CN220963280U - Semiconductor wafer centering device - Google Patents
Semiconductor wafer centering device Download PDFInfo
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- CN220963280U CN220963280U CN202322880706.9U CN202322880706U CN220963280U CN 220963280 U CN220963280 U CN 220963280U CN 202322880706 U CN202322880706 U CN 202322880706U CN 220963280 U CN220963280 U CN 220963280U
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- wafer
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- cleaning gas
- supporting
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000000007 visual effect Effects 0.000 claims abstract description 16
- 238000001179 sorption measurement Methods 0.000 claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims description 87
- 238000004140 cleaning Methods 0.000 claims description 46
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 4
- 238000011179 visual inspection Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor wafer centering device which comprises a substrate, a visual detection assembly, a wafer Z-axis supporting assembly, a Y-axis conveying assembly and a vacuum rotary slide assembly, wherein the visual detection assembly is used for detecting the position and the posture of a wafer, the Y-axis conveying assembly drives the vacuum rotary slide assembly to be close to or far away from the visual detection assembly, the vacuum rotary slide assembly is used for adsorbing the wafer in a vacuum adsorption mode and driving the wafer to rotate, and the wafer Z-axis supporting assembly is used for supporting and lifting the wafer. According to the utility model, through the cooperation arrangement of the visual detection assembly, the Y-axis conveying assembly, the vacuum rotary slide assembly and the wafer Z-axis supporting assembly comprising the linear stepping motor, the lifting arm and the wafer supporting piece, the occupied space of the whole equipment in the up-down direction can be greatly reduced, the whole structure of the equipment is more compact, the whole volume is effectively reduced, the vacuum rotary slide assembly is more suitable for the production environment with smaller equipment placing space, and the applicability is better.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor wafer centering device.
Background
In semiconductor processing, it is often desirable to center the processed semiconductor wafer. The present semiconductor wafer centering device adopts a linear cylinder as a driving piece to connect parts for supporting the moving wafer to the adjusting and supporting structure of the wafer, so as to drive the wafer to perform centering action. The cylinder body of the linear cylinder needs to be fixed with the equipment main body, and occupies a larger space in the up-down direction, so that the whole size of the equipment is larger, and the equipment is not suitable for use in a production environment with a smaller equipment placement space.
Disclosure of utility model
In view of the foregoing, an object of the present utility model is to provide a semiconductor wafer centering device.
The aim of the utility model is realized by the following technical scheme:
The semiconductor wafer centering device comprises a substrate, a visual detection assembly, a wafer Z-axis supporting assembly, a Y-axis conveying assembly and a vacuum rotating slide assembly, wherein the visual detection assembly is arranged on the substrate and is used for detecting the position and the posture of a wafer, the Y-axis conveying assembly is arranged on the substrate and drives the vacuum rotating slide assembly to be close to or far away from the visual detection assembly, the vacuum rotating slide assembly is used for adsorbing the wafer in a vacuum adsorption mode and driving the wafer to rotate, and the wafer Z-axis supporting assembly is used for supporting and lifting the wafer;
The wafer Z-axis supporting assembly comprises a linear stepping motor, a lifting arm and a wafer supporting piece, wherein the linear stepping motor comprises a screw rod part and a linear stepping motor main body part which are connected together, the screw rod part of the linear stepping motor is connected to the substrate, the lifting arm is connected with the linear stepping motor main body part of the linear stepping motor, and a plurality of wafer supporting pieces used for wafers are arranged on the lifting arm.
The lifting arm is U-shaped, the U-shaped opening of the lifting arm faces the visual detection assembly, the vacuum rotary slide assembly is located on the inner side of the U-shaped opening of the lifting arm, and the linear stepping motor main body part of the linear stepping motor is connected with one end, far away from the visual detection assembly, of the lifting arm.
The wafer support piece is a support supporting plate or a support PIN needle, and the support supporting plate or the support PIN needle is symmetrically arranged on two sides of the U-shaped lifting arm respectively.
The base plate is provided with a plurality of vertical guide rail mounting seats, each vertical guide rail mounting seat is provided with a vertical guide rail, the positions, corresponding to the vertical guide rails, on the lifting arms are respectively provided with a vertical sliding block, and each vertical sliding block is respectively in sliding connection with the corresponding vertical guide rail.
The Y-axis conveying assembly comprises an electric cylinder, a horizontal supporting plate and a horizontal supporting plate connecting piece, wherein a shell of the electric cylinder is arranged on the substrate, a driving end of the electric cylinder is connected with one end of the horizontal supporting plate connecting piece, the other end of the horizontal supporting plate connecting piece is connected with the horizontal supporting plate, and the vacuum rotary slide assembly is arranged on the horizontal supporting plate.
The base plate on the lower side of the horizontal supporting plate is provided with a plurality of horizontal guide rails, horizontal sliding blocks are respectively arranged on the horizontal supporting plate corresponding to the horizontal guide rails, and each horizontal sliding block is respectively connected with the corresponding horizontal guide rail in a sliding mode.
The vacuum rotary slide assembly comprises a hollow direct-drive rotary motor, a slide holder connecting flange and a vacuum slide holder, wherein a shell of the hollow direct-drive rotary motor is arranged on the horizontal supporting plate, and the vacuum slide holder is connected with a driving end of the hollow direct-drive rotary motor through the slide holder connecting flange.
The top surface of the vacuum slide holder is provided with a plurality of adsorption pore canals, the inside of the vacuum slide holder is provided with a vacuumizing air passage communicated with each adsorption pore canal, and the vacuumizing air passage is provided with an opening at the bottom of the vacuum slide holder.
The outer edge of the top surface of the vacuum slide table is fixedly provided with a flexible positioning washer through a positioning ring and a screw, and the outer periphery of the flexible positioning washer is provided with an adsorption edge in an extending way upwards and outwards.
The visual inspection assembly comprises a CCD camera mounting frame, a CCD camera and a cleaning gas pipeline joint, wherein the CCD camera mounting frame is mounted on the substrate, two CCD cameras which are correspondingly arranged up and down are mounted on one side surface of the CCD camera mounting frame, cleaning gas blowing holes are respectively formed in the positions, close to lenses of the CCD cameras, of the CCD camera mounting frame, a cleaning gas injection pipeline is mounted on the other side surface of the CCD camera mounting frame, the cleaning gas injection pipeline is provided with a cleaning gas outlet and a cleaning gas inlet, each cleaning gas blowing hole is respectively communicated with one cleaning gas outlet of the cleaning gas injection pipeline, and the cleaning gas pipeline joint is mounted on the inlet of the cleaning gas injection pipeline.
The utility model has the advantages and positive effects that:
According to the utility model, through the cooperation arrangement of the visual detection assembly, the Y-axis conveying assembly, the vacuum rotary slide assembly and the wafer Z-axis supporting assembly comprising the linear stepping motor, the lifting arm and the wafer supporting piece, the occupied space of the whole equipment in the up-down direction can be greatly reduced, the whole structure of the equipment is more compact, the whole volume is effectively reduced, the vacuum rotary slide assembly is more suitable for the production environment with smaller equipment placing space, and the applicability is better.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the arrangement of the wafer Z-axis support assembly of the present utility model;
FIG. 3 is a schematic diagram of the setup configuration of the vacuum rotary slide assembly of the present utility model;
FIG. 4 is a schematic view of the arrangement of the visual inspection assembly according to the present utility model;
FIG. 5 is a schematic diagram showing steps of the wafer centering process according to the present utility model;
FIG. 6 is a second schematic diagram showing steps of the wafer centering process according to the present utility model;
FIG. 7 is a third schematic diagram showing steps of the wafer centering process according to the present utility model;
FIG. 8 is a diagram showing steps for performing a final centering process on a wafer according to the present utility model;
FIG. 9 is a fifth schematic diagram showing steps of the wafer centering process according to the present utility model.
In the figure: the cleaning device comprises a substrate 1, a linear stepping motor 2, a screw rod part 201, a linear stepping motor main body 202, a lifting arm 3, a supporting PIN needle 4, a vertical guide rail mounting seat 5, a vertical guide rail 6, a vertical sliding block 7, an electric cylinder 8, a horizontal supporting plate 9, a horizontal supporting plate connecting piece 10, a horizontal guide rail 11, a horizontal sliding block 12, a hollow direct-drive rotating motor 13, a slide holder connecting flange 14, a vacuum slide holder 15, a positioning ring 16, a flexible positioning washer 17, a CCD camera mounting frame 18, a cleaning gas blowing hole 1801, a CCD camera 19, a cleaning gas pipeline joint 20 and an adapter plate 21.
