CN220963308U - Multichannel photoelectric coupler shell and multichannel photoelectric coupler - Google Patents

Abstract

The disclosure provides a multichannel photoelectric coupler shell and a multichannel photoelectric coupler, and relates to the technical field of photoelectricity. The multichannel photoelectric coupler shell comprises a tube seat, a plurality of coupling cavities, an outer cover plate, a plurality of pins and an inner cover plate which is arranged corresponding to the plurality of coupling cavities; a plurality of metalized areas are arranged at the bottom of the coupling cavity and at one side of the inner cover plate facing the coupling cavity; the metallized area is used for fixing the coupling element and can electrically connect the electrode of the coupling element with the pin; for any two adjacent coupling cavities, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are adjacently arranged; for any two adjacent inner cover plates, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are disposed adjacent. The multichannel photoelectric coupler provided by the disclosure can be arranged based on the symmetry of the coupling cavity and the inner cover plate, so that pins with the same polarity are arranged adjacently, the wiring length is simplified and reduced, the lead resistance and the power consumption are further reduced, and the reliability of a device is improved.

Description

Multichannel photoelectric coupler shell and multichannel photoelectric coupler

Technical Field

The disclosure relates to the technical field of photoelectric devices, in particular to a multichannel photoelectric coupler shell and a multichannel photoelectric coupler.

Background

An Optical Coupler (Optical Coupler) is an "electro-Optical-electrical" device that transmits electrical signals over an Optical medium. The photoelectric coupler has the characteristics of complete electrical isolation between the input end and the output end, unidirectional signal transmission, no influence of the output signal on the input end, strong anti-interference capability and high transmission efficiency. The photoelectric couplers can be divided into two main types of single-channel photoelectric couplers and multi-channel photoelectric couplers according to the number of channels. Wherein each channel in the multichannel photocoupler can work independently and can isolate a plurality of signals at the same time.

Because the multichannel photoelectric coupler relates to a plurality of groups of coupling elements (light emitting elements and light receiving elements), when designing, the relative position relation and distance between the light emitting elements and the light receiving elements are considered, and when the design is unreasonable, the problems of large lead resistance, poor interlayer insulation, large power consumption, small device performance design margin and the like of the multichannel photoelectric coupler are caused because a plurality of groups of leads and pins exist, and finally, the reliability and the stability of the multichannel photoelectric coupler are difficult to ensure.

Therefore, how to optimally design the structure of the existing multi-channel photoelectric coupler, especially the structure of the package shell and the layout and wiring of the coupling element is a problem to be solved at present.

Disclosure of utility model

In order to solve or improve the above-mentioned problems in the prior art, a first aspect of the present utility model provides a multi-channel optical coupler housing, which includes a socket, a plurality of coupling cavities disposed in the socket, a plurality of pins, an inner cover plate disposed corresponding to the plurality of coupling cavities, and an outer cover plate capable of sealing fit with the socket; a plurality of metalized areas are arranged at the bottom of the coupling cavity and at one side of the inner cover plate facing the coupling cavity; the metallized area is used for fixing the coupling element and can electrically connect the electrode of the coupling element with the pin; for any two adjacent coupling cavities, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are adjacently arranged; for any two adjacent inner cover plates, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are disposed adjacent.

The multichannel photoelectric coupler shell provided by the scheme can be provided with the coupling element for signal transmission and conversion. The interval metallized areas are used for leading out the positive electrode and the negative electrode of the coupling element, and the metallized areas for leading out the same polarity are adjacently arranged, so that the arrangement can effectively reduce the lead resistance, correspondingly reduce the power consumption and lead the wiring to be more reasonable.

Optionally, adjacent metallized areas at the bottom of the coupling cavity are symmetrically arranged, and adjacent metallized areas on the inner cover plate are symmetrically arranged. Through the symmetrical arrangement of adjacent metallized areas, the coupling elements arranged on the metal areas can be further arranged symmetrically, so that the leads for connecting the anode and the cathode can be arranged in a symmetrical mode, the wiring of a user in the use process is more reasonable, the power consumption in the actual use process can be effectively reduced, the reliability of the device is improved, and the higher requirements of the user are met.

