CN220960364U - Temperature measuring device and cryopump - Google Patents

Abstract

The embodiment of the application relates to a temperature measuring device and a cryopump. The temperature measuring device comprises a temperature sensor, a lead, an external wire protection tube and a heat conducting block, wherein one end of the lead is connected with the temperature sensor, and the other end of the lead is positioned outside the low-temperature vacuum environment; the external wire protection tube is sleeved on the lead wire, and the temperature sensor is positioned outside the external wire protection tube; be equipped with first mounting hole on the heat conduction piece, temperature sensor is located first mounting hole, and temperature sensor is close or contact first mounting hole bottom, outside protection tube outer wall and first mounting hole inner wall sealing connection. According to the temperature measuring device provided by the embodiment of the application, the external wire protection tube is sleeved on the lead wire, so that the occurrence of bending and corrosion phenomena of the cable is reduced. In addition, the temperature sensor is arranged in the first mounting hole which is arranged on the heat conducting block and is used for forming the seal, so that the stability and the accuracy of the temperature sensor in the use process are improved.

Description

Temperature measuring device and cryopump

Technical Field

The present application relates to the field of temperature measurement technologies, and in particular, to a temperature measurement device and a cryopump.

Background

The temperature measuring device is an indispensable device on the cryopump, and is used for detecting the temperatures of the primary cold head and the secondary cold head so as to reflect the performance effect of the cryopump.

Because the cryopump is in abominable environment, the cryopump is in the use, and the common cable connection is located the inside temperature measuring device of cryopump, and the connecting wire easily takes place to buckle or corrodes temperature measuring device and influence temperature measuring device's stability in use because of the corrosive substance in the service environment. In addition, the heat conducting piece in the conventional temperature measuring device needs to conduct heat through more heat conducting media, and the measurement accuracy is affected by poor heat conducting effect.

Disclosure of utility model

In view of the above, an embodiment of the present application provides a temperature measuring device for solving at least one problem existing in the background art, which can improve the heat conduction effect and further improve the measurement accuracy.

In a first aspect, an embodiment of the present application provides a temperature measurement device for measuring a test object in a cryogenic vacuum environment, the temperature measurement device including:

A temperature sensor;

One end of the lead is connected with the temperature sensor, and the other end of the lead is positioned outside the low-temperature vacuum environment;

an external wire protection tube sleeved on the lead wire, wherein the temperature sensor is positioned outside the external wire protection tube;

The heat conducting block is provided with a first mounting hole, the temperature sensor is located in the first mounting hole, the temperature sensor is close to or contacts with the bottom of the first mounting hole, and the outer wall of the external wire protecting pipe is in sealing connection with the inner wall of the first mounting hole.

With reference to the first aspect of the present application, in an optional implementation manner, the temperature measurement device further includes:

And the inner wire protection tube is sleeved on the lead wire, and the inner wire protection tube is positioned between the lead wire and the outer wire protection tube.

In combination with the first aspect of the present application, in an alternative embodiment, the lead is connected to an intermediate position of the temperature sensor, and an end of the temperature sensor is close to or contacts the bottom of the first mounting hole.

In combination with the first aspect of the present application, in an alternative embodiment, the lead is connected at a middle position deviated from the temperature sensor, an end of the temperature sensor is close to or contacts with a bottom of the first mounting hole, and a side of the temperature sensor is close to or contacts with an inner wall of the first mounting hole.

In combination with the first aspect of the present application, in an alternative embodiment, the outer wall of the outer grommet is sealingly connected to the inner wall of the first mounting hole by an adhesive.

In combination with the first aspect of the present application, in an alternative embodiment, the shape of the heat conducting block includes a sphere, a cylinder, a cuboid or a cube.

With reference to the first aspect of the present application, in an alternative embodiment, the heat conducting block is a copper block.

In combination with the first aspect of the present application, in an alternative embodiment, the heat conducting block is provided with a second mounting hole, and the second mounting hole is used for connecting the detected piece.

In a second aspect, embodiments of the present application provide a cryopump comprising a temperature measuring device according to any of the embodiments provided in the first aspect; further comprises:

a pump body in which the low-temperature vacuum environment is formed;

The adapter, it install in on the pump body, the adapter intercommunication the inside one end of pump body with outside protection conduit sealing connection, be equipped with the third mounting hole that runs through on the adapter, the lead wire runs through the third mounting hole and extends to the pump body is outside.

In combination with the second aspect of the present application, in an alternative embodiment, the adapter further includes a connection board, the connection board is connected in the third mounting hole in a sealing manner, a fourth mounting hole is formed on the connection board, and the external wire protection pipe is inserted into and connected with the fourth mounting hole in a sealing manner.