Detailed Description
The utility model is described in further detail below with reference to fig. 1-9.
1-4, The semiconductor wafer centering device in this embodiment includes a substrate 1, a vision detection assembly, a wafer Z-axis supporting assembly, a Y-axis conveying assembly and a vacuum rotating slide assembly, wherein the vision detection assembly is disposed on the substrate 1 and is used for detecting the position and the posture of the wafer, the Y-axis conveying assembly is disposed on the substrate 1 and drives the vacuum rotating slide assembly to approach or depart from the vision detection assembly (namely, move along the Y-axis direction), the vacuum rotating slide assembly is used for adsorbing the wafer in a vacuum adsorption manner and driving the wafer to rotate, and the wafer Z-axis supporting assembly is used for supporting and lifting the wafer.
The wafer Z-axis supporting component comprises a linear stepping motor 2, a lifting arm 3 and a wafer supporting piece, wherein the linear stepping motor 2 comprises a screw rod part 201 and a linear stepping motor main body part 202 which are connected together, the screw rod part 201 of the linear stepping motor 2 is connected to a base plate 1 through an adapter plate 21, the lifting arm 3 is connected with the linear stepping motor main body part 202 of the linear stepping motor 2, and a plurality of wafer supporting pieces for supporting and lifting the wafer are arranged on the lifting arm 3. The linear stepper motor 2 including the screw portion 201 and the linear stepper motor main body portion 202 in this embodiment is a commercially available product, and the operation is controlled by an external controller. When the lifting arm 3 is lifted, the linear stepping motor main body 202 of the linear stepping motor 2 moves together with the lifting arm 3, and only the screw rod part 201 needs to be fixed with the base plate 1.
Specifically, as shown in fig. 2, in this embodiment, the lifting arm 3 is in a U shape, the U-shaped opening of the lifting arm 3 faces the vision detection assembly, the vacuum rotating slide assembly is located at the inner side of the U-shaped opening of the lifting arm 3, and the linear stepping motor main body 202 of the linear stepping motor 2 is connected with one end of the lifting arm 3 far away from the vision detection assembly, so that the vacuum rotating slide assembly and the wafer Z-axis support assembly are more compact in arrangement structure, and occupation of equipment space is further reduced.
Specifically, in this embodiment, the wafer supporting member is a supporting pallet or a supporting PIN 4 (in the drawing of the specification, the supporting PIN 4 is used to support the PIN 4), and the supporting pallet or the supporting PIN 4 are symmetrically disposed on two sides of the lifting arm 3 having a U shape. The wafer can be lifted by using the supporting pallet or the supporting PIN needles 4 according to the use requirement. When the PIN 4 is supported, as shown in fig. 2, a plurality of PIN 4 are uniformly arranged on two sides of the lifting arm 3 in a U shape. When the supporting plate is adopted, two sides of the U-shaped lifting arm 3 are respectively provided with a supporting plate with relatively large length.
Specifically, as shown in fig. 2, in this embodiment, two vertical guide rail mounting seats 5 are provided on the substrate 1 through the adapter plate 21, each vertical guide rail mounting seat 5 is provided with a vertical guide rail 6, a vertical sliding block 7 is respectively provided on a position on the lifting arm 3 corresponding to each vertical guide rail 6, and each vertical sliding block 7 is respectively slidably connected with the corresponding vertical guide rail 6, so that the integral lifting formed by the linear stepping motor main body 202 of the linear stepping motor 2 and the lifting arm 3 can be stabilized. The length direction of each vertical rail 6 in this embodiment is perpendicular to the base plate 1.
