CN220896698U - PIN-TIA light receiving module for efficient signal transmission - Google Patents
PIN-TIA light receiving module for efficient signal transmission Download PDFInfo
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- CN220896698U CN220896698U CN202322674001.1U CN202322674001U CN220896698U CN 220896698 U CN220896698 U CN 220896698U CN 202322674001 U CN202322674001 U CN 202322674001U CN 220896698 U CN220896698 U CN 220896698U
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- 230000008054 signal transmission Effects 0.000 title claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 80
- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract 2
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 4
- 230000011664 signaling Effects 0.000 claims 6
- 238000007789 sealing Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 241001233242 Lontra Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The utility model provides a PIN-TIA light receiving module with high-efficiency signal transmission, which relates to the technical field of light receivers and comprises a transmission equipment main body and a connecting substrate, wherein a round radiating window is arranged in the transmission equipment main body near the center of the top surface, two sides of the round radiating window are provided with arc-shaped air guide channels in a penetrating way, the circumference of the bottom surface of the round radiating window is provided with inclined radiating ports, two sides of the transmission interface are provided with radiating cavities, the surfaces of the radiating cavities are provided with radiating screen boards, the inner wall surfaces of the radiating screen boards are provided with semiconductor refrigerating sheets, the round radiating window is provided with arc-shaped air guide channels on two sides for internal heat dissipation, so that heat generated by the internal connecting substrate can enter the round radiating window through the inclined radiating ports and then dissipate heat along the top surface and two sides of the round radiating window, the radiating cavity is matched with the semiconductor refrigerating sheets for the heat dissipation of the transmission interface, the whole device realizes an integral structure of internal heat dissipation and heat dissipation of the transmission interface, and has good heat dissipation effect under double pipes, and the problem of overhigh temperature of the transmission interface is effectively prevented, and the transmission efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of optical receivers, in particular to a PIN-TIA optical receiving module for efficient signal transmission.
Background
In the prior art, optical communication technology is widely applied to the communication field, in the optical fiber communication technology, an optical receiver is an important device, and in the prior art, a common optical receiver comprises: the PIN-TIA optical receiver and APD-TIA optical receiver, PIN-TIA optical receiver is used for converting weak optical signal into electric signal and amplifying signal with certain intensity and low noise, its working principle is: when the photosensitive surface of the PIN is irradiated by detection light, the p-n junction is in reverse bias, and photo-generated carriers drift under the action of an electric field to generate photocurrent in an external circuit; the photocurrent is amplified and output through the transimpedance amplifier, so that the function of converting the optical signal into an electric signal and then primarily amplifying the electric signal is realized.
The existing light receiver needs to radiate heat when generating heat during use, and the traditional linear radiating channel is adopted to radiate heat, meanwhile, sundries such as dust and the like can not be guided and cleaned easily, synchronous heat radiation can not be carried out aiming at the position of a transmission interface during heat radiation, and stable operation of the light receiver is not facilitated.
Disclosure of utility model
The utility model aims to solve the defects that a linear radiating channel cannot guide incoming dust and a transmission interface cannot radiate heat in the prior art, and provides a PIN-TIA light receiving module with efficient signal transmission.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a high-efficient signal transmission's PIN-TIA light receiving module, includes transmission equipment main part and connection base plate, the inside center position that is close to top surface department of transmission equipment main part is equipped with circular heat dissipation window, circular heat dissipation window both sides run through and are equipped with arc wind-guiding passageway, circular heat dissipation window bottom surface circumference is equipped with the inclined plane thermovent, transmission equipment openly is equipped with the transmission interface, transmission interface both sides are equipped with the heat dissipation cavity, the heat dissipation cavity surface is equipped with the heat dissipation otter board, heat dissipation otter board inner wall surface screw connection is equipped with the semiconductor refrigeration piece.
Preferably, a connecting substrate is arranged in the transmission equipment main body, the connecting substrate is positioned at the bottom of the heat dissipation cavity, and the arc-shaped air guide channel is positioned at the top of the connecting substrate.
Preferably, the inclined plane heat dissipation port penetrates through the surface space of the connecting substrate, and the side surface of the connecting substrate is electrically connected with the transmission interface.
Preferably, the inside top surface of circular heat dissipation window is the arc, and arc wind-guiding passageway bottom surface cambered surface offsets with circular heat dissipation window bottom surface, circular heat dissipation window top and transmission equipment main part top surface run through.
Preferably, the transmission interfaces are alternately distributed along the straight line direction of the front surface of the transmission equipment main body, and the intervals between adjacent transmission interfaces are the same.
Preferably, the outer edges of the main body of the transmission equipment are rounded, and the connection positions of the adjacent side surfaces of the transmission equipment are sealed.
Preferably, the inclined plane cooling hole inclination angle is 45 degrees, and the circumference size of the inclined plane cooling hole is larger than the circular range of the top of the circular cooling window.
Advantageous effects
According to the utility model, the round radiating window is arranged at the center position inside the transmission equipment main body, the arc-shaped air guide channels are arranged at the two sides of the transmission equipment main body to radiate heat inside, so that heat generated by the internal connecting substrate can enter the round radiating window through the inclined radiating opening and then radiate heat along the top surface and the two sides of the round radiating window, the radiating range is effectively increased, meanwhile, external dust can be effectively prevented from entering through the radiating opening arranged on the inclined surface and the arc-shaped radiating channels, and the radiating cavities arranged on the two sides of the transmission interface are matched with the semiconductor refrigerating sheets to radiate heat of the transmission interface.
Drawings
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a front cross-sectional view of the present utility model;
FIG. 3 is a side cross-sectional view of the present utility model;
Fig. 4 is a side view of the present utility model.
Legend description:
1. a transmission device main body; 2. a transmission interface; 3. a connection substrate; 4. a heat dissipation cavity; 5. a heat dissipation screen; 6. a semiconductor refrigeration sheet; 7. a circular heat radiation window; 8. an arc-shaped air guide channel; 9. and the inclined plane heat dissipation port.
Detailed Description
In order that the manner in which the above recited features, objects and advantages of the present utility model are obtained, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Based on the examples in the embodiments, those skilled in the art can obtain other examples without making any inventive effort, which fall within the scope of the utility model.
Specific embodiments of the present utility model are described below with reference to the accompanying drawings.
First embodiment:
Referring to fig. 1-4, a PIN-TIA light receiving module with efficient signal transmission, including transmission equipment main body 1 and connection base plate 3, transmission equipment main body 1 is inside to be close to top surface department central point put and is equipped with circular heat dissipation window 7, circular heat dissipation window 7 both sides run through and are equipped with circular air guide channel 8, circular heat dissipation window 7 is equipped with inclined plane thermovent 9 in the bottom surface circumference of transmission equipment main body 1, the inside central point put of transmission equipment main body 1 sets up circular heat dissipation window 7 and set up the heat dissipation of circular air guide channel 8 inside in both sides, make the heat that the connection base plate 3 of inside produced get into circular heat dissipation window 7 along top surface and both sides heat dissipation through inclined plane thermovent 9, effectively increase the radiating range, simultaneously can effectively prevent outside dust entering through the thermovent that the inclined plane set up and the curved heat dissipation channel, circular heat dissipation window 7 inside top surface is the arc, and circular heat dissipation window 7 bottom surface cambered surface offsets with circular heat dissipation window 7 bottom surface, circular heat dissipation window 7 top and transmission equipment main body 1 top surface run through, make the dust entering into inside circular heat dissipation window 7 from the inside earlier from the surface, because circular heat dissipation window 7 bottom surface's arc structure, make the dust entering from inside the surface slides along the surface and entering from inside of circular heat dissipation channel 1.
In order to increase the heat dissipation of the transmission interface 2 of the whole device, the transmission interface 2 is arranged on the front of the transmission equipment, the heat dissipation cavities 4 are arranged on two sides of the transmission interface 2, the heat dissipation screen plates 5 are arranged on the surfaces of the heat dissipation cavities 4, the semiconductor refrigerating sheets 6 are arranged on the inner wall surface of the heat dissipation screen plates 5 in a screwed connection mode, the heat dissipation cavities 4 are arranged on two sides of the transmission interface 2 to cooperate with the semiconductor refrigerating sheets 6 to conduct heat dissipation of the transmission interface 2, the whole device achieves the heat dissipation integrated structure of the inside of the transmission equipment main body 1 and the heat dissipation of the position of the transmission interface 2, the heat dissipation effect is good under double pipes, the problem that the temperature of the transmission interface 2 is too high is effectively prevented, so that the transmission efficiency is improved, one side of the semiconductor refrigerating sheets 6 is positioned in the heat dissipation cavity 4, the heated side of the semiconductor refrigerating sheets offsets against the surfaces of the heat dissipation screen plates 5, the inside of the heat dissipation cavities 4 is achieved, the temperature of the heat dissipation cavity 4 is reduced, the temperature is conducted, and the position of the transmission interface 2 is cooled.
Other limit structures of the whole device are that the inside connection substrate 3 that is equipped with of transmission equipment main part 1, connection substrate 3 is located the heat dissipation cavity 4 bottom, arc wind-guiding passageway 8 is located connection substrate 3 top, inclined plane thermovent 9 runs through with connection substrate 3 surface space, connection substrate 3 side and transmission interface 2 electric connection, transmission interface 2 is along transmission equipment main part 1 positive straight line direction alternate distribution, the interval is the same between the adjacent transmission interfaces 2, transmission equipment main part 1 outward flange department all adopts the fillet to handle, and transmission equipment adjacent side hookup location all adopts sealed processing, inclined plane thermovent 9 inclination is 45 degrees, and the circumference size that inclined plane thermovent 9 is located is greater than the circular scope at circular heat dissipation window 7 top, set up the thermovent of slope, for traditional vertical thermovent structure, when leading the dust, can carry out partial blocking to the dust, prevent that the dust from directly getting into connection substrate 3 surface along the thermovent, play dirt effect.
Specific embodiment II:
Referring to fig. 1 to 4, for the small structure of the transmission interface 2 of the transmission device main body 1 of the present application, the semiconductor refrigeration piece 6 is selected with a smaller structure and a smaller power model, the refrigeration effect is only represented by temperature reduction, the temperature reduction range is within the temperature range which does not reduce the transmission efficiency of the transmission interface 2, when the semiconductor refrigeration piece 6 is used, the external connection is provided with a power supply source, and the top surface of the transmission device can be provided with a battery or a power supply for supplying power to the semiconductor refrigeration piece 6, so that the normal operation of the semiconductor refrigeration piece 6 and the heat dissipation and the temperature reduction of the transmission interface 2 are ensured.
Third embodiment:
Referring to fig. 1 to 4, the inclination direction of the inclined plane heat dissipation port 9 may be selected according to the actual use situation, as shown in fig. 2, the inclined plane inclination port may be inclined to the right side, the inclined plane inclination port may be inclined to the left side according to the actual use situation, while the overall inclination structure of the inclined plane inclination port is ensured, the inside may be in a non-linear structure, such as a structure with a continuously bent inner wall structure, etc., and the inclined plane inclination port may be selected according to the actual use.
Third embodiment:
Referring to fig. 1 to 4, the whole device improves the transmission efficiency of signals mainly by reducing the temperature, and the connection circuit and the connection mode of the connection substrate 3 and the transmission interface 2 can be selected and set according to the actual use situation and the prior art.
To sum up:
1. Adopt transmission equipment main part 1 inside central point to put and set up circular heat dissipation window 7 and set up arc wind-guiding passageway 8 in both sides and carry out inside heat dissipation, make the heat accessible inclined plane thermovent 9 that inside connection base plate 3 produced get into circular heat dissipation window 7 back along top surface and both sides heat dissipation, effectively increase the radiating range, simultaneously through inclined plane setting's thermovent and arc heat dissipation passageway can effectively prevent outside dust entering.
2. Adopt transmission interface 2 both sides to set up the heat dissipation cavity 4 and cooperate semiconductor refrigeration piece 6 to carry out the heat dissipation of transmission interface 2, whole device realizes transmission equipment main part 1 inside heat dissipation and transmission interface 2 position heat dissipation integrated structure, and double-pipe is well down, and the radiating effect is good, effectively prevents the too high problem of transmission interface 2 temperature to improve transmission efficiency.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a PIN-TIA optical receiving module of high-efficient signal transmission, includes transmission equipment main part (1) and connection base plate (3), its characterized in that: the transmission equipment is characterized in that a circular radiating window (7) is arranged at the central position of the transmission equipment body (1), arc-shaped air guide channels (8) are formed in two sides of the circular radiating window (7) in a penetrating mode, a connecting substrate (3) is arranged in the transmission equipment body (1), the arc-shaped air guide channels (8) are located at the top of the connecting substrate (3), inclined radiating ports (9) are formed in the circumference of the bottom surface of the circular radiating window (7), a transmission interface (2) is arranged on the front face of the transmission equipment, radiating cavities (4) are formed in two sides of the transmission interface (2), radiating screen plates (5) are arranged on the surfaces of the radiating cavities (4), and semiconductor refrigerating sheets (6) are arranged on the surfaces of the inner walls of the radiating screen plates (5) in a screwed mode.
2. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the connecting substrate (3) is positioned at the bottom of the heat dissipation cavity (4).
3. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the inclined plane cooling port (9) penetrates through the surface space of the connecting substrate (3), and the side surface of the connecting substrate (3) is electrically connected with the transmission interface (2).
4. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the inside top surface of circular heat dissipation window (7) is the arc, and arc wind-guiding passageway (8) bottom surface cambered surface offsets with circular heat dissipation window (7) bottom surface, circular heat dissipation window (7) top and transmission equipment main part (1) top surface run through.
5. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the transmission interfaces (2) are alternately distributed along the straight line direction of the front face of the transmission equipment main body (1), and the distances between the adjacent transmission interfaces (2) are the same.
6. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the outer edges of the transmission equipment main body (1) are subjected to round corner treatment, and the connection positions of the adjacent side surfaces of the transmission equipment are subjected to sealing treatment.
7. The PIN-TIA optical receiving module for efficient signaling of claim 1, wherein: the inclination angle of the inclined radiating opening (9) is 45 degrees, and the circumference size of the inclined radiating opening (9) is larger than the circular range of the top of the circular radiating window (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322674001.1U CN220896698U (en) | 2023-09-28 | 2023-09-28 | PIN-TIA light receiving module for efficient signal transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322674001.1U CN220896698U (en) | 2023-09-28 | 2023-09-28 | PIN-TIA light receiving module for efficient signal transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220896698U true CN220896698U (en) | 2024-05-03 |
Family
ID=90871398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322674001.1U Active CN220896698U (en) | 2023-09-28 | 2023-09-28 | PIN-TIA light receiving module for efficient signal transmission |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220896698U (en) |
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2023
- 2023-09-28 CN CN202322674001.1U patent/CN220896698U/en active Active
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