CN220859457U - Atomizing device, atomizing equipment and heating element - Google Patents

Abstract

The application discloses an atomization device, an atomization apparatus and a heating element. The atomizing device comprises a heating body and a heating element, wherein the heating body comprises a liquid suction surface and an atomizing surface opposite to the liquid suction surface, and a flow passage penetrating through the liquid suction surface and the atomizing surface is formed on the heating body; the heating element is at least partially located on the side of the liquid suction surface, and the maximum height of the heating element from the liquid suction surface is greater than 0.5mm. In the atomizing device, the maximum height of the heating element from the liquid suction surface of the heating element is larger than 0.5mm, so that the heating element can heat an atomized substrate within the range of being larger than 0.5mm from the liquid suction surface, the viscosity of the atomized substrate is reduced, the atomized substrate can flow through the flow channel, and the probability of dry burning of the heating element is reduced.

Description

Atomizing device, atomizing equipment and heating element

Technical Field

The application relates to the technical field of atomization, in particular to an atomization device, an atomization equipment and a heating element.

Background

In the related art, the atomizing device includes a heat generating body provided with a flow passage through which an atomized substrate can flow from one side of the heat generating body to the other side of the heat generating body and be atomized by heating to form an aerosol. However, when the viscosity of the atomized substrate is high, it is difficult for the atomized substrate to flow through the flow path, and dry heating of the heating element tends to occur.

Disclosure of utility model

Embodiments of the present application provide an atomizing apparatus, an atomizing device, and a heating element.

The atomizing device comprises a heating body and a heating element, wherein the heating body comprises a liquid suction surface and an atomizing surface opposite to the liquid suction surface, and a flow passage penetrating through the liquid suction surface and the atomizing surface is formed in the heating body; the heating element is at least partially positioned on one side of the liquid suction surface, and the maximum height of the heating element from the liquid suction surface is greater than 0.5mm.

In the atomizing device, the maximum height of the heating element from the liquid suction surface of the heating element is larger than 0.5mm, so that the heating element can heat an atomized substrate within a range of being larger than 0.5mm from the liquid suction surface, the viscosity of the atomized substrate is reduced, the atomized substrate can flow through the flow channel, and the probability of dry combustion of the heating element is reduced.

In certain embodiments, the maximum height of the heating element from the liquid surface is 1mm to 3mm.

In some embodiments, the heating element comprises a base disposed proximate the heat-generating body and an extension extending from the base in a direction away from the heat-generating body, the extension having a maximum height from the liquid surface of greater than 0.5mm.

In some embodiments, the base is formed with a through hole penetrating through both surfaces in the thickness direction of the base.

In some embodiments, the extension includes at least one fin, each fin being connected to the base proximate an edge of the through hole.

In some embodiments, the number of the through holes is a plurality, and the fin is connected to the edge of each through hole.

In some embodiments, the fins extend in a direction substantially parallel to the thickness of the base.

In some embodiments, the fins are inclined to the thickness direction of the base.

In some embodiments, the fins are formed with vias that extend through both sides of the fin in the thickness direction.

In some embodiments, the heating element is in thermally conductive connection with the heat generating body, the heat of the heat generating body being capable of being transferred to the heating element.

In some embodiments, the atomizing device includes a flow stabilization element disposed between the heating element and the heat generating body, the flow stabilization element capable of transferring heat from the heat generating body to the heating element.

In certain embodiments, the heating element is configured to emit heat upon energization.

In some embodiments, the heating element is configured to contact an electrode terminal of the atomizing device for powering the heating element, the electrode terminal for contact with the atomizing face.

In some embodiments, the heating body is formed with a penetration hole for passing the electrode terminal therethrough to contact the electrode terminal with the heating element.

In some embodiments, the heating element includes a base positioned on one side of the liquid-absorbing surface and an electrical connection connected to the base, the electrical connection extending from the base to the atomizing surface and contacting the electrode terminals.

