CN220895129U - LED display screen - Google Patents

Abstract

The present disclosure provides an LED display screen, comprising: the COB module comprises a substrate, pixel points and a packaging layer, wherein the pixel points comprise a plurality of pixel points which are arranged on the upper surface of the substrate and are arrayed to form a pixel group, the packaging layer is arranged on the upper surface of the substrate to package the pixel group on the substrate, the substrate and the packaging layer form a trapezoid body with a big top and a small bottom, the pixel points on the edge of the pixel group are spaced from the edge of the trapezoid body adjacent to the pixel points, the COB module comprises a plurality of COB modules, the COB modules are spliced to form an LED display screen, and a temperature seam is formed between the side walls of the trapezoid bodies of two adjacent COB modules. According to the temperature sensor, the pixel points on the edges of the pixel groups are spaced from the edges of the adjacent trapezium bodies, and the temperature gaps are formed between the side walls of the trapezium bodies of the two adjacent COB modules, so that the problem that the pixel points on the edges of the COB modules are easy to be knocked is solved.

Description

LED display screen

Technical Field

The disclosure relates to the technical field of display screens, in particular to an LED display screen.

Background

COB (chip on Board) products have been widely used in LED display screen production due to the advantages of high reliability, surface light source, high protection performance, excellent display effect and the like.

The prior art provides a display panel (CN 213935483U) formed by splicing COB modules, which comprises a display panel formed by splicing a plurality of COB modules, wherein each COB module comprises a COB substrate, LED chips arranged on the COB substrate and used for emitting light and packaging glue used for packaging, each pixel point on the COB substrate is arranged in a straight line, each pixel point comprises R, G, B LED chips with three colors, each three pixel points are used as a whole to form an arrangement pixel group, and the arrangement mode of the three pixel points of each arrangement pixel group is R/G/B, G/B/R, B/R/G.

With the development of industry technology, the pixel pitch of the COB module is smaller and smaller, the chip arrangement is denser and denser, and the distance between the pixel at the edge of the COB module and the edge of the COB module is smaller and smaller. When the COB module is spliced and disassembled, the edge of the COB module is easy to collide, so that pixel points in the area are damaged and fail. In addition, after the LED display screen is lightened for a period of time, the COB module is heated, and when the COB module is disassembled, pixel points at the edge are also easy to be knocked out. Based on this, how to avoid breaking down the pixel points at the edge of the COB module is a problem that needs to be considered by those skilled in the art.

Disclosure of utility model

The technical problem to be solved by the present disclosure is that the pixel points at the edge of the COB module of the LED display screen are more easily damaged.

To solve the above technical problem, an embodiment of the present disclosure provides an LED display screen, including: the COB module comprises a substrate, pixel points and a packaging layer, wherein the pixel points comprise a plurality of pixel points which are arranged on the upper surface of the substrate and are arrayed to form a pixel group, the packaging layer is arranged on the upper surface of the substrate to package the pixel group on the substrate, the substrate and the packaging layer form a trapezoid body with a big top and a small bottom, the pixel points on the edge of the pixel group are spaced from the edge of the trapezoid body adjacent to the pixel points, the COB module comprises a plurality of COB modules, the COB modules are spliced to form an LED display screen, and a temperature seam is formed between the side walls of the trapezoid bodies of two adjacent COB modules.

In some embodiments, the pixel points comprise a chipset.

In some embodiments, the chipset includes a red LED chip, a green LED chip, and a blue LED chip.

In some embodiments, an electrical component is also included, the electrical component being disposed on a lower surface of the substrate for powering the chipset.

In some embodiments, the chipset further comprises electrodes that are connected to the electrical components through the substrate.

In some embodiments, the encapsulation layer comprises multiple layers.

In some embodiments, the encapsulation layer is made of epoxy.

In some embodiments, the substrate comprises an FR-4 epoxy board.

In some embodiments, the connector is disposed on a lower surface of the substrate for mounting the COB module.

In some embodiments, the connector includes a plurality of connectors.

According to the technical scheme, the LED display screen is provided, the pixel points on the edges of the pixel groups are spaced from the edges of the adjacent trapezium bodies, and the temperature gaps are formed between the side walls of the trapezium bodies of the two adjacent COB modules, so that the problem that the pixel points on the edges of the COB modules are easy to knock is solved.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

Fig. 1 is a schematic diagram of an LED display screen disclosed in an embodiment of the present disclosure.

Reference numerals illustrate:

1. A COB module; 2. a substrate; 3. a pixel point; 4. an encapsulation layer; 5. a trapezoid body; 6. a temperature seam; 7. an electrical component; 8. and a connecting piece.

Detailed Description

Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.

The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

Furthermore, the use of the terms first, second, and the like in this disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.

It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.

All terms used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

As mentioned in the above background art, as the pixel pitch of the COB module is smaller and the COB module is thermally expanded, the pixels at the edge of the COB module are easily broken down due to collision during the assembly and disassembly of the LED display. Based on this, the inventor provides an LED display screen in one or more embodiments, which avoids the problem that the pixel points on the edge of the COB module are easy to be knocked down by a certain distance between the pixel points on the edge of the pixel group and the adjacent edge of the trapezoid, and by forming a temperature gap between the sidewalls of the trapezoids of two adjacent COB modules. Which is believed to solve one or more of the problems of the prior art.

Aiming at the technical problem, the disclosure provides an LED display screen, as shown in fig. 1, comprising: the COB module 1, the COB module 1 includes base plate 2, pixel 3 and encapsulation layer 4, the pixel 3 is including a plurality of, a plurality of pixel 3 set up on the upper surface of base plate 2 and array arrangement in order to form the pixel group, encapsulation layer 4 sets up on the upper surface of base plate 2 in order to encapsulate the pixel group on base plate 2, base plate 2 and encapsulation layer 4 form big-end-up's trapezoid body 5, the pixel 3 that is located on the pixel group edge is spaced apart with the edge of its adjacent trapezoid body 5, wherein, COB module 1 is including a plurality of, a plurality of COB module 1 splice in order to form the LED display screen, form temperature seam 6 between the trapezoid body 5 lateral wall of two adjacent COB module 1.

Specifically, the distance d=0.5p-0.012 (μm) between the pixel points 3 on the edge of the pixel group and the edge of the adjacent trapezoid 5, where P is the center distance between the adjacent pixel points 3, so as to ensure that the pixel points 3 on the edge of the pixel group and the edge of the trapezoid 5 have a certain distance, avoid the problem that the pixel points 3 on the edge are easy to be knocked and simultaneously avoid forming a visual black screen seam between the adjacent COB modules 1 due to overlarge distance; the side wall of the trapezoid body 5 can be set to be at an angle of 15 degrees with the vertical direction of the surface of the substrate 2, namely, the temperature seam 6 forms an angle of 30 degrees at the junction of the packaging layer 4, and the problem that the pixel point 3 at the edge is easy to damage due to thermal expansion of the substrate 2 is avoided through the temperature seam 6.

Compared with the prior art, the LED display screen provided by the application has the advantages that the pixel points 3 on the edge of the pixel group have a certain distance from the adjacent edge of the trapezoid body 5, and the temperature gaps 6 are formed between the side walls of the trapezoid bodies 5 of the two adjacent COB modules 1, so that the problem that the pixel points 3 on the edge of the COB modules 1 are easy to be knocked is avoided.

In some embodiments, pixel 3 comprises a chipset. The image display of the pixel 3 is realized by the chipset.

In some embodiments, the chipset includes a red LED chip, a green LED chip, and a blue LED chip. The color display of the pixel point 3 is realized by the red LED chip, the green LED chip and the blue LED chip.

In some embodiments, as shown in fig. 1, electrical components 7 are provided on the lower surface of the substrate 2 for powering the chipset. The power supply to the chipset is ensured by the electrical element 7.

In some embodiments, the chipset further comprises electrodes, which are connected to the electrical element 7 through the substrate 2. Specifically, the electrodes are mounted on the bottom of the chipset and comprise positive and negative electrodes, through which the connection of the chipset to the electrical element 7 is achieved, and the energizing of the chipset is achieved.

In some embodiments, encapsulation layer 4 comprises multiple layers. Specifically, the packaging layer 4 is formed by pouring organic materials, and the multi-layer packaging layer 4 is formed by pouring for many times in the pouring process, so that the strength required by packaging is ensured, the uniformity of the organic materials of the packaging layer 4 is ensured, and the quality of the LED display screen is ensured.

In some embodiments, the encapsulation layer 4 is made of epoxy. The epoxy resin has the advantages of high strength, good wear resistance and strong corrosion resistance, thereby ensuring the quality and the service life of the LED display screen.

In some embodiments, the substrate 2 comprises an FR-4 epoxy board. The FR-4 epoxy resin board has the advantages of high temperature resistance, good insulation and moisture resistance and the like, and the quality and the service life of the LED display screen are ensured.

In some embodiments, as shown in fig. 1, the COB module 1 further includes a connector 8, and the connector 8 is disposed on the lower surface of the substrate 2. Specifically, the connecting piece 8 can take the form of a connecting plate or a bolt hole, and the installation of the COB module 1 is facilitated by arranging the connecting piece 8.

In some embodiments, as shown in FIG. 1, the connector 8 includes a plurality of connectors. The safety strength of the COB module 1 of the LED display screen is guaranteed through the connecting pieces 8.

In summary, compared with the prior art, the present disclosure provides an LED display screen, the pixel points 3 on the edges of the pixel groups have a certain distance from the edges of the adjacent trapezium bodies 5, and the temperature slots 6 are formed between the side walls of the trapezium bodies 5 of the two adjacent COB modules 1, so that the problem that the pixel points 3 on the edges of the COB modules 1 are easy to be knocked down is avoided.

Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.

Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.

Claims (10)

1. An LED display screen, comprising:

The COB module (1), the COB module (1) comprises a substrate (2), pixel points (3) and a packaging layer (4), the pixel points (3) comprise a plurality of pixel points (3) which are arranged on the upper surface of the substrate (2) and are arrayed to form a pixel group, the packaging layer (4) is arranged on the upper surface of the substrate (2) so as to package the pixel group on the substrate (2), the substrate (2) and the packaging layer (4) form a trapezoid body (5) with a size up and down, the pixel points (3) positioned on the edge of the pixel group are spaced from the edge of the trapezoid body (5) adjacent to the pixel points,

The COB modules (1) are spliced to form an LED display screen, and a temperature seam (6) is formed between the side walls of the trapezoid bodies (5) of two adjacent COB modules (1).

2. The LED display screen according to claim 1, characterized in that the pixel (3) comprises a chipset.

3. The LED display screen of claim 2, wherein the chipset comprises a red LED chip, a green LED chip, and a blue LED chip.

4. A LED display screen according to claim 3, further comprising an electrical element (7), said electrical element (7) being provided on a lower surface of the substrate (2) for powering the chipset.

5. The LED display screen according to claim 4, characterized in that the chipset further comprises electrodes, which are connected to the electrical element (7) through the substrate (2).

6. LED display screen according to claim 1, characterized in that the encapsulation layer (4) comprises a plurality of layers.

7. The LED display screen according to claim 6, characterized in that the encapsulation layer (4) is made of epoxy resin.

8. The LED display screen according to claim 1, characterized in that the substrate (2) comprises an FR-4 epoxy board.

9. The LED display screen according to claim 1, further comprising a connector (8), the connector (8) being provided on a lower surface of the substrate (2) for mounting the COB module (1).

10. The LED display screen according to claim 9, characterized in that the connection (8) comprises a plurality.