CN220856554U - Hollow clamp and detection equipment - Google Patents
Hollow clamp and detection equipment Download PDFInfo
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- CN220856554U CN220856554U CN202322573072.2U CN202322573072U CN220856554U CN 220856554 U CN220856554 U CN 220856554U CN 202322573072 U CN202322573072 U CN 202322573072U CN 220856554 U CN220856554 U CN 220856554U
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- 238000001514 detection method Methods 0.000 title claims abstract description 12
- 235000012431 wafers Nutrition 0.000 description 74
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer detection, in particular to a hollowed-out clamp and detection equipment. The hollow clamp comprises a support piece, a clamping piece and a driving piece, wherein the support piece is annular and is internally provided with a cavity, a first opening is formed in one end, close to the clamping piece, of the cavity in the axial direction, the driving piece is arranged on the outer radial side of the support piece, the clamping piece comprises a pressing plate connected with the driving piece and a buffer plate connected to one side, close to the axis of the support piece, of the pressing plate, and the surface, far away from the pressing plate, of the buffer plate is a first cambered surface matched with the outer circumferential surface of a workpiece to be tested; the buffer plate is spaced from one axial side end surface of the support piece, which surrounds the first opening; the driving piece can drive the clamping piece to move along the axial direction of the supporting piece towards the direction close to the supporting piece, so that the buffer plate can be matched with the supporting piece to clamp the piece to be tested. The hollowed-out clamp can realize the back hollowed-out of the product on the premise of ensuring that the workpiece to be tested is stably clamped, and avoid the back of the workpiece to be tested from being contacted.
Description
Technical Field
The utility model belongs to the technical field of wafer detection, and particularly relates to a hollowed-out clamp and detection equipment.
Background
The wafer clamp is one of functional parts for processing and detecting wafers, and the quality of the wafer clamp directly influences the precision and the yield of workpiece processing and detection.
In the existing wafer clamp, the wafer is clamped by adsorbing the wafer on the back surface by utilizing vacuum gas, and the wafer clamping mode uses atmospheric pressure as acting force, and in a sealed volume formed between a sucker and the wafer, a certain amount of gas molecules are pumped out by a vacuum source to reduce the pressure, so that the pressure difference is formed between the inside and the outside of the sucker, and the wafer is adsorbed under the action of the pressure difference. However, the wafer clamp has a large required adsorption area, and the back surface of the wafer cannot be hollowed out, so that the processing and detection requirements that the back surface cannot touch a workpiece cannot be met.
Disclosure of utility model
The technical problems to be solved by the utility model are as follows: aiming at the problems that the existing wafer clamp is large in required adsorption area and the back surface of the wafer cannot be hollowed out, the hollowed-out clamp and the detection equipment are provided.
In order to solve the technical problems, in one aspect, the embodiment of the utility model provides a hollowed-out fixture, which comprises a supporting piece, a clamping piece and a driving piece, wherein the supporting piece is annular and is internally provided with a cavity, one end of the cavity, which is close to the clamping piece in the axial direction, is provided with a first opening, the driving piece is arranged on the radial outer side of the supporting piece, the clamping piece comprises a pressing plate connected with the driving piece and a buffer plate connected to one side, close to the axis of the supporting piece, of the pressing plate, and the surface, which is far away from the pressing plate, of the buffer plate is a first cambered surface matched with the outer circumferential surface of a workpiece to be tested; the buffer plate is spaced from an axial side end surface of the support member surrounding the first opening;
The driving piece can drive the clamping piece to move along the axial direction of the supporting piece to the direction close to the supporting piece, so that the buffer plate can be matched with the supporting piece to clamp the piece to be tested.
Optionally, an open slot for taking and placing the workpiece to be measured is formed at one end of the support piece, which is provided with the first opening, and the open slot is communicated with the cavity. In this embodiment, this may facilitate the handling of the wafer. When placing or taking out the wafer, a part of the externally connected carrying piece stretches into the cavity through the open slot, so that the wafer can be better clamped. Of course, the wafer may be taken and placed when the open slot is not in communication with the cavity, and a structure in which the open slot is not in communication with the cavity is also within the scope of the present embodiment.
Optionally, the hollowed-out fixture further comprises a base, one end, away from the first opening, of the supporting piece is connected with the base, and a mounting hole for positioning is formed in the base. In this embodiment, the setting of base can be convenient to support piece's location installation.
