CN220964840U - Miniature quartz tuning fork wafer - Google Patents
Miniature quartz tuning fork wafer Download PDFInfo
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- CN220964840U CN220964840U CN202322739611.5U CN202322739611U CN220964840U CN 220964840 U CN220964840 U CN 220964840U CN 202322739611 U CN202322739611 U CN 202322739611U CN 220964840 U CN220964840 U CN 220964840U
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- 239000010453 quartz Substances 0.000 title claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000013016 damping Methods 0.000 claims description 33
- 238000009434 installation Methods 0.000 claims description 24
- 230000007704 transition Effects 0.000 claims description 6
- 230000003313 weakening effect Effects 0.000 abstract description 5
- 238000012360 testing method Methods 0.000 description 40
- 235000012431 wafers Nutrition 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000013598 vector Substances 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010835 comparative analysis Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model discloses a miniature quartz tuning fork wafer, which comprises: the base assembly comprises a first base, the vibration assembly comprises two vibrating arms which are symmetrically arranged, the two vibrating arms are connected with the first base, the connection assembly comprises two electric connecting arms and two vibration attenuating pieces, the two electric connecting arms are symmetrically arranged and far away from the central line of the first base relative to the vibrating arms, and the vibration attenuating pieces are arranged between the first base and the electric connecting arms and are connected with the first base and the electric connecting arms and used for reducing vibration energy generated by vibration of the vibrating arms and transmitted to the electric connecting arms through the first base so as to improve the anti-falling performance of a tuning fork wafer. The utility model can solve the problem of low anti-falling performance of the tuning fork wafer in the prior art because the tuning fork wafer does not have the characteristic of weakening vibration energy.
Description
Technical Field
The utility model relates to the technical field of technical crystal oscillators, in particular to a miniature quartz tuning fork wafer.
Background
The miniaturization and the wearable performance of intelligent electronic products make electronic components become trend in miniaturization, wherein quartz tuning fork crystal vibrators for timing are also developed in the miniaturization direction.
For example, the application number is: chinese utility model patent of CN202023102367.4, entitled: a tuning fork crystal piece comprises a fixing part, a vibrating part and an electric vibration damping piece, wherein the vibrating part and the electric vibration damping piece extend outwards from one end of the fixing part, the vibrating part comprises two vibrating arms, and the electric vibration damping piece comprises two electric connecting arms. Opposite two sides of the connecting end of the electric connecting arm are gradually reduced in volume towards the extending direction of the electric connecting arm to form a sharp corner connecting end, support arm through holes are penetrated through the upper surface and the lower surface of the electric connecting arm, which are close to the sharp corner connecting end, and silver colloid penetrating cavities are formed in the support arm through holes. The device sets up the closed angle link and can do benefit to the silver colloid to infiltrate around the closed angle link and realize the parcel, has improved the fastening degree that silver colloid is connected with the support arm simultaneously through silver colloid infiltration in the support arm through-hole. However, the tuning fork wafer in the structure has no characteristic of weakening vibration energy in the vibration energy transmission process due to the structural characteristics, so that the problem of low anti-falling performance is caused.
Therefore, there is a need for a micro quartz tuning fork wafer to solve the problem of low anti-falling performance of the tuning fork wafer caused by the fact that the tuning fork wafer does not have the characteristic of weakening vibration energy in the prior art.
Disclosure of utility model
In view of the foregoing, it is desirable to provide a tuning fork wafer of micro quartz, which solves the technical problem in the prior art that the tuning fork wafer has low anti-falling performance due to the fact that the tuning fork wafer does not have the characteristic of weakening vibration energy.
