CN220934113U - Micro LED packaging structure and display screen - Google Patents
Micro LED packaging structure and display screen Download PDFInfo
- Publication number
- CN220934113U CN220934113U CN202322316820.9U CN202322316820U CN220934113U CN 220934113 U CN220934113 U CN 220934113U CN 202322316820 U CN202322316820 U CN 202322316820U CN 220934113 U CN220934113 U CN 220934113U
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- Prior art keywords
- micro
- copper
- micro led
- chip
- substrate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides a Micro LED packaging structure and a display screen, and belongs to the technical field of LED packaging; the problem of short circuit leakage of the LED of the traditional flip-chip packaging structure is solved; the Micro LED chip comprises a Micro LED chip and a substrate, wherein the Micro LED chip is flip-chip provided with two chip electrodes, copper Micro bumps are deposited on each chip electrode, substrate die bonding islands corresponding to R, G, B Micro LED chip electrodes are divided on the substrate, substrate die bonding island Micro bumps are deposited on each substrate die bonding island, copper-copper bonding is carried out on the copper Micro bumps on the Micro LED chip and the substrate die bonding island Micro bumps on the substrate, and a plastic package body is arranged on the Micro LED chip for plastic package; the utility model is applied to full-color LED packaging.
Description
Technical Field
The utility model provides a Micro LED packaging structure and a display screen, and belongs to the technical field of LED packaging.
Background
The conventional flip chip is a gold-plated chip, bonding between the chip and the substrate adopts a screen printing solder paste process, and the solder bonding is formed by reflow soldering to complete the electrical connection between the chip and the substrate. The conventional substrate has a die-bonding island coating which is a gold-plating layer, and adopts a screen printing solder paste process to form tin bonding through reflow soldering so as to complete the electric connection between the chip and the substrate. When the electrode spacing of the flip chip is less than or equal to 30 mu m, the traditional packaging screen printing and reflow soldering process has the defects of abnormal micro short circuit of tin links between electrodes and short circuit leakage risk due to the tolerance of substrate circuits, screen printing and chip die bonding.
Disclosure of utility model
The utility model provides a Micro LED packaging structure and a display screen, which aim to solve the problem of short circuit and electric leakage of an LED of a traditional flip packaging structure and realize high reliability of LED packaging by improving hardware or improving combination connection of hardware modules and/or circuits.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides a Micro LED packaging structure, includes Micro LED chip and the base plate of R, G, B of flip-chip, be provided with two chip electrodes on the Micro LED chip, the deposit has copper Micro bump on every chip electrode, divide the solid brilliant base island of base plate that corresponds R, G, B's Micro LED chip electrode on the base plate, the deposit has the solid brilliant base island Micro bump of base plate on every solid brilliant base island of base plate, copper Micro bump on the Micro LED chip carries out copper-copper bonding with the solid brilliant base island Micro bump of base plate on the base plate and forms copper-copper bonding point, be provided with the plastic envelope body on the Micro LED chip and carry out the plastic envelope.
The distance between two chip electrodes of the Micro LED chip is less than or equal to 30 mu m.
The copper Micro-bump on the Micro LED chip is formed by a surface deposition copper layer process, wherein the diameter of the copper Micro-bump is less than or equal to 40 mu m, and the height of the copper Micro-bump is less than or equal to 20 mu m.
The substrate crystal-fixing base island micro-salient points on the substrate are formed in a mask electroplating mode, the diameter of the substrate crystal-fixing base island micro-salient points is less than or equal to 40 mu m, and the height of the substrate crystal-fixing base island micro-salient points is less than or equal to 20 mu m.
The substrate is specifically a BT carrier plate or an FR4 carrier plate or a glass carrier plate.
The thickness of the substrate is 0.04mm-0.5mm.
And the Micro LED chip and the substrate are subjected to a hot press molding process to complete copper-copper bonding of the copper Micro-bumps on the chip electrode and the substrate die-bonding island Micro-bumps, so that an electrical link is formed.
The plastic package body is made of resin materials.
A display screen is manufactured by adopting a Micro LED packaging structure.
Compared with the prior art, the utility model has the following beneficial effects:
The chip electrode and the substrate die bonding base island adopt a copper-copper bonding process, so that micro short circuit abnormality caused by tin bonding is avoided, and the reliability of the packaging device and a display screen formed by the packaging device is improved.
The Micro LED package has high requirement on quality, and the package of the chip and the substrate by adopting a copper-copper bonding process has the following advantages: ① Micro short circuit abnormality caused by traditional tin bonding is avoided, and reliability is improved; ② Optimizing the packaging process and eliminating the traditional solder paste screen printing process flow.
Drawings
The utility model is further described below with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of a Micro LED chip according to the present utility model;
FIG. 2 is a schematic view of a substrate according to the present utility model;
FIG. 3 is a schematic diagram of a package structure of a Micro LED according to the present utility model;
In the figure: 1 is a Micro LED chip; 2 is a chip electrode; 3 is a chip micro bump; 4 is a substrate; 5 is a substrate die bonding base island; 6 is a substrate die bonding base island micro bump; 7 is copper-copper bonding point; and 8 is a plastic package body.
Detailed Description
The utility model provides a Micro LED packaging structure which is applied to flip chips with chip electrode spacing less than or equal to 30 mu m, as shown in figure 1, copper Micro bumps are generated on copper layers of a first electrode and a second electrode of each Micro LED chip 1 on a wafer through a surface copper deposition process, namely, chip Micro bumps 3. Wherein the diameter of the chip micro-convex points 3 is less than or equal to 40 mu m, and the height is less than or equal to 20 mu m.
Copper micro-bumps with the diameter less than or equal to 40 mu m and the height less than or equal to 20 mu m, namely micro-bumps 6 on the substrate die-bonding base island, are generated on the substrate 4 through a mask electroplating mode, as shown in figure 2. And Ni plating, ag plating and Au plating are not performed after copper plating, so that the substrate die bonding base island 5 is ensured to be only provided with an electroplated copper layer. The substrate 4 of the present utility model may be a BT carrier or an FR4 carrier or a glass carrier. The thickness of the substrate is 0.04mm-0.5mm.
As shown in fig. 3, the Micro LED packaging structure of the present utility model is to perform copper-copper bonding on a Micro LED flip chip with Micro bumps and a substrate 4 with Micro bumps, and a first electrode and a second electrode of the Micro LED flip chip and copper Micro bumps on a substrate die bonding island through a hot press molding process to form copper-copper bonding points 7, wherein a plastic package body 8 is provided on the Micro LED chip 1 for plastic packaging. The Micro LED chip 1 and the substrate 4 are subjected to copper-copper bonding through a hot-press molding process to complete the chip Micro-convex points 3 and the substrate die-bonding base island Micro-convex points 6, so that electric links are formed; the plastic package 8 of the present utility model is made of a resin material.
According to the Micro LED chip electrode copper Micro-bump and substrate die-bonding base island copper Micro-bump, the chip and the base island are subjected to copper-copper bonding through a hot press molding process, bonding through solder paste is not needed in the packaging process, the required packaging space is small, and the Micro LED packaging requirement of Micro space is met. Copper-copper bonding can effectively complete packaging of Micro LED chips with Micro-spacing (chip electrodes are less than or equal to 30 mu m), so that the problem of Micro short circuit of solder paste caused by a solder paste wire mesh brushing process in Micro-spacing Micro LED packaging is avoided, product reliability is improved, product yield is improved, and material forming cost is reduced.
The specific structure of the utility model needs to be described that the connection relation between the component modules adopted by the utility model is definite and realizable, and besides the specific description in the embodiment, the specific connection relation can bring about corresponding technical effects, and on the premise of not depending on execution of corresponding software programs, the technical problems of the utility model are solved, the types of the components, the modules and the specific components, the connection modes of the components and the expected technical effects brought by the technical characteristics are clear, complete and realizable, and the conventional use method and the expected technical effects brought by the technical characteristics are all disclosed in patents, journal papers, technical manuals, technical dictionaries and textbooks which can be acquired by a person in the field before the application date, or the prior art such as conventional technology, common knowledge in the field, and the like, so that the provided technical scheme is clear, complete and the corresponding entity products can be reproduced or obtained according to the technical means.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (9)
1. Micro LED packaging structure, its characterized in that: including the Micro LED chip and the base plate of flip-chip R, G, B, be provided with two chip electrodes on the Micro LED chip, the deposit has copper Micro bump on every chip electrode, divide the solid brilliant base island of base plate that corresponds R, G, B's Micro LED chip electrode on the base plate, the deposit has the solid brilliant base island Micro bump of base plate on every solid brilliant base island of base plate, copper Micro bump on the Micro LED chip carries out copper-copper bonding with the solid brilliant base island Micro bump of base plate on the base plate and forms copper-copper bonding point, be provided with the plastic envelope body on the Micro LED chip and carry out plastic envelope.
2. The Micro LED package structure of claim 1, wherein: the distance between two chip electrodes of the Micro LED chip is less than or equal to 30 mu m.
3. The Micro LED package structure of claim 2, wherein: the copper Micro-bump on the Micro LED chip is formed by a surface deposition copper layer process, wherein the diameter of the copper Micro-bump is less than or equal to 40 mu m, and the height of the copper Micro-bump is less than or equal to 20 mu m.
4. The Micro LED package structure of claim 1, wherein: the substrate crystal-fixing base island micro-salient points on the substrate are formed in a mask electroplating mode, the diameter of the substrate crystal-fixing base island micro-salient points is less than or equal to 40 mu m, and the height of the substrate crystal-fixing base island micro-salient points is less than or equal to 20 mu m.
5. The Micro LED package structure of claim 1, wherein: the substrate is specifically a BT carrier plate or an FR4 carrier plate or a glass carrier plate.
6. The Micro LED package structure of claim 5, wherein: the thickness of the substrate is 0.04mm-0.5mm.
7. The Micro LED package structure of claim 1, wherein: and the Micro LED chip and the substrate are subjected to a hot press molding process to complete copper-copper bonding of the copper Micro-bumps on the chip electrode and the substrate die-bonding island Micro-bumps, so that an electrical link is formed.
8. The Micro LED package structure of claim 1, wherein: the plastic package body is made of resin materials.
9. A display screen, characterized in that: use of a Micro LED package structure according to any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322316820.9U CN220934113U (en) | 2023-08-28 | 2023-08-28 | Micro LED packaging structure and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322316820.9U CN220934113U (en) | 2023-08-28 | 2023-08-28 | Micro LED packaging structure and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220934113U true CN220934113U (en) | 2024-05-10 |
Family
ID=90961117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322316820.9U Active CN220934113U (en) | 2023-08-28 | 2023-08-28 | Micro LED packaging structure and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220934113U (en) |
-
2023
- 2023-08-28 CN CN202322316820.9U patent/CN220934113U/en active Active
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