CN220960001U - PCB warp measuring device convenient to leveling - Google Patents

PCB warp measuring device convenient to leveling Download PDF

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Publication number
CN220960001U
CN220960001U CN202322878631.0U CN202322878631U CN220960001U CN 220960001 U CN220960001 U CN 220960001U CN 202322878631 U CN202322878631 U CN 202322878631U CN 220960001 U CN220960001 U CN 220960001U
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CN
China
Prior art keywords
pcb
warp
swing
measuring device
support frame
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Active
Application number
CN202322878631.0U
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Chinese (zh)
Inventor
张成亮
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Wuxi Jinhejiyan Technology Co ltd
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Wuxi Jinhejiyan Technology Co ltd
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Priority to CN202322878631.0U priority Critical patent/CN220960001U/en
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Abstract

The utility model discloses a PCB warp measuring device convenient to level, which relates to the technical field of PCB warp measurement and comprises a PCB warp measuring device body, wherein the PCB warp measuring device body comprises a support frame, swing measuring units are arranged on the outer side surface of the top of the support frame, swing clamping positioning units are arranged on the edge positions of the front side and the rear side of the top of the support frame, a lap joint positioning unit is arranged on the outer side surface of the swing clamping positioning unit, and the lap joint positioning unit comprises a marble bedplate movably lapped on the top surface of the support frame. According to the utility model, the PCB is placed on the top surface of the marble bedplate, the swinging handle is pulled to swing the rocker arm, manual movement is performed, the laser displacement sensor is moved on the surface of the PCB, the laser of the laser displacement sensor is utilized to slide on the surface of the PCB, and then the bending measurement is performed on the data fed back by the laser through the warping calculation measurer.

Description

PCB warp measuring device convenient to leveling
Technical Field
The utility model relates to the technical field of PCB warp measurement, in particular to a PCB warp measurement device convenient to level.
Background
In order to ensure the assembly reliability and other quality performances of the printed circuit board, the PCB has certain flatness or warping degree control requirements, especially for high-density designed thin plates (such as less than or equal to 0.5 mm), the flatness or warping degree is more strict (such as less than or equal to 0.3 percent) and hundred percent detection is required, the warping is formed by a plastic part not according to the designed shape, but the surface of the plastic part is distorted, and the warping of the plastic part is caused by uneven shrinkage of the formed plastic part.
Such as Chinese patent publication No.: CN109099881A relates to the PCB board field, and including first brace table and detection mechanism, be connected through width adjustment mechanism between first brace table and the first brace table, the inside of first brace table is equipped with the first rectangular channel that runs through the terminal surface around, and the upper surface of first brace table is equipped with the second warning light.
The following problems exist in the prior art: when the existing PCB is subjected to warp measurement, the PCB is very light due to the fact that the warp measurement is performed on a plurality of very thin PCBs, and the problem that the position is deviated when the warp measurement is performed again due to the fact that the position deviation is easy to occur when the warp measurement is performed.
Disclosure of utility model
The utility model aims to provide a PCB warp measuring device convenient to level, so as to solve the problems in the background technology.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The utility model provides a PCB board warp measuring device convenient to carry out leveling, includes PCB warp board measuring device body, PCB warp board measuring device body includes the support frame, be provided with the swing measurement unit on the top outside surface of support frame, be provided with swing joint positioning unit on the both sides edge position around the top of support frame, be provided with overlap joint positioning unit on the outside surface of swing joint positioning unit.
The technical scheme of the utility model is further improved as follows: the swing joint positioning unit comprises fixed buckles which are connected to the top surfaces of the front side and the rear side of the support frame in a swinging mode, a joint limiting block is fixedly installed on the right side edge position of the top of the support frame, a warp calculation measurer is arranged on the top surface of the joint limiting block, and the warp calculation measurer is used for carrying out bending measurement on laser feedback data.
The technical scheme of the utility model is further improved as follows: the lap joint positioning unit comprises a marble platen movably lapped on the top surface of the supporting frame, a PCB board is placed on the top surface of the marble platen, and the outer side surface of the marble platen is movably lapped on the outer side surface of the fixed buckle.
The technical scheme of the utility model is further improved as follows: the swing measuring unit comprises a clamping supporting table detachably arranged on the outer side surface of the clamping limiting block.
The technical scheme of the utility model is further improved as follows: the top surface of the clamping supporting table is provided with a rotating shaft, and the swinging handle is pulled to swing the rocker arm to perform manual movement.
The technical scheme of the utility model is further improved as follows: the top surface of the rotating shaft is connected with a rocker in a swinging way, and one end of the rocker is fixedly connected with a swinging handle.
The technical scheme of the utility model is further improved as follows: a laser displacement sensor is arranged on the bottom surface of one end of the swing handle, the laser displacement sensor is moved on the surface of the PCB, laser of the laser displacement sensor is utilized to slide on the surface of the PCB, and then the warp calculation measurer is used for carrying out bending measurement on laser feedback data.
By adopting the technical scheme, compared with the prior art, the utility model has the following technical progress:
1. The utility model provides a PCB warp measuring device convenient for leveling, which is characterized in that a PCB is placed on the top surface of a marble bedplate, a swinging handle is pulled to swing a rocker arm to manually move, a laser displacement sensor is moved on the surface of the PCB, laser of the laser displacement sensor is utilized to slide on the surface of the PCB, and then a warp calculation measurer is utilized to carry out bending measurement on laser feedback data.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a three-dimensional structure of a clamping support table according to the present utility model;
fig. 3 is a schematic diagram of a three-dimensional structure of a laser displacement sensor according to the present utility model.
In the figure: 1. a PCB warp board measuring device body; 11. a support frame; 12. the limiting block is clamped; 13. a warp calculation measurer; 14. the clamping support table; 141. a rotating shaft; 142. a rocker arm; 143. swinging the handle; 15. a laser displacement sensor; 16. a fixing buckle; 17. a marble bedplate.
Detailed Description
The utility model is further illustrated by the following examples:
Example 1
As shown in fig. 1-3, the utility model provides a PCB board warp measuring device convenient for leveling, which comprises a PCB board warp measuring device body 1, wherein the PCB board warp measuring device body 1 comprises a support frame 11, swing measuring units are arranged on the outer side surfaces of the top of the support frame 11, swing clamping positioning units are arranged on the front side edge and the rear side edge of the top of the support frame 11, overlap joint positioning units are arranged on the outer side surfaces of the swing clamping positioning units, each swing clamping positioning unit comprises a fixed buckle 16 which is connected on the top surfaces of the front side and the rear side of the support frame 11 in a swinging manner, a clamping limiting block 12 is fixedly arranged on the right side edge position of the top of the support frame 11, a warp calculation measurer 13 is arranged on the top surface of the clamping limiting block 12, then the warp calculation measurer 13 is used for bending and measuring data fed back by laser, each overlap joint positioning unit comprises a marble platen 17 which is movably overlapped on the top surface of the support frame 11, a PCB board is placed on the top surface of the marble platen 17, and each outer side surface of the marble platen 17 is movably overlapped on the outer side surface of the fixed buckle 16.
Example 2
As shown in fig. 1-3, on the basis of embodiments 1-2, the present utility model provides a technical solution: preferably, the swing handle 143 is pulled to swing the rocker arm 142 for manual movement, the swing measurement unit comprises a clamping support table 14 detachably mounted on the outer side surface of the clamping limiting block 12, a rotating shaft 141 is arranged on the top surface of the clamping support table 14, the rocker arm 142 is connected to the top surface of the rotating shaft 141 in a swinging manner, the swing handle 143 is fixedly connected to one end of the rocker arm 142, a laser displacement sensor 15 is arranged on the bottom surface of one end of the swing handle 143, the laser displacement sensor 15 is moved on the surface of the PCB, and laser of the laser displacement sensor 15 is utilized to slide on the surface of the PCB.
The working principle of the PCB warp measuring device convenient to level is specifically described below.
As shown in fig. 1 to 3, a PCB board is placed on the top surface of the marble platen 17, a swing handle 143 is pulled to swing a swing arm 142, manual movement is performed, a laser displacement sensor 15 is moved on the surface of the PCB board, laser light of the laser displacement sensor 15 is used to slide on the surface of the PCB board, and then bending measurement is performed on laser fed back data through a warp calculation measurer 13.
The foregoing utility model has been generally described in great detail, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, it is intended to cover modifications or improvements within the spirit of the inventive concepts.

Claims (7)

1. The utility model provides a PCB board warp measuring device convenient to carry out leveling is applicable to and carries out location measurement to PCB warp board and handles, includes PCB warp board measuring device body (1), PCB warp board measuring device body (1) include support frame (11), its characterized in that: the swing measuring device is characterized in that a swing measuring unit is arranged on the outer side surface of the top of the supporting frame (11), swing clamping and positioning units are arranged on the edge positions of the front side and the rear side of the top of the supporting frame (11), and a lap joint positioning unit is arranged on the outer side surface of the swing clamping and positioning units.
2. The PCB board warp measuring apparatus for facilitating leveling according to claim 1, wherein: the swing joint positioning unit comprises fixed buckles (16) which are connected to the top surfaces of the front side and the rear side of the support frame (11) in a swinging mode, a joint limiting block (12) is fixedly installed on the position of the right side edge of the top of the support frame (11), and a warping calculation measurer (13) is arranged on the top surface of the joint limiting block (12).
3. The PCB board warp measuring apparatus for facilitating leveling according to claim 1, wherein: the lap joint positioning unit comprises a marble bedplate (17) which is movably lapped on the top surface of the supporting frame (11), and the outer side surface of the marble bedplate (17) is movably lapped on the outer side surface of the fixed buckle (16).
4. A PCB board warp measuring apparatus for facilitating leveling according to claim 3, wherein: the swing measuring unit comprises a clamping supporting table (14) which is detachably arranged on the outer side surface of the clamping limiting block (12).
5. The PCB board warp measuring apparatus for facilitating leveling according to claim 4, wherein: a rotating shaft (141) is arranged on the top surface of the clamping supporting table (14).
6. The PCB board warp measuring apparatus for facilitating leveling according to claim 5, wherein: the top surface of the rotating shaft (141) is connected with a rocker arm (142) in a swinging mode, and one end of the rocker arm (142) is fixedly connected with a swinging handle (143).
7. The PCB board warp measuring apparatus for facilitating leveling according to claim 6, wherein: a laser displacement sensor (15) is arranged on the bottom surface of one end of the swing handle (143).
CN202322878631.0U 2023-10-26 2023-10-26 PCB warp measuring device convenient to leveling Active CN220960001U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322878631.0U CN220960001U (en) 2023-10-26 2023-10-26 PCB warp measuring device convenient to leveling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322878631.0U CN220960001U (en) 2023-10-26 2023-10-26 PCB warp measuring device convenient to leveling

Publications (1)

Publication Number Publication Date
CN220960001U true CN220960001U (en) 2024-05-14

Family

ID=90982103

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322878631.0U Active CN220960001U (en) 2023-10-26 2023-10-26 PCB warp measuring device convenient to leveling

Country Status (1)

Country Link
CN (1) CN220960001U (en)

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