According to the temperature measuring device provided by the embodiment of the application, the external wire protection tube is sleeved on the lead, so that the occurrence of bending and corrosion phenomena of the cable is reduced. In addition, place temperature sensor in the first mounting hole that is equipped with on the heat conduction piece and be close or contact its bottom to make outside protective tube and heat conduction piece sealing connection, not only can protect temperature sensor, and temperature sensor and by the heat conduction medium between the measured piece few, heat conduction efficiency is high, improves temperature sensor's stability and accuracy in the use. In addition, this temperature measuring device simple structure improves the installation convenience greatly.

Additional aspects and advantages of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic view of a portion of an explosion of a temperature measuring device according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of a portion of a temperature measuring device according to an embodiment of the present application;

FIG. 3 is a cross-sectional view of a portion of a temperature measuring device according to another embodiment of the present application;

Fig. 4 is a schematic structural diagram of a transfer joint of a cryopump according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a cryopump according to an embodiment of the present application;

Reference numerals:

100. A temperature measuring device; 10. a temperature sensor; 20. a lead wire; 30. an external grommet; 40. an inner protective tube; 50. a heat conduction block; 510. a first mounting hole; 520. a second mounting hole; 200. an adapter; 201. a third mounting hole; 202. and (5) connecting a plate.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the application are shown in the drawings, it should be understood that the application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the application may be practiced without one or more of these details. In other instances, well-known features have not been described in detail so as not to obscure the application; that is, not all features of an actual implementation are described in detail herein, and well-known functions and constructions are not described in detail.

In the drawings, the size of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element or layer is referred to as being "on" … …, "" adjacent to "… …," "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected to or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" … …, "" directly adjacent to "… …," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application. When a second element, component, region, layer or section is discussed, it does not necessarily mean that the first element, component, region, layer or section is present.

Spatially relative terms, such as "under … …," "under … …," "below," "under … …," "over … …," "above," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below … …" and "under … …" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In order to provide a thorough understanding of the present application, detailed steps and detailed structures will be presented in the following description in order to explain the technical solution of the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.

The temperature measuring device provided by the embodiment of the application is used for measuring the detected piece in the low-temperature vacuum environment, and the temperature measuring device 100 can avoid the condition of being corroded by external corrosive substances under the condition of not affecting the vacuum performance of the vacuum device, so that the temperature measuring device 100 is protected. In addition, the heat conduction medium between the temperature sensor 10 and the detected member is small, the heat conduction efficiency is high, and the measurement stability and accuracy of the temperature measurement device 100 are improved.

A temperature measuring device provided by an embodiment of the present application is specifically described below with reference to the accompanying drawings.

Specifically, as shown in fig. 1 and 2, a temperature measuring device according to an embodiment of the present application includes a temperature sensor 10, a lead 20, an external protective tube 30, and a heat conducting block 50.

One end of the lead wire 20 is connected to the temperature sensor 10, and the other end is located outside the low-temperature vacuum environment. The other end of the lead 20 may be connected to a display (not shown) located outside the low temperature vacuum environment for displaying the measured temperature obtained by the temperature sensor.

The outer protective tube 30 is sleeved on the lead wire 20, and the temperature sensor 10 is located outside the outer protective tube 30.

The heat conducting block 50 is provided with a first mounting hole 510, the temperature sensor 10 is located in the first mounting hole 510, the temperature sensor 10 is close to or contacts with the bottom of the first mounting hole 510, and the outer wall of the outer protective tube 30 is connected with the inner wall of the first mounting hole 510 in a sealing mode.

Fig. 1 is a schematic, partially exploded view of a temperature measurement device 100. Fig. 2 is a schematic sectional view of a part of the structure of the temperature measuring device 100. The outer protective tube 30 is sleeved on the lead 20, the temperature sensor 10 is connected to one end of the lead 20 and is located outside the outer protective tube 30, one end of the outer protective tube 30 is inserted into the first mounting hole 510, the temperature sensor 10 is located in the first mounting hole 510, and the temperature sensor 10 is close to or contacts the bottom of the first mounting hole 510. The outer wall of the outer protective tube 30 is in sealing connection with the inner wall of the first mounting hole 510 to prevent corrosive substances in the low-temperature vacuum environment from corroding the temperature sensor 10, in addition, the temperature sensor 10 approaches or contacts the heat conducting block 50, the heat conducting distance between the detected piece and the temperature sensor 10 is shortened, the heat conducting medium between the detected piece and the temperature sensor 10 is less, the heat conducting efficiency of the temperature sensor 10 is improved, and the measuring stability and accuracy of the temperature sensor 10 are further improved.

The temperature measuring device 100 provided by the embodiment of the application can be used for measuring a detected piece in an ultra-low temperature and ultra-high vacuum environment. As an example, the detected piece is a primary cold head and a secondary cold head in the cryopump. The ultra-low temperature is below minus 100 ℃, and the ultra-high vacuum environment is below 10 ^-5 Pa.

