CN220934024U - Die attach process packaging device - Google Patents
Die attach process packaging device Download PDFInfo
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- CN220934024U CN220934024U CN202322542150.2U CN202322542150U CN220934024U CN 220934024 U CN220934024 U CN 220934024U CN 202322542150 U CN202322542150 U CN 202322542150U CN 220934024 U CN220934024 U CN 220934024U
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- vacuum
- packaging device
- area
- vacuum adsorption
- die attach
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims abstract description 46
- 238000003825 pressing Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 7
- 229910001018 Cast iron Inorganic materials 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 150000002505 iron Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The utility model discloses a die bonding process packaging device, which comprises a bottom plate and a pressing plate, wherein cast iron is integrally used as a cushion block material, a plurality of vacuum adsorption areas are formed at the top of the cushion block, a pin bearing area is arranged between every two vacuum adsorption areas, each vacuum adsorption area comprises a plurality of vacuum adsorption units, a plurality of product units can be adsorbed simultaneously, the top of each vacuum adsorption unit is designed to be sunken, the sunken area is an X-shaped cavity, and the sunken design of a vacuum hole and the X-shaped cavity is utilized to increase the vacuum area, so that the vacuum adsorption area is large and the adsorption force is stronger.
Description
Technical Field
The utility model relates to the technical field of die bonding processes, in particular to a die bonding process packaging device.
Background
As IC products are increasingly used, some products have increasingly higher BLT/Die tilt requirements, especially some BLT-demanding products, which can be very high for machine vacuum. The bonding condition of the pad can be judged through vacuum, and slight difference has great influence on the glue amount and BLT, so that the vacuum adsorption force plays a key role in the quality of the product in production.
The front surface of the cushion block of the current cushion block device comprises a vacuum adsorption area and a pin bearing area, the vacuum adsorption area consists of a plurality of vacuum holes, vacuum suction adsorption is provided, the vacuum holes are smaller than die in size, and the vacuum holes can be distributed in one row or a plurality of rows and can be distributed in fixed areas. The distance between the two transverse vacuum holes is smaller than the diameter of a single pad, the pin bearing area is not limited in the longitudinal direction, the pin bearing area comprises a plurality of sinking areas, and the adsorption area is small due to the design of single small holes.
Disclosure of utility model
This section is intended to outline some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description of the utility model and in the title of the utility model, which may not be used to limit the scope of the utility model.
The present utility model has been made in view of the above-mentioned and/or problems occurring in the prior art die attach process packaging apparatus.
Therefore, the utility model aims to provide a die bonding process packaging device, the whole cushion block material is cast iron, a plurality of vacuum adsorption areas are formed at the top of the cushion block, a pin bearing area is arranged between every two vacuum adsorption areas, each vacuum adsorption area comprises a plurality of vacuum adsorption units, a plurality of product units can be adsorbed simultaneously, the top of each vacuum adsorption unit is designed to be sunken, the sunken area is an X-shaped cavity, and the sunken design of vacuum holes and the X-shaped cavity is utilized to increase the vacuum area, so that the vacuum adsorption area is large and the adsorption force is stronger.
In order to solve the technical problems, according to one aspect of the present utility model, the following technical solutions are provided:
The die attach process packaging apparatus comprises:
The base plate, a plurality of vacuum adsorption areas have been seted up at the base plate top, every two be provided with the pin and bear the weight of the region between the vacuum adsorption area, every vacuum hole has all been seted up to vacuum adsorption area inside, the inside vacuum cavity that is provided with of base plate, the vacuum hole with the vacuum cavity link up, the sinking die cavity has been seted up at the vacuum hole top, the sinking die cavity is X type.
As a preferable scheme of the die bonding process packaging device, the diameter of the vacuum hole is in the range of 0.5-3 mm.
As a preferable scheme of the die bonding process packaging device, the length and width of the sinking cavity are 40% -60% of the size of a single bearing product Pad.
As a preferable scheme of the die bonding process packaging device, an air inlet is arranged at the bottom of the bottom plate and comprises three air inlets A, B and C, and the air inlets A, B and C are communicated through grooves.
As a preferable scheme of the die bonding process packaging device, the die bonding process packaging device further comprises a pressing plate, wherein the pressing plate is positioned at the top of the bottom plate and is matched with the pin bearing area to press the material strips.
As a preferable scheme of the die bonding process packaging device, a plurality of pressing stems are arranged in the pressing plate, the number of the pressing stems is consistent with that of the pin bearing areas, and each pressing stem is correspondingly arranged with the position of each corresponding pin bearing area.
As a preferable scheme of the die bonding process packaging device, the pressing plate is fixed on the machine table through the connecting piece.
Compared with the prior art: through wholly using cast iron class with the cushion material, the several vacuum adsorption district has been seted up at the cushion top, is provided with the pin between every two vacuum adsorption district and bears the weight of the district, and the vacuum adsorption district includes several vacuum adsorption unit, can adsorb several product unit simultaneously, and the design of sinking is established to vacuum adsorption unit top, and the sinking area is X die cavity, utilizes the vacuum hole to add X die cavity design of sinking, increases the vacuum region for the vacuum adsorption area is big, and the adsorption affinity is stronger.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following detailed description will be given with reference to the accompanying drawings and detailed embodiments, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. Wherein:
FIG. 1 is a diagram showing the whole structure of a die attach process package according to the present utility model;
FIG. 2 is a diagram showing a structure of a bottom plate of a die attach process package according to the present utility model;
Fig. 3 is a bottom structure diagram of a die attach process package device according to the present utility model.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings.
Next, the present utility model will be described in detail with reference to the drawings, wherein the sectional view of the device structure is not partially enlarged to general scale for the convenience of description, and the drawings are only examples, which should not limit the scope of the present utility model. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings.
The utility model provides a die bonding process packaging device, which is characterized in that cast iron is integrally used as a cushion block material, a plurality of vacuum adsorption areas are formed in the top of the cushion block, pin bearing areas are arranged between every two vacuum adsorption areas, each vacuum adsorption area comprises a plurality of vacuum adsorption units, a plurality of product units can be adsorbed simultaneously, the top of each vacuum adsorption unit is designed to be sunken, the sunken areas are X-shaped cavities, and the sunken designs of the vacuum holes and the X-shaped cavities are utilized to increase the vacuum areas, so that the vacuum adsorption area is large and the adsorption force is stronger.
Fig. 1-3 are schematic structural views of an embodiment of a die attach process packaging apparatus according to the present utility model, referring to fig. 1-3, the die attach process packaging apparatus of the present embodiment includes a bottom plate 100 and a pressing plate 200.
The bottom plate 100 top has been seted up to vacuum adsorption area 110, be provided with pin bearing area 120 between every two vacuum adsorption area 110, every vacuum adsorption area 110 is inside has all seted up vacuum hole 130, the inside vacuum cavity that is provided with of bottom plate 100, the vacuum hole with vacuum cavity link up, sinking die cavity 140 has been seted up at vacuum hole 130 top, sinking die cavity 140 is X type, bottom plate 100 wholly is cast iron class material, sinking die cavity 140 is the cavity type design of X type, the length and width of X die cavity is about 40% -60% of single Pad size, for big Pad not less than 3mm, the adsorption area needs even, and can not too many numbers of strokes, easy gas leakage, X is the most succinct symmetrical shape, for little Pad 3mm, can use other die cavities, for example, straight-line type die cavity, vacuum hole 130 and the X cavity type design of sinking die cavity 140, increase the vacuum area, make the vacuum adsorption area big, the adsorption power is stronger. And the X cavity structural support is more stable, the air inlet 150 is arranged at the bottom of the bottom plate 100 and can comprise three air inlets A, B, C, A, B and C which are communicated through the grooves, the design can provide stronger vacuum to the adsorption effect of pad, the cavity is arranged in the bottom plate 100, the air inlet 150 is used for air inlet, then the air is communicated with the cavity, and the vacuum hole 130 is formed in the front side of the bottom plate to achieve the vacuum effect.
The clamp plate 200 is located bottom plate 100 top, clamp plate (200) is fixed on the board through the connecting piece, the connecting piece includes screw and clamping device, cooperation pin bears regional 120 and carries out the centre gripping to the strip, clamp plate 200 internally mounted has a plurality of press stems 210, press stem 210 quantity and pin bears regional 120 quantity unanimity, and every press stem 210 aligns with every corresponding pin bears regional 120 position, the clamp plate 200 material is generally steel, increased a plurality of press stems 210 on original vacuum rectangle, press stem 210's overall arrangement standard and product size phase-match, press stem 210 is about to guarantee to be located the central point of the protruding strip structure of pin bears regional 120.
Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner as long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of omitting the descriptions and saving resources. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. The die attach process packaging device is characterized by comprising:
Bottom plate (100), a plurality of vacuum adsorption areas (110) have been seted up at bottom plate (100) top, every two be provided with pin bearing area (120) between vacuum adsorption area (110), every vacuum adsorption area (110) are inside all to be seted up vacuum hole (130), the inside vacuum cavity that is provided with of bottom plate (100), vacuum hole (130) with the vacuum cavity link up, sinking die cavity (140) have been seted up at vacuum hole (130) top, sinking die cavity (140) are X type.
2. The die attach process packaging device of claim 1, wherein the vacuum holes (130) have a diameter in the range of 0.5mm to 3mm.
3. The die attach process packaging device according to claim 1, wherein the length and width of the sinking cavity (140) is 40% -60% of the size of a single carrier product Pad.
4. The die attach process packaging device according to claim 1, wherein an air inlet (150) is provided at the bottom of the bottom plate (100), and the air inlet (150) comprises three air inlets a, B, C, which are penetrated by a slot.
5. The die attach process packaging device of claim 1, further comprising a platen (200), wherein the platen (200) is located at a top of the base plate (100) and cooperates with the pin bearing area (120) to press the strip.
6. The die attach process packaging device according to claim 5, wherein a plurality of press stems (210) are installed in the press plate (200), the number of press stems (210) is consistent with the number of the lead bearing areas (120), and each press stem (210) is disposed corresponding to each corresponding lead bearing area (120).
7. The die attach process packaging apparatus of claim 5, wherein the platen (200) is fixed to the machine by a connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322542150.2U CN220934024U (en) | 2023-09-19 | 2023-09-19 | Die attach process packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322542150.2U CN220934024U (en) | 2023-09-19 | 2023-09-19 | Die attach process packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220934024U true CN220934024U (en) | 2024-05-10 |
Family
ID=90934420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322542150.2U Active CN220934024U (en) | 2023-09-19 | 2023-09-19 | Die attach process packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220934024U (en) |
-
2023
- 2023-09-19 CN CN202322542150.2U patent/CN220934024U/en active Active
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