In some embodiments, the electrical connection part includes a first connection piece and a second connection piece, the first connection piece connects the base and the second connection piece, the second connection piece is bent with respect to the first connection piece and is located at one side of the atomizing surface, and the second connection piece is used for contacting with the electrode terminal.

In certain embodiments, the heating element is a metal heating element.

In certain embodiments, the heating element is a stainless steel heating element or an aluminum heating element.

In certain embodiments, the heating element is formed by a die casting process and/or a stamping process.

In certain embodiments, the atomizing device further comprises a mounting, and the heater and the heating element are both mounted within the mounting.

In certain embodiments, the atomizing device further comprises a housing having an atomizing substrate disposed therein, the atomizing substrate having a viscosity of greater than 10000cps at 25 ℃.

The atomizing device of the embodiment of the application comprises a host and the atomizing device of any embodiment, wherein the atomizing device is connected with the host.

The heating element is used for an atomization device and comprises a heating body, the heating body comprises a liquid suction surface and an atomization surface opposite to the liquid suction surface, a flow passage penetrating through the liquid suction surface and the atomization surface is formed in the heating body, the heating element is configured to be at least partially positioned on one side of the liquid suction surface, and the maximum height of the heating element from the liquid suction surface is larger than 0.5mm.

In some embodiments, the heating element comprises a base disposed proximate the heat-generating body and an extension extending from the base in a direction away from the heat-generating body, the extension having a maximum height from the liquid surface of greater than 0.5mm.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic plan view of an atomizing device according to an embodiment of the present disclosure;

FIG. 2 is a schematic perspective cross-sectional view of an atomizer according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of an atomizer according to an embodiment of the present application;

FIG. 4 is an enlarged schematic view of a portion of the atomizing device of FIG. 3;

FIG. 5 is a partially exploded schematic illustration of an atomizing device according to an embodiment of the present disclosure;

FIG. 6 is a schematic perspective view of a heat-generating body according to an embodiment of the present application;

FIG. 7 is a schematic perspective view of a heating element according to an embodiment of the present application;

FIG. 8 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

FIG. 9 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

FIG. 10 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

FIG. 11 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

FIG. 12 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

FIG. 13 is a schematic perspective view of a further heating element according to an embodiment of the present application;

FIG. 14 is a schematic perspective cross-sectional view of an atomizer according to another embodiment of the present application;

FIG. 15 is an enlarged schematic view of a portion of the atomizing device of FIG. 14;

FIG. 16 is a schematic perspective view of yet another heating element according to an embodiment of the present application;

Fig. 17 is a schematic perspective view of an atomizing apparatus according to an embodiment of the present disclosure.

Main labeling description:

100-atomizing device, 10-heating body, 11-liquid absorbing surface, 12-atomizing surface, 13-runner, 14-substrate, 15-heating film, 16-perforation, 20-heating element, 21-base, 211-through hole, 22-extension part, 221-fin, 222-through hole, 23-electric connection part, 231-first connection piece, 232-second connection piece, 233-clamping space, 30-steady flow element, 40-electrode terminal, 50-mount, 51-lower liquid channel, 52-mist outlet channel, 60-shell, 61-liquid storage chamber, 1000-atomizing equipment and 200-host.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or settings discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Referring to fig. 1 to 4, an atomization device 100 according to an embodiment of the present application includes a heating element 10 and a heating element 20, the heating element 10 includes a liquid suction surface 11 and an atomization surface 12 opposite to the liquid suction surface 11, and the heating element 10 is formed with a flow passage 13 penetrating the liquid suction surface 11 and the atomization surface 12; the heating element 20 is at least partially located on the side of the meniscus 11, the maximum height H of the heating element 20 from the meniscus 11 being greater than 0.5mm.

In the atomizing device 100 according to the embodiment of the application, the maximum height H of the heating element 20 from the liquid suction surface 11 of the heating element 10 is greater than 0.5mm, so that the heating element 20 can heat the atomized substrate within a range greater than 0.5mm from the liquid suction surface 11, thereby reducing the viscosity of the atomized substrate, being beneficial to the atomized substrate flowing through the flow channel 13 and reducing the probability of dry burning of the heating element 10.

