CN220872865U - Hot end heat radiation structure of semiconductor heat radiation device - Google Patents
Hot end heat radiation structure of semiconductor heat radiation device Download PDFInfo
- Publication number
- CN220872865U CN220872865U CN202322411540.6U CN202322411540U CN220872865U CN 220872865 U CN220872865 U CN 220872865U CN 202322411540 U CN202322411540 U CN 202322411540U CN 220872865 U CN220872865 U CN 220872865U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat radiation
- semiconductor
- connecting plate
- conduction copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 230000005855 radiation Effects 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 238000005057 refrigeration Methods 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007664 blowing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a hot end heat radiation structure of a semiconductor heat radiation device, which belongs to the technical field of semiconductor heat radiation structures and comprises a connecting plate, a plurality of heat conduction copper pipes and a heat radiation body, wherein the plurality of heat conduction copper pipes are connected to the connecting plate and penetrate through the heat radiation body, the hot end of a semiconductor refrigeration piece is connected to the plurality of heat conduction copper pipes, the inner side wall of the heat radiation body facing the connecting plate is closed, and an air inlet and a first air outlet are respectively arranged on the outer side of the heat radiation body facing away from the connecting plate. The utility model utilizes the principle of blowing at low temperature to high temperature to radiate the radiated heat through the first air outlet farthest from the projector, thereby avoiding the radiating end of the semiconductor refrigerating sheet from being too close to the projector and affecting the radiating effect of the projector.
Description
Technical Field
The utility model belongs to the technical field of semiconductor heat dissipation structures, and particularly relates to a hot end heat dissipation structure of a semiconductor heat dissipation device.
Background
The projector is used for projecting images or videos on a curtain or a wall, and large heat is often emitted during projection; most projectors used at present only dissipate heat through a simple fan, and the dissipated heat is difficult to be dissipated quickly and effectively, so that the projector still has a heating problem.
The common refrigeration method of the projector at present is that the semiconductor refrigeration sheet is manufactured, but the heat dissipation end of the existing semiconductor refrigeration sheet is too close to the projector, so that the heat dissipation effect of the projector is affected.
Disclosure of utility model
The utility model aims at: the heat-dissipating structure of the hot end of the semiconductor heat-dissipating device is provided for solving the problem that the heat-dissipating effect of the projector is affected by the fact that the heat-dissipating end of the conventional semiconductor refrigerating sheet is too close to the projector.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a semiconductor heat abstractor's hot junction heat radiation structure, includes connecting plate, a plurality of heat conduction copper pipe and radiator, a plurality of the heat conduction copper pipe is connected on the connecting plate, and runs through the radiator, the hot junction of semiconductor refrigeration piece is connected on a plurality of the heat conduction copper pipe, the radiator orientation the inside wall of connecting plate is confined, the radiator is dorsad be provided with air intake and first air outlet on the connecting plate outside respectively.
As a further description of the above technical solution:
The connecting plate is made of copper sheets.
As a further description of the above technical solution:
the connecting plate is provided with a plurality of connecting holes.
As a further description of the above technical solution:
The heat conduction copper pipes are positioned on the inner side of the first air outlet, and the distance between the heat conduction copper pipes and the first air outlet is smaller than the distance between the heat conduction copper pipes and the air inlet.
As a further description of the above technical solution:
The heat-conducting copper pipe is characterized in that a connecting groove is formed in the connecting plate, one end of the heat-conducting copper pipe is extruded into a sheet shape to be connected in the connecting groove, and the other end of the heat-conducting copper pipe penetrates through the heat radiation body and extends out of the heat radiation body.
As a further description of the above technical solution:
the heat radiator is made of heat radiating fins or aluminum fins.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
According to the utility model, one end of a plurality of heat conduction copper pipes is extruded into a sheet shape and connected in a connecting groove on a connecting plate, the other end is bent and extends upwards to penetrate through a radiator, the hot end of a semiconductor refrigeration sheet is connected to the connecting plate, one side of the radiator, which faces the semiconductor refrigeration sheet (or a projector), is sealed, a first air outlet and an air inlet are formed in one side, which faces away from the semiconductor refrigeration sheet (or the projector), of the radiator, wherein the plurality of heat conduction copper pipes are positioned at the inner side of the first air outlet, the distance between the heat conduction copper pipes and the first air outlet is smaller than the distance between the heat conduction copper pipes and the air inlet (the low-temperature area blows to the high-temperature area, the low-temperature area is cold and heavy, the density is large, the cold high-temperature area is hot and the density is small, the hot low-pressure is formed, the wind naturally blows from the high-pressure to the low-pressure), and the principle that the low-temperature blows to the high-temperature is utilized, the heat dissipated is dissipated through the first air outlet which is farthest away from the projector, and the heat dissipation end of the semiconductor refrigeration sheet is prevented from being too close to the projector, and the heat dissipation effect of the projector is influenced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a rear view of a hot side heat dissipating structure of a semiconductor heat dissipating device.