Specifically, as shown in fig. 1 and 3, the Y-axis conveying assembly in this embodiment includes an electric cylinder 8, a horizontal pallet 9 and a horizontal pallet connector 10, wherein the housing of the electric cylinder 8 is mounted on the substrate 1, the driving end of the electric cylinder 8 is connected with one end of the horizontal pallet connector 10, the other end of the horizontal pallet connector 10 is connected with the horizontal pallet 9, and the vacuum rotary slide assembly is mounted on the horizontal pallet 9. The cylinder 8 is controlled to act, so that the horizontal supporting plate 9 and the vacuum rotary slide assembly are driven to move integrally along the Y-axis direction. Two horizontal guide rails 11 are arranged on the base plate 1 below the horizontal supporting plate 9, horizontal sliding blocks 12 are respectively arranged on the horizontal supporting plate 9 corresponding to the horizontal guide rails 11, and each horizontal sliding block 12 is respectively connected with the corresponding horizontal guide rail 11 in a sliding manner, so that the horizontal supporting plate 9 can stably and horizontally move. In this embodiment, the longitudinal direction of each horizontal rail 11 is parallel to the base plate 1. In the embodiment, the electric cylinder 8 is a commercially available rodless electric cylinder product, and the action is controlled by an external controller.
Specifically, as shown in fig. 3, in this embodiment, the vacuum rotary slide assembly includes a hollow direct-drive rotary motor 13, a slide stage connecting flange 14, and a vacuum slide stage 15, where a housing of the hollow direct-drive rotary motor 13 is mounted on the horizontal support plate 9, and the vacuum slide stage 15 is connected with a driving end of the hollow direct-drive rotary motor 13 through the slide stage connecting flange 14. In this embodiment, the hollow direct-drive rotary motor 13 is a commercially available product, and the action is controlled by an external controller.
Specifically, in this embodiment, the top surface of the vacuum stage 15 is provided with a plurality of adsorption channels, the inside of the vacuum stage 15 is provided with a vacuum air channel communicated with each adsorption channel, and the bottom of the vacuum stage 15 is provided with an opening. The wafer is adsorbed on the vacuum stage 15 by forming a vacuum negative pressure through the vacuum suction passage and the adsorption duct of the vacuum stage 15. The specific arrangement structure of the vacuum slide holder 15 in this embodiment adopts the prior art; the gas pipeline communicated with the opening of the vacuumizing air passage can pass through the hollow direct-drive rotating motor 13, the horizontal supporting plate 9 and the substrate 1 and is connected with an external vacuumizing device, so that the space for arranging the gas pipeline for vacuumizing is saved.
Specifically, as shown in fig. 3, in this embodiment, a flexible positioning washer 17 is fixed to the outer edge of the top surface of the vacuum stage 15 by a positioning ring 16 and screws, and an adsorption edge extends upward and outward from the outer periphery of the flexible positioning washer 17. Through the setting of flexible positioning washer 17, can be when adsorbing the warpage wafer, directly adsorb the warpage wafer through flexible positioning washer 17, and then make the application scope of equipment wider. The flexible locating washer 17 in this embodiment is of the same material as is common for flexible sealing rings of the prior art, such as rubber.
Specifically, as shown in fig. 4, the visual detection assembly in this embodiment includes a CCD camera mounting frame 18, a CCD camera 19 and a cleaning gas pipe connector 20, the CCD camera mounting frame 18 is mounted on the substrate 1, two CCD cameras 19 correspondingly disposed up and down are mounted on a side surface of the CCD camera mounting frame 18, cleaning gas blowing holes 1801 are respectively formed in lenses of the CCD camera mounting frame 18, which are close to the two CCD cameras 19, a cleaning gas injection pipe is mounted on the other side surface of the CCD camera mounting frame 18, the cleaning gas injection pipe has a cleaning gas outlet and a cleaning gas inlet, each cleaning gas blowing hole 1801 is respectively communicated with one cleaning gas outlet of the cleaning gas injection pipe, and the cleaning gas pipe connector 20 is mounted on the inlet of the cleaning gas injection pipe. The purge line connection 20 is adapted to connect to an external source of clean air. In this example, nitrogen was used as the cleaning gas. In this embodiment, the CCD cameras 19 are all commercially available products, and are connected to an external controller. Through the arrangement of the cleaning gas blowing holes 1801, the cleaning gas injection pipelines and the cleaning gas pipeline joints 20 on the CCD camera mounting frame 18, when no wafer is centered, the cleaning gas can enter from the cleaning gas pipeline joints 20 and is output from each cleaning gas blowing hole 1801 through the cleaning gas injection pipelines, and then the lenses of the two CCD cameras 19 are respectively purged, so that no fog, water drops or tiny dust is ensured to be attached to the lenses. The external controller can control the external cleaning air source simultaneously, so that the automatic purging function of the lens can be realized, the self-detection and self-cleaning can be realized, and the centering precision and efficiency are improved.