In particular, the atomizing device 100 is a component for forming an aerosol from an atomized matrix. The atomizing device 100 may atomize the atomized substrate to form an aerosol by heating. The heat generating body 10 is a component for generating heat. The liquid suction surface 11 of the heat generating body 10 is the surface that comes into contact with the atomized substrate first, and the atomized surface 12 of the heat generating body 10 is the surface that atomizes the atomized substrate to form aerosol. The flow channels 13 are, for example, circular holes or the like, which allow passage of the atomizing medium from the liquid suction surface 11 to the atomizing surface 12.

As discussed above, the heat-generating body 10 itself may generate heat, thereby heating and atomizing the atomized matrix around the atomizing face 12 of the heat-generating body 10. However, the range of the heating body 10 to heat the atomized substrate is small, so that the amount of the heated atomized substrate is small, and it may be difficult to satisfy the requirement. In this way, the heating element 20 is at least partially arranged on one side of the liquid absorbing surface 11, and the maximum height H of the heating element 20 from the liquid absorbing surface 11 is greater than 0.5mm, so that the heating element 20 can exchange heat with more atomization matrix around, the temperature of the atomization matrix around the heating element 20 is increased, the viscosity is reduced, the fluidity of the atomization matrix is enhanced, the atomization matrix can reach the atomization surface 12 more easily through the flow channel 13, and the probability of dry burning of the heating element 10 is reduced.

It should be noted that the maximum height H of the heating element 20 from the liquid suction surface 11 refers to the maximum dimension between the heating element 20 and the liquid suction surface 11 along the normal direction of the liquid suction surface 11.

The atomizing substrate of the embodiments of the present application may be a high viscosity atomizing substrate, and the viscosity of the atomizing substrate may be greater than 10000cps at normal temperature (25 ℃). In an embodiment of the present application, the viscosity measurement method comprises: GBT 17473.5-1998 thick film microelectronics was viscometric using noble metal paste testing.

In some embodiments, the maximum height H of the heating element 20 from the meniscus 11 may be 0.6mm, 1mm, 1.5mm, 2mm, 3mm, etc. in size.

Referring to fig. 5 and 6, in some embodiments, the heat generating body 10 may include a substrate 14 and a heat generating film 15 disposed on the substrate 14. The substrate 14 has a liquid suction surface 11, and the heat generating film 15 has an atomizing surface 12. The substrate 14 may be sheet-like and may be made of glass, dense ceramic, or the like. The heat generating film 15 may be made of a material which is conductive and easily generates heat, such as metal, alloy, or the like. For example, the material of the heating film 15 may be gold, silver, platinum, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, titanium-zirconium alloy, palladium-silver alloy, gold-platinum alloy, stainless steel, or the like.

In some embodiments, the heating element 20 is a metal heating element 20. Alternatively, the heating element 20 may be made of a metallic material. Thus, the metal heating element 20 has good thermal conductivity and can rapidly exchange heat with the atomizing substrate, thereby heating the atomizing substrate. In one example, the heating element 20 may raise the temperature of the surrounding atomized matrix by more than 10 ℃.

In some embodiments, the heating element 20 is a stainless steel heating element 20 or an aluminum heating element 20. Alternatively, the heating element 20 may be made of stainless steel or aluminum materials. In this manner, stainless steel or aluminum materials have good heat conducting properties and are easily formed so that the heating element 20 can be more easily manufactured.

Of course, in some embodiments, the heating element 20 may be made of copper, metal alloy, or the like.

In some embodiments, the heating element 20 is formed by a die casting process and/or a stamping process. In this manner, the heating element 20 is easily formed into a predetermined shape, thereby facilitating heating of the atomized substrate. For example, in the embodiment of fig. 7-9, the heating element 20 may be formed by a die casting process; in the embodiment of fig. 12, the heating element 20 may be formed by a die casting process.