Fig. 2 is a front view of a hot-end heat dissipation structure of a semiconductor heat dissipation device.
Fig. 3 is a schematic diagram of a connection structure between a semiconductor cooling fin and a heat conductive copper pipe in a hot-end heat dissipation structure of a semiconductor heat dissipation device.
Fig. 4 is a schematic structural diagram of a hot-end heat dissipating structure of a semiconductor heat dissipating device.
Fig. 5 is a schematic structural diagram of a second embodiment of a hot-side heat dissipating structure of a semiconductor heat dissipating device.
Fig. 6 is a top view of a second embodiment of a hot side heat dissipating structure of a semiconductor heat dissipating device.
Legend description:
1-connecting plates; 2-a heat conduction copper pipe; 3-a heat sink; 4-connecting holes; 5-connecting grooves; 6, an air inlet; 7-a first air outlet; 8-semiconductor refrigerating sheets; 9-a second air outlet.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In describing embodiments of the present utility model, it should be noted that, the azimuth or positional relationship indicated by the terms "upper", "inner", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that the inventive product is conventionally put in use, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-6, the present utility model provides a technical solution: the utility model provides a semiconductor heat abstractor's hot junction heat radiation structure, includes connecting plate 1, a plurality of heat conduction copper pipe 2 and radiator 3, a plurality of heat conduction copper pipe 2 is connected on the connecting plate 1, and runs through radiator 3, the hot junction of semiconductor refrigeration piece 8 is connected on a plurality of heat conduction copper pipe 2, radiator 3 orientation the inside wall of connecting plate 1 is closed, radiator 3 is dorsad be provided with air intake 6 and first air outlet 7 on the connecting plate 1 outside respectively.
The connecting plate 1 is made of copper sheets. And the heat dissipation effect is improved.
A plurality of connecting holes 4 are formed in the connecting plate 1. The cold end of the semiconductor refrigeration piece is conveniently connected to the cold end connector through the screw passing through the connecting hole.
The heat conduction copper pipes 2 are located at the inner side of the first air outlet 7, and the distance between the heat conduction copper pipes 2 and the first air outlet 7 is smaller than the distance between the heat conduction copper pipes 2 and the air inlet 6.
The connecting plate 1 is provided with a connecting groove 5, one end of the heat conduction copper pipe 2 is extruded into a sheet shape and connected in the connecting groove 5, and the other end of the heat conduction copper pipe penetrates through the heat radiation body 3 and extends out of the heat radiation body 3.
The heat radiator 3 is made of heat radiating fins or aluminum fins. The heat dissipation effect is good.
The second air outlet 9 which is bent inwards can be formed in the middle inner side of the top of the heat radiation body 3, the second air outlet is close to the heat conduction copper pipe to form a high temperature area, and the second air outlet is positioned at the top end of the heat radiation body and far away from the projector, so that when heat is radiated, the second air outlet at the top can radiate heat, and the heat radiation effect of the whole heat radiation structure is greatly improved.
Working principle: the heat-conducting copper pipes are extruded into sheets at one ends and connected in the connecting grooves on the connecting plates, the other ends are bent and extend upwards to penetrate through the heat radiating bodies, the heat ends of the semiconductor refrigerating sheets are connected to the connecting plates, one sides of the heat radiating bodies, which face the semiconductor refrigerating sheets (or the projectors), are closed, a first air outlet and an air inlet are formed in one side, which faces away from the semiconductor refrigerating sheets (or the projectors), of the heat radiating bodies, wherein the heat-conducting copper pipes are located on the inner side of the first air outlet, the distance between the heat-conducting copper pipes and the first air outlet is smaller than the distance between the heat-conducting copper pipes and the air inlet (the low-temperature area blows to the high-temperature area, the low-temperature area is cold and heavy, the density is large, the cold high-pressure air is formed, the density is small, the hot low-pressure air is naturally blown to the low-pressure), the principle that the low-temperature is blown to the high-temperature is utilized, the heat dissipated through the first air outlet which is farthest away from the projector, and the heat radiating end of the semiconductor refrigerating sheets is too close to the projector is avoided, and the radiating effect of the projector is affected.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a semiconductor heat abstractor's hot junction heat radiation structure, its characterized in that includes connecting plate (1), a plurality of heat conduction copper pipe (2) and radiator (3), a plurality of heat conduction copper pipe (2) are connected on connecting plate (1), and run through radiator (3), the hot junction of semiconductor refrigeration piece (8) is connected on a plurality of heat conduction copper pipe (2), radiator (3) orientation the inside wall of connecting plate (1) is closed, radiator (3) are dorsad be provided with air intake (6) and first air outlet (7) on connecting plate (1) outside respectively.
