CN220935375U - Circuit board for preventing solder paste of overlap bonding pad from sliding - Google Patents
Circuit board for preventing solder paste of overlap bonding pad from sliding Download PDFInfo
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- CN220935375U CN220935375U CN202322478498.XU CN202322478498U CN220935375U CN 220935375 U CN220935375 U CN 220935375U CN 202322478498 U CN202322478498 U CN 202322478498U CN 220935375 U CN220935375 U CN 220935375U
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- Prior art keywords
- solder paste
- pad
- circuit board
- bonding pad
- gap
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Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application relates to a circuit board for preventing solder paste of an overlapped bonding pad from sliding. The circuit board for preventing the sliding of the solder paste of the overlapped bonding pad comprises: the circuit board body and the soldering tin subassembly, the soldering tin subassembly includes first pad and second pad, and first pad and second pad set up on the circuit board body, form the clearance portion between first pad and the second pad, and the clearance portion is close to one side of first pad and forms first solder paste non-flow district, and the clearance portion is close to one side of second pad and forms second solder paste non-flow district. According to the scheme provided by the application, solder paste on the overlapped bonding pads cannot flow in a high-temperature furnace passing process, so that the uniformity of the solder paste is ensured, and the devices cannot fall off.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board capable of preventing solder paste of an overlapping bonding pad from sliding.
Background
Solder materials are indispensable for production and maintenance work in the electronic industry, and conventionally, common solder materials include tin-lead alloy solder, antimony-added solder, cadmium-added solder, silver-added solder, copper-added solder, and the like.
In the related art, in order to save design cost, two device pads with the same function may be placed at the same position in the design stage of the electronic hardware product, as shown in fig. 1, however, in this way, the device pads are easy to overlap, when the amount of solder paste on two pads is small or only one of the overlapped pads is brushed, during the subsequent high-temperature furnace passing process, the solder paste slides, so that the solder paste is uneven, thereby causing the device to fall off, and if the amount of solder paste is increased before the high-temperature furnace passing process, the production cost will be increased.
Disclosure of utility model
The utility model aims to overcome the defects in the prior art and provide the circuit board for preventing the solder paste of the overlapped bonding pad from sliding, which can avoid the solder paste on the overlapped bonding pad from flowing in a high-temperature furnace passing process, thereby ensuring the uniformity of the solder paste and further ensuring that devices cannot fall off.
The aim of the utility model is realized by the following technical scheme:
The first aspect of the present application provides a circuit board for preventing solder paste sliding of an overlap pad, comprising: a circuit board body; and the soldering tin assembly comprises a first bonding pad and a second bonding pad, the first bonding pad and the second bonding pad are arranged on the circuit board body, a gap part is formed between the first bonding pad and the second bonding pad, a first solder paste non-flowing area is formed on one side of the gap part, which is close to the first bonding pad, and a second solder paste non-flowing area is formed on one side of the gap part, which is close to the second bonding pad.
The width of the gap part is 0.9 mm-1.1 mm.
The gap portion is a copper skin layer.
The first bonding pad is provided with a first side edge, the second bonding pad is provided with a second side edge, the gap portion is formed between the first side edge and the second side edge, one side, adjacent to the gap portion, of the first side edge forms the first solder paste non-flowing area, and one side, adjacent to the gap portion, of the second side edge forms the second solder paste non-flowing area.
The first side and the second side are flush with each other.
The first bonding pad is provided with a fifth side, a sixth side and a seventh side, the second bonding pad is provided with an eighth side, the fifth side, the sixth side, the seventh side and the eighth side jointly form the gap part, one side of the gap part, which is close to the fifth side, the sixth side and the seventh side, forms the first solder paste non-flowing area, and one side of the gap part, which forms the second solder paste non-flowing area.
The fifth side edge and the seventh side edge are respectively perpendicular to the sixth side edge.
The first bonding pad and the second bonding pad are of rectangular structures.
A first device placement area and a first solder paste coating area are formed on the first bonding pad, and the first device placement area is overlapped with the first solder paste coating area.
And a second device placement area and a second solder paste coating area are formed on the second bonding pad, and the second device placement area is overlapped with the second solder paste coating area.
Compared with the prior art, the utility model has at least the following advantages:
Through cutting first pad and second pad, form clearance portion between first pad and second pad, utilize the solder paste can only adhere at the copper cortex's principle to separate the solder paste between first pad and the second pad, in the follow-up high temperature stove technology of crossing, can avoid the solder paste to flow, make the solder paste more even, and then guarantee that the device can not take place to drop.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.
Fig. 1 is a schematic structural diagram of a circuit board in the related art at this stage;
FIG. 2 is a schematic diagram of a circuit board for preventing the sliding of the solder paste on the bonding pads according to an embodiment of the utility model;
Fig. 3 is a schematic structural diagram of another embodiment of a circuit board for preventing the sliding of the solder paste on the overlay pads according to an embodiment of the utility model.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While embodiments of the present application are illustrated in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the related art, in the design stage of the electronic hardware product, in order to save design cost, two device pads with the same function may be placed on the same position, however, in this way, the situation that the device pads overlap easily occurs, when the amount of solder paste on two pads is small or only one of the overlapped pads is brushed, during the subsequent high-temperature furnace passing process, the solder paste slides, so that the solder paste is uneven, and thus, the device falls off, and if the amount of the solder paste is increased before the high-temperature furnace passing process, the production cost will be increased.
In view of the above problems, embodiments of the present application provide a circuit board for preventing solder paste on an overlap pad from sliding, which can avoid solder paste on the overlap pad from flowing in a high-temperature furnace passing process, thereby ensuring uniformity of solder paste and preventing devices from falling off.
The following describes the technical scheme of the embodiment of the present application in detail with reference to the accompanying drawings.
Fig. 2 is a schematic structural view of a circuit board for preventing the sliding of the solder paste on the overlay pad according to an embodiment of the present application, and fig. 3 is a schematic structural view of another embodiment of the circuit board for preventing the sliding of the solder paste on the overlay pad according to an embodiment of the present application.
Referring to fig. 2 and 3, a circuit board for preventing a sliding of an overlay pad solder paste, comprising: the circuit board body 100 and the soldering tin assembly 200, the soldering tin assembly 200 comprises a first bonding pad 210 and a second bonding pad 220, the first bonding pad 210 and the second bonding pad 220 are arranged on the circuit board body 100, a gap part 300 is formed between the first bonding pad 210 and the second bonding pad 220, a first solder paste non-flowing area is formed on one side, close to the first bonding pad 210, of the gap part 300, and a second solder paste non-flowing area is formed on one side, close to the second bonding pad 220, of the gap part 300.
It should be noted that, the gap 300 is formed by cutting the first bonding pad 210 and the second bonding pad 220, so as to separate the first bonding pad 210 from the second bonding pad 220, so that solder paste is ensured not to flow between the first bonding pad 210 and the second bonding pad 220 after being heated at high temperature, that is, the gap 300 plays a role of blocking, so that the solder paste in the first bonding pad 210 or the second bonding pad 220 is more uniform, and the device is not dropped. Further, the first solder paste non-flowing area and the second solder paste non-flowing area are edges of the gap portion 300.
In one embodiment, the width of the gap 300 is 0.9mm to 1.1mm.
The width of the gap 300 is generally 1mm, and the tolerance is 0.1mm.
Further, in one embodiment, the gap 300 is a copper skin.
The gap 300 is formed by cutting a first layer of the board body of the circuit board, and the first layer is a copper skin layer, so that the solder paste between the first pad 210 and the second pad 220 is isolated by using the principle that the solder paste only adheres to the copper skin layer.
Referring to fig. 2, in an embodiment, the first bonding pad 210 is provided with a first side 211, the second bonding pad 220 is provided with a second side 221, the gap portion 300 is formed between the first side 211 and the second side 221, the first side 211 adjacent to the gap portion 300 forms the first solder paste non-flowing area, and the second side 221 adjacent to the gap portion 300 forms the second solder paste non-flowing area.
Specifically, the first side 211 and the second side 221 are flush with each other.
In this embodiment, in one of the cases where the first pad 210 and the second pad 220 overlap, the first side 211 and the second side 221 are formed by cutting the first pad 210 and the second pad 220, and the gap 300 is formed between the two sides, so that the first pad 210 and the second pad 220 are separated, thereby ensuring that solder paste between the first pad 210 and the second pad 220 does not flow after passing through the furnace at high temperature.
Referring to fig. 3, in an embodiment, the first bonding pad 210 is provided with a fifth side 212, a sixth side 213 and a seventh side 214, the second bonding pad 220 is provided with an eighth side 222, the fifth side 212, the sixth side 213 and the seventh side 214 and the eighth side 222 together form the gap 300, the gap 300 is close to one side of the fifth side 212, the sixth side 213 and the seventh side 214 and forms the first solder paste non-flowing area, and one side of the gap 300 and one side of the eighth side 222 forms the second solder paste non-flowing area.
Specifically, the fifth side 212 and the seventh side 214 are perpendicular to the sixth side 213, respectively.
In this embodiment, in one of the cases where the first bonding pad 210 and the second bonding pad 220 overlap, the fifth side 212, the sixth side 213, and the seventh side 214 are formed by cutting the first bonding pad 210, and the fifth side 212, the sixth side 213, and the seventh side 214 enclose the eighth side 222 of the second bonding pad 220 into the gap 300, so that the first bonding pad 210 and the second bonding pad 220 are separated, and solder paste between the first bonding pad 210 and the second bonding pad 220 is not flowed after passing through the furnace at high temperature.
In an embodiment, the first pad 210 and the second pad 220 have a rectangular structure.
It should be noted that, before dicing, the first pad 210 and the second pad 220 are each rectangular structures.
In an embodiment, the first bonding pad 210 is provided with a first device placement area and a first solder paste coating area, and the first device placement area coincides with the first solder paste coating area.
Specifically, the second bonding pad 220 is provided with a second device placement area and a second solder paste coating area, and the second device placement area coincides with the second solder paste coating area.
The first device placement area and the second device placement area are used for placing devices, and the first solder paste coating area and the second solder paste coating area are used for coating solder paste.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined and pruned according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided and pruned according to actual needs.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A circuit board for preventing a sliding of an overlay pad solder paste, comprising:
a circuit board body; and
The soldering tin assembly comprises a first bonding pad and a second bonding pad, wherein the first bonding pad and the second bonding pad are arranged on the circuit board body, a gap part is formed between the first bonding pad and the second bonding pad, a first solder paste non-flowing area is formed on one side, close to the first bonding pad, of the gap part, and a second solder paste non-flowing area is formed on one side, close to the second bonding pad, of the gap part.
2. The circuit board for preventing slip of overlay pad solder paste according to claim 1, wherein the width of the gap portion is 0.9mm to 1.1mm.
3. The circuit board of claim 1, wherein the gap is a copper skin.
4. The circuit board of claim 1, wherein the first pad is provided with a first side and the second pad is provided with a second side, the gap is formed between the first side and the second side, the first side forms the first solder paste non-flow area adjacent to a side of the gap, and the second side forms the second solder paste non-flow area adjacent to a side of the gap.
5. The circuit board of claim 4, wherein the first side and the second side are flush with each other.
6. The circuit board of claim 1, wherein the first solder pad is provided with a fifth side, a sixth side, and a seventh side, the second solder pad is provided with an eighth side, the fifth side, the sixth side, and the seventh side together with the eighth side form the gap portion, the gap portion forms the first solder paste non-flow area near one side of the fifth side, the sixth side, and the seventh side, and one side of the gap portion forms the second solder paste non-flow area.
7. The circuit board of claim 6, wherein the fifth side and the seventh side are perpendicular to the sixth side, respectively.
8. The circuit board of claim 1, wherein the first pad and the second pad are rectangular structures.
9. The circuit board of claim 1, wherein the first solder pad has a first device placement area and a first solder paste application area, the first device placement area coinciding with the first solder paste application area.
10. The circuit board of claim 1, wherein the second solder pad has a second device placement area and a second solder paste application area, the second device placement area coinciding with the second solder paste application area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322478498.XU CN220935375U (en) | 2023-09-12 | 2023-09-12 | Circuit board for preventing solder paste of overlap bonding pad from sliding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322478498.XU CN220935375U (en) | 2023-09-12 | 2023-09-12 | Circuit board for preventing solder paste of overlap bonding pad from sliding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220935375U true CN220935375U (en) | 2024-05-10 |
Family
ID=90965102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322478498.XU Active CN220935375U (en) | 2023-09-12 | 2023-09-12 | Circuit board for preventing solder paste of overlap bonding pad from sliding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220935375U (en) |
-
2023
- 2023-09-12 CN CN202322478498.XU patent/CN220935375U/en active Active
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