In order to achieve the technical purpose, the technical scheme of the utility model provides a miniature quartz tuning fork wafer, which comprises the following components:
a base assembly including a first base;
The vibration assembly comprises two vibration arms which are symmetrically arranged, and the two vibration arms are connected with the first base part;
The connecting assembly comprises two electric connecting arms and two vibration attenuating pieces, wherein the two electric connecting arms are symmetrically arranged and are far away from the central line of the first base part relative to the vibrating arms, and the vibration attenuating pieces are arranged between the first base part and the electric connecting arms and are connected with the first base part and the electric connecting arms respectively and are used for reducing vibration energy generated by vibration of the vibrating arms and transmitted to the electric connecting arms through the first base part so as to improve the falling resistance of a tuning fork wafer;
The vibration damping member includes at least one vibration damping portion including a first mounting arm, a second mounting arm, and a third mounting arm, which are sequentially disposed in a direction away from the first base, and a fourth mounting arm, the first mounting arm being disposed obliquely with respect to a center line of the first base, and the first mounting arm being continuously close to or apart from the center line of the first base in a direction away from the first base, the second mounting arm being disposed in a direction of the center line of the first base, the third mounting arm being disposed obliquely with respect to the center line of the first base, and the third mounting arm being continuously distant from or close to the center line of the first base in a direction away from the first base, the first installation arm, the second installation arm and the third installation arm are connected in sequence, the cross sectional areas of the first installation arm, the second installation arm and the third installation arm are equal or gradually increased along the direction far away from the first base, one end of the fourth installation arm is connected with the first installation arm, the other end of the fourth installation arm is connected with the first base, the cross sectional area of the fourth installation arm is smaller than or equal to the cross sectional area of the first installation arm, the cross sectional area of the electric connection arm is larger than the cross sectional area of the third installation arm, at least one groove group is formed in the circumferential outer wall of the electric connection arm, and the groove group is arranged along the length direction of the electric connection arm at intervals and used for dispensing.
Further, the angular extent between the first mounting arm and the midline of the first base is equal to the angular extent between the third mounting arm and the midline of the first base.
Further, the vibration assembly further comprises at least one vibration arm connecting portion and a second base portion, one end of the vibration arm connecting portion is connected to the first base portion, the second base portion is connected to the other end of the vibration arm connecting portion and is arranged in parallel with the first base portion, the two vibration arms are connected with the second base portion, and the projection area of the vibration arm connecting portion on the first base portion is smaller than that of the second base portion on the first base portion.
Further, the number of the vibrating arm connecting portions in the vibrating assembly is plural, and the plurality of the vibrating arm connecting portions are parallel to each other in the width direction of the second base portion and are arranged at intervals.
Further, a transition slope is formed between the vibrating arm and the second base, an included angle is formed between the top of the transition slope and two side walls of the vibrating arm, and the size of the included angle is 0.3 degrees.
Compared with the prior art, the utility model has the beneficial effects that: the two vibrating arms are symmetrically arranged and connected to the first base, the two electric connecting arms are arranged far away from the central line of the first base relative to the two vibrating arms and are symmetrically arranged to form a structure of the tuning fork wafer, wherein the electric connecting arms are connected with the first base through the vibration damping piece, so that energy generated by vibration of the vibrating arms is transmitted to the electric connecting arms through the vibration damping piece.
Drawings
FIG. 1 is a schematic three-dimensional structure of a micro quartz tuning fork wafer according to an embodiment of the present utility model;
FIG. 2 is a front view of a micro quartz tuning fork wafer provided by an embodiment of the present utility model;
FIG. 3 is a front view of another implementation of a micro quartz tuning fork wafer resonating arm connection provided in an embodiment of the present utility model;
FIG. 4 is a front view of another implementation of a micro quartz tuning fork wafer notch set provided by an embodiment of the present utility model;
fig. 5 is a schematic view of energy attenuation of vibration energy at a vibration attenuation portion provided by an embodiment of the present utility model.
Detailed Description
The following detailed description of preferred embodiments of the utility model is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the utility model, are used to explain the principles of the utility model and are not intended to limit the scope of the utility model.
Examples
Referring to fig. 1 to 4, the present utility model provides a micro quartz tuning fork wafer, comprising: the base assembly 1, the vibration assembly 2 and the connecting assembly 3, the base assembly 1 comprises a first base 11, the vibration assembly 2 comprises two vibration arms 21 which are symmetrically arranged, the two vibration arms 21 are connected with the first base 11, the connecting assembly 3 comprises two electric connecting arms 31 and two vibration attenuators 32, the two electric connecting arms 31 are symmetrically arranged and are far away from the central line of the first base 11 relative to the vibration arms 21, the vibration attenuators 32 are arranged between the first base 11 and the electric connecting arms 31 and are connected with the first base 11 and the electric connecting arms 31, and vibration energy generated by vibration of the vibration arms 21 and transmitted to the electric connecting arms 31 through the first base 11 is reduced, so that the anti-falling performance of a tuning fork wafer is improved.
In the device, two vibrating arms 21 are symmetrically arranged and connected to a first base 11, two electric connecting arms 31 are arranged away from the central line of the first base 11 relative to the two vibrating arms 21 and are symmetrically arranged to form a tuning fork wafer structure, wherein the electric connecting arms 31 are connected with the first base 11 through vibration damping pieces 32, so that energy generated by vibration of the vibrating arms 21 is transmitted to the electric connecting arms 31 through the vibration damping pieces 32, and the influence of vibration energy on the electric connecting arms 31 is reduced.
It will be appreciated that, compared to the prior art, after the vibration energy is transmitted to the vibration attenuating element 32, the vibration energy can be attenuated, so as to reduce the vibration energy generated by the vibration of the vibration arm 21 and transmitted to the electrical connection arm 31 via the first base 11, so as to improve the anti-falling performance of the tuning fork wafer, and solve the technical problem that the anti-falling performance of the tuning fork wafer is low because the tuning fork wafer does not have the characteristic of attenuating the vibration energy in the prior art.
Further, the electrical connection arm 31 in the device is connected with the base body of the resonator through conductive adhesive and welding, the connection structure of the electrical connection arm 31 and the base body is a conventional arrangement known to those skilled in the art, and the vibration damping member 32 is disposed between the first base 11 and the electrical connection arm 31 and is connected with the first base 11 and the electrical connection arm 31, so as to weaken the transmission of vibration energy, thereby reducing the influence of the vibration energy on the stability of the connection between the electrical connection arm 31 and the base body, and improving the anti-falling performance of the tuning fork wafer.
As shown in fig. 1, the vibration assembly 2 further includes at least one vibration arm connecting portion 22 and a second base portion 23, one end of the vibration arm connecting portion 22 is connected to the first base portion 11, the second base portion 23 is connected to the other end of the vibration arm connecting portion 22 and is disposed parallel to the first base portion 11, two vibration arms 21 are connected to the second base portion 23, and a projection area of the vibration arm connecting portion 22 on the first base portion 11 is smaller than a projection area of the second base portion 23 on the first base portion 11.
It will be appreciated that the first base 11 is connected to the second base 23 via at least one vibrating arm connection 22, and that the projected area of the vibrating arm connection 22 on the first base 11 is smaller than the projected area of the second base 23 on the first base 11, which is advantageous for damping vibration energy.
As another embodiment, the number of the vibrating arm connecting portions 22 in the vibrating assembly 2 is plural, and the plurality of vibrating arm connecting portions 22 are arranged parallel to each other in the width direction of the second base portion 23 at intervals.
It will be appreciated that in order to better reduce the transfer of vibration energy to the first base 11 via the second base 23, the vibrating arm connection 22 may involve a plurality of structures arranged parallel to each other and spaced apart, and that the plurality of vibrating arm connection 22 connects the first base 11 and the second base 23 to enhance the stability of the connection of the first base 11 and the second base 23.