Working principle:
In the initialized state, the cylinder 8 is controlled to act firstly, so that the vacuum rotary slide assembly integrally adsorbs and drives the wafer to move to a detection point, and the CCD camera 19 detects the position of the wafer; if the CCD camera 19 cannot detect the wafer, continuing to enable the vacuum rotary slide assembly to approach the CCD camera 19; if the CCD camera 19 detects that the wafer position exceeds the detection point range, the vacuum rotating slide assembly is far away from the CCD camera 19; after the wafer accords with the detection point range, the action of the electric cylinder 8 is stopped to finish the initialization deviation correction, and then the wafer is subjected to the formal centering process.
The specific steps of performing a formal centering process on a wafer are shown in fig. 5-9; the hollow direct-drive rotating motor 13 is controlled to act so that the vacuum rotating slide assembly drives the wafer to rotate, the wafer is scanned through the CCD camera 19, as shown in fig. 5 and 6, the wafer position offset x, y and the offset angle theta are obtained, and the offset angle alpha, the offset distance L and the offset angle beta of a notch (or a flat) are obtained through calculation; then, the vacuum rotary slide assembly drives the wafer to rotate by an angle alpha, as shown in fig. 7, and at the moment, the eccentric point of the wafer is rotated back to the Y axis; the vacuum rotary slide assembly is driven by the control cylinder 8 to move along the Y axis by a corresponding distance L, as shown in FIG. 8, so that the wafer is centered; the vacuum rotary slide assembly is controlled to stop adsorbing the wafer, so that the linear stepping motor 2 acts to drive the lifting arm 3 to lift, and the wafer support is lifted by the wafer support piece on the lifting arm 3 and separated from the vacuum slide table 15; the cylinder 8 is controlled to act, so that the vacuum rotary slide assembly moves along the Y-axis in the opposite direction by a corresponding L distance, and the vacuum slide table 15 is centered; the linear stepping motor 2 is operated to drive the lifting arm 3 to descend, and the vacuum rotary slide assembly is enabled to re-adsorb the wafer, and the wafer and the vacuum slide table 15 are concentric at the moment as shown in fig. 8; controlling the hollow direct-drive rotary motor 13 to act, and rotating the eccentric angle beta to enable the notch or the flat port to rotate to a specified position as shown in fig. 9; and controlling the electric cylinder 8 to act, so that the vacuum rotary slide assembly drives the wafer to retract, and the whole centering process is completed to wait for taking a slide.
Claims (10)
1. A semiconductor wafer centering device, characterized in that: the wafer Z-axis detection device comprises a substrate (1), a visual detection assembly, a wafer Z-axis supporting assembly, a Y-axis conveying assembly and a vacuum rotating slide assembly, wherein the visual detection assembly is arranged on the substrate (1) and is used for detecting the position and the posture of a wafer, the Y-axis conveying assembly is arranged on the substrate (1) and drives the vacuum rotating slide assembly to be close to or far away from the visual detection assembly, the vacuum rotating slide assembly is used for adsorbing the wafer in a vacuum adsorption mode and driving the wafer to rotate, and the wafer Z-axis supporting assembly is used for supporting and lifting the wafer;
the wafer Z-axis supporting assembly comprises a linear stepping motor (2), a lifting arm (3) and a wafer supporting piece, wherein the linear stepping motor (2) comprises a screw rod part (201) and a linear stepping motor main body part (202) which are connected together, the screw rod part (201) of the linear stepping motor (2) is connected to the substrate (1), the lifting arm (3) is connected with the linear stepping motor main body part (202) of the linear stepping motor (2), and a plurality of wafer supporting pieces for wafers are arranged on the lifting arm (3).
2. The semiconductor wafer centering apparatus of claim 1, wherein: the lifting arm (3) is U-shaped, the U-shaped opening of the lifting arm (3) faces the visual detection assembly, the vacuum rotary slide assembly is located on the inner side of the U-shaped opening of the lifting arm (3), and the linear stepping motor main body part (202) of the linear stepping motor (2) is connected with one end, away from the visual detection assembly, of the lifting arm (3).
