CN220856500U - Heating device for etching cavity - Google Patents

Heating device for etching cavity Download PDF

Info

Publication number
CN220856500U
CN220856500U CN202322395012.6U CN202322395012U CN220856500U CN 220856500 U CN220856500 U CN 220856500U CN 202322395012 U CN202322395012 U CN 202322395012U CN 220856500 U CN220856500 U CN 220856500U
Authority
CN
China
Prior art keywords
etching
electric heating
cavity
sealing ring
bearing table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202322395012.6U
Other languages
Chinese (zh)
Inventor
李志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Hengge Microelectronics Equipment Co ltd
Original Assignee
Zhuhai Hengge Microelectronics Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuhai Hengge Microelectronics Equipment Co ltd filed Critical Zhuhai Hengge Microelectronics Equipment Co ltd
Priority to CN202322395012.6U priority Critical patent/CN220856500U/en
Application granted granted Critical
Publication of CN220856500U publication Critical patent/CN220856500U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

The utility model discloses a heating device for an etching cavity, which comprises an etching box, wherein a bearing table for bearing a semiconductor device is arranged at the bottom side of the etching box; an etching working cavity enclosed and sealed by an etching box is formed on the top side of the bearing table, and a cavity wall sealing ring which is positioned at the inner wall of the etching box and is used for circularly protecting the semiconductor device to be processed on the bearing table in the circumferential direction is arranged at the peripheral outer edge of the etching working cavity; the cavity wall sealing ring is circumferentially and uniformly provided with a plurality of electric heating components which are respectively arranged inside the cavity wall sealing ring and used for directly heating the cavity wall sealing ring in a heat conduction way and heating the etching working cavity inside and the bearing table in a temperature control way through annular radiation, and the cavity wall sealing ring is directly heated through heat conduction of the electric heating components, so that the heating efficiency is effectively improved, and the temperature of the bearing table for processing semiconductor devices in the etching working cavity is effectively controlled between preset temperatures.

