CN220894620U - Optical device - Google Patents

Abstract

An optical device includes an optical component, a substrate, and a bonding component, the substrate being bonded to the optical component along a first direction. The assembly is then bonded to the optical assembly and the substrate.

Description

Optical device

Technical Field

The present utility model relates to an optical device, and more particularly, to an optical device for an in-vehicle system.

Background

In recent years, optical devices having an image pickup function are widely used in various fields, such as in-vehicle systems, etc., and the optical devices mounted on the in-vehicle systems must be able to withstand various severe environments, such as abrupt changes in weather, vibration shocks during traveling, etc., and particularly, the portions that are to be adhered between components in the optical devices are susceptible to the above-mentioned conditions, which may cause the detachment of some of the components and the overall damage of the optical devices.

Disclosure of utility model

Accordingly, in the embodiment of the present utility model, an optical device having a structure that is not easily detached or damaged even in a severe environment such as high temperature and high humidity, abrupt temperature change, or vibration impact is provided.

An embodiment of the present disclosure provides an optical apparatus including an optical component, a substrate, and a bonding component, the substrate being bonded to the optical component along a first direction. The assembly is then bonded to the optical assembly and the substrate.

According to some embodiments of the present disclosure, the substrate includes a plurality of through holes penetrating the substrate along a first direction, and then a portion of the component is disposed within the plurality of through holes.

According to some embodiments of the present disclosure, a substrate has a plurality of laminates stacked along a first direction.

According to some embodiments of the present disclosure, the number of the plurality of laminates is four to six.

According to some embodiments of the present disclosure, a plurality of vias respectively penetrate through a plurality of buildup layers.

According to some embodiments of the disclosure, a roughness of an inner face of any of the plurality of through holes is greater than a roughness of a first surface of the substrate, the first surface facing the optical component.

According to some embodiments of the present disclosure, a unit contact area of the bonding element with any of the through holes is larger than a unit contact area of the bonding element with the first surface.

According to some embodiments of the disclosure, the plurality of layers includes a first layer and a second layer, the first layer being adjacent to the second layer, wherein a roughness at an interface of the first layer and the second layer in the via is greater than a roughness at a non-interface in the via.

According to some embodiments of the present disclosure, a unit contact area at the following device and interface is larger than a unit contact area at the following device and non-interface.

According to some embodiments of the present disclosure, the optical component, the following component, and the via at least partially overlap when viewed along the first direction.

Drawings

The present disclosure will be apparent from the detailed description provided hereinafter in conjunction with the drawings. It is emphasized that, in accordance with the practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion.

Fig. 1 is a schematic perspective view of an optical device according to an embodiment of the disclosure.

Fig. 2 is an exploded view of an optical device according to an embodiment of the present disclosure.

Fig. 3 is a cross-sectional view of the optical device taken along line A-A in fig. 1.

Fig. 4 is a cross-sectional view of the optical device taken along line B-B in fig. 1.

Fig. 5 is an enlarged schematic cross-sectional view of a portion of the structure of an optical device according to an embodiment of the present disclosure.

Description of the reference numerals

1 Optical apparatus

100 Optical assembly

110 Optical component

120 Bearing seat

121 Bottom surface

130 Photosensitive assembly

200 Substrate

201 First build-up layer

202 Second laminate

203 Third lamination

204 Fourth lamination

210 Solder mask layer

300, Adhesive assembly

D1 first direction

G: gap

H is through hole

S1 first surface

Detailed Description

The following embodiments are described in detail with reference to the accompanying drawings, in order to make the objects, features, and advantages of the present disclosure more comprehensible. The arrangement of the components in the embodiments is illustrative and not intended to limit the disclosure. And repetition of reference numerals in the embodiments is for simplicity of illustration and does not in itself dictate a relationship between the various embodiments. The directional terms mentioned in the following embodiments are, for example: upper, lower, left, right, front or rear, etc., are merely references to the directions of the attached drawings. Thus, directional terminology is used for purposes of illustration and is not intended to be limiting of the disclosure.

It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or one or more elements can be present between the two elements. Moreover, the use of ordinal numbers such as first, second, and third does not necessarily imply a level of sequential perception, but rather may merely distinguish between multiple instances of an action or structure.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

First, please refer to fig. 1 to 4. Fig. 1 is a schematic perspective view of an optical apparatus 1 according to an embodiment of the present disclosure. Fig. 2 is an exploded view of an optical device 1 according to an embodiment of the present disclosure. Fig. 3 is a cross-sectional view of the optical device 1 taken along line A-A in fig. 1. Fig. 4 is a cross-sectional view of the optical device 1 taken along line B-B in fig. 1. The optical apparatus 1 comprises an optical component 100, a substrate 200, and an adhesive component 300.

In the present embodiment, the optical apparatus 1 may be applied to an in-vehicle system, and in more detail, the optical apparatus 1 may be an in-vehicle image pickup apparatus, and then the assembly 300, which is followed by the optical assembly 100 and the substrate 200, and the substrate 200 may be disposed and connected to an external electronic apparatus. The optical device 100 receives an external light beam in a predetermined range and converts the external light beam into an electrical signal, and transmits the electrical signal to an external electronic device through the substrate 200, so that an image of a vehicle during traveling can be obtained, for example, but is not limited thereto.

The optical assembly 100 includes an optical assembly 110, a carrier 120, and a photosensitive assembly 130. The optical component 110 may be an imaging lens, and the carrier 120 carries the optical component. The optical component 110 and the carrier 120 may be connected by screws or adhesives, but not limited thereto.

The step of connecting the optical component 110 to the carrier 120 is one of the steps of the active focusing (ACTIVE ALIGNMENT) process, if the optical component 110 is connected to the carrier 120 by a screw or an adhesive, the step of locking the screw or baking the adhesive is necessary to follow, so in the present embodiment, the optical component 110 and the carrier 120 are integrally formed, thereby saving the time of locking the screw or baking the adhesive and saving the cost of the workpieces.

The photosensitive element 130 is disposed on the substrate 200, receives the light passing through the optical element 110, and converts the light into an electrical signal. For example, the photosensitive element 130 may include a charge-coupled device (CCD) and/or a cmos active pixel sensor (complementary metal-oxide-semiconductor (CMOS) active pixel sensor), but is not limited thereto.

The substrate 200 is then connected to the optical component 100 along a first direction D1, and the substrate 200 has a plate-like structure with a first surface S1, and the first surface S1 extends perpendicular to the first direction D1 and faces the optical component 100. In some embodiments, the substrate 200 may be a printed circuit board (Printed circuit board, PCB) having a plurality of laminates and a solder mask layer 210, wherein the plurality of laminates are laminated along the first direction D1, and the solder mask layer 210 covers the plurality of base layers to achieve the insulation and protection effects. In more detail, the solder resist layer 210 may be the first surface S1 of the substrate.

The substrate 200 includes a plurality of through holes H penetrating the substrate 200 along the first direction D1. The through hole H may be formed through the plurality of stacked layers and the solder resist layer 210 by electric drilling or laser processing. Since these vias H are not used for electrical connection, copper plating is not necessary, but not limited thereto, and in some embodiments, some or all of the vias H may be plated copper vias H.

A plurality of through holes H are provided around the photosensitive member 130, as in the example shown in fig. 2 to 4, eight through holes H are provided around the photosensitive member 130, but the number of through holes H is not limited thereto and may be increased or decreased as required.

The adhesive assembly 300 may be a tacky glue such as a thermosetting adhesive, a UV light/heat dual cure adhesive, or the like. As shown in fig. 2 to 4, the assembly 300 is then distributed around the photosensitive assembly 130 in such a way that a portion thereof is disposed in the plurality of through holes H and corresponds to the shape of a bottom 121 of the carrier 120. The carrier 120 of the optical assembly 100, the following assembly 300, and the through hole H at least partially overlap when viewed along the first direction D1.

In the present embodiment, since the plurality of through holes H are formed on the substrate 200 by electric drilling or laser processing, and the substrate 200 is composed of a plurality of layers, a roughness of an inner surface of the through holes H formed in the above manner is larger than a roughness of the first surface S1 (solder resist layer) of the substrate 200 with respect to the solder resist layer 210 having a smooth surface formed by the printing process.

Therefore, a unit contact area of the bonding element 300 in any through hole H is larger than a unit contact area of the first surface S1, in detail, since the roughness of the inner surface of the through hole H is larger than the surface roughness of the first surface S1 (the solder resist layer 210), the contact area of the bonding element 300 and the inner surface of the through hole H is larger than the contact area of the bonding element 300 and the first surface S1 of the substrate 200 in the same unit.

In addition, referring to fig. 5, fig. 5 is an enlarged schematic cross-sectional view of a part of the structure of the optical device 1 according to an embodiment of the present disclosure, in the example shown in fig. 5, the plurality of layers are four layers, located between the upper and lower solder masks 210, including a first layer 201, a second layer 202, a third layer 203, and a fourth layer 204, where the first layer 201 is stacked adjacent to the second layer 202, the second layer 202 is stacked adjacent to the third layer 203, the third layer 203 is stacked adjacent to the fourth layer 204, and three interfaces are provided between the four layers.

Since the structural strength of the interface is weaker than that of the non-interface, it is more susceptible to damage when processed by an electric drill or laser. That is, on the inner face of the through hole H, the roughness at the interface (i.e., the unit area including the interface) is larger than that at the non-interface (i.e., the unit area not including the interface).

Thus, the unit contact area of the component 300 at the interface within the through hole H is then larger than the unit contact area at the non-interface within the through hole H, in more detail, because the roughness at the interface of the inner face of the through hole H is larger than the roughness at the non-interface, the contact area at the interface of the component 300 and the through hole H is then larger than the contact area at the non-interface within the through hole H at the same unit.

For example, as shown in fig. 5, a larger gap G is generated at the interface between the first and second laminates 201 and 202 (or between the second and third laminates 202 and 203, or between the third and fourth laminates 203 and 204) in the through hole H due to processing, so that the roughness is greater than that at the non-interface in the through hole H, and then the component 300 can go deep into the gap G at the interface, as if the anchor is hooked in the gap G perpendicular to the first direction D1, so that the substrate 200 and the next component 300 are more tightly adhered.

It should be noted that the enlarged cross-sectional view of fig. 5 is only for illustrating that the roughness at the interface is large, and is not for defining the shape, size, etc. of the gap G generated at the interface. On the other hand, although not shown in fig. 5, a larger gap G may be provided between the solder resist layer 210 and the first laminate 201, or between the fourth laminate 204 and the solder resist layer 210.

As is clear from the above, the more the number of layers of the substrate 200 is, the more the interface is in the through hole H, and the substrate 200 and the bonding unit 300 can be bonded more closely, but considering that various kinds of electronic devices currently in use are thinned, in this embodiment, the number of layers is preferably four to six, so that the optical device 1 can be maintained to be thinned and have a firm structure.

Furthermore, the present embodiment increases the bonding area through the through hole H, i.e. the bonding area along the first direction D1, and the conventional optical device generally increases the bonding area through increasing the bottom surface area of the carrier, i.e. perpendicular to the first direction D1. Since the area of the bottom surface of the carrying seat is increased, the volume of the whole optical assembly is also increased, and therefore, the optical device 1 of the present embodiment can be miniaturized and has a firm structure.

In a comparison test of the optical apparatus 1 of the present embodiment and the conventional optical apparatus, in the optical apparatus 1, eight through holes H are disposed on the substrate 200 around the photosensitive element 130 as shown in fig. 2 and 3, then the element 300 is attached to the first surface S1 of the substrate 200 and the bottom surface 121 of the carrier 120, and then a portion of the element 300 is attached to the eight through holes H. In contrast, the conventional optical apparatus is not provided with a through hole, and then the component is only bonded to the surface of the substrate and the bottom surface of the carrier.

As a result of the test, the adhesion area of the present example in which eight through holes H were provided was 72.42mm ², the adhesion area of the comparative example in which no through holes were provided was 62.37mm ², and the adhesion area of the present example was larger than that of the comparative example, and in percentage, the present example increased the adhesion area by 14% compared to the comparative example.

In the conventional optical device, when the substrate and the optical device are bonded together, the substrate and the optical device are not well bonded together due to the smooth surface of the solder mask, which may easily lead to detachment of the optical device, even though the optical device may be reinforced by manually repairing the adhesive, the adhesive may overflow the substrate and be scrapped because the width of the adhesive is difficult to be controlled to be uniform. On the other hand, after the adhesive is manually replenished, the adhesive needs to be baked again at a high temperature for a long time to fix the adhesive.

In contrast, in the optical apparatus 1 of the present embodiment, by using the substrate 200 composed of a plurality of laminates and disposing a plurality of through holes H on the substrate 200, a portion of the adhesive element 300 is disposed on the through holes H, so that the adhesion of the adhesive element 300 to the optical element 100 and the substrate 200 can be increased, and the optical element 100 is prevented from falling off, and no manual adhesive is required, thereby achieving the effects of reducing the manufacturing cost and increasing the productivity.

In summary, the present disclosure provides an optical apparatus including an optical component, a substrate, and a bonding component, wherein the substrate is bonded to the optical component along a first direction. The assembly is then bonded to the optical assembly and the substrate. With the optical device of the present embodiment, the optical device is not easily detached or damaged even in severe environments such as high temperature and high humidity, abrupt temperature change, vibration impact, and the like.

Although embodiments and advantages of the present utility model have been disclosed, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, unless otherwise specified, but rather should be construed broadly within its meaning and range of equivalents, and therefore should be understood by those skilled in the art to be able to more or less perform the function of the utility model than the function of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Accordingly, the present utility model is intended to cover such processes, machines, manufacture, compositions of matter, means, methods, or steps. In addition, each claim constitutes a separate embodiment, and the scope of the utility model also includes combinations of the individual claims and embodiments.

Claims (9)

1. An optical device, comprising:

An optical component;

a substrate, which is connected with the optical component along a first direction; and

A bonding element bonding the optical element and the substrate;

The substrate comprises a plurality of through holes, the through holes penetrate through the substrate along the first direction, and a part of the bonding assembly is arranged in the through holes.

2. The optical device of claim 1, wherein the substrate has a plurality of laminates stacked along the first direction.

3. The optical device of claim 2, wherein the plurality of laminates is four to six in number.

4. The optical device of claim 2, wherein the plurality of through holes extend through the plurality of laminates, respectively.

5. The optical device of claim 2, wherein a roughness of an inner face of any of the plurality of through holes is greater than a roughness of a first surface of the substrate, the first surface facing the optical component.

6. The optical device of claim 5, wherein a unit contact area of the bonding element with the inside of any one of the through holes is greater than a unit contact area of the bonding element with the first surface.

7. The optical device of claim 2, wherein the plurality of laminates includes a first laminate and a second laminate, the first laminate being adjacent to the second laminate, wherein a roughness at an interface of the first laminate and the second laminate within the via is greater than a roughness at a non-interface within the via.

8. The optical device of claim 7, wherein a unit contact area of the bonding element with the interface is greater than a unit contact area of the bonding element with the non-interface.

9. The optical device of claim 2, wherein the optical component, the bonding component, and the through hole at least partially overlap when viewed along the first direction.