In one embodiment, the sealed connection between the inner wall of the first mounting hole 510 and the outer wall of the outer grommet 30 is achieved by means of an adhesive. The specific kind of the binder is not limited and may be selected according to the need. Through the sealing connection mode of adhesive, easy operation is convenient, and carries out the sealing connection of adhesive after placing temperature sensor in first mounting hole, can not cause the damage to temperature sensor and lead wire.

Of course, the sealing connection between the inner wall of the first mounting hole 510 and the outer wall of the outer grommet 30 may be accomplished in other ways. As an example, sealing connection of the outer wall of the outer grommet 30 with the inner wall of the first mounting hole 510 may be achieved using a sealing ring.

In one embodiment, as shown in fig. 1, the temperature sensor 10 further includes an inner conduit 40, the inner conduit 40 is sleeved on the lead 20, and the inner conduit 40 is located between the lead 20 and the outer conduit 30, and the outer conduit 30 is sleeved on the inner conduit 40.

The inner protective tube 40 can further prevent the lead 20 from being bent to cause breakage of the lead 20, metal conduction, and the like, and further protect the lead 20.

In one embodiment, the outer conduit 30 is made of stainless steel. The outer protective tube 30 may be a stainless steel hose that can not only prevent corrosion of the lead 20 by corrosive substances, but also ensure arbitrary bending of the lead 20 without bending the lead 20. Of course, the outer protective tube 30 is not limited to stainless steel, and may be made of other materials.

Further, when the outer sheath pipe 30 is made of stainless steel, the inner sheath pipe 40 made of an insulating material can further prevent the lead wire 20 from being connected to the metal, thereby improving the measurement stability of the temperature measuring device 100. The material of the insulating material of the inner sheath tube 40 may be polyimide or resin, but is not limited to this.

In one embodiment, the heat conducting block 50 is made of a copper block, which has a better heat conducting effect and improves the heat conducting efficiency of the temperature sensor 10.

In one embodiment, as shown in fig. 1, the heat conducting block 50 is further provided with a second mounting hole 520, and the second mounting hole 520 is used for connecting with a detected piece.

The second mounting hole 520 is used for the detected piece to form better connection with the heat conducting block 50, so as to improve the contact effect between the detected piece and the heat conducting block 50 and the installation convenience, and further improve the measurement effect of the temperature measurement device 100.

The shape of the heat conducting block 50 includes, but is not limited to, a sphere, a cylinder, a cuboid, a cube, and a special-shaped structure, and the shape of the heat conducting block 50 may be changed according to the structure of the detected member, and the present application is not particularly limited.

In one embodiment, as shown in fig. 2, the lead 20 is connected to the middle position of the temperature sensor 10, and the end of the temperature sensor 10 is close to or contacts the bottom of the first mounting hole 510.

That is, the temperature sensor 10 is connected to the central axes of the outer and inner sheathing pipes 30 and 40 such that the side of the temperature sensor 10 is away from the side wall of the first mounting hole 510. By making the end of the temperature sensor 10 close to or contact with the bottom of the first mounting hole 510, the temperature sensor 10 can have better contact with the heat conducting block 50, and the heat conducting effect and the heat conducting efficiency are improved.

In another embodiment, as shown in fig. 3, the lead 20 is connected at a middle position deviated from the temperature sensor 10, the end of the temperature sensor 10 is close to or contacts the bottom of the first mounting hole 510, and the side of the temperature sensor 10 is close to or contacts the inner wall of the first mounting hole 510.

That is, by connecting the temperature sensor 10 to be offset from the central axes of the outer and inner sheathing tubes 30 and 40 such that the side edge of the temperature sensor 10 can approach or contact the side wall of the first mounting hole 510, the contact area of the temperature sensor 10 and the heat conduction block 50 is increased, further improving the heat conduction efficiency of the temperature sensor.

The embodiment of the present application further provides a cryopump, as shown in fig. 4 and 5, where the cryopump includes a pump body, a temperature measurement device 100 provided in any of the foregoing embodiments, and an adapter 200.

Wherein, a low temperature vacuum environment is formed inside the pump body, and the surface of the heat conduction block 50 contacts the low temperature vacuum environment. The adapter 200 is installed on the pump body, and the inside one end of adapter 200 intercommunication pump body and outside protective tube 30 sealing connection are equipped with the third mounting hole 201 that runs through on the adapter 200, and lead wire 20 runs through third mounting hole 201 and extends to the low temperature vacuum environment outside.

That is, the inside of the pump body is in a low-temperature vacuum environment, and the outside of the pump body is in a normal temperature and pressure state. The outside and the inside of the pump body are connected by the adapter 200, i.e. one end of the adapter 200 is located inside the pump body and the other end is located outside the pump body.