Referring to fig. 4, in some embodiments, the maximum height H of the heating element 20 from the liquid surface 11 is 1mm-3mm. For example, the maximum height H may be 1mm, 1.2mm, 1.5mm, 1.8mm, 2mm, 2.5mm, 3mm, etc. in size. In the case where the maximum height H is within this range, a sufficient amount of the atomized substrate can be heated so that a sufficient amount of the atomized substrate can be atomized through the flow path 13, and the volume of the heating element 20 can be reduced, resulting in a more compact atomizing device 100.

Referring to fig. 4, in some embodiments, the heating element 20 includes a base 21 and an extension 22, the base 21 is disposed near the heating element 10, the extension 22 extends from the base 21 in a direction away from the heating element 10, and a maximum height H of the extension 22 from the liquid suction surface 11 is greater than 0.5mm.

In this way, the base 21 can make the heating element 20 more stable when being installed, and the extension 22 can increase the height of the heating element 20 and heat the atomized substrate, thereby expanding the heating range of the heating element 20, and enabling the maximum height H of the heating element 20 from the liquid suction surface 11 of the heating element 10 to meet the requirement of more than 0.5 mm.

Specifically, the base 21 and the extension 22 may each be sheet-shaped. The profile of the base 21 may be square, and the extension 22 may be elongated. The maximum height H of the extension 22 from the liquid level 11 is the maximum height H of the heating element 20 from the liquid level 11.

Referring to fig. 4 and 7, in some embodiments, the base 21 is formed with a through hole 211, and the through hole 211 penetrates through both surfaces of the base 21 in the thickness direction. In this way, the through holes 211 can reduce the flow resistance of the atomized substrate, so that the heated atomized substrate can flow more easily to the liquid suction surface 11, and the atomized substrate can be atomized on the atomizing surface 12 after passing through the flow channel 13.

Specifically, the through hole 211 may be a square hole, a circular hole, or the like. The projection of the through-holes 211 onto the liquid-absorbing surface 11 may coincide with at least a portion of the area of the flow channels 13, thereby facilitating faster flow of the atomized substrate to the liquid-absorbing surface 11 after passing through the through-holes 211.

Referring to fig. 7, in some embodiments, the extension 22 includes at least one fin 221, and each fin 221 is connected to the base 21 near an edge of the through hole 211. In this manner, the fins 221 may be generally larger in surface area, which may increase the heating efficiency of the heating element 20, thereby allowing for a faster reduction in the viscosity of the atomized matrix. In addition, since the fin 221 is close to the edge of the through hole 211, the temperature of the atomized substrate flowing through the through hole 211 is not lowered, so that the atomized substrate maintains low viscosity, and the atomized substrate flows to the atomized surface 12 more smoothly, and the probability of dry burning of the heating element 10 is reduced.

Specifically, the fin 221 may have a straight bar shape, a bent shape, a frame shape, etc. configuration, and the present application is not limited to the specific shape and structure of the fin 221 as long as the fin 221 can heat the atomized substrate.

Referring to fig. 7 and 8, in some embodiments, the number of through holes 211 is plural, and fins 221 are connected to the edge of each through hole 211. In this way, the plurality of through holes 211 can make the number of the fins 221 be plural, so that the heating area of the heating element 20 is larger, which is beneficial to improving the heating efficiency of the heating element 20 on the atomized substrate. In addition, the fins 221 may heat the atomized substrate flowing through each of the through holes 211, thereby reducing the viscosity of the atomized substrate and improving the fluidity of the atomized substrate as a whole.

In the case where the number of the fins 221 is plural, the types of the fins 221 may be the same or different. As shown in fig. 7, the partial fin 221 is in a straight strip shape, and the partial fin 221 is in a bent shape. As shown in fig. 8, 9 and 12, the fin 221 has the same configuration.