As shown in fig. 1, a transition slope 24 is formed between the vibrating arm 21 and the second base 23, and an included angle is formed between the top of the transition slope 24 and two side walls of the vibrating arm 21, and the included angle is 0.3 °.
It will be appreciated that vibrating arm 21 has an inclination of 0.3 from the top of the groove in order to allow the energy to start to decrease in vibrating arm 21, the groove being parallel to the shape of vibrating arm 21 in order to obtain a more uniform electric field force, thus obtaining a smaller resistance, and a higher Q value, where the Q value is a conventional arrangement known to a person skilled in the art, not described here too much.
As shown in fig. 1 and 5, the vibration damping member 32 includes at least one vibration damping portion 321, the vibration damping portion 321 includes a first mounting arm 3211, a second mounting arm 3212, and a third mounting arm 3213 that are sequentially disposed in a direction away from the first base 11, the first mounting arm 3211 is disposed obliquely with respect to a center line of the first base 11, the first mounting arm 3211 is continuously close to or away from the center line of the first base 11 in the direction away from the first base 11, the second mounting arm 3212 is disposed in a direction of the center line of the first base 11, the third mounting arm 3213 is disposed obliquely with respect to the center line of the first base 11, and the third mounting arm 3213 is continuously away from or near the center line of the first base 11 in the direction away from the first base 11.
It can be appreciated that the vibration damping portion 321 has a folded line structure formed by a first mounting arm 3211, a second mounting arm 3212 and a third mounting arm 3213, and the first mounting arm 3211 and the third mounting arm 3213 are bent in opposite directions relative to the second mounting arm 3212, so as to form a vibration damping structure for gradually reducing vibration energy.
Wherein as an embodiment, the angle between the first mounting arm 3211 and the midline of the first base 11 is equal to the angle between the third mounting arm 3213 and the midline of the first base 11.
It will be appreciated that the angles between the first mounting arm 3211 and the third mounting arm 3213 and the midline of the first base 11 are equal, which is advantageous for gradual energy attenuation, for example, as shown in fig. 5, taking the angle between the first mounting arm 3211 and the third mounting arm 3213 and the midline of the first base 11 to be 30 °, fig. 5 is a graph of energy split vectors along directions parallel to the mounting arm and perpendicular to the mounting arm, where there is only one energy split vector parallel to the mounting arm and two energy split vectors perpendicular to the mounting arm. As can be seen from the vector exploded view of fig. 5, the final vibration energy is only about 1/2 of the initial vibration energy, whether parallel to the mounting arm or perpendicular to the mounting arm, and specific values need to be taken into the resolved angle calculation. I.e. the final energy parallel to the mounting arm is 1 x cos30 = 0.5625 and the final energy perpendicular to the mounting arm is 1 x cos30 = 0.5625.
In a preferred embodiment, the first mounting arm 3211, the second mounting arm 3212 and the third mounting arm 3213 are sequentially connected, and the cross-sectional areas of the first mounting arm 3211, the second mounting arm 3212 and the third mounting arm 3213 are equal or gradually increased in a direction away from the first base 11.
It will be appreciated that, similar to the connection between the first base 11 and the second base 23, the first mounting arm 3211, the second mounting arm 3212 and the third mounting arm 3213 also have an equal or gradually increasing tendency, so that the energy gradually decreases during transmission, and the energy parallel to the mounting arm direction is not effectively reduced, rather than a linear structure having a width gradually increasing in a direction away from the base, in which the vector is not decomposed, and the energy perpendicular to the mounting arm direction is linearly reduced as the mounting arm widens.
As an embodiment, as shown in fig. 1, two first mounting arms 3211 are symmetrically arranged outside the vibrating arm 21 along a center line of the first base 11.
It will be appreciated that the angle of the mounting arm from the base of the wafer to the top of the mounting arm cannot be too great, subject to the number of wafer rows and base mounting pad widths in the lithography section, and that the energy dissipation effect is weaker than that of the flexure.