3. The semiconductor wafer centering apparatus of claim 2, wherein: the wafer support piece is a support supporting plate or a support PIN needle (4), and the support supporting plate or the support PIN needle (4) are symmetrically arranged on two sides of the U-shaped lifting arm (3) respectively.
4. The semiconductor wafer centering apparatus of claim 1, wherein: the base plate (1) is provided with a plurality of vertical guide rail mounting seats (5), each vertical guide rail mounting seat (5) is provided with a vertical guide rail (6), vertical sliding blocks (7) are respectively arranged on the lifting arm (3) corresponding to each vertical guide rail (6), and each vertical sliding block (7) is respectively in sliding connection with the corresponding vertical guide rail (6).
5. The semiconductor wafer centering apparatus of claim 1, wherein: the Y-axis conveying assembly comprises an electric cylinder (8), a horizontal support plate (9) and a horizontal support plate connecting piece (10), wherein a shell of the electric cylinder (8) is installed on the base plate (1), a driving end of the electric cylinder (8) is connected with one end of the horizontal support plate connecting piece (10), the other end of the horizontal support plate connecting piece (10) is connected with the horizontal support plate (9), and the vacuum rotary slide assembly is installed on the horizontal support plate (9).
6. The semiconductor wafer centering apparatus of claim 5, wherein: a plurality of horizontal guide rails (11) are arranged on the base plate (1) at the lower side of the horizontal supporting plate (9), horizontal sliding blocks (12) are respectively arranged on the horizontal supporting plate (9) corresponding to the horizontal guide rails (11), and the horizontal sliding blocks (12) are respectively connected with the corresponding horizontal guide rails (11) in a sliding mode.
7. The semiconductor wafer centering apparatus of claim 5, wherein: the vacuum rotary slide assembly comprises a hollow direct-drive rotary motor (13), a slide holder connecting flange (14) and a vacuum slide holder (15), wherein a shell of the hollow direct-drive rotary motor (13) is arranged on the horizontal support plate (9), and the vacuum slide holder (15) is connected with a driving end of the hollow direct-drive rotary motor (13) through the slide holder connecting flange (14).
8. The semiconductor wafer centering apparatus of claim 7, wherein: the top surface of the vacuum slide table (15) is provided with a plurality of adsorption pore canals, the inside of the vacuum slide table (15) is provided with a vacuumizing air passage communicated with each adsorption pore canal, and the vacuumizing air passage is provided with an opening at the bottom of the vacuum slide table (15).
9. The semiconductor wafer centering apparatus of claim 7, wherein: the outer edge of the top surface of the vacuum slide table (15) is fixedly provided with a flexible positioning washer (17) through a positioning ring (16) and a screw, and the outer periphery of the flexible positioning washer (17) is provided with an adsorption edge in an extending mode upwards and outwards.
10. The semiconductor wafer centering apparatus of claim 1, wherein: the visual inspection assembly comprises a CCD camera mounting frame (18), a CCD camera (19) and a cleaning gas pipeline joint (20), wherein the CCD camera mounting frame (18) is mounted on the substrate (1), two CCD cameras (19) which are correspondingly arranged up and down are mounted on one side surface of the CCD camera mounting frame (18), cleaning gas blowing holes (1801) are respectively formed in lenses of the CCD cameras (19) on the CCD camera mounting frame (18), cleaning gas injection pipelines are mounted on the other side surface of the CCD camera mounting frame (18), each cleaning gas injection pipeline is provided with a cleaning gas outlet and a cleaning gas inlet, each cleaning gas blowing hole (1801) is respectively communicated with one cleaning gas outlet of the cleaning gas injection pipeline, and the cleaning gas pipeline joint (20) is mounted on the inlet of the cleaning gas injection pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322880706.9U CN220963280U (en) | 2023-10-26 | 2023-10-26 | Semiconductor wafer centering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322880706.9U CN220963280U (en) | 2023-10-26 | 2023-10-26 | Semiconductor wafer centering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220963280U true CN220963280U (en) | 2024-05-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322880706.9U Active CN220963280U (en) | 2023-10-26 | 2023-10-26 | Semiconductor wafer centering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220963280U (en) |
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2023
- 2023-10-26 CN CN202322880706.9U patent/CN220963280U/en active Active
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