Specifically, the number of the through holes 211 may be 2, 3, 4, or the like. As in the example of fig. 9, the number of through holes 211 is 2, and as in the example of fig. 10, the number of through holes 211 is 3. One or more fins 221 may be attached to the edge of the same through hole 211. For example, in the example of fig. 9, one fin 221 is connected to an edge of one through hole 211. In the example of fig. 11, two fins 221 are connected to the edge of one of the through holes 211.

Further, the number of fins 221 connected to the edge of each through hole 211 may be the same or different. As in the example of fig. 11, two fins 221 are connected to the edge of the middle through hole 211, and one fin 221 is connected to the edge of the side through hole 211.

Referring to fig. 12, in some embodiments, the extending direction of the fin 221 is substantially parallel to the thickness direction of the base 21. In this manner, each side of the fin 221 may be in contact with the atomized substrate to heat the atomized substrate, and may cause the atomized substrate to flow along the side of the fin 221 toward the base 21, thereby making the atomized substrate flow resistance smaller and facilitating the atomized substrate flow. In addition, the fins 221 may form a greater maximum height H, thereby allowing for an increased heating range of the heating element 20, which may be advantageous for reducing the viscosity of a greater amount of atomized substrate.

Referring to fig. 13, in some embodiments, the fins 221 are inclined with respect to the thickness direction of the base 21. In this way, the fin 221 can reduce the flow speed of the atomized matrix, the contact time between the fin 221 and the atomization is longer, which is beneficial to heating the atomized matrix, so that the viscosity of the atomized matrix flowing to the heating element 10 is reduced, the atomized matrix can more easily reach the atomization surface 12 to be atomized, and the probability of dry burning of the heating element 10 is reduced.

Referring to fig. 13, in some embodiments, the fin 221 is formed with a via hole 222, and the via hole 222 penetrates through both sides of the fin 221 in the thickness direction. In this way, the through holes 222 reduce the flow resistance of the atomized substrate so that the atomized substrate can smoothly pass through the through holes 211 and the flow channels 13 in order to reach the atomizing face 12. Specifically, the number of the through holes 222 on each fin 221 may be one or more. The via 222 may be a circular hole, a square hole, a stripe hole, or the like, and the present application is not limited to the specific shape of the via 222.

Referring again to FIG. 4, in some embodiments, the heating element 20 is thermally conductively coupled to the heating element 10, and heat from the heating element 10 can be transferred to the heating element 20. In this way, after the heating element 20 exchanges heat with the heating element 10, the temperature of the heating element 20 itself increases, so that the atomized substrate can be heated.

It should be noted that the heating element 20 and the heating element 10 may be in thermal conductive connection, and the heating element 20 and the heating element 10 may be in contact connection, or the heating element 20 and the heating element 10 may be indirectly connected through an intermediate medium, so long as the heating element 10 can transfer heat to the heating element 20.

Referring again to fig. 4 and 5, in some embodiments, the atomizing device 100 includes a flow stabilization element 30, the flow stabilization element 30 is disposed between the heating element 20 and the heating element 10, and the flow stabilization element 30 is capable of transferring heat from the heating element 10 to the heating element 20.

Thus, the flow stabilizing element 30 not only can stabilize the flow rate of the atomized substrate and prevent the liquid leakage of the heating element 10, so that the atomized substrate can flow to the atomizing surface 12 more uniformly through the flow channel 13 to be atomized, but also can transfer the heat of the heating element 10 to the heating element 20 by the flow stabilizing element 30, so that the temperature of the heating element 20 per se is increased.

Specifically, the flow stabilizing element 30 is an element having multiple pores, which may be regularly arranged or may be irregularly arranged. The current stabilizing element 30 may be in the form of a sheet and stacked with the heat generating body 10. The base 21 of the heating element 20 can be pressed against the steady flow element 30, so that the contact area between the steady flow element 30 and the heating element 20 is larger, and the heat of the heating element 10 is transmitted to the heating element 20 through the steady flow element 30.

In some embodiments, the flow stabilizing element 30 may be a cotton or metal flow stabilizer. In the case that the current stabilizing element 30 is a cotton current stabilizing member, the current stabilizing element 30 is made of cotton material, and the heating element 10 can transfer heat to the heating element 20 through the atomized matrix adsorbed on the cotton current stabilizing member. In the case that the current stabilizing element 30 is a metal current stabilizing member, the current stabilizing element 30 is made of a metal material, and the heating element 10 can transmit heat to the heating element 20 through an atomization matrix on the metal current stabilizing member and the metal current stabilizing member itself.

Referring to fig. 14 and 15, in some embodiments, the heating element 20 is configured to emit heat upon energization. In this way, the heating element 20 can convert electrical energy into thermal energy, the heating element 20 itself can be at a higher temperature and emit more heat to rapidly heat the atomized matrix, and the temperature rise of the atomized matrix is made greater, which is beneficial to lower viscosity of the atomized matrix and thus increase fluidity of the atomized matrix.

Specifically, as discussed above, the heating element 20 may be made of a metallic material, which may effectively convert electrical energy into thermal energy due to its electrical resistance.

Referring to fig. 14 and 15, in some embodiments, the heating element 20 is configured to contact the electrode terminal 40 of the atomizing device 100 such that the electrode terminal 40 provides power to the heating element 20, the electrode terminal 40 being configured to contact the atomizing face 12. In this way, the electrode terminal 40 can supply power to the heating body 10 and the heating element 20 at the same time, or the heating body 10 and the heating element 20 can share the same electrode terminal 40, so that the number of parts of the atomizing device 100 can be reduced, thereby making the atomizing device 100 more compact.

Specifically, the number of the electrode terminals 40 may be two, which are a positive electrode terminal and a negative electrode terminal, respectively, the positive electrode terminal may be connected to the positive electrode of the power supply, the negative electrode terminal may be connected to the negative electrode of the power supply, and the power supply supplies power to the heating element 20 and the heating element 10 through the positive electrode terminal and the negative electrode terminal, so that both the heating element 10 and the heating element 20 may generate heat.

Referring to fig. 15, in some embodiments, the heating body 10 is formed with a penetration hole 16, and the penetration hole 16 is used for passing through the electrode terminal 40 so that the electrode terminal 40 contacts the heating element 20. As described above, the heating element 20 is positioned at one side of the liquid suction surface 11, and the electrode terminal 40 is in contact with the atomizing surface 12, so that the perforation 16 is formed on the heating element 10, so that one end of the electrode terminal 40 is in contact with the heating element 20, thereby causing the electrode terminal 40 to supply power to the heating element 20.

Specifically, the electrode terminal 40 is generally cylindrical, and the size of the through-hole 16 may be slightly larger than the size of the electrode terminal 40, so that the atomized substrate is prevented from leaking from the through-hole 16 while the electrode terminal 40 passes through the through-hole 16.

It is understood that in the case where the current stabilizing element 30 is provided between the heating body 10 and the heating element 20, the electrode terminal 40 passes through the current stabilizing element 30 and abuts against the heating element 20.

Referring to fig. 16, in some embodiments, the heating element 20 includes a base 21 and an electrical connection 23 connected to the base 21, the base 21 is located on one side of the liquid suction surface 11, and the electrical connection 23 extends from the base 21 to the atomizing surface 12 and contacts the electrode terminal 40. In this way, the power connection portion 23 may connect the heating element 20 with the electrode terminal 40, so that the electrode terminal 40 supplies power to the heating element 20, so that the heating element 20 may heat the atomized substrate.

Specifically, the material of the power receiving portion 23 may be the same as that of the base 21. The power receiving portion 23 and the base 21 may be manufactured by a die casting process and/or a stamping process. The power receiving portion 23 may extend from the side of the heating element 10 to the atomizing face 12, so that the structure of the heating element 10 may not be broken, and the atomized substrate may stably flow to the atomizing face 12.

Referring to fig. 16, in some embodiments, the electrical connection portion 23 may include a first connection piece 231 and a second connection piece 232, where the first connection piece 231 connects the base 21 and the second connection piece 232, and the second connection piece 232 is bent with respect to the first connection piece 231 and located on the atomizing surface 12 side, and the second connection piece 232 is used for contacting with the electrode terminal 40. In this way, the first connecting piece 231 and the second connecting piece 232 cooperate such that the power receiving portion 23 extends from the base 21 to the atomizing face 12, so that the power receiving portion 23 is connected to the electrode terminal 40 through the second connecting piece 232.

Specifically, the first connection piece 231, the second connection piece 232, and the base 21 may collectively form a clamping space 233, and the heating element 10 and the current stabilizing element 30 are accommodated in the clamping space 233. Thus, the clamping space 233 can form a whole body of the heating body 10, the heating element 20 and the steady flow element 30, which is beneficial to the installation of the heating body 10, the heating element 20 and the steady flow element 30.

Referring to fig. 4 and 5, in some embodiments, the atomizing device 100 further includes a mounting base 50, and the heating element 10 and the heating element 20 are mounted in the mounting base 50. In this way, the mount 50 can make the heating body 10 and the heating element 20 mounted more stably. Specifically, as shown in fig. 5, the mount 50 is provided with a lower liquid passage 51 and an aerosol-generating passage 52, the lower liquid passage 51 being a passage through which the atomized substrate flows from the liquid storage chamber to the heat generating body 10. The atomized substrate enters the lower liquid passage 51 from one end of the lower liquid passage 51 and flows toward the heating element 10 from the other end of the lower liquid passage 51 by the action of gravity, air pressure, and the like.

The mist outlet passage 52 is a passage for guiding out the aerosol, etc., formed by atomizing the atomized substrate heated by the heating element 10, to the outside of the mount 50, or the aerosol formed by atomizing the substrate can flow out of the mount 50 through the mist outlet passage 52.

The mist outlet passage 52 and the lower liquid passage 51 are disposed to intersect and be isolated, for example, the lower liquid passage 51 is disposed on a first side of the mount 50, the mist outlet passage 52 is disposed on a second side of the mount 50, and the first side and the second side are perpendicular. As shown in the orientation of the figure, the liquid discharge passages 51 are provided on both the left and right sides of the mount 50, and the mist discharge passages 52 are provided on both the front and rear sides of the mount 50.

Referring again to fig. 1-4, in some embodiments, the atomizing device 100 further includes a housing 60, with an atomizing substrate disposed within the housing 60. In this manner, a predetermined amount of nebulized substrate may be contained within housing 60 such that nebulizing device 100 may be reused multiple times. In particular, the housing 60 is a base member of the atomizing device 100, and the housing 60 may carry other parts of the atomizing device 100. The housing 60 is formed with a liquid storage chamber 61, and the atomized substrate is accommodated in the liquid storage chamber 61.

Referring to fig. 17, an atomizing apparatus 1000 according to an embodiment of the present application includes a main unit 200 and an atomizing device 100 according to any of the above embodiments, wherein the atomizing device 100 is connected to the main unit 200.

To sum up, in one embodiment, the heating element 20 is used in the atomizing device 100, the atomizing device 100 includes a heating element 10, the heating element 10 includes a liquid suction surface 11 and an atomizing surface 12 opposite to the liquid suction surface 11, the heating element 10 is formed with a flow channel 13 penetrating the liquid suction surface 11 and the atomizing surface 12, the heating element 20 is configured to be at least partially located on one side of the liquid suction surface 11, and a maximum height H of the heating element 20 from the liquid suction surface 11 is greater than 0.5mm.

In some embodiments, the heating element 20 includes a base 21 and an extension 22, the base 21 being disposed proximate the heat-generating body 10, the extension 22 extending from the base 21 in a direction away from the heat-generating body 10, the maximum height H of the extension 22 from the liquid suction surface 11 being greater than 0.5mm.