One end of the adapter 200 connected to the inside of the pump body is hermetically connected to the outer shield tube 30 to isolate the lead wire 20, the temperature sensor 10 and the inner shield tube 40 from the low temperature vacuum environment, thereby ensuring the stability of the temperature measuring device 100.

Further, as shown in fig. 5, the adapter 200 further includes a connection plate 202, where the connection plate 202 is sealingly connected to the third mounting hole 201, and a fourth mounting hole is provided on the connection plate 202, and the external protection tube 30 is inserted into and sealingly connected to the fourth mounting hole.

The cryopump may include one temperature measuring device 100, or may include two or more temperature measuring devices 100, which may be set according to specific measurement requirements, and embodiments of the present application are not limited thereto.

The cryopump may include a plurality of temperature measuring devices 100, so the inner diameter of the third mounting hole 201 of the adapter 200 is larger to accommodate the plurality of temperature measuring devices 100.

The adapter plate is in sealing connection with the third mounting hole 201, a fourth mounting hole is formed in the adapter plate, the number of the fourth mounting holes is set based on the number of the temperature measuring devices 100, and the outer wall of the outer protective tube 30 is matched with the inner wall of the fourth mounting hole and forms sealing connection. The manner of sealing connection is described above and will not be described here again.

It should be noted that, the embodiment of the temperature measuring device provided by the application and the embodiment of the cryopump belong to the same conception; the features of the embodiments described in the present application may be combined arbitrarily without any conflict. However, it should be further explained that the temperature measuring device provided by the embodiment of the application has various technical characteristics combined to solve the technical problems to be solved by the application; therefore, the temperature measuring device provided by the embodiment of the application can be not limited by the cryopump provided by the embodiment of the application.

It should be understood that the above examples are illustrative and are not intended to encompass all possible implementations encompassed by the claims. Various modifications and changes may be made in the above embodiments without departing from the scope of the disclosure. Likewise, the individual features of the above embodiments can also be combined arbitrarily to form further embodiments of the application which may not be explicitly described. Therefore, the above examples merely represent several embodiments of the present application and do not limit the scope of protection of the patent of the present application.

Claims (10)

1. A temperature measurement device for measuring a test piece in a cryogenic vacuum environment, the temperature measurement device comprising:

A temperature sensor;

One end of the lead is connected with the temperature sensor, and the other end of the lead is positioned outside the low-temperature vacuum environment;

an external wire protection tube sleeved on the lead wire, wherein the temperature sensor is positioned outside the external wire protection tube;

The heat conducting block is provided with a first mounting hole, the temperature sensor is located in the first mounting hole, the temperature sensor is close to or contacts with the bottom of the first mounting hole, and the outer wall of the external wire protecting pipe is in sealing connection with the inner wall of the first mounting hole.

2. The temperature measurement device of claim 1, wherein the temperature measurement device further comprises:

And the inner wire protection tube is sleeved on the lead wire, and the inner wire protection tube is positioned between the lead wire and the outer wire protection tube.

3. The temperature measurement device of claim 1, wherein the lead is connected to an intermediate location of the temperature sensor, and wherein an end of the temperature sensor is proximate to or in contact with a bottom of the first mounting hole.

4. The temperature measurement device of claim 1, wherein the leads are connected at an intermediate position offset from the temperature sensor, wherein the distal end of the temperature sensor is proximate to or in contact with the bottom of the first mounting hole, and wherein the lateral side of the temperature sensor is proximate to or in contact with the inner wall of the first mounting hole.

5. The temperature measurement device of claim 1 wherein the outer conduit outer wall and the first mounting hole inner wall are sealingly connected by an adhesive.

6. The temperature measurement device of claim 1, wherein the thermally conductive mass has a shape comprising a sphere, cylinder, cuboid, or cube.

7. The temperature measurement device of claim 1, wherein the thermally conductive block is a copper block.

8. The temperature measuring device of claim 1, wherein the heat conducting block is provided with a second mounting hole, and the second mounting hole is used for connecting the detected piece.

9. A cryopump comprising a temperature measurement device as claimed in any one of claims 1 to 8; further comprises:

a pump body in which the low-temperature vacuum environment is formed;

The adapter, it install in on the pump body, the adapter intercommunication the inside one end of pump body with outside protection conduit sealing connection, be equipped with the third mounting hole that runs through on the adapter, the lead wire runs through the third mounting hole and extends to the pump body is outside.

10. The cryopump of claim 9, wherein the adapter further includes a connection plate sealingly connected to the third mounting hole, a fourth mounting hole is provided in the connection plate, and the external conduit is inserted into and sealingly connected to the fourth mounting hole.