Optionally, a second opening is provided at one end of the cavity away from the first opening, the cavity and the second opening form a cylindrical channel, the mounting hole is communicated with the channel, and the axis of the cylindrical channel coincides with the axis of the support member. In this embodiment, the support is a cylindrical structure that mates with the wafer, the edge portion of the wafer is placed on the support, and a majority of the area of the back of the wafer is located in the cylindrical channel.
Optionally, the number of the clamping members is plural, and the plurality of the clamping members are uniformly distributed around the outside of the support member. This allows a more stable clamping of the wafer, and in this embodiment, the number of clamping members is preferably two, the two clamping members being symmetrically arranged on the support member or the base about the axis of the support member. Correspondingly, in the embodiment, two driving members are also provided.
Optionally, a through slot for installing a pipeline or a line is arranged at one end of the support piece, which is far away from the first opening, and the through slot is communicated with the cavity. In this embodiment, lead to the groove and can play the effect of dodging, the setting of leading to the groove can be convenient for some external pipeline, pencil's installation and dismantlement.
Optionally, the driving member includes at least one of a lifting cylinder and a lifting motor. For example, when the driving member is a lifting cylinder, the cylinder body of the lifting cylinder is mounted on the supporting member or the base, and the clamping member is mounted on the telescopic rod of the lifting cylinder.
Optionally, a surface of one side of the buffer plate, which is close to the pressing plate, is a second cambered surface matched with the outer circumferential surface of the workpiece to be tested, and the radian of the second cambered surface is the same as that of the outer circumferential surface of the supporting piece. In this embodiment, the circumferential surface formed by the first cambered surface coincides with a part of the cross-sectional surface of the wafer, and meanwhile, the radian of the second cambered surface in this embodiment is the same as the radian of the outer circumferential surface at a certain position on the wafer, so that the clamping piece can complete more stable clamping of the wafer with a smaller contact area with the wafer. Meanwhile, the buffer plate can prevent the clamping piece from damaging the wafer when clamping the wafer.
Optionally, a state detecting member for detecting the position of the workpiece to be detected and a limiting block for limiting the position of the driving member are arranged outside the supporting member. The state detecting member may be a photoelectric sensor, and may detect whether a deviation occurs in the position of the wafer. Simultaneously, the stopper sets up in the below of driving piece, and the setting of stopper can avoid driving piece transition to remove, and then can prevent that clamping piece and support piece from damaging the wafer.
According to the hollowed-out structure of the embodiment, when the wafer is placed, the edge of the wafer is located on the supporting piece, and the center part of the back surface of the wafer extends into the cavity through the first opening. Then the driving piece drives the clamping piece to move towards the direction of the supporting piece, so that the clamping structure formed by the clamping piece and the supporting piece can clamp the edge part of the wafer (the test piece to be tested), and the clamping of the wafer is realized. In this embodiment, the wafer is held by the clamping structure at the edge thereof, and the wafer is held by the small-area contact with the wafer. Meanwhile, in the embodiment, the center part of the back surface of the wafer is located in the cavity and is not contacted, so that the back surface of the wafer can be hollowed out, and the yield of the wafer is prevented from being influenced. In addition, through setting up first cambered surface in this embodiment, for traditional square, can be under the prerequisite of guaranteeing that the wafer is stabilized the centre gripping, reduce the area of contact of clamping piece and wafer, and then can further avoid the influence of clamping piece to the wafer yields. Preferably, in this embodiment, the buffer plate is an arc-shaped member matched with the test piece to be tested.
On the other hand, the embodiment of the utility model provides detection equipment, which comprises the hollowed-out clamp.
Drawings
Fig. 1 is a schematic structural diagram of a first view angle of a hollow clamp according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a second view angle of the hollow clamp according to an embodiment of the present utility model;
fig. 3 is a schematic view of the structure of fig. 2 taken along line A-A.