Optionally, the bottom of the coupling cavity is provided with a first metallization region and a second metallization region, and the inner cover plate is provided with a third metallization region and a fourth metallization region; the coupling cavity is provided with a first mounting plate and a second mounting plate which are opposite to each other and used for mounting the inner cover plate, and a fifth metalized area and a sixth metalized area which are arranged on the first mounting plate are respectively contacted with and electrically connected with a third metalized area and a fourth metalized area on the inner cover plate.

Optionally, one end of the inner cover plate is provided with a notch, and the third metalized area and the fourth metalized area extend to two sides of the notch respectively.

Optionally, the first and second metallized regions extend to a side of the coupling cavity where the second mounting plate is disposed.

Optionally, the pins include an input pin and an output pin; the input end pin is arranged on one side of the tube seat close to the first mounting plate and is electrically connected with the fifth metallization area or the sixth metallization area; the output terminal pin is arranged on one side of the tube seat, which is away from the first mounting plate, and is electrically connected with the first metalized area or the second metalized area.

Optionally, the first metalized region and the second metalized region are independently selected from rectangular or L-shaped; the third metalized region and the fourth metalized region are independently selected from rectangular or L-shaped.

Optionally, a positioning mark is further arranged on the tube seat.

A second aspect of the present disclosure provides a multi-channel optocoupler comprising a coupling element and a multi-channel optocoupler housing as set forth in the foregoing first aspect and any one of its preferred aspects; the coupling element comprises a light emitting element and a light receiving element, the light emitting element is arranged in a metallized area on the inner cover plate, and the light receiving element is arranged in a metallized area at the bottom of the coupling cavity.

Optionally, one electrode of the light-emitting element is electrically connected with the metallization region where the light-emitting element is arranged through a conductive medium, and the other electrode is electrically connected with the other metallization region on the inner cover plate through a bonding wire; one electrode of the light receiving element is electrically connected with the metallization region arranged in the light receiving element through a conductive medium, and the other electrode is electrically connected with the other metallization region at the bottom of the coupling cavity through a bonding wire.

In summary, in the multi-channel photoelectric coupler housing provided by the present disclosure, and the multi-channel photoelectric coupler having such a housing, the leads with the same polarity are arranged adjacently, and the adjacent coupling cavities and the corresponding inner cover plates are further arranged symmetrically, so that only the leads need to be connected with the same polarity during wiring, thereby avoiding cross wiring, reducing the resistance of the leads and the power consumption brought by the same, and achieving the purpose of reducing the saturation voltage drop to a certain extent, so that the overall wiring becomes more reasonable, and the reliability and stability of the whole device are improved.

Drawings

Fig. 1 is a schematic diagram of an internal structure of a multi-channel optocoupler according to an embodiment;

fig. 2 is a schematic structural diagram of an inner cover plate of a multi-channel photoelectric coupler according to an embodiment;

Fig. 3 is a schematic structural diagram of an outer cover plate of a multi-channel photoelectric coupler according to an embodiment;

Fig. 4 is a schematic diagram of a multi-channel optocoupler package structure according to an embodiment;

Fig. 5 is a schematic circuit diagram of an exemplary four-channel optocoupler.

The reference numerals in the drawings indicate:

1 a coupling cavity, 101 a first metalized region, 102 a second metalized region, 111 a first mounting plate, 112 a second mounting plate, 113a fifth metalized region, 114 a sixth metalized region;

2. A light emitting element;

3. A light receiving element;

4 inner cover plate, 401 third metalized area, 402 fourth metalized area, 41 notch;

5. A bonding wire;

6. an optical isolation wall;

7. a tube seat;

8. An outer cover plate;

9. positioning marks.

Detailed Description

Embodiments of the present disclosure are described in detail below with reference to the attached drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The following examples are illustrative, and the embodiments described therein are not representative of all embodiments consistent with the present application.

In this specification, it will also be understood that when an element is described as being "electrically connected" to another element, such as the other element, the one element may be directly connected or directly coupled to the one element, or there may be a third element in between.

It should be appreciated that although the present application employs ordinal terms such as "first," "second," "… …" and "sixth," these ordinal terms are merely used to distinguish one type of thing from another, and do not represent a sequence, importance or quantity thereof. The features of the examples and embodiments described below may be combined with each other without conflict.

Embodiments of the present disclosure provide a multichannel optocoupler housing. As shown in fig. 1, the multi-channel optocoupler housing includes a header 7, a plurality of pins (not shown in fig. 1), a plurality of inner cover plates 4 as shown in fig. 4, and an outer cover plate 8 as shown in fig. 3. The embodiment of the disclosure also provides a multichannel photoelectric coupler, which comprises a multichannel photoelectric coupler shell and a coupling element, wherein the coupling element comprises a light emitting element 2 and a light receiving element 3.

The inner space of the tube seat 7 is divided into a plurality of coupling cavities 1, and the number of the coupling cavities 1 is consistent with that of the optocoupler channels. In general, an optical isolation wall 6 may be provided in the socket 7 to partition the inner space of the socket 7 to form a plurality of coupling cavities 1. And, the optical isolation wall 6 can play a physical isolation role between adjacent channels, so that each channel can independently and normally work.

In an exemplary embodiment, the tube base 7 is a rectangular parallelepiped, and the coupling cavities 1 are arranged in a single row along the long axis direction of the tube base 7. A plurality of pins (not shown) are arranged on the outer side wall of the header 7, for example, on both long sides of the header 7, respectively, and the metallized areas within the header 7 are electrically connected correspondingly.

The inner cover plate 4 is used for forming a space for accommodating the coupling element in cooperation with the coupling cavity 1, and the inner cover plate 4 can also be used for fixing part of the coupling element. The plurality of inner cover plates 4 can be integrated or arranged separately, namely, the plurality of coupling cavities 1 are corresponding to one integrated inner cover plate 4 together, or each coupling cavity 1 is corresponding to one inner cover plate 4 respectively; the latter approach is preferred for embodiments of the present disclosure.

A plurality of metalized areas are arranged at the bottom of the coupling cavity 1 and at the side of the inner cover plate 4 facing the coupling cavity 1; the metallized area is used to electrically connect the electrode of the coupling element with the pin. In a specific implementation, a portion of the electrodes of the coupling element may be connected to the metallized region by a conductive medium to secure the coupling element to the metallized region while simultaneously making an electrical connection. The conductive medium is preferably a conductive adhesive.

In a typical embodiment, two metallized regions insulated from each other may be disposed at the bottom of the coupling cavity at intervals, and one electrode of the light receiving element 3 is connected to one metallized region through conductive adhesive, so that the light receiving element 3 is fixed on the metallized region and electrically connected to the metallized region, and the other electrode of the light receiving element 3 is electrically connected to the other metallized region through a wire, a lead, or the like.

Of course, the area of the metallized area, especially the metallized area for installing the coupling element is preferably larger than the installation area of the corresponding coupling element, so that the coupling element can adjust the installation position, and further adjust the parameters such as the transmission gain of the optical coupler.

Depending on the actual situation, for example the arrangement of the electrodes of the coupling element, it is also possible to mount the coupling element in a non-metallized area, the electrodes of the coupling element being connected to different metallized areas by means of wires or the like, respectively.

In an exemplary embodiment, for any two adjacent coupling cavities 1, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are disposed adjacent; similarly, for any two adjacent inner cover plates 4, the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are disposed adjacently. Referring to the first and second coupling cavities from the left in fig. 1, it can be seen that the two metallized areas electrically connected to the pd+ electrode are both close to the middle optical isolation wall 6, the corresponding outlets are closer, and similarly, the corresponding pins are also adjacent.

In an embodiment, the light emitting element 2 can be disposed in a metallized area of the inner cover plate 4, and the light receiving element 3 can be disposed in a metallized area at the bottom of the coupling cavity 1; preferably, the metallized areas at the bottom of the adjacent coupling cavities 1 are symmetrically arranged, and the metallized areas on the adjacent inner cover plates 4 are symmetrically arranged.

According to the above-described embodiments, there is further provided an embodiment of a multichannel photocoupler, as shown in fig. 1 and 2, in which one light receiving element 3 is provided in each coupling cavity 1, and one light emitting element 2 is provided on the inner cover plate 4 corresponding to each coupling cavity 1, but the embodiment of the present disclosure is not limited thereto, and the positions of the light emitting element 2 and the light receiving element 3 may be changed as long as conversion of an electric signal-optical signal-electric signal is achieved, in other words, as long as the light receiving element 3 can receive an optical signal provided by the light emitting element 2.

In an embodiment of a multi-channel optocoupler, a plurality of light emitting elements and/or light receiving elements may be provided in each channel, for example, one light emitting element 2 and two light receiving elements 3 in one coupling cavity 1 as a linear optocoupler; or two light emitting elements 2 and one light receiving element 3 are arranged in one coupling cavity 1.

Specifically, a plurality of metallized areas and a light receiving element 3 are arranged at the bottom of each coupling cavity 1, and the photosensitive surface of the light receiving element 3 faces the inner cover plate 4. The light receiving element 3 may be a phototransistor, a photodiode, a photosensitive darlington tube, or the like.

Specifically, a plurality of metallized areas and light-emitting elements 2 are arranged on the surface of each inner cover plate 4 facing the coupling cavity 1, and the light-emitting surface of the light-emitting element 2 faces the photosensitive surface of the light-receiving element 3, so as to realize the propagation and the reception of optical signals. Wherein the light emitting element 2 can be a light emitting diode.

In an exemplary embodiment, the metallized areas at the bottom of each two adjacent coupling cavities 1 are identical in shape and symmetrically arranged; similarly, the metalized areas on adjacent inner cover plates 4 are similarly shaped and positioned symmetrically so that the electrodes of the same polarity of light emitting elements 2 are positioned adjacent and the electrodes of the same polarity of light receiving elements 3 are positioned adjacent.

In a specific embodiment, as shown in fig. 1, a first metallization region 101 and a second metallization region 102 are disposed at the bottom of each coupling cavity 1, and the light receiving element 3 is disposed in one of the first metallization region 101 and the second metallization region 102. Referring to fig. 2 and 4 together, the inner cover plate 4 is provided with a third metalized region 401 and a fourth metalized region 402, and the light emitting element 2 is provided in one of the third metalized region 401 and the fourth metalized region 402.

In one embodiment, one electrode of the light emitting element 2 is electrically connected to a metalized area provided on the inner cover plate 4 through a conductive paste, and the other electrode is electrically connected to another metalized area provided on the inner cover plate 4 through a bonding wire; one electrode of the light receiving element 3 is electrically connected with a metallization region arranged at the bottom of the coupling cavity 1 through conductive adhesive, and the other electrode is electrically connected with the other metallization region at the bottom of the coupling cavity 1 through bonding wires.

According to the above embodiment, the optical isolation wall 6 is provided in the middle of the adjacent coupling cavities 1, and a pair of mounting plates are provided on the opposite inner side walls of each coupling cavity 1 for mounting the inner cover plate 4. As shown in fig. 1, the pair of mounting plates specifically includes a first mounting plate 111 and a second mounting plate 112, which are disposed on both sides of the inner sidewall of the coupling cavity 1 in the vertical direction, wherein one of the first mounting plate 111 or the second mounting plate 112 is provided with a spaced metallized region. In the following description, a metalized area provided on the first mounting board 111 will be described as an example. The other end of the inner cover plate 4, which is not provided with a metalized area, can be fixedly connected with a mounting plate (second mounting plate 112) which is not provided with a metalized area through insulating glue.

In an exemplary embodiment, as shown in fig. 1, the coupling cavity 1 is provided with opposite mounting plates, wherein the first mounting plate 111 is provided with two metallized areas arranged at intervals, namely a fifth metallized area 113 and a sixth metallized area 114, and the fifth metallized area 113 and the sixth metallized area 114 can be respectively contacted and electrically connected with a third metallized area 401 and a fourth metallized area 402 arranged at one end of the inner cover plate 4, for example, the electric contact can be realized by conductive media such as conductive glue; the other end of the inner cover plate 4, which is not provided with a metalized area, can be fixed to the second mounting plate 112 by an insulating adhesive.

Illustratively, two mounting plates of each of the four coupling cavities 1 are arranged along two long sides of the stem 7, respectively. In one embodiment, the mounting plates of the plurality of coupling cavities 1, which are provided with the metallized areas, are all positioned on the same side of the tube seat 7; as shown in fig. 1, the first mounting plates 111 are each located on the side below the stem 7 (in the drawing), and the second mounting plates 112 are each located on the side above the stem 7 (in the drawing).

In one embodiment, as shown in fig. 2, one end of the inner cover plate 4 has a notch 41, and the third metalized area 401 and the fourth metalized area 402 extend to both sides of the notch 41, respectively. According to the above embodiment, the metallized areas on both sides of the notch 41 can be fixed and electrically connected with the metallized areas on the first mounting board 111 at intervals by conductive adhesive, so that the extraction of the positive and negative electrodes of the light emitting element 2 can be realized, and meanwhile, the short circuit between the positive and negative electrodes can be avoided. Alternatively, the mounting plate may be an insulating material such as ceramic.

In one embodiment, the first and second metallized areas 101, 102 extend to the side of the coupling cavity 1 facing away from the mounting plate on which the metallized areas are provided, respectively, and, in the example of fig. 1, to the side on which the second mounting plate 112 is provided. It will be appreciated that the pins of the signal output terminals in this embodiment should be concentrated in the upper part of the figure, and the pins of the signal output terminals are electrically connected to the above-mentioned extending portions and thereby connected to the electrodes of the light receiving element 3, so that concentrated pin arrangement of the output terminals is achieved, and pins of the same polarity may be adjacently disposed.

The pins of the multi-channel photoelectric coupler provided by the embodiment specifically comprise a plurality of input end pins and a plurality of output end pins, and the pins are used for realizing the electric connection between the multi-channel photoelectric coupler and an external circuit so as to be convenient for normal use.

Specifically, the pins are located outside the header 7 and are electrically connected to the metallized areas on the header 7. The pins of the photoelectric coupler can have various structural forms according to different packaging forms. For example, for dual in-line DIP packages, the portion of the leads that are outside the header 7 extends along the entire thickness of the header 7 and beyond the bottom surface of the header 7; for a surface mount package, the leads may extend to cover the bottom surface of header 7. Optionally, the multi-channel optical-electrical coupler provided in the embodiment of the present disclosure may also use SOP packages, surface-mounted LCC packages, and the like, and correspondingly, the pin shapes and structures thereof are different. In addition, it should be noted that, in the present embodiment, the pins are pins in a broad sense, for example, for dual in-line DIP packages, the pins refer to metal posts with specific shapes; for surface mount packages, the fingers may be a specially shaped metal layer.

The specific implementation for pin set up is as follows:

The input terminal pins are arranged on one side of the tube seat 7 close to the mounting plate with the metalized area, namely one side close to the first mounting plate 111 in fig. 1, and are electrically connected with the fifth metalized area 113 or the sixth metalized area 114; the output pins are arranged on the side of the tube socket 7 facing away from the mounting plate provided with the metallized area, i.e. on the side of fig. 1 close to the second mounting plate 112, and are electrically connected to the first metallized area 101 or the second metallized area 102.

In one embodiment, as shown in fig. 1, one of the first and second metalized areas 101 and 102 is rectangular and the other is L-shaped; of course, the present disclosure is not limited thereto, and in other embodiments, the first metalized region 101 and the second metalized region 102 may each take other shapes, such as a parallelogram; or the first metalized region 101 and the second metalized region may both be rectangular or both be L-shaped.

Similarly, the present disclosure is not strictly limited to the shape of the third metalized region 401 and the fourth metalized region 402, and the shape and size of the two may be the same or different, as long as the mounting of the fixed light emitting element and the reliable electrical connection to the light emitting element are facilitated. In a specific embodiment, as shown in fig. 2, the third metalized area 401 and the fourth metalized area 402 are each L-shaped with different lengths and have staggered short sides. In other embodiments, one of the third metalized region 401 and the fourth metalized region 402 is rectangular and the other is L-shaped.

According to the above embodiment, as shown in fig. 1, alternatively, the first metalized area 101 may be rectangular, the second metalized area 102 may be mirrored "L" or positive "L", and the light receiving element 3 is fixed on the second metalized area 102 by conductive adhesive, and the electrode of the light receiving element 3 is electrically connected to the first metalized area 101 by the metal bonding wire 5. Of course, the light receiving element 3 may also be fixed on the first metalized area 101 by conductive adhesive, and the electrode of the light receiving element 3 is electrically connected to the second metalized area 102 by the metal bonding wire 5.

As shown in fig. 2, alternatively, the third metalized region 401 may be inverted "L" shaped or inverted mirror image "L" shaped, and the fourth metalized region 402 may also be inverted mirror image "L" shaped or inverted "L" shaped. The light emitting element 2 is fixed on the fourth metallization region 402 by a conductive adhesive, and the electrode of the light emitting element 2 is electrically connected to the third metallization region 401 by a metal bonding wire 5. Alternatively, the light emitting element 2 may be fixed to the third metallization region 401 by a conductive adhesive, and the electrode of the light emitting element 2 is electrically connected to the fourth metallization region 402 by a metal bonding wire 5.

