CN213259900U

CN213259900U - Punching buffering structure of circuit board punching die

Info

Publication number: CN213259900U
Application number: CN202021796551.0U
Authority: CN
Inventors: 王学军
Original assignee: Kunshan Army Wave Machinery Co ltd
Current assignee: Kunshan Army Wave Machinery Co ltd
Priority date: 2020-08-25
Filing date: 2020-08-25
Publication date: 2021-05-25
Anticipated expiration: 2030-08-25

Abstract

The utility model discloses a punching press buffer structure of die-cut mould of circuit board belongs to punching press technical field, and its technical essential includes main base template, the equal fixed mounting in the left and right sides at main base template top has the connecting block, two the equal fixed mounting in top of connecting block has the support frame, two the equal block in top of support frame is connected with inferior buffering subassembly, two one side sliding connection that the support frame is relative has the lower bolster, the equal fixed mounting in the left and right sides of lower bolster bottom has main buffering subassembly. The utility model discloses a, the bottom of cope match-plate pattern not only can with the lower bolster contact, still can with the top contact of inferior buffering subassembly, the change is that main buffering subassembly supports simultaneously with inferior buffering subassembly, has guaranteed that too big can not receive the damage to main buffering subassembly and support frame and the slip relation between the master template to can also guarantee the inseparable effect of laminating of whole lower bolster and cope match-plate pattern when the punching press.

Description

Punching buffering structure of circuit board punching die

Technical Field

The utility model belongs to the technical field of the punching press, concretely relates to punching press buffer structure of die-cut mould of circuit board.

Background

A stamping die is a special processing device for processing a material (metal or nonmetal) into a part (or a semi-finished product) in cold stamping, and is called a cold stamping die (commonly called a cold stamping die), and stamping is a pressure processing method for applying pressure to the material by using a die installed on a press machine at room temperature to separate or plastically deform the material so as to obtain a required part.

When carrying out the punching press, go up the mould gliding and carry out stamping operation with the bed die contact, but the dynamics of punching press is too big sometimes, and two kinds of rigid structure contacts to change back and cause the bed die to be crushed, consequently need to design one to the bed die can guarantee original punching press quality, can prevent the punching press buffer structure of the die-cut mould of circuit board that the mould damaged again.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a punching press buffer structure of die-cut mould of circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a punching press buffer structure of die-cut mould of circuit board, includes main die plate, the equal fixed mounting in the left and right sides at main die plate top has the connecting block, two the equal fixed mounting in top of connecting block has the support frame, two the equal block in top of support frame is connected with inferior buffering subassembly, two one side sliding connection that the support frame is relative has the lower bolster, the equal fixed mounting in the left and right sides of lower bolster bottom has main buffering subassembly, two one side that main buffering subassembly carried on the back mutually respectively with two one side fixed connection that the support frame is relative, the top of lower bolster is provided with the cope match-plate pattern, the equal fixed mounting in four angles at lower bolster top has the locating lever, four the top of locating lever all runs through and extends to the.

Preferably, the secondary buffer assembly comprises two buffer contact pads, a plurality of rubber support rods are fixedly mounted on one opposite side of each of the two buffer contact pads at equal intervals, the two adjacent rubber support rods are in contact with each other, a honeycomb filling foam plate is filled between each two adjacent rubber support rods, a positioning ring is fixedly mounted at the bottom of each buffer contact pad, the bottom of each buffer contact pad is connected with the top of the support frame in a clamping mode through the positioning ring, and one side, close to the lower template, of each buffer contact pad is attached to the lower template.

Preferably, the left side and the right side of the lower template are fixedly provided with sliding blocks, the two sliding grooves are formed in the opposite sides of the support frames, and the two sliding blocks are connected with the adjacent sliding grooves in a sliding mode.

Preferably, the main buffering component comprises a supporting block and a second contact block, the second contact block is attached to one side, opposite to the supporting block, of the second contact block, a first contact block is connected to one side, away from the supporting block, of the second contact block in a sliding mode, a first telescopic rod is arranged on one side, away from the supporting block, of the first contact block, a first supporting spring is sleeved on the surface of an output rod of the first telescopic rod, the surface of the output rod of the first telescopic rod is fixedly connected with the surface of the first contact block, the bottoms of the first telescopic rod and the supporting block are fixedly connected with the top of the main base template, and the top of the second contact block is fixedly connected with the bottom of the lower template.

Preferably, the cross sections of the second contact block and the first contact block in the front view are both right-angled trapezoids.

Preferably, a plurality of second telescopic links are fixedly mounted at the top of the main base template, a plurality of second telescopic link output rods are sleeved on the surfaces of the second telescopic link output rods, and the top ends of the second telescopic link output rods are fixedly connected with the bottom of the lower template.

Compared with the prior art, the beneficial effects of the utility model are that: the whole device takes a main base template, a lower template and an upper template as main bodies, the main base template and the lower template are in sliding connection through a support frame instead of a fixed connection structure, the main buffer component is added at one side of the lower template opposite to the main template to serve as a buffer structure, so that the lower template can slide up and down and can receive the force generated in stamping, the work is completed, and a certain buffer effect is achieved, and when stamping pressure was too big, the bottom of cope match-plate pattern not only can contact with the lower bolster, still can contact with the top of inferior buffering subassembly, and the change is main buffering subassembly and the simultaneous support of inferior buffering subassembly, has guaranteed that too big pressure also can not receive the damage to main buffering subassembly and support frame and the sliding relation between the master template to can also guarantee the inseparable effect of whole lower bolster and cope match-plate pattern laminating when the punching press.

Drawings

FIG. 1 is a front sectional view of the present invention;

FIG. 2 is a front sectional view of the secondary cushion assembly of the present invention;

FIG. 3 is an enlarged view of the point A of FIG. 1 according to the present invention;

fig. 4 is an enlarged view of the point B in fig. 1 according to the present invention.

In the figure: 1. a master template; 2. a lower template; 3. mounting a template; 4. a secondary buffer assembly; 41. a buffer contact pad; 42. a cellular filled foam board; 43. a rubber support rod; 44. a positioning ring; 5. a slider; 6. a support frame; 7. connecting blocks; 8. a primary buffer assembly; 81. a first contact block; 82. a first telescopic rod; 83. a second contact block; 84. a support block; 85. a first support spring; 9. a second telescopic rod; 10. a second support spring; 11. a sliding groove; 12. and (5) positioning the rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-4, the utility model provides a punching press buffer structure of die-cut mould of circuit board, including main base plate 1, the equal fixed mounting in the left and right sides at main base plate 1 top has connecting block 7, the equal fixed mounting in top of two connecting blocks 7 has support frame 6, the equal block in top of two support frames 6 is connected with inferior buffering subassembly 4, one side sliding connection that two support frames 6 are relative has lower bolster 2, the equal fixed mounting in the left and right sides of lower bolster 2 bottom has main buffering subassembly 8, one side that two main buffering subassemblies 8 carried on the back mutually respectively with one side fixed connection that two support frames 6 are relative, the top of lower bolster 2 is provided with cope match-plate pattern 3, four angles at lower bolster 2 top all fixed mounting have locating lever 12, the top of four locating levers 12 all runs through and extends to the top of cope match-plate pattern 3, whole device is, The lower template 2 and the upper template 3 are taken as main bodies, the main template 1 and the lower template 2 are changed into a sliding connection through a support frame 6 from a fixed connection structure, a main buffer component 8 is added at one side of the lower template 2 opposite to the main template 1 to be used as a buffer structure, so that the lower template 2 can slide up and down and can also receive the force generated in stamping, the work is completed, and a certain buffer effect is achieved, and when the stamping pressure is overlarge, the bottom of the upper template 3 can not only contact with the lower template 2, but also contact with the top of the secondary buffer assembly 4, the primary buffer assembly 8 and the secondary buffer assembly 4 are changed to be supported at the same time, the sliding relation between the primary buffer assembly 8, the supporting frame 6 and the primary template 1 can not be damaged even if the pressure is overlarge, and the tight effect of laminating when the punching press of whole lower bolster 2 and cope match-plate pattern 3 can also be guaranteed.

In this embodiment, preferably, the secondary buffer assembly 4 includes two buffer contact pads 41, a plurality of rubber support rods 43 are fixedly installed on opposite sides of the two buffer contact pads 41 at equal intervals, two adjacent rubber support rods 43 are in contact with each other, a honeycomb filling foam plate 42 is filled between two adjacent rubber support rods 43, a positioning ring 44 is fixedly installed at the bottom of the bottom buffer contact pad 41, the bottom of the buffer contact pad 41 is connected with the top of the support frame 6 in a clamping manner through the positioning ring 44, one side of the buffer contact pad 41 close to the lower template 2 is attached to the lower template 2, the secondary buffer assembly 4 is configured to cooperate with the primary buffer assembly 8 to complete the second layer of buffering when the stamping pressure is too high, the two buffer contact pads 41 are supported by the rubber support rods 43 and are filled with the honeycomb filling foam plate 42, the rubber support rods 43 have supporting and toughness effects, after the honeycomb filling foam plate 42 is filled, the honeycomb filling foam plate has a better supporting effect, can be deformed and cannot be crushed, and can be connected with the top of the supporting frame 6 through the positioning ring 44 and the bolts, so that the honeycomb filling foam plate is convenient to replace.

In this embodiment, preferred, the equal fixed mounting in the left and right sides of lower bolster 2 has sliding block 5, and sliding tray 11 has all been seted up to two relative one sides of support frame 6, and two 5 one sides that carry on the back mutually all with adjacent sliding tray 11 sliding connection, through being provided with sliding block 5 and sliding tray 11 as the slip between lower bolster 2 and the support frame 6, can make the lift of lower bolster 2 more stable.

In this embodiment, preferably, the main buffering assembly 8 includes a supporting block 84 and a second contact block 83, one side of the second contact block 83 opposite to the supporting block 84 is attached to each other, one side of the second contact block 83 away from the supporting block 84 is slidably connected with a first contact block 81, one side of the first contact block 81 away from the supporting block 84 is provided with a first telescopic rod 82, the surface of an output rod of the first telescopic rod 82 is sleeved with a first supporting spring 85, the surface of the output rod of the first telescopic rod 82 is fixedly connected with the first contact block 81, the bottoms of the first telescopic rod 82 and the supporting block 84 are both fixedly connected with the top of the main template 1, the top of the second contact block 83 is fixedly connected with the bottom of the lower template 2, in the structure of the main buffering assembly 8, when the second contact block 83 can move downwards, the first contact block 81 is compressed by contacting with the first contact block 81, the added first supporting spring 85 can generate elastic force to enable the lower template 2 on the top of the second contact block 83 to rebound when the lower template is not stressed.

In this embodiment, preferably, the cross sections of the second contact block 83 and the first contact block 81 in the front view are both right trapezoid, and the first contact block 81 and the first telescopic rod 82 can be flatly placed by using the inclined plane of the right trapezoid, which is in contact with the first contact block 81, so as to achieve the effect of better contacting with the first contact block 81.

In this embodiment, it is preferred, main base template 1's top fixed mounting has a plurality of second telescopic links 9, and the surface of a plurality of second telescopic links 9 output pole all overlaps and is equipped with second supporting spring 10, the top of a plurality of second telescopic links 9 output poles all with the bottom fixed connection of lower bolster 2, provide the supplementary effect to main buffering subassembly 8 through being provided with second telescopic link 9 and second supporting spring 10.

The utility model discloses a theory of operation and use flow: the whole device takes a main base template 1, a lower template 2 and an upper template 3 as main bodies, the structure of fixedly connecting the main base template 1 and the lower template 2 is changed into sliding connection through a support frame 6, a main buffer component 8 is added at one side of the lower template 2 opposite to the main template 1 to be used as a buffer structure, so that the lower template 2 can slide up and down and can also receive the force generated in stamping, the work is completed, and a certain buffer effect is achieved, and when the stamping pressure is overlarge, the bottom of the upper template 3 can not only contact with the lower template 2, but also contact with the top of the secondary buffer assembly 4, the primary buffer assembly 8 and the secondary buffer assembly 4 are changed to be supported at the same time, the sliding relation between the primary buffer assembly 8, the supporting frame 6 and the primary template 1 can not be damaged even if the pressure is overlarge, and the tight effect of laminating when the punching press of whole lower bolster 2 and cope match-plate pattern 3 can also be guaranteed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a punching press buffer structure of die-cut mould of circuit board, includes main die plate (1), its characterized in that: the left side and the right side of the top of the main base template (1) are both fixedly provided with connecting blocks (7), the tops of the two connecting blocks (7) are both fixedly provided with supporting frames (6), the tops of the two supporting frames (6) are both connected with a secondary buffer component (4) in a clamping manner, one side of the two supporting frames (6) opposite to each other is connected with a lower template (2) in a sliding manner, the left side and the right side of the bottom of the lower template (2) are both fixedly provided with main buffer components (8), one side of the back of each of the two main buffer components (8) is respectively and fixedly connected with one side of the two support frames (6) which is opposite, the top of lower bolster (2) is provided with cope match-plate pattern (3), four equal fixed mounting in angle at lower bolster (2) top have locating lever (12), four the top of locating lever (12) all runs through and extends to the top of cope match-plate pattern (3).

2. The punching buffering structure of the circuit board punching die according to claim 1, characterized in that: the secondary buffer assembly (4) comprises two buffer contact pads (41), a plurality of rubber supporting rods (43) are fixedly mounted on one opposite side of each buffer contact pad (41) at equal intervals, the rubber supporting rods (43) are in contact with each other adjacently, a honeycomb filling foam board (42) is filled between each two adjacent rubber supporting rods (43), a positioning ring (44) is fixedly mounted at the bottom of each buffer contact pad (41), the bottom of each buffer contact pad (41) is connected with the top of the support frame (6) in a clamping mode through the positioning ring (44), and one side, close to the lower template (2), of each buffer contact pad (41) is attached to the lower template (2) mutually.

3. The punching buffering structure of the circuit board punching die according to claim 1, characterized in that: the equal fixed mounting in both sides has sliding block (5) about lower bolster (2), two sliding tray (11) have all been seted up to one side that support frame (6) is relative, two one side that sliding block (5) were carried on the back mutually all with adjacent sliding tray (11) sliding connection.

4. The punching buffering structure of the circuit board punching die according to claim 1, characterized in that: the main buffer assembly (8) comprises a supporting block (84) and a second contact block (83), the second contact block (83) is attached to one side, opposite to the supporting block (84), of the second contact block (83), one side, far away from the supporting block (84), of the second contact block (83) is connected with a first contact block (81) in a sliding mode, one side, far away from the supporting block (84), of the first contact block (81) is provided with a first telescopic rod (82), the surface of an output rod of the first telescopic rod (82) is sleeved with a first supporting spring (85), the output rod of the first telescopic rod (82) is fixedly connected with the surface of the first contact block (81), the bottoms of the first telescopic rod (82) and the supporting block (84) are fixedly connected with the top of the main template (1), and the top of the second contact block (83) is fixedly connected with the bottom of the lower template (2).

5. The punching buffering structure of the circuit board punching die as set forth in claim 4, wherein: the cross sections of the second contact block (83) and the first contact block (81) in the front view are both right-angled trapezoids.

6. The punching buffering structure of the circuit board punching die according to claim 1, characterized in that: the top fixed mounting of main template (1) has a plurality of second telescopic links (9), and is a plurality of the surface of second telescopic link (9) output rod all overlaps and is equipped with second supporting spring (10), and is a plurality of the top of second telescopic link (9) output rod all with the bottom fixed connection of lower bolster (2).