Description

Heating device for etching cavity
[ Field of technology ]
The utility model relates to a semiconductor etching technology, in particular to a heating device for an etching cavity.
[ Background Art ]
In the semiconductor etching process, the bearing table is used for fixing the semiconductor device, and when the temperature of the semiconductor device reaches the temperature required by the etching reaction under the action of the heating system, the etching gas reacts with the surface of the semiconductor device, so that the etching of the semiconductor device is realized.
When a semiconductor device is etched in an etching chamber, a tray body made of ceramic is generally adopted as a bearing table, and in order to avoid generating an accessory on the bearing table in the etching process and avoiding the defect of the semiconductor device caused by the accessory falling onto the semiconductor device, the temperature of the semiconductor device is generally required to be controlled within a preset temperature range.
In the existing temperature control method for the bearing table, two ventilation pipelines respectively arranged at two sides of the etching chamber are generally adopted to synchronously introduce gas into the chamber, two heaters are adopted to synchronously heat the gas introduced by the two ventilation pipelines respectively, and then the gas introduced by the ventilation pipelines into the etching chamber contacts with the bearing table to correspondingly control the temperature of the bearing table.
However, the temperature control method of the bearing table cannot control the temperature of the bearing table to be a preset temperature, and is low in temperature control speed and high in temperature control cost.
[ utility model ]
The utility model provides a heating device for an etching cavity, which effectively ensures the sealing symmetry of exhaust emission in the etching process, effectively improves the density and energy uniformity of plasma in an etching space and effectively improves the etching processing precision.
The technical scheme adopted for solving the technical problems is as follows:
The heating device for the etching cavity is used for controlling the temperature of a bearing table for processing the semiconductor device in the etching working cavity to be between preset temperatures and comprises an etching box, wherein the bottom side of the etching box is provided with the bearing table for bearing the semiconductor device;
the top side of the bearing table forms an etching working cavity enclosed and sealed by the etching box;
A cavity wall sealing ring which is positioned at the inner wall of the etching box and is used for circularly protecting the semiconductor device to be processed on the bearing table in the circumferential direction is arranged at the circumferential outer edge of the etching working cavity;
And a plurality of electric heating components which are respectively arranged inside the cavity wall sealing ring, are used for directly heating the cavity wall sealing ring in a heat conduction way and are used for heating the etching working cavity inside and the bearing table in a temperature control way through annular radiation are uniformly arranged around the circumference of the cavity wall sealing ring.
Preferably, the cavity wall sealing ring is an annular limiting ring.
Preferably, the annular limiting ring is symmetrically provided with four uniformly distributed and axially-penetrated axial through holes for mounting and fixing each electric heating component along the circular circumference.
Preferably, each electric heating assembly comprises a round electric heating rod and at least one elastic fixing piece, wherein the electric heating rod and the elastic fixing pieces are arranged in the axial through hole in close proximity to the attached plug bush, and the outer wall of the electric heating rod is tightly attached to the inner wall of the axial through hole of the annular limiting ring through elastic limiting of the elastic fixing pieces.
Preferably, the bottom end of the circular limiting ring is also provided with a positioning ring which is fixedly connected with the electric heating rods and the elastic fixing sheets on all the electric heating assemblies.
Preferably, the two elastic fixing pieces are mounted in the axial through hole along with the electric heating rod plug bush after being overlapped.
Preferably, the inner edge at the bottom end of the circular limiting ring is also provided with an inner convex edge which extends inwards in the circumferential direction and is fixedly connected with the inner edge of the positioning ring.
The beneficial effects of the utility model are as follows:
A plurality of electric heating components which are respectively arranged inside the cavity wall sealing ring are uniformly arranged around the circumference of the cavity wall sealing ring, the cavity wall sealing ring is directly heated through heat conduction of the electric heating components, the temperature of the etching working cavity and the temperature of the bearing table are heated through annular radiation of the cavity wall sealing ring, the heating efficiency is effectively improved, and the temperature of the bearing table for processing semiconductor devices in the etching working cavity is effectively controlled between preset temperatures.
[ Description of the drawings ]
FIG. 1 is a schematic diagram of an explosive structure in an embodiment of the utility model;
FIG. 2 is a schematic view of an exploded view of a seal ring for a chamber wall and an electrical heating assembly in accordance with an embodiment of the present utility model;
FIG. 3 is a schematic view of a three-dimensional assembly structure of a cavity wall seal ring and an electrical heating assembly in an embodiment of the utility model;
FIG. 4 is a schematic view of a partially enlarged construction of an assembled connection of an electrical heating assembly and a chamber wall seal ring in an embodiment of the utility model;
Reference numerals:
1. etching box; 2. a lower electrode assembly; 3. etching a working chamber; 4. an annular flow passage; 5. slow flow grating plates; 6. a diversion guide plate; 7. a diversion guide hole; 60. an arc plate; 8. an annular envelope; 9. a strip-shaped slow flow through hole; 10. an observation window; 11. an arc-shaped guide plate.
[ Detailed description ] of the invention
Technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model provides a be used for etching chamber heating device, as shown in fig. 1 through 4, be used for controlling the plummer temperature of processing the semiconductor device in the etching chamber between preset temperature, including etching case 1, etching case 1 bottom side is provided with plummer (not shown in the figure) that is used for accepting the semiconductor device, and plummer top side forms and closes up the etching chamber 2 sealed by etching case 1; a cavity wall sealing ring 3 which is positioned at the inner wall of the etching box 1 and is used for circularly protecting the semiconductor device to be processed on the bearing table in the circumferential direction is arranged at the circumferential outer edge of the etching working cavity 2; four electric heating components 4 which are respectively arranged inside the cavity wall sealing ring 3 and are used for directly heating the cavity wall sealing ring 3 in a heat conduction way and heating the etching working cavity inside and the bearing table in a temperature control way through annular radiation are uniformly arranged around the circumference of the cavity wall sealing ring 3.
As shown in fig. 1 to 4, in this embodiment, the cavity wall sealing ring 3 is a circular limiting ring, four uniformly distributed and axially penetrating axial through holes 30 for mounting and fixing each electric heating component 4 are symmetrically formed in the circular circumferential direction of the circular limiting ring, each electric heating component 4 comprises a circular electric heating rod 40 and two elastic fixing sheets 41, the two elastic fixing sheets 41 are mounted in the axial through holes 30 along with the insertion sleeve of the electric heating rod 40 after being closely overlapped, the outer wall of the electric heating rod 40 is tightly attached to the inner wall of the axial through holes 30 of the circular limiting ring through elastic limiting sheets 41, so that the electric heating rod 40 is conveniently and directly thermally conducted to heat the cavity wall sealing ring 3, heating efficiency is improved, and the heating efficiency is avoided, and the cavity wall sealing ring 3 is heated in a heat radiation mode due to the fact that gaps exist between the electric heating rod 40 inclines or is avoided.
As shown in fig. 1 and 2, a positioning ring 5 fixedly connected with the electric heating rods 40 and the elastic fixing plates 41 on all the electric heating assemblies 4 is also arranged at the bottom end of the annular limiting ring in a bearing manner, and an inner convex edge 31 fixedly connected with the inner edge of the positioning ring 5 is arranged at the inner edge of the bottom end of the annular limiting ring and extends inwards in the circumferential direction.
In this embodiment, through the direct heat conduction heating chamber wall sealing ring 3 of a plurality of electrical heating assemblies 4, then the annular radiation of chamber wall sealing ring 3 is to etching working chamber inside and plummer control by temperature change heating, and not only simple structure, heating efficiency are high, conveniently control the plummer temperature in the etching working chamber between preset temperature, effectively improve the machining efficiency of etching.
The above embodiments are merely preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, but all equivalent changes according to the shape, construction and principle of the present utility model are intended to be included in the scope of the present utility model.

Claims (7)

1. The heating device for the etching cavity is used for controlling the temperature of a bearing table for processing the semiconductor device in the etching working cavity to be between preset temperatures and is characterized by comprising an etching box, wherein the bottom side of the etching box is provided with the bearing table for bearing the semiconductor device;
the top side of the bearing table forms an etching working cavity enclosed and sealed by the etching box;
A cavity wall sealing ring which is positioned at the inner wall of the etching box and is used for circularly protecting the semiconductor device to be processed on the bearing table in the circumferential direction is arranged at the circumferential outer edge of the etching working cavity;
And a plurality of electric heating components which are respectively arranged inside the cavity wall sealing ring, are used for directly heating the cavity wall sealing ring in a heat conduction way and are used for heating the etching working cavity inside and the bearing table in a temperature control way through annular radiation are uniformly arranged around the circumference of the cavity wall sealing ring.
2. A heating apparatus for an etching chamber according to claim 1, wherein: the cavity wall sealing ring is an annular limiting ring.
3. A heating apparatus for an etching chamber according to claim 2, wherein: four axial through holes which are uniformly distributed and axially communicated and are used for installing and fixing each electric heating component are symmetrically formed in the annular limiting ring along the circular circumference.
4. A heating apparatus for an etching chamber according to claim 3, wherein: each electric heating assembly comprises a round electric heating rod and at least one elastic fixing piece, wherein the electric heating rod and the elastic fixing pieces are closely attached to the insertion sleeve in the axial through hole, and the outer wall of the electric heating rod is closely attached to the inner wall of the axial through hole of the circular limiting ring through elastic limiting of the elastic fixing pieces.
5. A heating apparatus for an etching chamber according to claim 4, wherein: and the bottom end of the circular limiting ring is also provided with a positioning ring which is fixedly connected with the electric heating rods and the elastic fixing sheets on all the electric heating assemblies.
6. A heating apparatus for an etching chamber according to claim 4, wherein: the two elastic fixing sheets are mounted in the axial through hole along with the electric heating rod plug bush after being closely overlapped.
7. A heating apparatus for an etching chamber according to claim 5, wherein: the inner edge at the bottom end of the circular limiting ring is also provided with an inner convex edge which extends inwards in the circumferential direction and is fixedly connected with the inner edge of the positioning ring.
CN202322395012.6U 2023-09-04 2023-09-04 Heating device for etching cavity Active CN220856500U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322395012.6U CN220856500U (en) 2023-09-04 2023-09-04 Heating device for etching cavity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322395012.6U CN220856500U (en) 2023-09-04 2023-09-04 Heating device for etching cavity

Publications (1)

Publication Number Publication Date
CN220856500U true CN220856500U (en) 2024-04-26

Family

ID=90771470

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322395012.6U Active CN220856500U (en) 2023-09-04 2023-09-04 Heating device for etching cavity

Country Status (1)

Country Link
CN (1) CN220856500U (en)

Similar Documents

Publication Publication Date Title
US20200411350A1 (en) Method and apparatus for substrate transfer and radical confinement
KR102151001B1 (en) High temperature electrostatic chuck with real-time heat zone regulating capability
US8071920B2 (en) Planar heater
CN110736345B (en) Process chamber and heat treatment furnace for SiC high-temperature oxidation process
US11282735B2 (en) Electrostatic chuck and semiconductor equipment
CN220856500U (en) Heating device for etching cavity
KR20170139597A (en) Thermal insulation electrical contact probes
WO2020263690A1 (en) Detachable biasable electrostatic chuck for high temperature applications
KR20010076133A (en) Ultra-high-temperature heat treatment apparatus
CN114267625A (en) Semiconductor process equipment and bearing device thereof
CN203062141U (en) Welding tool of wideband millimeter wave traveling wave tube electronic gun outer shell
CN213126899U (en) Heat radiation structure for automatic frying pan device
CN110638113A (en) Circumferential heating non-combustion smoking set and heat insulation system of heating assembly thereof
KR100502613B1 (en) Substrate Cooling Device and Semiconductor Manufacturing Equipment
KR20220136375A (en) Atomization unit and atomizer
CN219244219U (en) Heating furnace for component assembly
CN220892254U (en) Ceramic gas range
CN214120762U (en) Electric stove guard shield with smoking mechanism
CN112164618B (en) High coaxiality porcelain shell assembly
CN213421198U (en) Diffusion pump heated by electromagnetic oven
CN220892972U (en) Furnace tube device
CN215771056U (en) Cathode supporting structure for cathode grid assembly and cathode grid assembly
CN111383874B (en) Cooling structure for klystron
CN117968112A (en) Pot support and cooking utensils
CN104515395A (en) High-temperature furnace bed supporting device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant