CN220894451U - Circuit board semiconductor tin soldering welding spot detection equipment - Google Patents
Circuit board semiconductor tin soldering welding spot detection equipment Download PDFInfo
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- CN220894451U CN220894451U CN202321882398.7U CN202321882398U CN220894451U CN 220894451 U CN220894451 U CN 220894451U CN 202321882398 U CN202321882398 U CN 202321882398U CN 220894451 U CN220894451 U CN 220894451U
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- 238000001514 detection method Methods 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000005476 soldering Methods 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 title abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 3
- 239000000523 sample Substances 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 230000002457 bidirectional effect Effects 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of semiconductor soldering spot detection, in particular to circuit board semiconductor soldering spot detection equipment, which comprises a transmission platform, a mounting rack, a position sensor, control equipment, a detection probe and an adjusting component, wherein the transmission platform is arranged on the mounting rack; the adjusting component comprises a fixed frame, a movable frame, side plates, a movable member, a connecting member and a push-out member; the fixing frame is fixedly connected with the mounting frame, is located on one side of the mounting frame, is connected with the fixing frame in a sliding mode, is located on one side of the fixing frame, is fixedly connected with the side plate, is located on one side of the moving frame, is connected with the fixing frame, is connected with the detection probe, is connected with the mounting frame, achieves automatic transmission and positioning of welded circuit boards through the arranged components, and is convenient to detect welding spots of a large number of circuit boards, and the detection efficiency is high in practical operation.
Description
Technical Field
The utility model relates to the technical field of semiconductor soldering spot detection, in particular to circuit board semiconductor soldering spot detection equipment.
Background
Soldering is a welding means for circuit board semiconductors, and is mainly a welding method for penetrating and filling gaps at joints of metal pieces after heating and melting by utilizing low-melting metal solder, and is currently used for replacing manual work, generally, automatic welding is directly carried out by using machinery, then welding spot detection is carried out on the circuit board after the welding is finished, but the traditional welding spot detection is carried out manually by means of manual detection, so that the whole detection is time-consuming, labor-consuming and low in efficiency.
The prior patent CN111007383A discloses a circuit board semiconductor soldering welding spot detection device, which judges the actual welding condition of the welding spot according to the electrifying condition of an electric wire arranged inside by two connecting blocks which are arranged to be in contact with the welding spot, thereby achieving the purpose of automatic detection of the welding spot.
However, by adopting the above mode, manual alignment and matching are needed for the welding points and the two connecting blocks every time when the detection is carried out, and when the detection is applied to large-batch production of factories, manual placement and alignment are needed for arrangement staff, so that the using effect of the whole equipment in the actual processing process is not ideal.
Disclosure of utility model
The utility model aims to provide the device for detecting the soldering points of the semiconductor of the circuit board, which can automatically transmit and position the soldered circuit board through the arranged components, thereby facilitating the detection of the soldering points of a large number of circuit boards and having higher detection efficiency in actual operation.
In order to achieve the above purpose, the utility model provides a circuit board semiconductor soldering spot detection device, which comprises a transmission platform, a mounting frame, a position sensor, a control device and a detection probe, wherein the position sensor is mounted on the mounting frame, the control device is electrically connected with the position sensor and is mounted on the mounting frame, and the detection probe is electrically connected with the control device and is mounted on the mounting frame and also comprises an adjustment assembly;
The adjusting component comprises a fixed frame, a movable frame, side plates, a movable member, a connecting member and a pushing member; the fixing frame is fixedly connected with the mounting frame and is positioned on one side of the mounting frame, the movable frame is in sliding connection with the fixing frame and is positioned on one side of the fixing frame, the side plate is fixedly connected with the movable frame and is positioned on one side of the movable frame, the movable member is connected with the fixing frame, the connecting member is connected with the detection probe, and the push-out member is connected with the mounting frame.
The movable component comprises a bidirectional screw rod and a movable motor, wherein the bidirectional screw rod is in threaded connection with the movable frame and is rotatably arranged on one side of the fixed frame; the output shaft of the mobile motor is connected with the bidirectional screw rod, and the mobile motor is fixedly arranged on one side of the fixing frame.
The connecting component comprises a pressing cylinder, a connecting frame, a rotating motor and an adjusting part, wherein the pressing cylinder is connected with the mounting frame and is positioned on one side of the mounting frame; the connecting frame is connected with the output end of the lower air cylinder and is positioned at one side of the lower air cylinder; the rotating frame is connected with the detection probe through the adjusting component and is rotatably arranged on one side of the connecting frame; the output shaft of the rotating motor is connected with the rotating frame, and the rotating motor is fixedly arranged on one side of the connecting frame; the adjusting component is connected with the rotating frame.
The adjusting component comprises an adjusting plate, an adjusting screw and an adjusting motor, wherein the adjusting plate is fixedly connected with the detecting probe and is slidably arranged on one side of the rotating frame; the adjusting screw is in threaded connection with the adjusting plate and is rotatably arranged on one side of the rotating frame; the output shaft of the adjusting motor is connected with the adjusting screw, and the adjusting motor is fixedly arranged on one side of the rotating frame.
The pushing-out member comprises a pushing-out air cylinder and a pushing plate, wherein the pushing-out air cylinder is connected with the mounting frame and is positioned on one side of the mounting frame; the push plate is connected with the output end of the pushing-out cylinder and is positioned at one side of the pushing-out cylinder.
According to the circuit board semiconductor soldering welding spot detection equipment, the bidirectional screw is driven to rotate through the moving motor, then the moving frames at two sides and the side plates at the sides of the moving frames are driven to move through the rotation of the bidirectional screw, so that a user can adjust the distance between the side plates at two sides according to the actual shape of a soldering circuit board, after the position adjustment of the side plates at two sides is finished, the user can directly place a soldered workpiece on the transmission platform, the transmission platform and the side plates at two sides can guide and convey the corresponding position of the workpiece, then the position sensor is arranged to sense that the workpiece enters a detection area, the connecting frame and the contact points corresponding to the workpiece are driven through the pressing cylinder, automatic positioning and detection of the workpiece are finished, the position of the detection probes at two sides can be freely adjusted through the adjusting motor and the adjusting screw before the detection, the rotation of the rotating motor is matched, the detection probes can be driven to rotate widely, the detection efficiency can be improved, and the detection circuit can be more flexibly realized, and the detection efficiency can be realized, and the detection circuit can be more conveniently and the detection circuit can be used for realizing the detection of the type of the welding spot detection.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic view showing the overall structure of a circuit board semiconductor solder joint detecting apparatus according to a first embodiment of the present utility model.
Fig. 2 is a schematic view of the installation structure of the bidirectional screw of the first embodiment of the present utility model.
Fig. 3 is a schematic structural view of a connection member according to a first embodiment of the present utility model.
Fig. 4 is a schematic view showing the overall structure of a circuit board semiconductor solder joint detecting apparatus according to a second embodiment of the present utility model.
In the figure: the device comprises a 101-transmission platform, a 102-mounting frame, a 103-position sensor, a 104-control device, a 105-detection probe, a 106-fixing frame, a 107-moving frame, a 108-side plate, a 109-bidirectional screw, a 110-moving motor, a 111-pressing cylinder, a 112-connecting frame, a 113-rotating frame, a 114-rotating motor, a 115-adjusting plate, a 116-adjusting screw, a 117-adjusting motor, a 201-pushing cylinder and a 202-pushing plate.
Detailed Description
The following detailed description of embodiments of the utility model, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the utility model.
The first embodiment of the application is as follows:
Referring to fig. 1 to 3, fig. 1 is a schematic structural view of an entire circuit board semiconductor soldering spot detecting apparatus, fig. 2 is a schematic structural view of a mounting structure of a bidirectional screw 109, and fig. 3 is a schematic structural view of a connecting member.
The utility model provides a circuit board semiconductor soldering spot detection device, which comprises: including transmission platform 101, mounting bracket 102, position sensor 103, control equipment 104, test probe 105 and adjustment subassembly, the adjustment subassembly includes mount 106, movable rack 107, curb plate 108, movable member, connecting element and release member, movable member includes bi-directional screw 109 and mobile motor 110, the connecting element includes down cylinder 111, link 112, swivel mount 113, rotating electrical machines 114 and adjusting part, adjusting part includes regulating plate 115, adjusting screw 116 and adjusting motor 117, has solved through the aforesaid scheme and has all needed manual counterpoint cooperation to welding point and two connecting blocks at every turn when detecting, just needs the arrangement personnel to carry out manual placement and counterpoint when using the big batch production of mill to detect for the result of use of whole equipment is not ideal in actual course of working.
In this embodiment, the position sensor 103 is mounted on the mounting frame 102, the control device 104 is electrically connected with the position sensor 103, and is mounted on the mounting frame 102, the detection probes 105 are electrically connected with the control device 104, and are mounted on the mounting frame 102, the transmission platform 101 is an existing transmission belt transmission platform, meanwhile, a plurality of pushing bosses are uniformly distributed on the transmission platform 101, so that the transmission of the workpiece can be more stably completed, the position sensor 103 is an existing infrared sensor for detecting the workpiece, the position sensor 103 is connected with the control device 104 fixed on the mounting frame 102, the two detection probes 105 are also connected with the control device 104 through corresponding circuits, the two detection probes 105 are contacted with two connectors corresponding to the welded workpiece, and then the detection judgment is performed on the welded workpiece through whether the two detection probes 105 are electrified, so that the above principle and the corresponding workpiece are very mature prior art, and therefore the scheme is not repeated.
The fixing frame 106 is fixedly connected with the mounting frame 102 and is located at one side of the mounting frame 102, the movable frame 107 is slidably connected with the fixing frame 106 and is located at one side of the fixing frame 106, the side plate 108 is fixedly connected with the movable frame 107 and is located at one side of the movable frame 107, the movable member is connected with the fixing frame 106, the connecting member is connected with the detection probe 105, the push-out member is connected with the mounting frame 102, the bidirectional screw 109 is in threaded connection with the movable frame 107 and is rotatably mounted at one side of the fixing frame 106; the output shaft of the moving motor 110 is connected with the bidirectional screw 109, the moving motor 110 is fixedly installed on one side of the fixing frame 106, the fixing frame 106 is fixedly installed on the side edge of the bottom of the fixing frame 102, two moving frames 107 are installed on two sides of the fixing frame 106 in a sliding mode, the two moving frames 107 are symmetrically arranged on two sides of the bidirectional screw 109 respectively, the screw threads on two sides of the bidirectional screw 109 are opposite in rotation direction, the bidirectional screw 109 is fixed with the output shaft of the moving motor 110, each side edge of the top of each moving frame 107 is provided with a side plate 108, the corresponding two sides of a workpiece placed on the conveying platform 101 can be clamped and limited through the side plates 108 arranged on the two sides of the moving frames 107, so that the positions of a plurality of workpieces can be kept consistent during conveying, and meanwhile, the distance between the two moving frames 107 and the side plates 108 can be adjusted through the moving motor 110 so as to adapt to workpieces with different widths.
Next, the lower pressure cylinder 111 is connected to the mounting frame 102 and located at one side of the mounting frame 102; the connecting frame 112 is connected with the output end of the lower pressure cylinder 111 and is positioned at one side of the lower pressure cylinder 111; the rotating frame 113 is connected with the detecting probe 105 through the adjusting component and is rotatably installed at one side of the connecting frame 112; an output shaft of the rotating motor 114 is connected with the rotating frame 113, and the rotating motor 114 is fixedly installed at one side of the connecting frame 112; the adjusting part is connected with the rotating frame 113, and the adjusting plate 115 is fixedly connected with the detecting probe 105 and is slidably arranged at one side of the rotating frame 113; the adjusting screw 116 is in threaded connection with the adjusting plate 115 and is rotatably installed at one side of the rotating frame 113; the output shaft of the adjusting motor 117 is connected with the adjusting screw 116, the adjusting motor 117 is fixedly installed on one side of the rotating frame 113, the lower air cylinder 111 is fixed on a boss on the top of the mounting frame 102, the output end of the lower air cylinder 111 is fixed with the connecting frame 112, the rotating frame 113 is rotatably installed at the bottom of the connecting frame 112, two adjusting plates 115 are slidably installed on two sides of the rotating frame 113 respectively, the detecting probe 105 is fixed at the bottom of the adjusting plate 115, meanwhile, the output shaft of the rotating motor 114 installed on the connecting frame 112 is fixed with the rotating frame 113, the adjusting plates 115 on two sides are matched with the adjusting screws 116 installed on the rotating frame 113 respectively, each adjusting screw 116 is also matched and installed with the adjusting motor 117, the output shaft of the adjusting motor 117 is fixed with the adjusting screws 116, so that a user can independently adjust the contact positions of the two detecting probes according to practical conditions, and the contact positions of the two detecting probes can be conveniently welded to the two different circuit adjustment positions of the rotating frame 113.
When the circuit board semiconductor soldering spot detection device is used, the bidirectional screw 109 is driven to rotate through the moving motor 110, then the moving frame 107 on two sides and the side plates 108 on the side edges of the moving frame 107 are driven to move through the rotation of the bidirectional screw 109, so that a user can adjust the spacing between the side plates 108 on two sides according to the actual shape of a welding circuit board, after the position adjustment of the side plates 108 on two sides is completed, the user can directly place a welded workpiece on the transmission platform 101, the transmission platform 101 and the two sides can guide and convey the corresponding position of the workpiece under the matching of the side plates 108, then the connecting frame 112 and the contact points corresponding to the workpiece can be driven through the lower pressure cylinder 111, the automatic positioning and detection of the workpiece can be finished, the automatic positioning and detection can be further carried out through the adjusting motor 117 and the position adjustment of the probe 105, and the automatic positioning can be carried out on two sides of the welding spot detection device, the detection device can be more conveniently used for realizing the automatic positioning and detection of the welding spot detection device, and the detection device can be more convenient for realizing the high-speed adjustment of the position adjustment of the welding spot detection device.
Second embodiment:
Referring to fig. 4, fig. 4 is a schematic structural diagram of the whole circuit board semiconductor soldering spot detecting apparatus according to the second embodiment, and the pushing member provided by the present utility model includes a pushing cylinder 201 and a pushing plate 202.
Wherein the push-out cylinder 201 is connected with the mounting frame 102 and is located at one side of the mounting frame 102; the push plate 202 is connected with the output end of the push-out cylinder 201 and is located at one side of the push-out cylinder 201, the push-out cylinder 201 is fixedly installed on a boss platform at the side of the installation frame 102, meanwhile, a position sensor 103 is also arranged at the position where the push-out cylinder 201 is arranged, the push plate 202 is fixed at the output end of the push-out cylinder 201, when the control device 104 monitors that a welding circuit board detects failure, the position sensor 103 beside the push-out cylinder 201 is started, when a failure workpiece is sensed by the corresponding position sensor 103, the push-out cylinder 201 drives the push plate 202 to push the failure workpiece out of the transmission platform 101, so that automatic screening and separation of the failure workpiece are completed, and a storage frame or a storage bag is arranged at the position where the push plate 202 is pushed out by a user for recycling and reprocessing the failure product.
When the device for detecting the soldering points of the semiconductor tin of the circuit board is used, the push plate 202 can be driven by the push-out cylinder 201 to push out unqualified circuit soldering boards from the transmission platform 101, so that automatic screening of unqualified workpieces is completed, and the practicability of the whole device is greatly enhanced.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present application, and it is not intended to limit the scope of the claims hereof, as persons of ordinary skill in the art will understand that all or part of the processes for practicing the embodiments described herein may be practiced with equivalent variations in the claims, which are within the scope of the application.
Claims (5)
1. The detection equipment for the semiconductor soldering points of the circuit board comprises a transmission platform, a mounting frame, a position sensor, a control device and a detection probe, wherein the position sensor is mounted on the mounting frame, the control device is electrically connected with the position sensor and mounted on the mounting frame, the detection probe is electrically connected with the control device and mounted on the mounting frame,
The device also comprises an adjusting component;
The adjusting component comprises a fixed frame, a movable frame, side plates, a movable member, a connecting member and a pushing member; the fixing frame is fixedly connected with the mounting frame and is positioned on one side of the mounting frame, the movable frame is in sliding connection with the fixing frame and is positioned on one side of the fixing frame, the side plate is fixedly connected with the movable frame and is positioned on one side of the movable frame, the movable member is connected with the fixing frame, the connecting member is connected with the detection probe, and the push-out member is connected with the mounting frame.
2. The apparatus for inspecting solder joints of a semiconductor device for circuit boards according to claim 1,
The movable component comprises a bidirectional screw rod and a movable motor, wherein the bidirectional screw rod is in threaded connection with the movable frame and is rotatably arranged on one side of the fixed frame; the output shaft of the mobile motor is connected with the bidirectional screw rod, and the mobile motor is fixedly arranged on one side of the fixing frame.
3. The apparatus for inspecting solder joints of a semiconductor device for circuit boards according to claim 1,
The connecting member comprises a pressing cylinder, a connecting frame, a rotating motor and an adjusting part, wherein the pressing cylinder is connected with the mounting frame and is positioned at one side of the mounting frame; the connecting frame is connected with the output end of the lower air cylinder and is positioned at one side of the lower air cylinder; the rotating frame is connected with the detection probe through the adjusting component and is rotatably arranged on one side of the connecting frame; the output shaft of the rotating motor is connected with the rotating frame, and the rotating motor is fixedly arranged on one side of the connecting frame; the adjusting component is connected with the rotating frame.
4. The apparatus for inspecting solder joints of a circuit board semiconductor according to claim 3,
The adjusting part comprises an adjusting plate, an adjusting screw and an adjusting motor, wherein the adjusting plate is fixedly connected with the detecting probe and is slidably arranged on one side of the rotating frame; the adjusting screw is in threaded connection with the adjusting plate and is rotatably arranged on one side of the rotating frame; the output shaft of the adjusting motor is connected with the adjusting screw, and the adjusting motor is fixedly arranged on one side of the rotating frame.
5. The apparatus for inspecting solder joints of a semiconductor device for circuit boards according to claim 1,
The pushing-out member comprises a pushing-out air cylinder and a pushing plate, and the pushing-out air cylinder is connected with the mounting frame and is positioned on one side of the mounting frame; the push plate is connected with the output end of the pushing-out cylinder and is positioned at one side of the pushing-out cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321882398.7U CN220894451U (en) | 2023-07-18 | 2023-07-18 | Circuit board semiconductor tin soldering welding spot detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321882398.7U CN220894451U (en) | 2023-07-18 | 2023-07-18 | Circuit board semiconductor tin soldering welding spot detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220894451U true CN220894451U (en) | 2024-05-03 |
Family
ID=90878795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321882398.7U Active CN220894451U (en) | 2023-07-18 | 2023-07-18 | Circuit board semiconductor tin soldering welding spot detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220894451U (en) |
-
2023
- 2023-07-18 CN CN202321882398.7U patent/CN220894451U/en active Active
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