In the description of embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims (24)

1. An atomizing device, comprising:

The heating body comprises a liquid suction surface and an atomization surface opposite to the liquid suction surface, and a flow passage penetrating through the liquid suction surface and the atomization surface is formed in the heating body; and

And the heating element is at least partially positioned on one side of the liquid suction surface, and the maximum height of the heating element from the liquid suction surface is more than 0.5mm.

2. An atomising device according to claim 1 wherein the maximum height of the heating element from the liquid surface is 1mm-3mm.

3. An atomising device according to claim 1 wherein the heating element comprises a base and an extension, the base being disposed adjacent the heating element, the extension extending from the base in a direction away from the heating element, the maximum height of the extension from the liquid surface being greater than 0.5mm.

4. An atomizing device according to claim 3, wherein the base is formed with through holes penetrating both surfaces in the thickness direction of the base.

5. The atomizing device of claim 4, wherein the extension includes at least one fin, each fin being connected to the base proximate an edge of the through-hole.

6. The atomizing device of claim 5, wherein the number of through holes is plural, and the fin is connected to an edge of each through hole.

7. The atomizing device of claim 5, wherein the fins extend in a direction substantially parallel to a thickness direction of the base.

8. The atomizing device of claim 5, wherein the fins are inclined to a thickness direction of the base.

9. The atomizing device of claim 8, wherein the fins are formed with through holes penetrating through both sides in a thickness direction of the fins.

10. An atomising device according to claim 1 wherein the heating element is in thermally conductive connection with the heating element, the heat of the heating element being transferable to the heating element.

11. An atomizing device as set forth in claim 10, wherein said atomizing device includes a flow stabilizing element disposed between said heating element and said heat generating body, said flow stabilizing element being capable of transferring heat from said heat generating body to said heating element.

12. The atomizing device of claim 1, wherein the heating element is configured to emit heat upon energization.

13. The atomizing device of claim 12, wherein the heating element is configured to contact an electrode terminal of the atomizing device, such that the electrode terminal provides power to the heating element, the electrode terminal for contact with the atomizing face.

14. An atomizing device according to claim 13, wherein said heat generating body is formed with a through hole for passing said electrode terminal therethrough to bring said electrode terminal into contact with said heating element.

15. The atomizing device of claim 13, wherein the heating element includes a base and an electrical connection to the base, the base being located on one side of the liquid-absorbing surface, the electrical connection extending from the base to the atomizing surface and contacting the electrode terminals.

16. The atomizing device of claim 15, wherein the electrical connection portion includes a first connection piece and a second connection piece, the first connection piece connecting the base and the second connection piece, the second connection piece being disposed bent with respect to the first connection piece and located on the atomizing face side, the second connection piece being for contact with the electrode terminal.

17. An atomising device according to claim 1 wherein the heating element is a metal heating element.

18. An atomising device according to claim 17 wherein the heating element is a stainless steel heating element or an aluminium heating element.

19. An atomizing device according to claim 1, characterized in that the heating element is shaped by a die casting process and/or a stamping process.

20. The atomizing device of claim 1, further comprising a mounting base, wherein the heater and the heating element are both mounted within the mounting base.

21. The atomizing device of claim 1, further comprising a housing having an atomizing base disposed therein, wherein the atomizing base has a viscosity of greater than 10000cps at 25 ℃.

22. An atomizing apparatus, comprising:

A host; and

The atomizing device of any one of claims 1-21, wherein the atomizing device is coupled to the host.

23. A heating element for an atomizing device, the atomizing device comprising a heat generating body comprising a liquid suction surface and an atomizing surface opposite to the liquid suction surface, the heat generating body being formed with a flow passage extending through the liquid suction surface and the atomizing surface, characterized in that the heating element is configured to be at least partially located on one side of the liquid suction surface, and the maximum height of the heating element from the liquid suction surface is greater than 0.5mm.

24. A heating element as claimed in claim 23, wherein the heating element comprises a base disposed adjacent the heat generating body and an extension extending from the base in a direction away from the heat generating body, the extension having a maximum height from the liquid suction surface of greater than 0.5mm.