Further, if the mounting arms on two sides are arranged in the same direction or in the same bending structure, the number of the arranged photoetching fragments can be influenced, the production efficiency is influenced, the cost is increased, and on the other hand, the base end is not beneficial to glue dispensing and carrying under the condition of a certain width.
As shown in fig. 1, the vibration damping member 32 further includes a fourth mounting arm 322, one end of the fourth mounting arm 322 is connected to the first mounting arm 3211, the other end is connected to the first base 11, and the cross-sectional area of the fourth mounting arm 322 is smaller than or equal to the cross-sectional area of the first mounting arm 3211, and the cross-sectional area of the electrical connection arm 31 is larger than the cross-sectional area of the third mounting arm 3213.
It will be appreciated that similar to the connection of the first base 11 and the second base 23 via the vibrating arm connection 22, the cross-sectional area of the fourth mounting arm 322 is less than or equal to the cross-sectional area of the first mounting arm 3211, and the cross-sectional area of the electrical connection arm 31 is greater than the cross-sectional area of the third mounting arm 3213, which is more advantageous for damping during vibration energy transfer.
As shown in fig. 1, at least one groove group 311 is formed in the circumferential outer wall of the electrical connection arm 31, and the groove groups 311 are disposed at intervals along the length direction of the electrical connection arm 31 for dispensing.
It can be appreciated that the electrical connection arm 31 is provided with a plurality of groove groups 311 along the length direction, and the arrangement of the groove groups 311 is beneficial to increasing the connection area between the conductive silver paste and the electrical connection arm 31 and the substrate, thereby improving the connection stability between the electrical connection arm 31 and the substrate.
Further, the groove sets 311 in the present device may be continuously disposed along the circumferential direction of the electrical connection arm 31, or may be intermittently disposed along the circumferential direction of the electrical connection arm 31, or the like, which will not be described herein.
Comparative example 1
By canceling the setting of the vibrating arm connecting portion 22 or the cross sectional area of the vibrating arm connecting portion 22 is equal to the cross sectional area of the second base portion 23, namely, the variable quantity of the vibrating arm connecting portion 22 is controlled, the other structures and parameters are all invariable, and simultaneously, the rear end glue parameter, the curing parameter, the fine tuning parameter, the wheel welding parameter, the ageing parameter, the reflow parameter and the like are all invariable, so that multiple simulation tests are performed.
Firstly, testing initial data of a tuning fork wafer on a computer through 250b testing software, then after the directional drop tester is free to drop, testing the data after drop through 250b software on the computer. The auxiliary test is performed by using a directional drop test machine, a computer, 250b software and the like, and the directional drop test machine, the computer, the 250b software and the like are all conventional settings known to those skilled in the art, so that data such as frequency, resistance, capacitance, inductance and Q value can be directly measured, and the data are not excessively described herein.
Further, firstly randomly sampling numbers, grouping 20 samples into a group, then sequentially testing the frequency and the resistance parameters in the software of a computer 250b by the sampled samples, wherein the target frequency is set to be 0ppm at 32.768KHz, waiting for the initial frequency, then performing 3 drop tests, taking an average value to record data, finally performing 12 drop tests to record data, performing comparative analysis on the frequency and the resistance values through the simulation tests, and as shown in the following table,
TABLE 1
| Before test (PPM) | 3 Times (PPM) | 12 Times (PPM) | △Freq.(ppm) | |
| Examples | 1.80 | -1.68 | -3.37 | -5.17 |
| Comparative example | 1.88 | -18.42 | -25.67 | -23.79 |
The Δfreq in table 1 represents the variation of the frequency after 12 drop tests and before the drop tests, wherein the frequency before the test is randomly sampled in a variation interval allowed by the product frequency, and the average value is analyzed, and it is found by comparison that under the condition that other conditions are unchanged, the frequency variation of the vibration arm connecting portion 22 is set to be-5.17, the frequency variation of the vibration arm connecting portion 22 is not set to be-23.79, and the absolute value of-5.17 is smaller than the absolute value of-23.79 according to the judgment standard that the drop resistance is better when the absolute value of the frequency variable is closer to zero, namely the drop resistance of the vibration arm connecting portion 22 is set to be stronger than that of the vibration arm connecting portion 22.
