CN220914265U - Light emitting diode package assembly - Google Patents

Abstract

The application provides a light emitting diode packaging component. The light emitting diode package assembly includes a circuit board, a reflective member, one or more light emitting diodes, and one or more lenses. The reflecting member is arranged on the circuit board and is provided with one or more through holes. The one or more light emitting diodes are arranged on the circuit board and respectively correspond to the one or more through holes. One or more lenses are arranged on the reflecting member and respectively correspond to one or more through holes. An annular groove is arranged between the upper surface and the side surface of the reflecting member, and a light absorbing substance covers the upper surface of the reflecting member and fills the annular groove. The LED packaging component can avoid water and gas entering caused by gaps between the metal lead frame and the plastic shell, and further improves the environmental tolerance when the LED packaging component is applied to outdoor display equipment.

Description

Light emitting diode package assembly

Technical Field

The present application relates to a package assembly, and more particularly, to a light emitting diode package assembly.

Background

Semiconductor lighting is commonly used in the field of general display. Among them, light Emitting Diodes (LEDs) are used in a large amount in outdoor display devices due to high brightness and high power. In existing LEDs, plastic leaded chip carrier (PLASTIC LEADED CHIP CARRIER, PLCC) packages are often used, however, this type of packaging has a number of drawbacks.

In detail, the PLCC package is formed by wrapping a metal lead frame with a plastic casing. In the manufacturing process of the PLCC package, a plurality of bending processes are required to form the metal lead frame, which is time-consuming and causes an increase in cost. Furthermore, the gaps between the metal lead frame and the plastic shell are easy to allow moisture to enter, so that the tolerance of the LED in the outdoor display equipment is low.

Disclosure of utility model

The application aims to solve the technical problem of providing a light-emitting diode packaging component capable of improving the durability of the component aiming at the defects in the prior art.

In order to solve the above technical problems, one technical solution adopted in the present application is to provide a light emitting diode package assembly, the light emitting diode package assembly includes: a circuit board; the reflecting member is arranged on the circuit board and is provided with one or more through holes; one or more Light Emitting Diodes (LEDs) arranged on the circuit board and respectively corresponding to the one or more through holes; and one or more lenses arranged on the reflecting member and corresponding to one or more through holes respectively; an annular groove is arranged between the upper surface and the side surface of the reflecting member, and a light absorbing substance covers the upper surface of the reflecting member and fills the annular groove.

Optionally, the light emitting diode package further includes one or more internal grooves, the one or more internal grooves are disposed between two adjacent through holes and connected to the annular groove, and the internal grooves are filled with the light absorbing material.

Optionally, the depth of the annular groove is between one sixth and two thirds of the thickness of the reflective member, and the width of the annular groove is between one third and one half of the depth of the annular groove.

Optionally, the depth of the inner groove is between one sixth and two thirds of the thickness of the reflective member, and the width of the inner groove is between one third and one half of the depth of the inner groove.

Optionally, the light emitting diode package further includes a light transmitting material filled in the one or more through holes.

Optionally, the one or more lenses have a base with side surfaces that are flush with side surfaces of the reflective member and the side surfaces of the reflective member.

Optionally, the one or more light emitting diodes are driven independently of each other.

Optionally, the circuit board has a resistor component embedded therein.

Optionally, the circuit board, the reflecting member, the light absorbing substance and the one or more lenses are the same in base material.

Optionally, the circuit board, the reflecting member, the light absorbing substance, the light transmitting material and the one or more lenses are the same in base material.

Optionally, the plurality of through holes are arranged in a linear or matrix arrangement.

Optionally, the one or more lenses have a circular or elliptical architecture.

Optionally, the one or more lenses do not extend into the annular groove.

Optionally, the side wall of the light absorbing substance and the side wall of the corresponding through hole form a continuous line in a cross-sectional view.

For a further understanding of the nature and the technical aspects of the present application, reference should be made to the following detailed description of the application and the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the application.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a light emitting diode package according to an embodiment of the application.

Fig. 2A is a schematic view of a reflective member according to an embodiment of the present application.

Fig. 2B is a cross-sectional view taken along line II-II of fig. 2A.

Fig. 3 is a flowchart of forming a reflective member according to an embodiment of the present application.

Fig. 4 is a schematic diagram of the manufacturing process of step S101.

Fig. 5 is a schematic diagram of the manufacturing process of step S102.

Fig. 6 is a schematic diagram of the manufacturing process of step S103.

Fig. 7A is a schematic diagram of a reflective member combined with a circuit board according to an embodiment of the present application.

Fig. 7B is a cross-sectional view taken along line VII-VII of fig. 7A.

Fig. 7C is another cross-sectional view taken along line VII-VII of fig. 7A.

Fig. 8A is a schematic diagram of an led according to an embodiment of the application disposed on a circuit board.

Fig. 8B is a cross-sectional view taken along line VIII-VIII of fig. 8A.

Fig. 9A is a schematic view of a lens according to an embodiment of the application mounted on a reflective member.

Fig. 9B is a cross-sectional view taken along line IX-IX of fig. 9A.

Fig. 9C is a cross-sectional view of another embodiment.

Fig. 10A is a first schematic diagram of a light emitting diode package according to an embodiment of the application.

Fig. 10B is a second schematic diagram of the led package according to the embodiment of the application.

Detailed Description

The following specific examples are given to illustrate the embodiments of the present application disclosed herein with respect to a "light emitting diode package assembly", and those skilled in the art will appreciate the advantages and effects of the present application from the disclosure herein. The application is capable of other and different embodiments and its several details are capable of modification and variation in various respects, all from the point of view and application, all without departing from the spirit of the present application. The drawings of the present application are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present application in detail, but the disclosure is not intended to limit the scope of the present application. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.

Fig. 1 is a flowchart of a method for manufacturing a light emitting diode package according to an embodiment of the application. Referring to fig. 1, an embodiment of the present application provides a method for manufacturing a light emitting diode package, which includes the following steps:

Step S10: a reflective member is provided. Fig. 2A is a schematic view of a reflective member according to an embodiment of the present application, and fig. 2B is a cross-sectional view along a line II-II of fig. 2A. As shown in fig. 2A and 2B, the reflective member 1 is, for example, a plate body, and includes a plurality of through holes 12 and a plurality of grooves 14 located on the upper surface 10 of the reflective member 1. The light absorbing substance 16 covers the upper surface 10 of the reflective member 1 and completely fills the trenches 14. By fully filled, it is meant that the light absorbing substance 16 fills the trench 14 to form a surface above the trench 14 that is at least flush with the upper surface 10.

In detail, the plurality of grooves 14 may include an annular groove 140 formed between the upper surface 10 and the side surface 11 of the reflective member 1 around the one or more through holes 12. In the led module, the number and arrangement of the corresponding through holes 12 may be selected in advance according to the number and arrangement of the leds to be arranged (for example, in a linear or matrix arrangement), and then the annular grooves 140 are formed to surround the selected through holes 12. In some embodiments, the trench 14 further includes an inner trench 141, and the inner trench 141 may be disposed between two adjacent through holes 12 and connected to the annular trench 140. In some embodiments, there are no trenches 14 between partially adjacent vias 12.

The width of the annular groove 140 and the width of the inner groove 141 are both smaller than the width Yu Guankong. The through hole 12 has a cross section with a wide upper part and a narrow lower part in a cross section, and thus the through hole 12 is a column. In addition, the through hole 12 may have a circular or elliptical vertical projection on the upper surface 10 of the reflective member 1. Therefore, when the vertical projection of the through hole 12 is shown as a circle, the width of the annular groove 140 and the width of the inner groove 141 may be both smaller than the diameter of Yu Guankong a 12, and when the vertical projection of the through hole 12 is shown as an ellipse, the width of the annular groove 140 and the width of the inner groove 141 are both smaller than the length of the major axis and the length of the minor axis of Yu Guankong 12. Alternatively, in terms of depth, the depth of the trench 14 may be between one third and two thirds of the depth of the via 12. In other words, the depth of the groove 14 is between one third and two thirds of the thickness of the reflective member 1. In detail, if the trench 14 is too deep, the trench 14 will be easily broken along the trench 14 in the subsequent dicing process, and if the trench 14 is too shallow, the coverage of the side black glue of the diced individual led package assembly will be insufficient, which affects the device performance. Therefore, it is necessary to strictly control the depth and width of the grooves 14, more precisely, the depth and width of the annular grooves 140 and the inner grooves 141. In an alternative embodiment, the depth of the annular groove 140 is between one sixth and two thirds of the thickness of the reflective member 1, the width of the annular groove 140 is between one third and one half of the depth of the annular groove 140, the depth of the inner groove 141 is between one sixth and two thirds of the thickness of the reflective member 1, and the width of the inner groove 141 is between one third and one half of the depth of the inner groove 141.

The light absorbing material 16 may be formed, for example, by printing a black ink on the upper surface 10, or using other anti-reflective or matting material manufacturing processes. When the light absorbing substance 16 is used, it is ensured that the light emitting diode package assembly is applied to an outdoor display device without causing interference when the light emitting diode emits light due to strong light reflection.

It should be noted that the reflecting member 1 may be prefabricated. For example, referring to fig. 3 to 6, fig. 3 is a flowchart illustrating the formation of the reflective member 1 according to the embodiment of the present application, fig. 4 is a schematic view illustrating the manufacturing process of step S101, fig. 5 is a schematic view illustrating the manufacturing process of step S102, and fig. 6 is a schematic view illustrating the manufacturing process of step S103.

As shown in fig. 3, the reflecting member 1 mentioned in the embodiment of the present application may be formed in advance by performing the following steps:

Step S101: a reflective substrate is provided, and a light absorbing substance is coated on an upper surface of the reflective substrate. As shown in fig. 4, the reflective substrate 17 may be, for example, a substrate including a high reflectivity material, such as a reflective ceramic material (THERMAL CERAMIC MATERIAL, TCM), a silver metal material, or an epoxy-based BT resin, to enhance the light emitting efficiency, and the light absorbing material 16 may be, for example, printed by ink on the upper surface 171, or formed using other anti-reflective or light-extinction material manufacturing processes. In this case, the side wall 161 of the light absorbing substance 16 and the side wall 121 of the through hole 12 form a continuous line, which may be a straight line or a curved line, from a sectional view (see fig. 4). Structurally, the side wall 161 of the light absorbing material 16 and the side wall 121 of the through hole 12 form a continuous surface, and may be a plane or an arc.

Step S102: a drilling process is performed from the upper surface of the reflective substrate to form a via.

As shown in fig. 5, one or more through holes 12 may be formed in the reflective substrate 17. It should be noted that the number of the through holes is not limited in the embodiment of the present application, and the number of the through holes may be configured according to the requirement. For example, a plurality of through holes may be formed in a linear or array form, and then after the array of the plurality of led packages is completed, the plurality of led packages may be cut according to the required number and arrangement. In addition, the side surfaces of the through holes 12 may be inclined with respect to the upper surface 171 to form the column-shaped through holes 12 having a wide upper portion and a narrow lower portion, but the shape of the through holes 12 is merely an example, and the present application is not limited thereto. In some embodiments, there are no trenches 14 between partially adjacent vias 12. Since the light absorbing material is coated on the reflective substrate 17 and then the reflective substrate 17 is drilled, the light absorbing material 16 is prevented from flowing into the through hole 12 to affect the optical reflection performance.

Step S103: a grooving process is performed from the upper surface of the reflective substrate to form a groove.

As shown in fig. 6, a groove 14 may be formed on the upper surface 171 of the reflective substrate 17. Similar to the previous description, the trench 14 may include an annular trench 140 formed around the one or more through holes 12. In the led module, the number and arrangement of the corresponding through holes 12 can be selected in advance according to the number and arrangement of the leds to be arranged, and then the annular groove 140 is formed to surround the selected through holes 12. In some embodiments, the trench 14 further includes an inner trench 141, and the inner trench 141 may be disposed between two adjacent through holes 12 and connected to the annular trench 140.

Step S104: the light absorbing substance is filled into the trench. After the grooves 14 are filled with the light absorbing material 16, the reflective member 1 shown in fig. 2A and 2B is formed.

Referring to fig. 1, the method for manufacturing the light emitting diode package assembly proceeds to step S11: a circuit board is provided, and a reflecting member and the circuit board are combined. In this step, the reflecting member 1 and the circuit board 2 may be bonded by an adhesive such as epoxy resin.

The composition of the circuit board 2 is described below. Referring to fig. 7A and 7B, fig. 7A is a schematic diagram illustrating a combination of a reflective member and a circuit board according to an embodiment of the application, and fig. 7B is a cross-sectional view along a line VII-VII of fig. 7A. As shown in fig. 7A and 7B, the circuit board 2 has a circuit board upper surface 21. The circuit board 2 may include, for example, a solder mask layer 22, a first metal layer 23, an insulating layer 24, and a second metal layer 25. The solder mask layer 22 is disposed on the lower surface of the insulating layer 24 and has a plurality of solder mask openings 220. The first metal layer 23 is disposed on the solder mask layer 22 and includes a plurality of first electrodes 230 and a plurality of second electrodes 231 exposed by the plurality of solder mask openings 220. The insulating layer 24 is disposed on the first metal layer 23, and may be made of TCM or resin (e.g., BT resin), for example. The second metal layer 25 is disposed on the insulating layer 24 and includes a plurality of third electrodes 250 and a plurality of fourth electrodes 251 exposed on the upper surface 21 of the circuit board. The first electrode 230 may be electrically connected to the corresponding third electrode 250 through a plurality of through holes in the insulating layer 24, and the second electrode 231 may be electrically connected to the corresponding fourth electrode 251 through a plurality of through holes in the insulating layer 24. The first electrode 230 and the second electrode 231 may form contacts for electrically connecting the light emitting diode with the outside, such as positive and negative electrode pads.

It should be noted that the above embodiment only provides one implementation manner of the circuit board 2, wherein the led package assembly may include one or more leds 3 driven independently of each other, but the present application is not limited thereto, and some or all of the leds 3 included in the led package assembly may be driven independently, for example, some or all of the leds 3 may be connected in parallel or in series through the circuit board 2.

On the other hand, referring to fig. 7C, fig. 7C is another cross-sectional view along line VII-VII of fig. 7A. In another embodiment, as shown in fig. 7C, the circuit board 2 further includes an intermediate circuit layer 26 disposed between the first metal layer 23 and the second metal layer 25. The intermediate circuit layer 26 may have a plurality of resistor elements R embedded therein, and each resistor element R is electrically connected to at least one of the first electrodes 230 and the corresponding second electrode 250. Therefore, since the circuit board 2 incorporates the embedded resistive element R, the back-end assembly can eliminate the step of providing the resistive element.

Step S12: the light emitting diode is arranged on the circuit board corresponding to the through hole.

Referring to fig. 8A and 8B, fig. 8A is a schematic diagram of an led disposed on a circuit board according to an embodiment of the application, and fig. 8B is a cross-sectional view along a line VIII-VIII of fig. 8A. As shown in fig. 8A and 8B, the light emitting diode 3 may be first disposed at a predetermined position in the through hole 12 by means of adhesion. The light emitting diodes 3 with one or more colors can be obtained according to the requirement, and the light emitting diodes 3 are arranged in the preset through holes 12 according to the preset color configuration. Then, the led 3 is electrically connected to the second electrode 250 (corresponding to the positive electrode and the negative electrode) through the wire 32 by wire bonding, so as to initially form the basic structure of the led package.

Step S13: and filling the through holes with filling pieces respectively. For example, referring to fig. 8A and 8B, the filler 4 may be, for example, a light transmissive material mixed light scattering particle, or a light transmissive material mixed color dye for forming a predetermined light shape. The filler element 4 fills in one or more through holes 12. The upper surface 41 of the filling element 4 may be at the same level as the upper surface 10 of the reflecting member 1, however, the application is not limited thereto, and the upper surface 41 of the filling element 4 may be slightly recessed toward the bottom of the through hole 12. Besides being used for fixing the light emitting diode 3, the second electrode 250, the wire 32 and other elements, the filling member 4 can also be used as a sealing layer to prevent the elements from being aged or damaged due to direct contact with the outside.

Step S14: the lens is mounted on the reflecting member at a position corresponding to the through hole.

Referring to fig. 9A and 9B, fig. 9A is a schematic view of a lens mounted on a reflective member according to an embodiment of the application, and fig. 9B is a cross-sectional view along line IX-IX of fig. 9A. As shown in fig. 9A and 9B, the lens 5 has a circular or elliptical configuration, and the number and position arrangement thereof may be disposed on the reflecting member 1 corresponding to the number and position arrangement of the through holes 12. Further, the lens 5 may be disposed above the base 51, and the base 51 is directly connected with the upper surface 10 of the reflecting member 1. The base 51 may have the same material as the lens 5 and may be integrally formed with the lens 5 to form a lens assembly with the lens 5. As shown in fig. 9B, the base 51 may be, for example, a plate body, the side surface 510 of which is flush with the side surface 11 and the reflecting member 1. In some embodiments, the lens 5 and the base 51 may comprise a transparent material, such as epoxy, and be formed by injection molding. The lens 5 and the base 51 may be used to protect the led 3 and any electrical contacts between it and the circuit board 2, and may be formed into a predetermined light shape.

In other embodiments, the lens may include a light conversion material (e.g., phosphor), light scattering particles to mix the encapsulated light, and textures to enhance light extraction. The lens may comprise many different shapes and sizes. In some embodiments, the lens 5 may be dome-shaped, while in other embodiments, the lens 5 may be elliptical to match the shape of the through hole 12, and the lens 5 may also include a mixture of different shapes for enhancing the light emitting efficiency of the light emitting diode package. In some embodiments, the base materials of the circuit board 2, the reflective member 1, the light absorbing substance 16 and the lens 5 may be the same. However, the present application is not limited thereto. In other embodiments, the base materials of the circuit board 2, the reflective member 1, the light absorbing substance 16, the light transmitting material forming the filling 4, and the lens 5 may be the same. For example, when the circuit board 2, the reflecting member 1, the light absorbing material 16, the light transmitting material forming the filler 4, and the lens 5 are bonded to each other using a base material based on epoxy resin on the package, the waterproof property of the package can be further enhanced due to the bonding of the homogeneous materials, and the weather resistance and the humidity sensitivity level can be increased.

In addition, because the metal lead frame adopted by the PLCC packaging mode is not used, the time and the cost can be saved in the manufacturing process, and the entry of moisture caused by a gap between the metal lead frame and the plastic shell of the formed LED packaging piece can be avoided, so that the environmental tolerance of the LED packaging component in the outdoor display equipment is further improved. Furthermore, the LED package assembly of the present application is not formed by covering the package substrate of the step structure, but can avoid the process defect caused by covering the step difference of the step structure.

It should be noted that, in the present embodiment, the annular groove 140 is covered by the lens assembly formed by the lens 5 and the base 51. However, the present application is not limited thereto. Referring to fig. 9C, fig. 9C is a cross-sectional view of another embodiment. In the embodiment of fig. 9C, the lens assembly formed by the lens 5 and the base 51 does not cover the annular groove 140. Under this configuration, the light absorbing substance 16 is exposed from the side surface 11 and the upper surface 10 of the reflecting member 1 after a cutting operation described later.

Step S15: cutting along part or all of the grooves.

Referring to fig. 10A and 10B, fig. 10A is a first schematic view of a light emitting diode package assembly according to an embodiment of the application, and fig. 10B is a second schematic view of a light emitting diode package assembly according to an embodiment of the application. As shown in fig. 10A and 10B, the finished product after step S14 may be cut according to the positions of the grooves 14 (e.g., the annular grooves 140 and/or the inner grooves 141) to obtain various numbers and configurations of light emitting diode package assemblies 6. For example, as shown in fig. 10A, the light emitting diode package 6 is cut into single color and single (1 x 1), or the light emitting diode package 6 is cut into multiple color and multiple (1 x2,1x3,2x2, m x n, m, n are positive integers greater than or equal to 1) matrix forms. It should be noted that the arrangement of the led packages 6 is not limited to a single-row linear type, but may be a multi-row matrix type, so that the led packages 6 may be cut into single-color (1 x 1), three-color RGB (1 x 3) or four-color RGBY (2 x 2) according to the user's needs, for example.

Advantageous effects of the embodiments

In the light emitting diode package assembly and the manufacturing method thereof provided by the application, because the metal lead frame adopted by the PLCC package mode is not used, the time and the cost can be saved in the manufacturing process, and the entry of moisture of the formed light emitting diode package due to the gap between the metal lead frame and the plastic shell can be avoided, so that the environmental tolerance of the light emitting diode package assembly in the outdoor display equipment is further improved. Furthermore, the LED package assembly and the manufacturing method thereof of the application can avoid the process defect caused by covering the step difference of the step structure instead of covering the package substrate of the step structure.

The foregoing disclosure is only a preferred embodiment of the present application and is not intended to limit the scope of the claims, so that all equivalent technical changes made by the application of the present application and the accompanying drawings are included in the scope of the claims.

Claims (14)

1. A light emitting diode package assembly, the light emitting diode package assembly comprising:

A circuit board;

The reflecting member is arranged on the circuit board and is provided with one or more through holes;

One or more Light Emitting Diodes (LEDs) arranged on the circuit board and respectively corresponding to the one or more through holes; and

One or more lenses arranged on the reflecting member and corresponding to one or more through holes respectively;

An annular groove is arranged between the upper surface and the side surface of the reflecting member, and a light absorbing substance covers the upper surface of the reflecting member and fills the annular groove.

2. The led package of claim 1, further comprising one or more internal grooves disposed between two adjacent ones of the through holes and connected to the annular groove, the internal grooves being filled with the light absorbing substance.

3. The light emitting diode package of claim 1, wherein the annular groove has a depth between one third and two thirds of the thickness of the reflective member, and the annular groove has a width between one sixth and one half of the depth of the annular groove.

4. The light emitting diode package of claim 2, wherein the depth of the inner trench is between one sixth and two thirds of the thickness of the reflective member, and the width of the inner trench is between one third and one half of the depth of the inner trench.

5. The led package of claim 1, further comprising a light transmissive material filled in the one or more through holes.

6. The light emitting diode package assembly of claim 1, wherein the one or more lenses have a base with side surfaces that are flush with side surfaces of the reflective member and the side surfaces of the reflective member.

7. The light emitting diode package of claim 1, wherein the one or more light emitting diodes are driven independently of each other.

8. The light emitting diode package assembly of claim 1, wherein the circuit board has a resistor assembly embedded therein.

9. The light emitting diode package as recited in claim 1, wherein the circuit board, the reflective member, the light absorbing material, and the one or more lenses are the same base material.

10. The light emitting diode package as recited in claim 5, wherein the circuit board, the reflective member, the light absorbing material, the light transmissive material, and the one or more lenses are the same base material.

11. The light emitting diode package as recited in claim 1, wherein the plurality of through holes are arranged in a linear or matrix arrangement.

12. The light emitting diode package of claim 1, wherein the one or more lenses have a circular or elliptical configuration.

13. The light emitting diode package as recited in claim 1, wherein the one or more lenses and base form a lens assembly that does not cover the annular groove.

14. The led package of claim 1, wherein the light absorbing material and the corresponding via side wall form a continuous line at a cross-sectional view.