2. A hot-end heat dissipating structure of a semiconductor heat dissipating device according to claim 1, wherein the connection board (1) is made of copper sheet.
3. A hot-end heat dissipating structure of a semiconductor heat dissipating device according to claim 2, wherein the connection board (1) is provided with a plurality of connection holes (4).
4. The hot-end heat dissipation structure of a semiconductor heat dissipation device according to claim 1, wherein a plurality of the heat conduction copper tubes (2) are located inside the first air outlet (7), and the distance between the heat conduction copper tubes (2) and the first air outlet (7) is smaller than the distance between the heat conduction copper tubes (2) and the air inlet (6).
5. The hot-end heat radiation structure of the semiconductor heat radiation device according to claim 4, wherein the connecting plate (1) is provided with a connecting groove (5), one end of the heat conduction copper pipe (2) is extruded into a sheet shape and connected in the connecting groove (5), and the other end passes through the heat radiation body (3) and extends out of the heat radiation body (3).
6. The hot-end heat radiation structure of the semiconductor heat radiation device according to claim 1, wherein the heat radiation body (3) is made of heat radiation fins or aluminum fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322411540.6U CN220872865U (en) | 2023-09-06 | 2023-09-06 | Hot end heat radiation structure of semiconductor heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322411540.6U CN220872865U (en) | 2023-09-06 | 2023-09-06 | Hot end heat radiation structure of semiconductor heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220872865U true CN220872865U (en) | 2024-04-30 |
Family
ID=90814067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322411540.6U Active CN220872865U (en) | 2023-09-06 | 2023-09-06 | Hot end heat radiation structure of semiconductor heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220872865U (en) |
-
2023
- 2023-09-06 CN CN202322411540.6U patent/CN220872865U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108153401A (en) | A kind of computer server radiator | |
| CN207674759U (en) | A kind of semiconductor cooling device | |
| CN220872865U (en) | Hot end heat radiation structure of semiconductor heat radiation device | |
| CN205825570U (en) | A kind of heat abstractor of semiconductor freezer | |
| CN210725857U (en) | Air conditioner and plate-fin phase-change heat dissipation control box thereof | |
| TWM554979U (en) | Phase-change evaporator and phase-change heat dissipation device | |
| CN215646842U (en) | Heat dissipation exchanger shell | |
| CN214206200U (en) | Novel heat dissipation device | |
| CN109494047B (en) | Energy-saving and environment-friendly rectifier transformer with air cooling and heat dissipation functions | |
| CN214225866U (en) | Cavity radiator with high-efficient initiative refrigeration module | |
| CN201166825Y (en) | Water-cooled notebook computer radiator | |
| CN209914356U (en) | Heat radiation structure of condenser | |
| CN112437590A (en) | Novel heat dissipation device | |
| WO2017201761A1 (en) | Autonomous heat dissipating cob integrated led lamp body based on heat convection | |
| CN218122452U (en) | Projector with heat dissipation function of heat superconducting material | |
| CN207909067U (en) | A kind of computer server radiator | |
| CN213586782U (en) | High-power communication equipment beneficial to heat dissipation | |
| CN219300692U (en) | Fin radiator | |
| US20240085769A1 (en) | Projector with thermal superconducting material for heat dissipation | |
| CN219042408U (en) | Cabinet with heat abstractor | |
| CN216357883U (en) | Heat dissipation module used in sealed cavity | |
| CN215864149U (en) | Heat exchange device and micromodule | |
| CN220958977U (en) | Reagent refrigerating device | |
| CN215121748U (en) | Graphite alkene heat dissipation aluminum plate structure | |
| CN215929726U (en) | Heating plate with convection heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |