In the above-described embodiment of the present application, the first vacuum pipe 1211, the second vacuum pipe 1311, and the vacuum chamber 111 are optionally externally connected to a negative pressure apparatus, respectively, and the pressure values of the first vacuum pipe 1211 and the second vacuum pipe 1311 are each smaller than the pressure value of the vacuum chamber 111.
In this embodiment, the nozzle of the vacuum pipe is connected to an external negative pressure device, and the vacuum chamber 111 is connected to the external negative pressure device through a vacuum line. By setting the pressure values of the first vacuum pipe 1211 and the second vacuum pipe 1311 to be smaller than the pressure value of the vacuum chamber 111, a sufficient vacuum degree can be provided when the first adsorption stage 120 and the second adsorption stage 130 are pressed together, so that bubbles are prevented from being generated between the substrates.
As shown in fig. 2, 4, 6 and 8, in the above-described embodiment of the present application, optionally, the first vacuum duct 1211 is circumferentially disposed at the outer circumference of the first adsorption platform 120, and the second adsorption hole 123 is located at the inner circumference of the first vacuum duct 1211; the second vacuum pipe 1311 is disposed around the outer circumference of the second adsorption stage 130, and the fourth adsorption holes 133 are located in the inner circumference of the second vacuum pipe 1311.
In the present embodiment, by disposing the first vacuum duct 1211 around the outer circumference of the first adsorption stage 120, the second adsorption hole 123 is located at the inner circumference of the first vacuum duct 1211, that is, the first adsorption hole 122 is disposed around the outer side of the first adsorption stage 120, and the second adsorption hole 123 is disposed at the inner side of the first adsorption stage 120, so that the circumference of the first substrate 200 can be adsorbed through the first adsorption hole 122, since the adsorption force of the second adsorption hole 123 is derived from the vacuum chamber 111, and the adsorption force of the vacuum chamber 111 is greater, the overall adsorption force is increased to achieve a stable adsorption function to the first substrate 200. Through setting up second vacuum pipe 1311 around the periphery at second adsorption platform 130, fourth adsorption port 133 is located the inner circumference of second vacuum pipe 1311, i.e. third adsorption port 132 encircles the outside that sets up at second adsorption platform 130, fourth adsorption port 133 sets up the inboard at second adsorption platform 130, can adsorb the periphery of second base plate 300 through third adsorption port 132 like this, because the adsorption force of fourth adsorption port 133 comes from vacuum chamber 111, and the adsorption force of vacuum chamber 111 is great, so has increased holistic adsorption force, in order to realize the stable adsorption function to second base plate 300. As shown in fig. 3, 5, 7 and 9, in the above embodiment of the present application, optionally, at least one third vacuum pipe 1212 is further disposed in the first vacuum adsorption chamber 121, and the third vacuum pipe 1212 is located at an inner circumference of the first vacuum pipe 1211 and communicates with the first vacuum pipe 1211; at least one fourth vacuum pipe 1312 is further provided in the second vacuum adsorption chamber 131, and the fourth vacuum pipe 1312 is located at an inner circumference of the second vacuum pipe 1311 and communicates with the second vacuum pipe 1311.
In this embodiment, at least one third vacuum pipe 1212 located at the inner circumference of the first vacuum pipe 1211 is disposed in the first vacuum adsorption cavity 121, and the third vacuum pipe 1212 is in communication with the first vacuum pipe 1211, so that the first vacuum adsorption cavity 121 may be partially located in the middle of the first adsorption platform 120, so that the surface of the first adsorption platform 120 has at least two adsorption areas, on one hand, a plurality of small substrates may be processed, and on the other hand, an adsorption force is increased in the middle of the first adsorption platform 120, so that the adsorption substrates are more stable when moving.
Through set up at least one fourth vacuum pipeline 1312 that is located the inner circumference of second vacuum pipeline 1311 in second vacuum adsorption cavity 131, and fourth vacuum pipeline 1312 and second vacuum pipeline 1311 intercommunication, make second vacuum adsorption cavity 131 can be located the centre of second adsorption platform 130 like this, make second adsorption platform 130 surface have two at least adsorption areas, on the one hand can handle a plurality of little base plates, on the other hand increases the adsorption affinity in the centre of second adsorption platform 130, make the adsorption base plate more firm when removing. In some embodiments of the present application, optionally, a first profiling fixture is disposed on a side of the first adsorption platform 120 adjacent to the second adsorption platform 130, and a second profiling fixture is disposed on a side of the second adsorption platform 130 adjacent to the first adsorption platform 120. Like this, make compression fittings 100 can handle curved product, profile modeling tool can laminate the radian of curved surface for everywhere pressure is even when the curved surface is laminated, be difficult to produce the fold.
Specifically, the profiling fixture has a shape consistent with the surface of the curved substrate, can be accurately attached to the substrate, so that the substrate is subjected to uniform compressive stress in the lamination process, the problems of poor attachment, layering and the like of the substrate at a position with a larger radian are avoided, and the processing efficiency and yield of products are improved.
In addition, the first profiling jig and/or the second profiling jig are made of flexible materials, such as rubber, and when the first adsorption platform 120 and the second adsorption platform 130 are close to each other and are pressed together, the profiling jig made of flexible rubber can prevent the substrate from being damaged in the lamination process, so that the buffering effect is achieved.
As shown in fig. 1, in some embodiments of the present application, optionally, the device body 110 includes a first body 112 and a second body 113, the first adsorption platform 120 is disposed in the first body 112, the second adsorption platform 130 is disposed in the second body 113, the first body 112 may be combined with or separated from the second body 113, and the first body 112 and the second body 113 are combined to define the vacuum chamber 111.
As shown in fig. 1, in some embodiments of the present application, optionally, the pressing device 100 further includes a moving mechanism 140, the moving mechanism 140 is disposed in the first body 112 and/or the second body 113, and the first adsorption platform 120 and/or the second adsorption platform 130 are disposed on the moving mechanism 140.
Therefore, the moving mechanism 140 pushes the first adsorption platform 120 to move downwards and/or the second adsorption platform 130 to move upwards, so that the second substrate 300 on the second adsorption platform 130 is attached to the first substrate 200 on the first adsorption platform 120, and the function of attaching the multi-layer product is realized.
Specifically, the moving mechanism 140 may select a servo linear motor or an air cylinder, and set a limit position of the first adsorption platform 120 and/or the second adsorption platform 130, so as to avoid risks such as overstroke, impact, and the like, and avoid the substrate from being damaged during lamination.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (10)
1. A bonding apparatus, comprising:
a device body having a vacuum chamber;
the first adsorption platform is arranged in the vacuum chamber;
The second adsorption platform is arranged in the vacuum chamber and is opposite to the first adsorption platform;
The first adsorption platform is provided with a first vacuum adsorption cavity, a first adsorption hole and a second adsorption hole are formed in the first adsorption platform, the first adsorption hole is communicated with the first vacuum adsorption cavity, and the second adsorption hole is communicated with the vacuum cavity;
The second adsorption platform is provided with a second vacuum adsorption cavity, and is provided with a third adsorption hole, and the third adsorption hole is communicated with the second vacuum adsorption cavity.
2. The bonding apparatus according to claim 1, wherein the second adsorption platform is provided with a fourth adsorption hole, and the fourth adsorption hole is communicated with the vacuum chamber.
3. The pressing device according to claim 2, wherein a first ventilation groove is formed in a side, away from the second adsorption platform, of the first adsorption platform, and the second adsorption hole is communicated with the vacuum chamber through the first ventilation groove.
4. A pressing device according to claim 3, wherein a second ventilation groove is formed in a side, away from the first adsorption platform, of the second adsorption platform, and the fourth adsorption hole is communicated with the vacuum chamber through the second ventilation groove.
5. The bonding apparatus of claim 2, wherein a first vacuum conduit is disposed within the first vacuum adsorption cavity, a second vacuum conduit is disposed within the second vacuum adsorption cavity, the first vacuum conduit is in communication with the first adsorption aperture, and the second vacuum conduit is in communication with the third adsorption aperture.
6. The bonding apparatus according to claim 5, wherein the first vacuum pipe, the second vacuum pipe, and the vacuum chamber are respectively connected to a negative pressure device, and pressure values of the first vacuum pipe and the second vacuum pipe are smaller than pressure values of the vacuum chamber.
7. The bonding apparatus according to claim 5, wherein the first vacuum pipe is circumferentially disposed around an outer periphery of the first adsorption platform, and the second adsorption hole is located in an inner periphery of the first vacuum pipe;
The second vacuum pipeline surrounds and sets up in the periphery of second adsorption platform, the fourth absorption hole is located the interior circumference of second vacuum pipeline.
8. The pressing device according to claim 7, wherein at least one third vacuum pipe is further provided in the first vacuum adsorption chamber, and the third vacuum pipe is located in an inner circumference of the first vacuum pipe and is communicated with the first vacuum pipe;
And at least one fourth vacuum pipeline is further arranged in the second vacuum adsorption cavity, is positioned at the inner circumference of the second vacuum pipeline and is communicated with the second vacuum pipeline.
9. The bonding device according to any one of claims 1 to 8, wherein a first profiling jig is provided on a side of the first adsorption platform adjacent to the second adsorption platform, and a second profiling jig is provided on a side of the second adsorption platform adjacent to the first adsorption platform.
10. The bonding device according to any one of claims 1 to 8, wherein the device body comprises a first body and a second body, the first adsorption platform is disposed in the first body, the second adsorption platform is disposed in the second body, the first body is combined with or separated from the second body, and the first body and the second body are combined to define the vacuum chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322528392.6U CN220965293U (en) | 2023-09-18 | 2023-09-18 | Pressing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322528392.6U CN220965293U (en) | 2023-09-18 | 2023-09-18 | Pressing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220965293U true CN220965293U (en) | 2024-05-14 |
Family
ID=90979494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322528392.6U Active CN220965293U (en) | 2023-09-18 | 2023-09-18 | Pressing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220965293U (en) |
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2023
- 2023-09-18 CN CN202322528392.6U patent/CN220965293U/en active Active
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