Comparative example 2
The comparison experiment is performed by canceling the vibration damping piece 32 and setting the vibration damping piece 32, namely, the vibration damping piece 32 is controlled to be variable, other structures and parameters are all invariable, and meanwhile, the rear end point glue parameter, the curing parameter, the fine tuning parameter, the wheel welding parameter, the ageing parameter, the reflow parameter and the like are controlled to be invariable, so that the simulation experiment is performed for a plurality of times.
Firstly, testing initial data of a tuning fork wafer on a computer through 250b testing software, then after the directional drop tester is free to drop, testing the data after drop through 250b software on the computer. The auxiliary test is performed by using a directional drop test machine, a computer, 250b software and the like, and the directional drop test machine, the computer, the 250b software and the like are all conventional settings known to those skilled in the art, so that data such as frequency, resistance, capacitance, inductance and Q value can be directly measured, and the data are not excessively described herein.
Further, firstly randomly sampling numbers, grouping 20 samples into a group, then sequentially testing the frequency and the resistance parameters in the software of a computer 250b by the sampled samples, wherein the target frequency is set to be 0ppm at 32.768KHz, waiting for the initial frequency, then performing 3 drop tests, taking an average value to record data, finally performing 12 drop tests to record data, performing comparative analysis on the frequency and the resistance values through the simulation tests, and as shown in the following table,
TABLE 2
| Before test (PPM) | 3 Times (PPM) | 12 Times (PPM) | △Freq.(ppm) | |
| Examples | 65.88 | 66.94 | 67.28 | 1.40 |
| Comparative example 2 | 65.86 | 68.59 | 69.54 | 3.68 |
The Δfreq. in table 2 represents the variation of the frequency after 12 drop tests and before the drop tests, wherein the frequency before the test is randomly sampled in a variation interval allowed by the product frequency, and the average value is analyzed, and it is found by comparison that the frequency variation of the vibration damping member 32 is set to be 1.40 and the frequency variation of the vibration damping member 32 is not set to be 3.68 under the condition that other conditions are unchanged, and the absolute value of the frequency variation is closer to zero, which is the better judgment standard of the anti-drop performance, compared with the absolute value of 1.40 which is smaller than the absolute value of 3.68, namely, the vibration damping member 32 is set to improve the anti-drop performance of tuning fork wafers.
Comparative example 3
The vibration arm connecting part 22 is canceled, the vibration damping piece 32 is canceled, and a comparison experiment is performed, namely, the vibration arm connecting part 22 and the vibration damping piece 32 are controlled to be variable, other structures and parameters are all invariable, and meanwhile, the rear end point glue parameter, the curing parameter, the fine tuning parameter, the wheel welding parameter, the ageing parameter, the reflux parameter and the like are controlled to be invariable, so that a plurality of simulation experiments are performed.
Firstly, testing initial data of a tuning fork wafer on a computer through 250b testing software, then after the directional drop tester is free to drop, testing the data after drop through 250b software on the computer. The auxiliary test is performed by using a directional drop test machine, a computer, 250b software and the like, and the directional drop test machine, the computer, the 250b software and the like are all conventional settings known to those skilled in the art, so that data such as frequency, resistance, capacitance, inductance and Q value can be directly measured, and the data are not excessively described herein.
Further, firstly randomly sampling numbers, grouping 20 samples into a group, then sequentially testing the frequency and the resistance parameters in the software of a computer 250b by the sampled samples, wherein the target frequency is set to be 0ppm at 32.768KHz, waiting for the initial frequency, then performing 3 drop tests, taking an average value to record data, finally performing 12 drop tests to record data, performing comparative analysis on the frequency and the resistance values through the simulation tests, and as shown in the following table,
TABLE 3 Table 3
| Before test (PPM) | 3 Times (PPM) | 12 Times (PPM) | △Freq.(ppm) | |
| Examples | 14.31 | 10.24 | 8.99 | -5.56 |
| Comparative example 3 | -14.13 | -25.32 | -26.73 | -12.61 |
The Δfreq in table 3 represents the variation of the frequency after 12 drop tests and before the drop tests, wherein the frequency before the test is randomly sampled in a variation interval allowed by the product frequency, and the average value is analyzed, and it is found by comparison that under the condition that other conditions are unchanged, the frequency variation of the vibrating arm connecting portion 22 and the vibration damping member 32 is set to be-5.56 at the same time, the frequency variation when not set is-12.61, and the absolute value of-5.56 is smaller than the absolute value of-12.61 according to the judgment standard that the absolute value of the frequency variation is closer to zero, namely, the falling resistance of the tuning fork wafer can be improved by simultaneously setting the vibrating arm connecting portion 22 and the vibration damping member 32.
In the specific working procedure of the present utility model, the two vibrating arms 21 are symmetrically arranged and connected to the first base 11, and the two electrical connecting arms 31 are disposed away from the center line of the first base 11 relative to the two vibrating arms 21 and are symmetrically arranged to form a structure of a tuning fork wafer, wherein the electrical connecting arms 31 are connected with the first base 11 through the vibration damping members 32, so that energy generated by vibration of the vibrating arms 21 is transferred to the electrical connecting arms 31 through the vibration damping members 32, and compared with the prior art, the vibration damping members 32 can attenuate the energy, so as to reduce vibration energy generated by vibration of the vibrating arms 21 and transferred to the electrical connecting arms 31 through the first base 11, thereby improving the anti-falling performance of the tuning fork wafer.
Through the structure, the technical problem that the anti-falling performance of the tuning fork wafer is low because the tuning fork wafer does not have the characteristic of weakening vibration energy in the prior art can be solved.
The present utility model is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model.
Claims (6)
1. A miniature quartz tuning fork wafer, comprising:
a base assembly including a first base;
The vibration assembly comprises two vibration arms which are symmetrically arranged, and the two vibration arms are connected with the first base part;
The connecting assembly comprises two electric connecting arms and two vibration attenuating pieces, wherein the two electric connecting arms are symmetrically arranged and are far away from the central line of the first base part relative to the vibrating arms, and the vibration attenuating pieces are arranged between the first base part and the electric connecting arms and are connected with the first base part and the electric connecting arms respectively and are used for reducing vibration energy generated by vibration of the vibrating arms and transmitted to the electric connecting arms through the first base part so as to improve the falling resistance of a tuning fork wafer;
The vibration damping member includes at least one vibration damping portion including a first mounting arm, a second mounting arm, and a third mounting arm, which are sequentially disposed in a direction away from the first base, and a fourth mounting arm, the first mounting arm being disposed obliquely with respect to a center line of the first base, and the first mounting arm being continuously close to or apart from the center line of the first base in a direction away from the first base, the second mounting arm being disposed in a direction of the center line of the first base, the third mounting arm being disposed obliquely with respect to the center line of the first base, and the third mounting arm being continuously distant from or close to the center line of the first base in a direction away from the first base, the first installation arm, the second installation arm and the third installation arm are connected in sequence, the cross sectional areas of the first installation arm, the second installation arm and the third installation arm are equal or gradually increased along the direction far away from the first base, one end of the fourth installation arm is connected with the first installation arm, the other end of the fourth installation arm is connected with the first base, the cross sectional area of the fourth installation arm is smaller than or equal to the cross sectional area of the first installation arm, the cross sectional area of the electric connection arm is larger than the cross sectional area of the third installation arm, at least one groove group is formed in the circumferential outer wall of the electric connection arm, and the groove group is arranged along the length direction of the electric connection arm at intervals and used for dispensing.
2. The micro quartz tuning fork wafer of claim 1, wherein an angular dimension between the first mounting arm and a midline of the first base is equal to an angular dimension between the third mounting arm and a midline of the first base.
3. The micro quartz tuning fork wafer of claim 1, wherein the two first mounting arms are symmetrically arranged outside the vibrating arms along a midline of the first base.
4. The micro quartz tuning fork wafer of claim 1, wherein the vibrating assembly further comprises at least one vibrating arm connection portion and a second base portion, one end of the vibrating arm connection portion is connected to the first base portion, the second base portion is connected to the other end of the vibrating arm connection portion and is arranged in parallel with the first base portion, two vibrating arms are connected to the second base portion, and a projected area of the vibrating arm connection portion on the first base portion is smaller than a projected area of the second base portion on the first base portion.
5. The micro quartz tuning fork wafer of claim 4, wherein the number of the vibrating arm connection portions in the vibrating assembly is plural, and the plurality of the vibrating arm connection portions are arranged parallel to each other and at intervals in the width direction of the second base portion.
6. The micro quartz tuning fork wafer of claim 5, wherein a transition slope is formed between the vibrating arm and the second base, and an included angle is formed between the top of the transition slope and both side walls of the vibrating arm, and the included angle is 0.3 °.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211239307.8A CN115940876A (en) | 2022-10-11 | 2022-10-11 | Miniature quartz tuning fork wafer |
| CN2022112393078 | 2022-10-11 |
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| CN202322739611.5U Active CN220964840U (en) | 2022-10-11 | 2023-10-11 | Miniature quartz tuning fork wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8358052B2 (en) * | 2003-06-30 | 2013-01-22 | Piedek Technical Laboratory | Unit having resonator, oscillator having unit and electronic apparatus having unit |
| JP5062413B2 (en) * | 2007-11-08 | 2012-10-31 | セイコーエプソン株式会社 | Tuning fork type piezoelectric resonator element and tuning fork type piezoelectric vibrator |
| JP5181938B2 (en) * | 2008-09-03 | 2013-04-10 | 株式会社大真空 | Tuning fork crystal unit |
| JP4709260B2 (en) * | 2008-10-16 | 2011-06-22 | 日本電波工業株式会社 | Piezoelectric vibrating piece and piezoelectric device |
| JP5482250B2 (en) * | 2010-02-02 | 2014-05-07 | セイコーエプソン株式会社 | Vibrating body and vibrating device |
| US8283988B2 (en) * | 2010-02-25 | 2012-10-09 | Seiko Epson Corporation | Resonator element, resonator, oscillator, and electronic device |
| JP5085681B2 (en) * | 2010-03-31 | 2012-11-28 | 日本電波工業株式会社 | Piezoelectric vibrating piece, piezoelectric device, and method of manufacturing piezoelectric vibrating piece |
| JP2011239132A (en) * | 2010-05-10 | 2011-11-24 | Seiko Epson Corp | Vibration piece, vibrator and oscillator |
| JP2016092754A (en) * | 2014-11-11 | 2016-05-23 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric transducer |
| CN213754460U (en) * | 2020-11-23 | 2021-07-20 | 泰晶科技股份有限公司 | Micro-thin-sheet tuning fork crystal piece and tuning fork crystal resonator |
| CN213846635U (en) * | 2020-12-21 | 2021-07-30 | 泰晶科技股份有限公司 | Micro tuning fork crystal wafer |
| CN213846634U (en) * | 2020-12-21 | 2021-07-30 | 泰晶科技股份有限公司 | Ultramicro thin-sheet type tuning fork crystal piece and tuning fork crystal resonator |
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