Reference numerals in the specification are as follows:
1. A support; 2. a clamping member; 3. a driving member; 4. a cavity; 5. a first cambered surface; 6. a clamping structure; 7. an open slot; 8. a base; 9. a mounting hole; 10. a through groove; 11. a state detecting member; 12. a limiting block; 13. a first opening; 14. a second cambered surface; 21. a pressing plate; 22. and a buffer plate.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 3, an embodiment of the present utility model provides a hollow-out fixture, which includes a supporting member 1, a clamping member 2 and a driving member 3, wherein the supporting member 1 is annular and has a cavity 4 therein, one end of the cavity 4, which is adjacent to the clamping member 1 in the axial direction, is provided with a first opening 13, the driving member 3 is arranged radially outside the supporting member 1, the clamping member 2 includes a pressing plate 21 connected to the driving member 3 and a buffer plate 22 connected to one side of the pressing plate 21, which is adjacent to the axial direction of the supporting member 1, and a surface of the buffer plate, which is far from the pressing plate 21, is a first cambered surface 5 matched with an outer circumferential surface of a workpiece to be measured; the buffer plate 22 is spaced from one axial side end surface of the support member 1 surrounding the first opening;
The driving member 3 can drive the clamping member 2 to move along the axial direction of the supporting member 1 in the direction approaching the supporting member 1, so that the buffer plate 22 can be matched with the supporting member 1 to clamp the member to be tested.
In one embodiment, the end of the support member 1 provided with the first opening 13 is provided with an open slot 7 for taking and placing the workpiece to be measured, and the open slot 7 is communicated with the cavity 4. In this embodiment, this may facilitate the handling of the wafer. When placing or taking out the wafer, a part of the externally connected carrying piece stretches into the cavity 4 through the open groove 7, so that the wafer can be better clamped. Of course, the wafer may be taken and placed when the open groove 7 is not in communication with the cavity 4, and a structure in which the open groove 7 is not in communication with the cavity 4 is also within the scope of the present embodiment.
In an embodiment, the hollowed-out fixture further comprises a base 8, one end, away from the clamping piece 2, of the supporting piece 1 is connected with the base 8, and a mounting hole 9 for positioning is formed in the base 8. In this embodiment, the base 8 is provided to facilitate positioning and mounting of the support member 1.
In one embodiment, the end of the cavity 4 away from the first opening 13 is provided with a second opening, the first opening 13, the cavity 4 and the second opening form a cylindrical channel, and the mounting hole 9 is communicated with the channel; the support 1 is cylindrical, the axis of the cylindrical channel coinciding with the axis of the support 1. In this embodiment, the support 1 has a cylindrical structure matching the wafer, the edge portion of the wafer is placed on the support 1, and most of the area of the back of the wafer is located in the cylindrical passage.
In one embodiment, the number of clamping members 2 is plural, and the plurality of clamping members 2 are uniformly distributed around the outside of the support member 1. This allows a more stable clamping of the wafer, in this embodiment the number of clamping members 2 is preferably two, the two clamping members 2 being symmetrically arranged on the support member 1 or the base 8 about the axis of the support member 1. Correspondingly, in this embodiment, there are two driving members 3.
In an embodiment, the end of the support 1 remote from the first opening 13 is provided with a through slot 10 for mounting a pipe or line, the through slot 10 being in communication with the cavity 4. In this embodiment, the through groove 10 may perform an avoidance function, and the arrangement of the through groove 10 may facilitate the installation and disassembly of some external pipes and wire harnesses.
In one embodiment, the driving member 3 includes at least one of a lift cylinder and a lift motor. For example, when the driving member 3 is a lifting cylinder, the cylinder body of the lifting cylinder is mounted on the supporting member 1 or the base 8, and the clamping member 2 is mounted on the telescopic rod of the lifting cylinder.
In an embodiment, a surface of the buffer plate 22 near the pressing plate 21 is a second arc surface 14 matched with the outer peripheral surface of the workpiece to be measured, and the radian of the second arc surface 14 is the same as that of the outer peripheral surface of the supporting member 1. In this embodiment, the circumferential surface formed by the first cambered surface 5 coincides with a part of the cross-sectional surface of the wafer, and meanwhile, the radian of the second cambered surface 14 in this embodiment is the same as the radian of the outer circumferential surface at a certain position on the wafer, so that the clamping piece 2 can complete more stable clamping of the wafer with a smaller contact area with the wafer. The buffer plate 22 is arranged to avoid damage to the wafer caused by the clamping piece 2 when clamping the wafer.
In one embodiment, the outside of the support member 1 is provided with a state detecting member 11 for detecting the position of the workpiece to be measured and a stopper 12 for defining the position of the driving member 3. The state detecting member 11 may be provided to detect whether a deviation occurs in the position of the wafer, wherein the state detecting member 11 may be a photoelectric sensor. Meanwhile, the limiting block 12 is arranged below the driving piece 3, and the driving piece 3 can be prevented from transitionally moving by the limiting block 12, so that the wafer can be prevented from being damaged by the clamping piece 2 and the supporting piece 1.
According to the hollowed-out structure of the present embodiment, when placing the wafer, the edge position of the wafer is located on the supporting member 1, and the center portion of the back surface of the wafer extends into the cavity 4 through the first opening 13. Then, the driving member 3 drives the clamping member 2 to move towards the direction of the supporting member 1, so that the clamping structure 6 formed by the clamping member 2 and the supporting member 1 can clamp the edge portion of the wafer, and clamping of the wafer is achieved. In this embodiment, the clamping structure 6 holds the edge of the wafer, and the wafer can be clamped by contacting the wafer with a small area. Meanwhile, in the embodiment, the center part of the back surface of the wafer is located in the cavity 4 and is not contacted, so that the back surface of the wafer can be hollowed out, and the influence on the yield of the wafer can be avoided. In addition, the first cambered surface 5 in this embodiment can reduce the contact area between the clamping member 2 and the wafer on the premise of ensuring that the wafer is stably clamped, so as to further avoid the influence of the clamping member 2 on the wafer yield. In this embodiment, the buffer plate 22 is an arc-shaped member matched with the test piece to be tested.
In addition, an embodiment of the utility model provides a detection device, which comprises the hollowed-out clamp of the embodiment.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. The hollow clamp is characterized by comprising a supporting piece, a clamping piece and a driving piece, wherein the supporting piece is annular, a cavity is formed in the supporting piece, a first opening is formed in one end, close to the clamping piece, of the cavity in the axial direction, the driving piece is arranged on the outer radial side of the supporting piece, the clamping piece comprises a pressing plate connected with the driving piece and a buffer plate connected to one side, close to the axis of the supporting piece, of the pressing plate, and the surface, close to the pressing plate, of one side of the buffer plate is a first cambered surface matched with the outer circumferential surface of a workpiece to be tested; the buffer plate is spaced from an axial side end surface of the support member surrounding the first opening;
The driving piece can drive the clamping piece to move along the axial direction of the supporting piece to the direction close to the supporting piece, so that the buffer plate can be matched with the supporting piece to clamp the piece to be tested.
2. The hollowed-out fixture according to claim 1, wherein an open slot for taking and placing a workpiece to be measured is formed in one end of the support member, which is provided with the first opening, and the open slot is communicated with the cavity.
3. The hollowed-out fixture according to claim 1, further comprising a base, wherein one end of the supporting member away from the first opening is connected with the base, and a mounting hole for positioning is formed in the base.
4. A hollowed-out fixture according to claim 3, wherein a second opening is provided at an end of the cavity away from the first opening, the cavity, and the second opening form a cylindrical channel, the mounting hole communicates with the channel, and an axis of the cylindrical channel coincides with an axis of the support member.
5. The hollowed-out jig according to claim 1, wherein the number of the clamping members is plural, and the plural clamping members are uniformly distributed around the outside of the supporting member.
6. The hollowed-out fixture according to claim 1, wherein the end of the support member away from the first opening is provided with a through groove for installing a pipe or a line, and the through groove is communicated with the cavity.
7. The hollowed-out fixture of claim 1, wherein the driving member comprises at least one of a lifting cylinder and a lifting motor.
8. The hollowed-out fixture according to claim 1, wherein a surface of one side of the buffer plate, which is close to the pressing plate, is a second cambered surface matched with the outer circumferential surface of the workpiece to be tested, and the radian of the second cambered surface is the same as that of the outer circumferential surface of the supporting piece.
9. The hollow-out clamp according to claim 1, wherein a state detecting member for detecting the position of the workpiece to be detected and a limiting block for limiting the position of the driving member are arranged outside the supporting member.
10. A detection device comprising the hollow-out jig according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322573072.2U CN220856554U (en) | 2023-09-21 | 2023-09-21 | Hollow clamp and detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322573072.2U CN220856554U (en) | 2023-09-21 | 2023-09-21 | Hollow clamp and detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856554U true CN220856554U (en) | 2024-04-26 |
Family
ID=90740007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322573072.2U Active CN220856554U (en) | 2023-09-21 | 2023-09-21 | Hollow clamp and detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856554U (en) |
-
2023
- 2023-09-21 CN CN202322573072.2U patent/CN220856554U/en active Active
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