CN220927003U - Electroplating device for production and processing of semiconductors - Google Patents
Electroplating device for production and processing of semiconductors Download PDFInfo
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- CN220927003U CN220927003U CN202322719445.2U CN202322719445U CN220927003U CN 220927003 U CN220927003 U CN 220927003U CN 202322719445 U CN202322719445 U CN 202322719445U CN 220927003 U CN220927003 U CN 220927003U
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- force application
- electrolytic cell
- wall
- electrolyte
- electrolytic
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 210000004027 cell Anatomy 0.000 claims abstract description 13
- 210000005056 cell body Anatomy 0.000 claims abstract description 11
- 239000003792 electrolyte Substances 0.000 abstract description 25
- 238000005868 electrolysis reaction Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a production and processing electroplating device of a semiconductor, and relates to the technical field of electroplating devices. The utility model comprises the following steps: the electrolytic cell comprises an electrolytic cell body, wherein a liquid pushing plate is inserted into the inner wall of the electrolytic cell body in a sliding manner. According to the utility model, when different semiconductors need to be replaced for electrolysis, after a user discharges electrolyte through the liquid outlet pipe of the electrolytic tank body, the bottom of the inner wall of the semiconductor electrolytic tank is usually required to be kept flat and smooth. So have partial electrolyte to remain at the inner wall of electrolysis trough, at this moment, the user just can place the push away the liquid board behind the inner wall of electrolysis trough body, through the length of actuating mechanism control its along the electrolysis trough body to remove to push away the entry of drain pipe with remaining electrolyte, realize comparatively thorough emission to the electrolyte, then can wash with water, the rethread pushes away the liquid board and carries out the repeated flowing back, can effectually guarantee subsequent electrolytic effect, abundant embodiment the practicality of device.
Description
Technical Field
The utility model relates to the technical field of electroplating devices, in particular to a semiconductor production processing electroplating device.
Background
A semiconductor electroplating bath is an apparatus for performing electroplating of semiconductor devices, mainly for depositing metal onto the device surface to form a thin film or filler material, and electroplating often requires an electrolytic bath, which is a container for holding an electroplating solution (also referred to as an electrolyte). The cells are typically made of a non-conductive material such as polypropylene or polyvinylchloride.
For the bottom of the inner wall of the semiconductor electrolytic cell, it is generally required to keep flat and smooth, because the electrolyte circulates in the electrolytic cell and contacts with the semiconductor material during the electrolytic process, if the bottom of the electrolytic cell is uneven or has rough surfaces, current can be gathered in different areas to form uneven current density distribution, which may cause too fast electroplating rate of partial areas, and other areas are too slow, thereby affecting the uniformity and quality of the electroplated layer, and when different semiconductors need to be replaced for electrolysis, the electrolyte in the electrolytic cell needs to be poured out, and at this time, because the inner wall of the electrolytic cell is flat, the electrolyte may not flow out completely, affecting the effect of the next electrolysis, therefore, a novel semiconductor production processing electroplating device is required to solve the above problems.
Disclosure of Invention
The utility model adopts the following technical scheme for realizing the purposes:
An electroplating apparatus for semiconductor production and processing, comprising: the electrolytic cell comprises an electrolytic cell body, wherein a liquid pushing plate is inserted into the inner wall of the electrolytic cell body in a sliding manner, and the electrolytic cell further comprises a driving mechanism, wherein the driving mechanism is used for controlling the liquid pushing plate to move along the length direction of the electrolytic cell body.
Further, the actuating mechanism includes two all set up in the sliding tray at electrolysis trough body top, two the inner wall of sliding tray is all pegged graft and is had the gyro wheel, two the equal fixed mounting in top of gyro wheel has the drive plate, two the other end fixed mounting of drive plate has same mounting panel, the mounting panel set up in the top of pushing away the liquid board, still include force application mechanism, force application mechanism is used for connecting the liquid board with the mounting panel and to the downward force of pushing away the liquid board application.
Further, the force application mechanism comprises a plurality of force application holes which are formed in the surface of the mounting plate, force application rods are slidably inserted into the inner walls of the force application holes, the other ends of the force application rods are fixedly mounted on the surface of the liquid pushing plate, springs in a compressed state are slidably sleeved on the surfaces of the force application rods, one ends of the springs are fixedly mounted on the surfaces of the force application rods respectively, and the other ends of the springs are fixedly mounted on the inner walls of the force application holes respectively.
Further, the novel sliding rail comprises sliding rails, two ends of each sliding rail are fixedly installed on the surfaces of the two driving plates respectively, an I-shaped plate is inserted into the inner wall of each sliding rail in a sliding mode, and a handle is fixedly installed at the top of each I-shaped plate.
Further, a plurality of taking grooves are formed in the surfaces of the two driving plates.
The beneficial effects of the utility model are as follows:
According to the utility model, when different semiconductors need to be replaced for electrolysis, after a user discharges electrolyte through the liquid outlet pipe of the electrolytic tank body, the bottom of the inner wall of the semiconductor electrolytic tank is usually required to be kept flat and smooth. So have partial electrolyte to remain at the inner wall of electrolysis trough, at this moment, the user just can place the push away the liquid board behind the inner wall of electrolysis trough body, through the length of actuating mechanism control its along the electrolysis trough body to remove to push away the entry of drain pipe with remaining electrolyte, realize comparatively thorough emission to the electrolyte, then can wash with water, the rethread pushes away the liquid board and carries out the repeated flowing back, can effectually guarantee subsequent electrolytic effect, abundant embodiment the practicality of device.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a partial perspective view of the present utility model;
FIG. 3 is a schematic view of a partial perspective view of another aspect of the present utility model;
Fig. 4 is a schematic partial view in half section of a partial structure of the present utility model.
Reference numerals: 1. an electrolytic cell body; 2. a liquid pushing plate; 3. a driving mechanism; 301. a sliding groove; 302. a roller; 303. a driving plate; 304. a mounting plate; 4. a force application mechanism; 401. a force application hole; 402. a force application rod; 403. a spring; 5. a slide rail; 6. a I-shaped plate; 7. a handle; 8. and (5) taking the groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
The application provides a semiconductor production processing electroplating device, which is mainly used for solving the problems that the bottom of the inner wall of a semiconductor electrolytic tank is required to be kept flat and smooth, because electrolyte circulates in the electrolytic tank and is contacted with semiconductor materials in the electrolytic process, if the bottom of the electrolytic tank is uneven or has rough surfaces, current can be gathered in different areas to form uneven current density distribution, the electroplating speed of partial areas can be too high, other areas are too slow, the uniformity and quality of an electroplated layer are affected, and when different semiconductors are required to be replaced for electrolysis, electrolyte in the electrolytic tank needs to be poured out, and at the moment, the electrolyte can not flow out completely because of the flat inner wall of the electrolytic tank, and the effect of the next electrolysis is affected, and the following technical scheme is provided, and is described in detail below with reference to fig. 1-4:
An electroplating apparatus for semiconductor production and processing, comprising: the electrolytic bath body 1 for carrying out electrolytic operation, the inner wall of the electrolytic bath body 1 is slidably inserted with a liquid pushing plate 2 for pushing residual liquid, and the electrolytic bath further comprises a driving mechanism 3 for controlling the liquid pushing plate 2 to move along the length direction of the electrolytic bath body 1, wherein the driving mechanism 3 mainly comprises the following components: two sliding grooves 301 which are all arranged at the top of the electrolytic bath body 1, rolling wheels 302 are connected to the inner walls of the two sliding grooves 301 in a sliding mode, driving plates 303 are fixedly arranged at the tops of the two rolling wheels 302, a mounting plate 304 which is arranged above the liquid pushing plate 2 is fixedly arranged at the other ends of the two driving plates 303, and a force application mechanism 4 which is used for connecting the liquid pushing plate 2 with the mounting plate 304 and applying downward force to the liquid pushing plate 2 is further included.
When it is necessary to replace a different semiconductor for electrolysis, the user discharges the electrolyte through the outlet pipe of the electrolytic cell body 1, and it is generally necessary to keep the bottom of the inner wall of the semiconductor electrolytic cell flat and smooth. So have partial electrolyte to remain at the inner wall of electrolysis trough, at this moment, the user just can place the push away liquid board 2 behind the inner wall of electrolysis trough body 1, through the length of actuating mechanism 3 control its along electrolysis trough body 1 to remove to push away the entry of drain pipe with remaining electrolyte, realize comparatively thorough emission to the electrolyte, then can use water to wash, the rethread pushes away liquid board 2 and carries out the repeated flowing back, can effectually guarantee subsequent electrolytic effect, abundant embodiment device's practicality.
As shown in fig. 4, in some embodiments, in order to further optimize the solution, the force application mechanism 4 includes a plurality of force application holes 401 all formed on the surface of the mounting plate 304, the inner walls of the plurality of force application holes 401 are all slidably inserted with force application rods 402, the other ends of the plurality of force application rods 402 are all fixedly mounted on the surface of the electrolyte pushing plate 2, the surfaces of the plurality of force application rods 402 are all slidably sleeved with springs 403 in a compressed state, one ends of the plurality of springs 403 are respectively fixedly mounted on the surfaces of the plurality of force application rods 402, the other ends of the plurality of springs 403 are respectively fixedly mounted on the inner walls of the plurality of force application holes 401, and the electrolyte pushing plate 2 applies downward pressure to the inner walls of the electrolyte pushing plate 1 under the action of the springs 403 in a compressed state in the sliding process of the inner walls of the electrolyte pushing plate 1, so that the electrolyte can be thoroughly pushed to the liquid outlet pipe of the electrolyte pushing plate 1.
As shown in fig. 2, in some embodiments, for further optimization, the electrolytic cell further comprises a sliding rail 5 with two ends fixedly installed on the surfaces of the two driving plates 303, the inner wall of the sliding rail 5 is slidably inserted with an i-shaped plate 6 with a handle 7 fixedly installed at the top, a user standing on two sides of the electrolytic cell body 1 can pull the handle 7 to drive the i-shaped plate 6 to slide on the inner wall of the sliding rail 5, so that the position of the handle 7 is adjusted to adapt to the arm lengths of different people, and a plurality of taking grooves 8 for conveniently taking the liquid pushing plate 2 are formed on the surfaces of the two driving plates 303.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. An electroplating apparatus for semiconductor production and processing, comprising: the electrolytic cell comprises an electrolytic cell body (1), wherein a liquid pushing plate (2) is slidably inserted into the inner wall of the electrolytic cell body (1), the electrolytic cell further comprises a driving mechanism (3), and the driving mechanism (3) is used for controlling the liquid pushing plate (2) to move along the length direction of the electrolytic cell body (1).
2. The electroplating device for semiconductor production and processing according to claim 1, wherein the driving mechanism (3) comprises two sliding grooves (301) which are respectively formed in the top of the electrolytic tank body (1), rollers (302) are respectively and slidably inserted into the inner walls of the two sliding grooves (301), driving plates (303) are respectively and fixedly installed at the tops of the two rollers (302), one mounting plate (304) is fixedly installed at the other ends of the two driving plates (303), the mounting plates (304) are arranged above the liquid pushing plates (2), and the electroplating device further comprises a force application mechanism (4), and the force application mechanism (4) is used for connecting the liquid pushing plates (2) with the mounting plates (304) and applying downward force to the liquid pushing plates (2).
3. The electroplating device for semiconductor manufacturing and processing according to claim 2, wherein the force application mechanism (4) comprises a plurality of force application holes (401) which are formed in the surface of the mounting plate (304), the inner walls of the plurality of force application holes (401) are respectively and slidably inserted with a force application rod (402), the other ends of the plurality of force application rods (402) are respectively and fixedly arranged on the surface of the liquid pushing plate (2), springs (403) in a compressed state are respectively and slidably sleeved on the surface of the plurality of force application rods (402), and one ends of the plurality of springs (403) are respectively and fixedly arranged on the surface of the plurality of force application rods (402), and the other ends of the plurality of springs (403) are respectively and fixedly arranged on the inner walls of the plurality of force application holes (401).
4. The electroplating device for semiconductor production and processing according to claim 2, further comprising a sliding rail (5), wherein two ends of the sliding rail (5) are respectively and fixedly installed on the surfaces of the two driving boards (303), an I-shaped board (6) is inserted into the inner wall of the sliding rail (5) in a sliding manner, and a handle (7) is fixedly installed at the top of the I-shaped board (6).
5. A semiconductor manufacturing and processing electroplating device according to claim 2, wherein the surfaces of both the driving plates (303) are provided with a plurality of pick-up grooves (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322719445.2U CN220927003U (en) | 2023-10-11 | 2023-10-11 | Electroplating device for production and processing of semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322719445.2U CN220927003U (en) | 2023-10-11 | 2023-10-11 | Electroplating device for production and processing of semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220927003U true CN220927003U (en) | 2024-05-10 |
Family
ID=90961949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322719445.2U Active CN220927003U (en) | 2023-10-11 | 2023-10-11 | Electroplating device for production and processing of semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220927003U (en) |
-
2023
- 2023-10-11 CN CN202322719445.2U patent/CN220927003U/en active Active
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