According to the above embodiment, as shown in fig. 1 and 2, the optical isolation wall 6 is provided between the adjacent coupling cavities 1, and the adjacent coupling cavities 1 and the inner cover plate 4 corresponding to the coupling cavities 1 are symmetrically provided with the optical isolation wall 6 as the symmetry axis.

According to the above embodiment, the positive and negative electrodes can be extracted according to the layout position and polarity setting of the light emitting element 2. For example, as shown in fig. 2, when the light emitting element 2 is fixed to the metallized region on the left side of the inner cover plate 4 in the drawing, the two metallized regions of the inner cover plate 4 can lead out the positive electrode (+) and the negative electrode (-), respectively. In contrast, when the light emitting element 2 is fixed to the metallized region on the right side of the inner cover plate 4 in the drawing, the two metallized regions of the inner cover plate 4 can lead out the negative electrode (-) and the positive electrode (+) respectively.

In one embodiment, as shown in fig. 1 and 4, the tube seat 7 is further provided with a positioning mark 9, which can facilitate identification and positioning during processing by a craftsman and during use by a user, and optionally, the positioning mark 9 may be a square metalized area and be disposed on the top surface of the tube seat 7. Of course, the positioning mark 9 is not limited thereto, and may take other forms, such as a notch or the like formed on the stem 7.

Referring to fig. 4, in the multi-channel photoelectric coupler housing provided in the embodiment of the present disclosure, the top surface of the tube seat 7 is further provided with a metalized area for mounting the outer cover plate 8 by means of parallel seam welding.

According to the above embodiment, the multi-channel photoelectric coupler housing and the multi-channel photoelectric coupler provided by the present disclosure have the same internal structure of each channel, the metallized areas between adjacent channels are symmetrically distributed, a plurality of input terminal pins are all disposed at one side of the multi-channel photoelectric coupler, and is electrically connected to the metallized areas on the mounting board, and the pins of the same electrode are disposed adjacent, as shown in figure 1, the input pins are connected to the metallized areas on the first mounting board 111, may be "++ - +++ - + … …" (+ being positive electrode, -being negative electrode) in that order; the output pins are all arranged on the other side of the multichannel photoelectric coupler and are electrically connected with the metallization area at the bottom of the coupling cavity 1, as shown in figure 1, the output terminal pin is connected with the metallized area at the bottom of the coupling cavity 1 the sequence is 'PD-PD+PD+PD-PD-PD+PD+PD- …' (PD+ is positive electrode, PD-is the negative electrode). By the aid of the method, interlayer wiring can be avoided, lead resistance is reduced, power consumption caused by leads can be reduced, and the purpose of reducing saturation voltage drop is achieved to a certain extent. By adopting the design, in actual use, the adjacent identical electrodes are only required to be connected together, so that the electric connection can be realized.

Preferably, the tube seat 7 of the multi-channel photoelectric coupler housing provided by the embodiment of the present disclosure is a metal ceramic gold-plated tube seat, and the inner cover plate 4 is a ceramic material. The ceramic material not only has high resistivity and high dielectric constant, but also has the advantages of high strength, oxidation resistance, corrosion resistance, high temperature resistance and the like; the metal material, especially gold, has the characteristics of low resistivity, low dielectric constant, high conductivity and the like, and can better meet the requirements on the working frequency, the signal transmission speed, the power consumption and the like of the photoelectric coupler.

Preferably, the outer cover plate 8 adopts a gold-plated kovar alloy, and a metallized ceramic full-sealing structure can be realized between the kovar alloy and the metal ceramic tube seat, so that the requirement of water vapor content is ensured, and the multichannel metal ceramic package is realized.

Examples

The embodiment of the disclosure provides a four-channel photoelectric coupler housing and a four-channel photoelectric coupler, and fig. 5 is a schematic circuit diagram of the four-channel photoelectric coupler. Referring to fig. 1 and 2, the light emitting element 2 converts an electrical signal into an optical signal and transmits the optical signal to the light receiving element 3, and the light receiving element 3 converts the received optical signal into an electrical signal and outputs the electrical signal, thereby realizing "electro-optical-electrical" conversion.

As shown in fig. 1, the four-channel photoelectric coupler housing comprises a tube seat 7, wherein the interior of the tube seat 7 is divided into four coupling cavities 1 which are sequentially distributed by three optical isolation walls 6, the number of the coupling cavities 1 is consistent with that of channels, and for convenience of description, the 1 st, 2 nd, 3 rd and 4 th channels are sequentially arranged from left to right in fig. 1.

In this example, a phototransistor is selected as the light receiving element 3, and a light emitting diode is selected as the light emitting element 2. As shown in fig. 1, in the 1 st channel, i.e. in the first coupling cavity 1, the phototransistor is fixed in the second metallization region 102 by conductive glue, i.e. the metallization region arranged as mirror image "L" in the figure, the collector of the phototransistor is electrically connected to the second metallization region 102, and the emitter is electrically connected to the first metallization region 101 by a metal bonding wire, i.e. the metallization region arranged as square in the figure.

The 2 nd channel is adjacent to the 1 st channel and symmetrically arranged, the phototransistor is fixed in a second metallized area 102 in the second coupling cavity by conductive adhesive, that is, the metallized area is arranged as a positive L-shaped metallized area in the figure, and the connection mode of the two electrodes of the phototransistor and the metallized area is the same as the above, which is not repeated here.

The 3 rd bit channel and the 2 nd bit channel are symmetrically arranged, and the 4 th bit channel and the 3 rd bit channel are symmetrically arranged. The specific fixed position and connection manner of the phototransistor in the 3 rd channel may refer to the related content in the 1 st channel, and the fixed position and connection manner of the phototransistor in the 4 th channel may refer to the related content in the 2 nd channel, which is not described herein.

According to the above embodiment, as shown in fig. 1, the first mounting plate 111 and the second mounting plate 112 are provided on both sides in the vertical direction in each coupling chamber 1 for mounting the inner cover plate 4. Wherein, the first mounting plate 111 is provided with square metallized areas at intervals on two sides in the horizontal direction for leading out the positive and negative electrodes, and the second mounting plate 112 is not provided with metallized areas.

According to the above embodiment, a metallized square positioning mark 9 is provided on the top surface of the tube seat 7, and as shown in fig. 1, the positioning mark 9 can be conveniently identified and positioned by a craftsman during processing and a user during use.

In fig. 2, there are shown two structures of the inner cover plate 4, wherein the inner cover plate 4 on the left side is adapted for the 1 st and 3 rd channels of the four-channel photocoupler, and the inner cover plate 4 on the right side is adapted for the 2 nd and 4 th channels of the four-channel photocoupler. The surface of the inner cover plate 4 is provided with a third metalized area 401 and a fourth metalized area 402 at intervals. In the specific embodiment of the disclosure, the inner cover plate corresponding to the 1 st and 3 rd channels is taken as an example. The third metalized area 401 is in an inverted positive L shape, the fourth metalized area 402 is in an inverted mirror image L shape, the light emitting diode is fixed on the fourth metalized area 402 through conductive adhesive, the light emitting diode and the third metalized area 401 are respectively arranged on two sides of the inner cover plate 4 in the horizontal direction, and the light emitting diode is connected with the third metalized area 401 through a metal bonding wire 5. The inner cover plate 4 on the right side and the inner cover plate 4 on the left side in the drawing are symmetrically arranged, and are not described herein.

According to the above embodiment, the middle region of the lower end of the inner cover plate 4 is provided with a notch 41, and the third metalized region 401 and the fourth metalized region 402 extend from the middle region of the inner cover plate 4 to both sides of the notch 41, respectively. The metallized areas on both sides of the notch 41 can be respectively and fixedly connected and electrically connected with the metallized areas on the first mounting plate 111 through conductive adhesive, and the other end of the inner cover plate 4 can be fixedly connected with the second mounting plate 112 through insulating adhesive.

According to the above embodiment, the top surface partial region of the stem 7 is provided with a metalized region for mounting the outer cover 8 by means of parallel seam welding.

In the embodiment of the disclosure, the four-way optocoupler shown in fig. 1 adopts a design of a 16-pin package, and includes 8 input pins located on the lower side of the overall package and 8 output pins located on the upper side in the vertical direction in the figure. For the input-side pins to be used, the positive electrode and the negative electrode may be sequentially arranged from left to right according to the horizontal direction in the figure; for the output pins, it may be set to "PD-PD + PD" (PD + is the output positive), PD-is negative at the output).

In summary, the multichannel photoelectric coupler housing and the multichannel photoelectric coupler provided by the embodiments of the present disclosure are based on symmetrically arranging the adjacent metallized areas on the bottom of the coupling cavity and the inner cover plate, and the light emitting element and the light receiving element mounted on the metallized areas, so that the pins with the same polarity are arranged adjacently, and the pins with the same polarity are connected, so that the wiring is more reasonable, the cross wiring is avoided, the lead resistance and the power consumption brought by the lead resistance are further reduced, the reliability and the stability of the device are greatly improved, and the higher requirements of users are satisfied.

The above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims (10)

1. The multichannel photoelectric coupler shell is characterized by comprising a tube seat (7), a plurality of coupling cavities (1) arranged in the tube seat (7), an inner cover plate (4) arranged corresponding to the plurality of coupling cavities (1), a plurality of pins and an outer cover plate (8) capable of being in sealing fit with the tube seat (7);

A plurality of metalized areas are arranged at the bottom of the coupling cavity (1) and at one side of the inner cover plate (4) facing the coupling cavity (1); the metallized area is used for fixing a coupling element and can electrically connect an electrode of the coupling element with the pin;

For any two adjacent coupling cavities (1), the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are adjacently arranged;

For any two adjacent inner cover plates (4), the metallized areas for electrically connecting the homopolar electrodes of the coupling elements are arranged adjacently.

2. The multi-channel optocoupler housing of claim 1 wherein the metallized areas at the bottom of adjacent coupling cavities (1) are symmetrically arranged and the metallized areas on adjacent inner cover plates (4) are symmetrically arranged.

3. The multi-channel optocoupler housing of claim 2, wherein a first metallized area (101) and a second metallized area (102) are provided at the bottom of the coupling cavity (1), and a third metallized area (401) and a fourth metallized area (402) are provided on the inner cover plate (4);

The coupling cavity (1) is provided with a first mounting plate (111) and a second mounting plate (112) which are opposite to each other for mounting the inner cover plate (4), and a fifth metalized area (113) and a sixth metalized area (114) which are provided on the first mounting plate (111) are respectively contacted and electrically connected with a third metalized area (401) and a fourth metalized area (402) on the inner cover plate (4).

4. A multi-channel optocoupler housing according to claim 3, characterized in that one end of the inner cover plate (4) has a notch (41), the third (401) and fourth (402) metallized areas extending to both sides of the notch (41), respectively.

5. A multi-channel optocoupler housing according to claim 3, characterized in that the first (101) and second (102) metallized areas extend to the side of the coupling cavity (1) where the second mounting plate (112) is arranged.

6. The multi-channel optocoupler housing of any one of claims 3 to 5 wherein the pins comprise an input pin and an output pin; wherein,

The input end pins are arranged on one side of the tube seat (7) close to the first mounting plate (111) and are electrically connected with the fifth metalized area (113) or the sixth metalized area (114);

The output terminal pins are arranged on one side of the tube seat (7) which is away from the first mounting plate (111) and are electrically connected with the first metalized area (101) or the second metalized area (102).

7. A multi-channel optocoupler housing of claim 3 wherein the first metallized region (101) and second metallized region (102) are independently selected from rectangular or L-shaped;

The third (401) and fourth (402) metallized regions are independently selected from rectangular or L-shaped.

8. Multichannel optocoupler housing according to any one of claims 1 to 5, 7, characterized in that the tube socket (7) is further provided with positioning marks (9).

9. A multi-channel optocoupler comprising a coupling element and a multi-channel optocoupler housing according to any one of claims 1 to 8;

The coupling element comprises a light emitting element (2) and a light receiving element (3), wherein the light emitting element (2) is arranged in a metallization area on the inner cover plate (4), and the light receiving element (3) is arranged in a metallization area at the bottom of the coupling cavity (1).

10. The multichannel photocoupler according to claim 9, characterized in that one electrode of the light emitting element (2) is electrically connected to the metallization region where it is arranged by means of a conductive medium, the other electrode being electrically connected to the other metallization region on the inner cover plate (4) by means of a bonding wire;

One electrode of the light receiving element (3) is electrically connected with the metallization region arranged on the light receiving element through a conductive medium, and the other electrode is electrically connected with the other metallization region at the bottom of the coupling cavity (1) through a bonding wire.